ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.
IS63LV1024 ISSI®
Integrated Silicon Solution, Inc. — 1-800-379-4774
1
Rev. H
10/02/00
128K x 8 HIGH-SPEED CMOS STATIC RAM
3.3V REVOLUTIONARY PINOUT
FEATURES
High-speed access times:
8, 10, 12 and 15 ns
High-performance, low-power CMOS process
Multiple center power and ground pins for
greater noise immunity
Easy memory expansion with CE and OE
options
CE power-down
Fully static operation: no clock or refresh
required
TTL compatible inputs and outputs
Single 3.3V power supply
Packages available:
– 32-pin 300-mil SOJ
– 32-pin 400-mil SOJ
– 32-pin TSOP (Type II)
DESCRIPTION
The ISSI IS63LV1024 is a very high-speed, low power,
131,072-word by 8-bit CMOS static RAM in revolutionary
pinout. The IS63LV1024 is fabricated using ISSI's
high-performance CMOS technology. This highly reliable
process coupled with innovative circuit design
techniques, yields higher performance and low power
consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS63LV1024 operates from a single 3.3V power
supply and all inputs are TTL-compatible.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
CE
OE
WE
128K X 8
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
I/O0-I/O7
SEPTEMBER 2000
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. H
10/02/00
IS63LV1024 ISSI
®
PIN CONFIGURATION
32-Pin SOJ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/O7
I/O6
GND
Vcc
I/O5
I/O4
A12
A11
A10
A9
A8
PIN DESCRIPTIONS
A0-A16 Address Inputs
CE Chip Enable Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Bidirectional Ports
Vcc Power
GND Ground
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND 0.5 to Vcc + 0.5 V
TBIAS Temperature Under Bias 55 to +125 °C
TSTG Storage Temperature 65 to +150 °C
PTPower Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
TRUTH TABLE
Mode WE CE OE I/O Operation Vcc Current
Not Selected X H X High-Z ISB1, ISB2
(Power-down)
Output Disabled H L H High-Z ICC1, ICC2
Read H L L DOUT ICC1, ICC2
Write L L X DIN ICC1, ICC2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/o7
I/O6
GND
Vcc
I/O5
I/O4
A12
A11
A10
A9
A8
PIN CONFIGURATION
32-Pin TSOP (Type II) (T)
Integrated Silicon Solution, Inc. — 1-800-379-4774
3
Rev. H
10/02/00
IS63LV1024 ISSI
®
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = 4.0 mA 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V
VIH Input HIGH Voltage 2.2 VCC + 0.3 V
VIL Input LOW Voltage(1) 0.3 0.8 V
ILI Input Leakage GND VIN VCC Com. 11µA
Ind. 55
ILO Output Leakage GND VOUT VCC, Outputs Disabled Com. 11µA
Ind. 55
Notes:
1. VIL = 3.0V for pulse width less than 10 ns.
CAPACITANCE(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
CI/O Input/Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Min. Max. Unit
ICC1Vcc Operating VCC = Max., CE = VIL Com. 160 150 130 120 mA
Supply Current IOUT = 0 mA, f = Max. Ind. 170 160 140 130
ISB TTL Standby VCC = Max., Com. 55 45 40 35 mA
Current VIN = VIH or VIL Ind. 55 45 40 35
(TTL Inputs) CE VIH, f = Max
ISB1TTL Standby VCC = Max., Com. 25 25 25 25 mA
Current VIN = VIH or VIL Ind. 30 30 30 30
(TTL Inputs) CE VIH, f = 0
ISB2CMOS Standby VCC = Max., Com. 5555mA
Current CE VCC 0.2V, Ind. 10 10 10 10
(CMOS Inputs) VIN VCC 0.2V, or
VIN 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 3.3V ± 0.3V
Industrial 40°C to +85°C 3.3V ± 0.15V
4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. H
10/02/00
IS63LV1024 ISSI
®
AC TEST LOADS
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V
Input Rise and Fall Times 3 ns
Input and Output Timing 1.5V
and Reference Levels
Output Load See Figures 1a and 1b
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 8 10 12 15 ns
tAA Address Access Time 810 12 15 ns
tOHA Output Hold Time 2 233ns
tACE CE Access Time 810 12 15 ns
tDOE OE Access Time 4567ns
tLZOE
(2)
OE to Low-Z Output 0 000ns
tHZOE
(2)
OE to High-Z Output 0 4 0 5 0 6 0 7 ns
tLZCE
(2)
CE to Low-Z Output 3 333ns
tHZCE
(2)
CE to High-Z Output 0 4 0 5 0 6 0 7 ns
tPU CE to Power Up Time 0 000ns
tPD CE to Power Down Time 810 12 15 ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and C1
output loading specified in Figure 1.
