Io = 200 mA
VR = 30 Volts
RB520S-30
Page 1
QW-BB023
REV:B
A
mA
V
1
200
30
IO
VR
IFSM
8.3ms single half sine-wave superimposed
on rate load(JEDEC method)
OC
OC
+125
+125
-40
TSTG
Tj
Storage temperature
Junction temperature
Mean rectkfying current
DCReverse voltage
Peak forward surge current
Parameter Conditions Symbol Min Typ
Max
Unit
µA
V
1
0.6
IR
VF
Reverse current
Forward voltage
Parameter Conditions Symbol Min Typ
Max
Unit
VR = 10 V
IF = 200 mA
Maximum Ratings (at TA=25°C unless otherwise noted)
Electrical Characteristics (At Ta=25°C, unless otherwise noted)
Comchip Technology CO., LTD.
Dimensions in inches and (millimeter)
SOD-523
0.014(0.35)
0.010(0.25)
0.051(1.30)
0.043(1.10)
0.033(0.85)
0.030(0.75)
0.067(1.70)
0.059(1.50)
0.008(0.20)
REF
0.006(0.15)
0.003(0.08)
0.031(0.77)
0.020(0.51)
0.003(0.07)
0.001(0.01)
+
-
Features
Low reverse current.
Designed for mounting on small surface.
Extremely thin package.
Majority carrier conduction.
Mechanical data
Case: SOD-523 standard package,
molded plastic.
Terminals: solderable per MIL-STD-750
,method 2026.
Marking code: cathode band & B
Mounting position: Any
Weight: 0.0012 gram(approx.).
Circuit Diagram
RoHS Device
SMD Schottky Barrier Diodes
RATING AND CHARACTERISTIC CURVES (RB520S-30)
Page 2
REV:B
Capacitance between terminals, (PF)
Reverse voltage, (V)
0
20
40
60
80
100
0 25 50 75 100 125
Ambient temperature, (°C)
Average forward current,(%)
Fig.4 - Derating curve
Fig. 3 - Capacitance between
terminals characteristics
0 1510 20
1
10
100
525 30
Reverse current ( A )
Reverse voltage, (V)
1u
1n
10u
100n
0 10 20 25 30
Fig. 2 - Reverse characteristics
1m
100u
15
5
10n
O
25 C
O
-25 C
O
75 C
O
125 C
f = 1 MHz
150
Comchip Technology CO., LTD.
Fig.1 Forward Characteristics
IF, Forward Current (A)
Forward Voltage, (V)
0 0.4 0.7
1m
100m
10μ
0.1 0.2 0.3 0.5 0.6
1μ
100μ
10m
O
TA1C
=25
O
TA=75 C
O
A=
T25C
O
TA=-25C
QW-BB023
1
(Mounting on glass epoxy PCBs)
SMD Schottky Barrier Diodes
Page 3
REV:B
o
120
Trailer Device Leader
10 pitches (min)10 pitches (min)
.......
.......
.......
.......
.......
.......
..... ..
.......
End Start
D1
D2
D
W1
T
C
Direction of Feed
Reel Taping Specification
Comchip Technology CO., LTD.
QW-BB023
Index hole
d
E
F W
A
P
P0
P1
B
Polarity
B C dD D2D1
SOD-523
SYMBOL
A
(mm)
(inch) 2.142 ± 0.016
2.00 ± 0.10
1.50 + 0.10 54.40 ± 0.40 13.00 ± 0.20
4.00 ± 0.10 2.00 ± 0.10
178 ± 1.00
0.059 0.004+7.008 ± 0.039 0.512 ± 0.008
SYMBOL
(mm)
(inch) 0.079 ± 0.004 0.158 ± 0.004 0.079 ± 0.004
E F P P0P1W W1
1.75 ± 0.10
0.069 ± 0.004
3.50 ± 0.05
0.138 ± 0.002
SOD-523
0.90 ± 0.10
0.035 ± 0.004
1.94 ± 0.10
0.076 ± 0.004
0.73 ± 0.10
0.029 ± 0.004
9.50 ± 1.00
0.374 ± 0.039
8.00 0.30 /+–0.10
0.315 0.012 /+–0.004
SMD Schottky Barrier Diodes
Page 4
REV:B
Part Number
RB520S-30
Marking Code
B
Marking Code
Comchip Technology CO., LTD.
B
QW-BB023
Suggested PAD Layout
SIZE
(inch)
0.055
(mm)
1.40
0.60
0.70
0.024
0.028
SOD-523
2.00 0.079
E0.80 0.031
A
B
C
D
SMD Schottky Barrier Diodes
A
B
C
E
D
SOD-523
Standard Packaging
Case Type
3,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
