LBA110 Dual Pole OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Description LBA110 comprises two independent 350V, 120mA, 35 solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay. LBA110 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required. Features * 3750Vrms Input/Output Isolation * 100% Solid State * Low Drive Power Requirements (TTL/CMOS Compatible) * Arc-Free With No Snubbing Circuits * FCC Compatible * VDE Compatible * No EMI/RFI Generation * Machine Insertable, Wave Solderable Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component TUV Certificate B 09 07 49410 004 Applications Ordering Information * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Part # LBA110 LBA110S LBA110STR LBA110P LBA110PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Normally Closed - Control - Normally Closed + Control - Normally Open - Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices Form-B IF IF ILOAD ton DS-LBA110-R09 Normally Open Pole Form-A ILOAD 90% Pb Normally Closed Pole 90% 10% 10% toff toff ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LBA110 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units t = 10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 350 35 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 2 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110 Form-A/Form-B PERFORMANCE DATA @25C (Unless Otherwise Noted)* LED Forward Voltage Drop (V) 35 Typical LED Forward Voltage Drop vs. Temperature Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 1.25 -20 0 LED Forward Voltage Drop (V) 20 40 60 80 Temperature (C) 100 120 Form-A PERFORMANCE DATA @25C (Unless Otherwise Noted)* 15 10 5 0 0.75 1.05 1.35 15 10 5 1.65 25 20 15 10 5 0 0.12 0.20 0.28 0.36 0.44 0.52 0.60 19.5 20.5 21.5 22.5 23.5 24.5 25.5 Turn-On Time (ms) Turn-Off Time (ms) On-Resistance (:) Form-A Typical IF for Switch Operation (N=50, IL=120mADC) Form-A Typical IF for Switch Dropout (N=50, IL=120mADC) Form-A Typical Blocking Voltage Distribution (N=50) 15 10 5 0 30 20 15 10 5 0.91 1.17 1.43 LED Current (mA) 1.69 1.95 25 20 15 10 5 0 0.65 35 Device Count (N) 20 25 Device Count (N) Device Count (N) 30 20 0 0.45 25 35 Device Count (N) 20 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) 25 Form-A Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 0.39 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 1.95 400 420 440 460 480 500 520 Blocking Voltage (VP) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA110 Form-A Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 LED Current (mA) 0.205 0.200 0.195 0.190 0.185 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 -40 50 45 40 60 Form-A Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-A Typical Turn-On Time vs. Temperature (IL=120mADC) Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) 1.4 1.0 0.5 0.40 IF=10mA 0.8 0.6 IF=20mA 0.4 0.2 0 20 40 60 80 100 -40 -20 0 20 40 60 80 Temperature (C) Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) Form-A Typical Load Current vs. Load Voltage (IF=5mA) 150 30 20 -20 0 20 40 60 80 50 0 -50 -2 -1 0 1 2 3 Load Voltage (V) Form-A Typical Blocking Voltage vs. Temperature Form-A Typical Leakage vs. Temperature Measured Across Pins 5&6 0.012 0.010 0.008 0.006 0.004 430 0.002 420 -20 0 20 40 60 Temperature (C) 80 100 20 40 60 Temperature (C) 120 100 IF=20mA IF=10mA IF=5mA 80 60 40 0 -40 -20 0 20 40 -20 0 20 40 60 80 100 120 Energy Rating Curve Load Current (A) Leakage (A) 440 0 Temperature (C) 0.014 450 -20 140 -40 4 0.016 460 -40 0 -3 Temperature (C) 470 0.10 20 -4 100 480 0.15 180 -150 0 0.20 160 100 -100 10 100 0.25 Form-A Maximum Load Current vs. Temperature Load Current (mA) Load Current (mA) 40 80 0.30 0 100 Temperature (C) 50 100 0.05 0 -20 80 0.35 IF=5mA 1.0 Turn-Off Time (ms) 1.5 -40 20 Temperature (C) 2.0 -40 0 LED Forward Current (mA) 1.2 -40 -20 LED Forward Current (mA) Turn-On Time (ms) LED Current (mA) 0.210 0 On-Resistance (:) 2.5 0.180 2.5 Blocking Voltage (VP) Form-A Typical IF for Switch Operation vs. Temperature (IL=120mADC) 0.215 0 60 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.220 Turn-Off Time (ms) Turn-On Time (ms) Form-A PERFORMANCE DATA @25C (Unless Otherwise Noted)* 60 Temperature (C) 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110 Form-B PERFORMANCE DATA @25C (Unless Otherwise Noted)* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 25 15 10 5 0 0.35 0.45 0.55 0.65 10 5 5 0.40 0.56 0.72 0.88 25.5 1.04 26.5 27.5 28.5 29.5 30.5 31.5 On-Resistance (:) Form-B Typical IF for Switch Operation (N=50, IL=120mADC) Form-B Typical IF for Switch Dropout (N=50, IL=120mADC) Form-B Typical Blocking Voltage Distribution (N=50) 25 5 30 25 20 Device Count (N) 10 15 10 5 0.7 0.9 0.42 1.1 1.3 1.5 1.7 15 10 0 0.7 1.9 0.9 1.1 1.3 1.5 1.7 1.9 365 375 385 395 405 415 425 LED Current (mA) LED Current (mA) Blocking Voltage (VP) Form-B Typical Turn-On Time vs. LED Forward Current (IL=120mADC) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) Form-B Typical IF for Switch Operation vs. Temperature (IL=120mADC) 0.7 0.41 3.0 0.40 0.39 0.38 0.37 0.36 0.5 0.4 0.3 0.2 0.35 0.1 0.34 0 10 15 20 25 30 35 40 45 2.5 LED Current (mA) Turn-Off Time (ms) 0.6 5 20 5 0 50 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 LED Forward Current (mA) LED Forward Current (mA) Temperature (C) Form-B Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) Form-B Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.7 1.2 2.0 1.5 1.0 0.5 Turn-Off Time (ms) Turn-On Time (ms) 2.5 0.5 0.4 0.3 0.2 0.1 0 0 -20 0 20 40 60 Temperature (C) 80 100 80 100 IF=5mA 0.6 -40 10 Turn-Off Time (ms) 15 3.0 15 Turn-On Time (ms) 20 0 20 0 0.24 0 Turn-On Time (ms) 15 0.75 Device Count (N) Device Count (N) 25 LED Current (mA) 20 0 0.25 Form-B Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 1.0 0.8 IF=10mA 0.6 0.4 IF=20mA 0.2 0 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 80 100 Temperature (C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA110 Form-B PERFORMANCE DATA @25C (Unless Otherwise Noted)* 30 20 10 160 50 0 -50 -100 140 120 100 80 60 40 20 -150 0 -40 -20 0 20 40 60 80 -3 -2 -1 0 1 2 3 Temperature (C) Load Voltage (V) Form-B Typical Blocking Voltage vs. Temperature Form-B Typical Leakage vs. Temperature Measured Across Pins 5&6 (IF=5mA) 415 0.016 410 0.014 405 0.012 400 395 390 0.002 0 20 40 60 Temperature (C) 80 100 0 -40 -20 0 20 40 -20 0 20 40 60 80 100 120 Energy Rating Curve 0.006 0.004 -40 Temperature (C) 0.008 380 -20 4 0.010 385 -40 0 -4 100 Leakage (A) Blocking Voltage (VP) 180 Load Current (mA) Load Current (mA) 40 375 Form-B Maximum Load Current vs. Temperature (IF=0mA) 100 50 On-Resistance (:) 150 Form-B Typical Load Current vs. Load Voltage (IF=5mA) Load Current (A) 60 Form-B Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 60 Temperature (C) 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBA110 / LBA110S / LBA110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBA110 / LBA110S 250C for 30 seconds LBA110P 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R09 e3 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA110 MECHANICAL DIMENSIONS LBA110 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LBA110S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 3.302 0.051 (0.130 0.002) 0.635 0.127 (0.025 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LBA110P 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110 MECHANICAL DIMENSIONS LBA110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 LBA110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LBA110-R09 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012