
Series 111 112 115 120 121 126 128 129 135
Description small, hermetically
sealed glass bead
large, hermetically
sealed glass bead
EI tested and
matched beads on
header assembly
mini glass probe standard glass probe matched large glass bead matched mini glass probe matched large glass probe glass encapsulated chip, DO35
type
Operating
temperature range
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
60 °C to 300 °C
[76 °F to 572 °F]
Dissipation constant
in still air 0.1 mW/°C 0.4 mW/°C varies with assembly
type 0.7 mW/°C, 1.0 mW/°C 1.0 mW/°C 0.8 mW/°C 2.1 mW/°C 3.0 mW/°C 2.5 mW/°C
Time constant in air 0.5 s 4.0 s 0.5 s 10.0 s 22.0 s 4.0 s 10.0 s 22.0 s 4.0 s
Nominal resistance
at 25 °C [77 °F]
1 kOhm, 2 kOhm,
8 kOhm, 10 kOhm,
100 kOhm
200 Ohm, 500 Ohm,
1 kOhm, 2 kOhm,
5 kOhm, 10 kOhm,
50 k Ohm, 100 kOhm,
500 kOhm, 2 MOhm
2 kOhm, 8 kOhm 1 kOhm, 2 kOhm,
10 kOhm
2 kOhm, 5 kOhm, 10 kOhm,
50 kOhm, 100 kOhm,
1 MOhm
2 kOhm, 100 kOhm 2 kOhm, 15 kOhm 2 kOhm, 4 kOhm
1 kOhm, 2 kOhm, 5 kOhm, 10 Ohm,
20 kOhm, 25 kOhm, 30 kOhm,
47 kOhm, 50 kOhm, 100 kOhm,
200 kOhm, 230 kOhm, 500 kOhm,
1 MOhm, 5 MOhm
Maximum diameter 0,36 mm [0.014 in] 1,14 mm [0.045 in] 0,36 mm [0.014 in] 1,5 mm [0.060 in] 2,54 mm [0.10 in] 2,54 mm [0.10 in] 3,05 mm [0.120 in] 5,08 mm [0.20 in] 2,0 mm [0.080 in]
Termination material platinum iridium platinum iridium glass to metal header dumet dumet platinum iridium dumet dumet tinned copper-clad steel
Lead length 9,6 mm [0.375 in] 9,6 mm [0.375 in] 31,75 mm [1.25 in] 31,8 mm [1.25 in] 50,8 mm [2.00 in] 9,6 mm [0.375 in] 31,8 mm [1.25 in] 50,8 mm [2.00 in] 28,6 mm [1.125 in]
Features
enhanced response time
and long-term stability,
hermetically sealed in
glass, micro size, welded
platinum iridium leads
enhanced response
time, hermetically
sealed in glass, small
size, enhanced long-
term stability
EI matched in air or helium,
interchangeable pairs,
extended life, compression-
type glass hermetic seal,
high pressure solder seal
hermetically sealed in glass,
enhanced reliability and stability,
weldable/solderable dumet leads
hermetically sealed in glass,
interchangeability, enhanced
sensitivity and reliability, small
size
hermetically sealed in glass,
interchangeability, enhanced
sensitivity and reliability, minia-
ture size
interchangeability;
enhanced sensitivity,
reliability, and stability;
miniature size
enhanced temperature capability,
uniform dimensions, tape and reel
Series 140 142 143 173 175 192 194 197 ICL
Description small disc large disc large disc EIA 0805 surface
mount, end-banded
EIA 1206 surface mount,
end-banded
uni-curve with bare leads and
epoxy
uni-curve with insulated leads
and epoxy chip with bare leads and epoxy in-rush current limiter
Operating
temperature range
