DATA SH EET
Product specification
File under Integrated Circuits, IC02 1996 Jan 25
INTEGRATED CIRCUITS
TDA8771A
Triple 8-bit video Digital-to-Analog
Converter (DAC)
1996 Jan 25 2
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
FEATURES
•8-bit resolution
•Sampling rate up to 35 MHz
•Internal reference voltage regulator
•No deglitching circuit required
•Large output voltage range
•1kΩ output load
•Power dissipation only 200 mW
•Single 5 V power supply
•44-pin QFP package.
APPLICATIONS
•General purpose high-speed digital-to-analog
conversion
•Digital TV
•Graphic display
•Desktop video processing.
GENERAL DESCRIPTION
The TDA8771A is a triple 8-bit video Digital-to-Analog
Converter (DAC). It converts the digital input signals into
analog voltage outputs at a maximum conversion rate of
35 MHz.
The DACs are based on resistor-string architecture with
integrated output buffers. The output voltage range is
determined by a built-in reference source.
The device is fabricated in a 5 V, CMOS process that
ensures high functionality with low power dissipation.
QUICK REFERENCE DATA
Note
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDDA analog supply voltage 4.5 5.0 5.5 V
VDDD digital supply voltage 4.5 5.0 5.5 V
IDDA analog supply current RL=1kΩ; note 1 10 33 45 mA
IDDD digital supply current fclk = 35 MHz −720mA
INL integral non-linearity fclk = 35 MHz; ramp input −±0.5 ±1 LSB
DNL differential non-linearity fclk = 35 MHz; ramp input −±0.25 ±0.5 LSB
fclk(max) maximum clock frequency 35 −−MHz
Ptot total power dissipation RL=1kΩ; fclk = 35 MHz; note 1 45 200 360 mW
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA8771AH QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 ×10 ×1.75 mm SOT307-2
1996 Jan 25 3
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBH039
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
31
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
30,29
26,25
4
24 to 21
4
BANDGAP
REFERENCE
16 to 13
4
20 to 17
4
5 to 3
4
12 to 9
4
8
34, 37, 38,41 33
36
2,42 6,28
40
44
1
clock input
7,2732,35,39,43
VDDA DDD
V
reference
current input
RED
analog output
GREEN
analog output
BLUE
analog output
VSSA SSD
V
reference voltage
decoupling input
not
connected
BLUE
digital inputs
(bits B4 to B7)
BLUE
digital inputs
(bits B0 to B3)
GREEN
digital inputs
(bits G4 to G7)
GREEN
digital inputs
(bits G0 to G3)
RED
digital inputs
(bits R4 to R7)
RED
digital inputs
(bits R0 to R3)
TDA8771A
(I )
REF
(V )
REF
1996 Jan 25 4
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
PINNING
SYMBOL PIN DESCRIPTION
IREF 1 reference current input for output buffers
VSSA1 2 analog supply ground 1
R7 3 RED digital input data; bit 7 (MSB)
R6 4 RED digital input data; bit 6
R5 5 RED digital input data; bit 5
VSSD1 6 digital supply ground 1
VDDD1 7 digital supply voltage 1
R4 8 RED digital input data; bit 4
R3 9 RED digital input data; bit 3
R2 10 RED digital input data; bit 2
R1 11 RED digital input data; bit 1
R0 12 RED digital input data; bit 0 (LSB)
G7 13 GREEN digital input data; bit 7 (MSB)
G6 14 GREEN digital input data; bit 6
G5 15 GREEN digital input data; bit 5
G4 16 GREEN digital input data; bit 4
G3 17 GREEN digital input data; bit 3
G2 18 GREEN digital input data; bit 2
G1 19 GREEN digital input data; bit 1
G0 20 GREEN digital input data; bit 0 (LSB)
B7 21 BLUE digital input data; bit 7 (MSB)
B6 22 BLUE digital input data; bit 6
B5 23 BLUE digital input data; bit 5
B4 24 BLUE digital input data; bit 4
B3 25 BLUE digital input data; bit 3
B2 26 BLUE digital input data; bit 2
VDDD2 27 digital supply voltage 2
VSSD2 28 digital supply ground 2
B1 29 BLUE digital input data; bit 1
B0 30 BLUE digital input data; bit 0 (LSB)
CLK 31 clock input
VDDA1 32 analog supply voltage 1
VREF 33 decoupling input for reference voltage
n.c. 34 not connected
VDDA2 35 analog supply voltage 2
OUTB 36 BLUE analog output
n.c. 37 not connected
n.c. 38 not connected
VDDA3 39 analog supply voltage 3
OUTG 40 GREEN analog output
1996 Jan 25 5
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
n.c. 41 not connected
VSSA2 42 analog supply ground 2
VDDA4 43 analog supply voltage 4
OUTR 44 RED analog output
SYMBOL PIN DESCRIPTION
Fig.2 Pin configuration.
handbook, full pagewidth
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
index
corner
TDA8771A
IREF
VSSA1
R7
R6
R5
R4
R3
R2
R1
B6
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
VSSD2
VREF
CLK
VDDA1
VDDD2
B2
B3
B4
VDDA2
VDDA4
VDDA3
OUTR
n.c.
