Table of Contents
1 Ratings....................................................................................5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings.......................................................5
1.4 Voltage and current operating ratings............................. 5
1.4.1 Recommended POR Sequencing .................... 6
2 General................................................................................... 8
2.1 AC electrical characteristics.............................................8
2.2 Nonswitching electrical specifications..............................9
2.2.1 Voltage and current operating requirements.....9
2.2.2 HVD, LVD and POR operating requirements....10
2.2.3 Voltage and current operating behaviors.......... 11
2.2.4 Power mode transition operating behaviors......12
2.2.5 Power consumption operating behaviors.......... 14
2.2.6 Electromagnetic Compatibility (EMC)
specifications.....................................................20
2.2.7 Designing with radiated emissions in mind....... 20
2.2.8 Capacitance attributes...................................... 20
2.3 Switching specifications...................................................21
2.3.1 Device clock specifications............................... 21
2.3.2 General switching specifications....................... 21
2.4 Thermal specifications.....................................................23
2.4.1 Thermal operating requirements....................... 23
2.4.2 Thermal attributes............................................. 23
3 Peripheral operating requirements and behaviors.................. 24
3.1 Core modules.................................................................. 24
3.1.1 Debug trace timing specifications..................... 24
3.1.2 JTAG electricals................................................ 25
3.2 Clock modules................................................................. 28
3.2.1 MCG specifications........................................... 28
3.2.2 IRC48M specifications...................................... 31
3.2.3 Oscillator electrical specifications..................... 32
3.2.4 32 kHz oscillator electrical characteristics.........34
3.3 Memories and memory interfaces................................... 34
3.3.1 QuadSPI AC specifications............................... 34
3.3.2 Flash electrical specifications............................39
3.3.3 Flexbus switching specifications....................... 41
3.3.4 SDRAM controller specifications.......................43
3.4 Security and integrity modules........................................ 46
3.5 Analog............................................................................. 46
3.5.1 ADC electrical specifications.............................46
3.5.2 CMP and 6-bit DAC electrical specifications.....50
3.5.3 12-bit DAC electrical characteristics................. 52
3.5.4 Voltage reference electrical specifications........ 55
3.6 Timers..............................................................................56
3.7 Communication interfaces............................................... 56
3.7.1 EMV SIM specifications.................................... 57
3.7.2 USB VREG electrical specifications..................61
3.7.3 USB DCD electrical specifications.................... 62
3.7.4 DSPI switching specifications (limited voltage
range)................................................................63
3.7.5 DSPI switching specifications (full voltage
range)................................................................64
3.7.6 I2C switching specifications.............................. 66
3.7.7 UART switching specifications.......................... 66
3.7.8 LPUART switching specifications......................66
3.7.9 SDHC specifications......................................... 67
3.7.10 I2S switching specifications.............................. 68
3.8 Human-machine interfaces (HMI)....................................74
3.8.1 TSI electrical specifications...............................74
4 Dimensions............................................................................. 74
4.1 Obtaining package dimensions....................................... 74
5 Pinout......................................................................................75
5.1 K82 Signal Multiplexing and Pin Assignments.................75
5.2 Recommended connection for unused analog and
digital pins........................................................................82
5.3 K82 Pinouts..................................................................... 84
6 Ordering parts......................................................................... 88
6.1 Determining valid orderable parts....................................88
7 Part identification.....................................................................89
7.1 Description.......................................................................89
7.2 Format............................................................................. 89
7.3 Fields............................................................................... 89
7.4 Example...........................................................................90
8 Terminology and guidelines.................................................... 90
8.1 Definitions........................................................................90
8.2 Examples.........................................................................91
8.3 Typical-value conditions.................................................. 91
8.4 Relationship between ratings and operating
requirements....................................................................92
8.5 Guidelines for ratings and operating requirements..........92
9 Revision History...................................................................... 92
4Kinetis K82 Sub-Family, Rev. 2, 11/2016
NXP Semiconductors