60 °C to 150 °C
[76 °F to 302 °F]
60 °C to 150 °C
[76 °F to 302 °F]
60 °C to 150 °C
[76 °F to 302 °F]
60 °C to 125 °C
[76 °F to 257 °F]
60 °C to 125 °C
[76 °F to 257 °F]
60 °C to 150 °C
[76 °F to 302 °F]
60 °C to 150 °C
[76 °F to 302 °F]
60 °C to 125 °C
[76 °F to 257 °F]
40 °C to 185 °C
[40 °F to 365 °F]
Dissipation constant
in still air 3.0 mW/°C, 4.0 mW/°C 3.0 mW/°C, 4.0 mW/°C 5 mW/°C to 7 mW/°C 3.5 mW/°C 3.5 mW/°C 0.75 mW/°C 0.75 mW/°C 0.75 mW/°C 12.7 mW/°C to 23 mW/°C
Time constant in air 10.0 s 10.0 s 16.0 s to 20.0 s 10.0 s 10.0 s 15.0 s 15.0 s 15.0 s 32 s to 93 s
Nominal resistance at
25 °C [77 °F]
500 Ohm, 1 kOhm,
3 kOhm, 5 kOhm,
10 kOhm, 50 kOhm,
100 k Ohm
500 Ohm, 1 kOhm,
3 kOhm, 5 kOhm,
10 kOhm, 50 kOhm,
100 k Ohm
100 Ohm, 200 Ohm,
1 kOhm, 3 kOhm,
5 kOhm, 30 kOhm
500 Ohm, 5 kOhm,
10 kOhm, 22 kOhm,
33 kOhm, 47 kOhm,
50 kOhm, 100 kOhm
5 kOhm, 10 kOhm, 5 kOhm,
100 k Ohm, 440 kOhm
500 Ohm, 1 kOhm, 2,252 Ohm,
3 kOhm, 5 kOhm, 10 kOhm,
30 kOhm, 50 k Ohm, 100 kOhm
2,252 Ohm, 3 kOhm, 5 kOhm,
10 kOhm, 30 kOhm, 100 kOhm,
50 kOhm
300 Ohm, 1 kOhm, 3 kOhm,
5 kOhm, 10 kOhm, 50 kOhm,
100 kOhm
0.5 Ohm to 220 Ohm ±20 %
Maximum diameter 2,54 mm [0.1 in] 3,81 mm [0.15 in] 6,35 mm [0.25 in] EIA 0805 SMD EIA 1206 SMD 2,413 mm [0.095 in]12,413 mm [0.095 in]12,413 mm [0.095 in]19.5 mm [0.374 in] to
32 mm [1.26 in]
Termination material tinned copper tinned copper tinned copper solder-plated nickel
barrier
solder-plated nickel
barrier tinned copper, alloy 180 solid nickel, Teflon® insulated tinned copper, alloy 180 tinned copper
Lead length 38,1 mm [1.50 in] 38,1 mm [1.50 in] 38,1 mm [1.50 in] – – 38,1 mm [1.50 in] 38,1 mm [1.50 in] 38,1 mm [1.50 in] [25,4 mm] 1 in min.
Features
pc-board mountable,
rugged design, solder-
able leads
pc-board mountable,
rugged design, solder-
able leads
rugged design,
pc-board mountable,
solderable leads
surface mount, tape
and reel, glass-coated
ceramic, 0805 EIA
package
surface mount tape and reel,
glass-coated ceramic, 1206 EIA
package
resistance temperature curve
interchangeability, enhanced
stability and life, epoxy coated
resistance temperature curve
interchangeability, enhanced
stability and life, epoxy coated,
teflon-coated leads
rapid response times, epoxy
coated
enhanced reliability, special high-
temp protective coating, rugged
design, pc-board mountable
Temperature Sensors | Thermistors
Change resistance with
change in temperature.
Available in wide range
of resistance values and
temperature ranges.
Variety of packages and
sizes from leaded devices
to surface mount versions.
Potential applications
include military, aerospace,
appliances, medical, and
instrumentation such as
chromatography, thermal
conductivity and gas
analysis.
6 sensing.honeywell.com