2. Tested with the C2 load in Figure 1. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
Figure 1
OUTPUT
VT = 1.5V
ZOUT = 50
50
317
5 pF
Including
jig and
scope
351
OUTPUT
3.3V
Figure 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
5
Rev. H
10/02/00
IS63LV1024 ISSI
®
DATA VALID
READ1.eps
PREVIOUS DATA VALID
t AA
t OHA
t OHA
t RC
D
OUT
ADDRESS
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACE
t
LZCE
t
HZOE
HIGH-Z DATA VALID
CE_RD2.eps
ADDRESS
OE
CE
DOUT
t
HZCE
READ CYCLE NO. 2(1,3)
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = VIL.
3. Address is valid prior to or coincident with CE LOW transitions.
AC WAVEFORMS
READ CYCLE NO. 1(1,2)
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. H
10/02/00
IS63LV1024 ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 8 10 12 15 ns
tSCE CE to Write End 7 7810 ns
tAW Address Setup Time to 8 8810 ns
Write End
tHA Address Hold from 0 000ns
Write End
tSA Address Setup Time 0 000ns
tPWE
1
(1)
WE Pulse Width (OE High) 7 7810 ns
tPWE
2
(2)
WE Pulse Width (OE Low) 8 10 12 15 ns
tSD Data Setup to Write End 5 567ns
tHD Data Hold from Write End 0 000ns
tHZWE
(2)
WE LOW to High-Z Output 4567ns
tLZWE
(2)
WE HIGH to Low-Z Output 3 333ns
Notes:
1. Test conditions assume signal transition times of 3ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of
the signal that terminates the Write.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2 (CE Controlled, OE = HIGH or LOW)
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCE
t
PWE1
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
DOUT
DIN DATA
IN
VALID
t
LZWE
t
SD
CE_WR1.eps
Integrated Silicon Solution, Inc. — 1-800-379-4774
7
Rev. H
10/02/00
IS63LV1024 ISSI
®
DATA UNDEFINED
LOW
t
WC
VALID ADDRESS
t
PWE1
t
AW
t
HA
HIGH-Z
t
HD
t
SA t
HZWE
ADDRESS
CE
WE
D
OUT
DIN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR2.eps
WRITE CYCLE NO. 2(1)
(WE Controlled, OE = HIGH during Write Cycle)
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
DATA UNDEFINED
t
WC
VALID ADDRESS
LOW
LOW
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR3.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE VIH.
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. H
10/02/00
IS63LV1024 ISSI
®
ISSI
®
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
8 IS63LV1024-8T TSOP (Type II)
IS63LV1024-8J 300-mil Plastic SOJ
IS63LV1024-8K 400-mil Plastic SOJ
10 IS63LV1024-10T TSOP (Type II)
IS63LV1024-10J 300-mil Plastic SOJ
IS63LV1024-10K 400-mil Plastic SOJ
12 IS63LV1024-12T TSOP (Type II)
IS63LV1024-12J 300-mil Plastic SOJ
IS63LV1024-12K 400-mil Plastic SOJ
15 IS63LV1024-15T TSOP (Type II)
IS63LV1024-15J 300-mil Plastic SOJ
IS63LV1024-15K 400-mil Plastic SOJ
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
8 IS63LV1024-8TI TSOP (Type II)
IS63LV1024-8JI 300-mil Plastic SOJ
IS63LV1024-8KI 400-mil Plastic SOJ
10 IS63LV1024-10TI TSOP (Type II)
IS63LV1024-10JI 300-mil Plastic SOJ
IS63LV1024-10KI 400-mil Plastic SOJ
12 IS63LV1024-12TI TSOP (Type II)
IS63LV1024-12JI 300-mil Plastic SOJ
IS63LV1024-12KI 400-mil Plastic SOJ
15 IS63LV1024-15TI TSOP (Type II)
IS63LV1024-15JI 300-mil Plastic SOJ
IS63LV1024-15KI 400-mil Plastic SOJ