OUTG
VSSA2
MBH040
VSSD1
VDDD1
B1
B0
B5
n.c.
n.c.
n.c.
OUTB
1996 Jan 25 6
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
THERMAL CHARACTERISTICS
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
SYMBOL PARAMETER MIN. MAX. UNIT
VDDA analog supply voltage −0.5 +6.5 V
VDDD digital supply voltage −0.5 +6.5 V
∆VDD supply voltage difference between VDDA and VDDD −1.0 +1.0 V
Tstg storage temperature −55 +150 °C
Tamb operating ambient temperature 0 +70 °C
Tjjunction temperature −+125 °C
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 75 K/W
1996 Jan 25 7
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
CHARACTERISTICS
VDDA =V
DDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA −VDDD =−0.5 to +0.5 V; Tamb = 0 to 70 °C;
typical values measured at VDDA =V
DDD = 5 V and Tamb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VDDA analog supply voltage 4.5 5.0 5.5 V
VDDD digital supply voltage 4.5 5.0 5.5 V
IDDA analog supply current RL=1kΩ; note 1 10 33 45 mA
IDDD digital supply current fclk = 35 MHz −720mA
Inputs
CLOCK INPUT (PIN 31)
VIL LOW level input voltage 0 −1.2 V
VIH HIGH level input voltage 2.0 −VDDD V
R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21)
VIL LOW level input voltage 0 −1.2 V
VIH HIGH level input voltage 2.0 −VDDD V
IREF REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN 1)
IIinput current −0.6 0.7 mA
Timing; see Fig.3
fclk(max) maximum clock frequency 35 −−MHz
tCPH clock pulse width HIGH 8 −−ns
tCPL clock pulse width LOW 8 −−ns
trclock rise time −−5ns
t
fclock fall time −−6ns
t
SU;DAT input data set-up time 4 −−ns
tHD;DAT input data hold time 4 −−ns
Voltage reference (pin 33, referenced to VSSA)
VREF output reference voltage 1.180 1.242 1.305 V
Outputs
OUTB, OUTR, OUTG ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO VSSA)FOR 1kΩLOAD; see Table 1
FSR full-scale output voltage range 2.80 2.95 3.10 V
Vos offset of analog voltage output −0.25 −V
VOmax maximum output voltage data inputs = logic 1;
note 2 2.95 3.20 3.45 V
VOmin minimum output voltage data inputs = logic 0;
note 2 0.05 0.25 0.45 V
THD total harmonic distortion fi= 4.43 MHz;
fclk = 35 MHz −−44 −dB
ZLoutput load impedance 0.9 1.0 1.1 kΩ
1996 Jan 25 8
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
Notes
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
2. VO is directly proportional to VREF.
Table 1 Input coding and DAC output voltages (typical values)
Transfer function (fclk = 35 MHz)
INL integral non-linearity ramp input −0.5 ±1 LSB
DNL differential non-linearity ramp input −0.25 ±0.5 LSB
αct crosstalk DAC to DAC −50 −−dB
DAC to DAC matching −1.0 2.0 %
Switching characteristics (for 1 kΩ output load); see Fig.4
tdinput to 50% output delay time full-scale change −12 −ns
ts1 settling time 10% to 90% of
full-scale change −15 −ns
ts2 settling time to ±1 LSB −50 −ns
Output transients (glitches)
Vgarea for 1 LSB change −1−LSB⋅ns
BINARY INPUT DATA
(SYNC = BLANK = 0) CODE DAC OUTPUT VOLTAGES (V)
OUTB, OUTR, OUTG
RL=1kΩ
0000 0000 0 0.262
0000 0001 1 0.273
.... .... . .
1000 0000 128 1.731
.... .... . .
