Features:
To learn more about DDR4 connectors:
web: amphenolcanada.com email: sales@amphenolcanada.com
Ordering Information:
Applications:
-
DDR4 X
Termination
288 XX
X
-- -
X
-
X
--
X
Dip Options (Dim A, Dim B, Dim C)
Color of Housing/Latch
01 2.10mm, 3.94mm, 1.57mm
02 2.67mm, 3.94mm, 1.57mm
03 3.95mm, 4.60mm, 2.36mm
04 3.18mm, 4.60mm, 2.36mm
1 Black/Black
2 Black/Natural
3 Natural/Black
4 Natural/Natural
5 Blue/Natural
6 Green/Natural
7 Blue/Blue
Latch Option
Blank Small
F Big
T Soft tray
H Hard tray (only SMT type)
0 Gold ash
1 15μ” gold
2 20μ” gold
3 30μ” gold
4 3μ” gold over 12μ” PdNi
5 3μ” gold over 27μ” PdNi
Packing Code
Contact Area Plating
V TH type
S SMT type
* TH Type Note:
Dim A = Pin tail length
Dim B = Board lock length
Dim C = Recommended PCB
thickness
Overview:
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01 3.94mm, 1.57mm ***
02 3.94mm, 1.57mm
03 4.60mm, 2.36mm ***
04 4.60mm, 2.36mm
05 2.00mm, 1.57mm ***
06 2.00mm, 1.57mm
SMT Type TH Type
** SMT Type Note:
Dim A = Board lock length
Dim B = Recommended PCB
thickness
*
**
DDR4-288-S-XX-X-X-X-X
DDR4-288-V-XX-X-X-T-X
*** With Mylar for Pick and
Place assembly equipment
DDR4 SERIES
DDR4-288-
S
-XX-X-X-X-
X
DDR
4-2
88
-V-XX-X-X-T-
X
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soldering process
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Technical Characteristics:
To learn more about DDR4 connectors:
web: amphenolcanada.com email: sales@amphenolcanada.com
Dimensions:
* Please visit amphenolcanada.com to nd drawings for other products in this series.
All drawings are measured in millimeters (mm).
DDR4-288-V-XX-X-X-T-X
FRONT VIEW
SIDE VIEW
DDR4-288-S-XX-X-X-X-X
FRONT VIEW
SIDE VIEW
DDR4 SERIES
Insertion Force 10.88Kgf maY.
Withdrawal Force 14gf min. (per contact pair)
Retention Force Contact: 0.30Kgf min.
Boardlock: 1.36Kgf min.
Durability Contact resistance: ΔR: 10mΩ maY. after test
Vibration,
Mechanical Shock
No physical damage
Discontinuity < 1μs
Contact resistance: ΔR: 10mΩ maY. after test
Reseating No damage
Latch Overstress
Force 3.5kg min. force held for 10s with no damage
Latch Actuation Force The force to fully actuate the latch open shall be 4.5kgf
maY. per latch
Module Rip Out Force 9.1kgf min. retention force of the module in connector
with no damage
Retention of
Connector to PCB No lifting of connector from applicable PCB
Insertion Force of
Connector into PCB Total insertion force to be 6.8kgf maY.
Mechanical
Voltage Rating 30V AC (RMS)/DC
Current Rating 0.7 Amps/pin maY.
Low Level Contact
Resistance
10mΩ maY. initial
ΔR: 10mΩ maY. after test
DWV No breakdown
Insulation Resistance 1000 MΩ min.
Electrical
Insulator High temp. thermal plastic, 6L94V0,
Coloroption
Copper alloy
Contact Area
a) Gold ash or
b) 15 microinches minimum of gold or
c) 30 microinches minimum or gold
Solder Area Tin or matte tin plating
Under
p
late Nickel
p
latin
g
over all
Copper alloy
Solder Area Tin plating
Underplate Nickel plating overall
Solderability Solder coverage: 95% min.
Resistance to
Soldering Heat Visual: no damage or discoloration of connector materials
Temperature Life,
Thermal Shock
Contact resistance:
ΔR: 10mΩ maY. after test
Cycling Temperature
and Humidity
Contact resistance:
ΔR: 10mΩ maY. after test
DWV: No breakdown at 500VAC
Insulation Resistance: 1000 MΩ min.
Temperature Rise Temperature rise: 30°C maY.
Mixed Flowing Gas,
Thermal Disturbance,
Salt Spray
Contact resistance:
ΔR: 10mΩ maY. after test
Materials
ContactsBoardlock
Environmental