1111 1110 254 3.188
1111 1111 255 3.200
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Jan 25 9
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
TIMING
Fig.3 Input timing.
handbook, full pagewidth
,,,,,
,,,,,
,,,,,
,,,,,
HD; DAT
t
data input
clock input
MBB656 - 1
SU; DAT
t
CPL
tCPH
t
VIH
VIL
VIL
50 %
50 %
stable
Fig.4 Switching timing.
handbook, full pagewidth
MBB662 - 3
clock input
code 1023
code 0
input code
(example of a
full-scale input
data transition)
10 %
50 %
90 %
1 LSB
1 LSB
td
s1
t
s2
t
Vo(1)
714 mV
(code 1023)
54 mV
(code 0)
50 %
1996 Jan 25 10
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
INTERNAL CIRCUITRY
Fig.5 Internal circuitry.
1/1 page = 296 mm (Datasheet) 27 mm
MBB658 - 1
VDDD
VSSD
GND
(a)
VDDA
VSSA
(b)
DACs
resistor
string
V
(c)
VDDA
VSSA
(d)
VDD VDD VDD
VDDA
VDD
GND
DDA
125 Ω
(typ.)
(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31.
(b) VREF; pin 33.
(c) IREF; pin 1.
(d) OUTR, G, B; pins 44, 40 and 36.
1996 Jan 25 11
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
APPLICATION INFORMATION
Fig.6 Application diagram.
Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on application.
See Figs 7 and 9 for example of anti-aliasing filter.
handbook, full pagewidth
MBH041
VREF 100 nF VSSA
VDDA2
CLK
B0
B1
VSSD2
R0 G7 G6 G5 G4 G3 G2 G1 G0 B7
VDDD1
10 nF
5 V
VSSD1
R4
R3
R2
R1
VDDA3
10 nF
5 V
VSSA2
1
kΩ
n.c.
VDDA4
10 nF
5 V
VSSA1
R5
R6
R7
1
2
3
4
5
6
7
8
9
10
11
44 43 42 41 40 39 38 37 36 35 34
12 13 14 15 16 17 18 19 20 21 22
33
32
31
30
29
28
27
26
25
24
23
TDA8771A
1
kΩ
VSSA
OUTR
VSSA
OUTG
VSSA
OUTB
VSSA
VDDA1
10 nF5 V
VSSA
VSSD
VSSA
REF
I
n.c. n.c.
10 nF
5 V
VSSA
1
kΩ
n.c.
VDDD2
10 nF5 V
VSSD
B2
B3
B4
B5
B6
VSSA
6.8 kΩ
1996 Jan 25 12
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
Fig.7 Example of anti-aliasing filter for 2.4 V output swing.
handbook, full pagewidth
MBH042
56 pF 150 pF 56 pF
820 Ω
18 pF 18 pF
12 µH 12 µH
analog video output
(R,G or B)
2.4 V (p-p)
Ω125
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8771A
analog ground
Ω180
Fig.8 Frequency response for filter shown in Fig.7.
1/2 page (Datasheet) 22 mm
01020 40
0
40
120
160
80
MSA693
30 f (MHz)
α
(dB)
Characteristics of Fig.8
•Order 5; adapted CHEBYSHEV
•Ripple ρ≥0.7 dB
•fat−3 dB = 6.2 MHz
•fNOTCH = 10.8 MHz.
1996 Jan 25 13
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
Fig.9 Example of anti-aliasing filter for 1.5 V output swing.
handbook, full pagewidth
MBH043
27 pF 68 pF 27 pF
500 Ω
6.8 pF 6.8 pF
27 µH 27 µH
analog video output
(R,G or B)
1.5 V (p-p)
Ω125
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8771A
analog ground
Ω500
Fig.10 Frequency response for filter shown in Fig.9.
1/2 page (Datasheet) 22 mm
01020 40
0
40
120
160
80
MSA694
30 f (MHz)
i
α
(dB)
Characteristics of Fig.10
•Order 5; adapted CHEBYSHEV
•Ripple ρ≥0.25 dB
•fat−3 dB = 5.6 MHz
•fNOTCH = 11.7 MHz.
1996 Jan 25 14
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
PACKAGE OUTLINE
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1996 Jan 25 15
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
“Quality
Reference Handbook”
(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
•The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Jan 25 16
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Jan 25 17
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
NOTES
1996 Jan 25 18
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
NOTES
1996 Jan 25 19
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC) TDA8771A
NOTES
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Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
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Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
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TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
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Bangkok 10260, THAILAND,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel.380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825
SCDS47 © Philips Electronics N.V. 1996
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Printed in The Netherlands
537021/1100/01/pp20 Date of release: 1996 Jan 25
Document order number: 9397 750 00591
