TVS Diode Arrays (SPA(R) Devices) Lightning Surge Protection- SRDA05 Series SRDA05 Series 8pF 30A Diode Array RoHS Pb GREEN The SRDA05 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect I/O pins against ESD and lightning induced surge events. This robust device can safely absorb up to 30A per IEC61000-4-5 (tp=8/20s) without performance degradation and a minimum 30kV ESD per IEC61000-4-2 international standard. Its low loading capacitance makes it ideal for high-speed interface protection. Pinout Features I/O 1 1 8 Ref 2 Ref 1 2 7 I/O 4 * Lightning protection, IEC61000-4-5, 30A (8/20s) Ref 1 3 6 I/O 3 * EFT, IEC61000-4-4, 50A (5/50ns) I/O 2 4 5 Ref 2 * ESD, IEC61000-4-2, 30kV contact, 30kV air * Low clamping voltage * Low leakage current * SOIC-8 surface mount package (JEDEC MS-012) SOIC-8 (Top View) Note: Pinout diagrams above shown as device footprint on circuit board. Functional Block Diagram Applications * Video Line Protection * Tertiary (IC Side) Protection: I/O 1 Ref 1 I/O 2 * Security Cameras - T1/E1/T3/E3 * Storage DVRs - HDSL/SDSL * Network Equipment - Ethernet * Instrumentation, Medical Equipment * RS232, RS485 Application Example R Tip I/O 4 Ref 2 I/O 3 R Ring 8 T1/E1/ T 3 / E 3 Transceiver Life Support Note: Not Intended for Use in Life Support or Life Saving Applications SRDA05-4 1 The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 5 4 T Tip T Ring T1/E1/T3/E3 Interface Protection (c)2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 Revision: January 21, 2013 SRDA05 Series SRDA05 Description TVS Diode Arrays (SPA(R) Devices) Lightning Surge Protection- SRDA05 Series Absolute Maximum Ratings Value Units Ppk Peak Pulse Power (8/20s) Parameter 600 W Ipp Peak Pulse Current (8/20s) 30 A Operating Temperature Range -40 to 125 C Top Operating Temperature -40 to 125 C Storage Temperature Range -55 to 150 C Storage Temperature -55 to 150 C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 C TSTOR Parameter Rating Units 170 C/W SOIC Package CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25C) Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage Parameter VRWM IT1A - - 5.0 V Reverse Leakage Current IR VR= 5V - - 10 A Reverse Breakdown Voltage VBR It = 1mA 6 - - V 1 VC IPP= 1A, tp=8/20 s - 9.2 - V Clamping Voltage, Line-Ground VC IPP= 2A, tp=8/20 s - 10.0 - V 1 Clamping Voltage, Line-Ground VC IPP= 10A, tp=8/20 s - 14.5 - V Clamping Voltage, Line-Ground1 VC IPP= 25A, tp=8/20 s - 21.0 - V Dynamic Resistance, Line-Ground1 RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.8 - ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) 30 30 - - kV kV CI/O-I/O Reverse Bias=0V - 4.0 - pF CI/O-GND Reverse Bias=0V - 8.0 - pF Clamping Voltage, Line-Ground 1 Diode Capacitance1 1 Parameter is guaranteed by design and/or device characterization. Variation of Capacitance vs. Reverse Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power-Ppk (kW) 2.5 2.4 Capacitance (pF) Cj(VR)/Cj(VR=0) 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 1 0.1 0.4 0.2 0.0 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.1 5.0 Bias Voltage (V) SRDA05 Series 1 10 100 1000 Pulse Duration-tp(S) 2 Revision: January 21, 2013 (c)2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SP4040 Symbol Thermal Information TVS Diode Arrays (SPA(R) Devices) Lightning Surge Protection- SRDA05 Series Clamping Voltage vs. IPP Power Derating Curve 110 100 Clamp Voltage (VC) 20.00 15.00 10.00 90 80 70 60 50 SRDA05 % of Rated Power or IPP 25.00 40 30 20 5.00 10 0 0.00 1.0 10.0 20.0 30.0 0 25 50 75 100 Ambient Temperature-TA Peak Pulse Current-IPP (A) Pulse Waveform 150 125 (oC) Product Characteristics 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (s) Soldering Parameters Pre Heat Pb - Free assembly - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds 260 Time within 5C of actual peak Temperature (tp) 20 - 40 seconds tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time C Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C (c)2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition Ordering Information Part Number Package Marking Min. Order Qty. SRDA05-4BTG SOIC-8 LF SRDA05 SYYWW 2500 3 Revision: January 21, 2013 SRDA05 Series TVS Diode Arrays (SPA(R) Devices) Lightning Surge Protection- SRDA05 Series Part Numbering System Part Marking System SRDA 05 4 B T G TVS Diode Arrays (SPA(R) Devices) Voltage SRDA05 F L G= Green T= Tape & Reel Marking SYYWW Package B = SOIC-8 Channel 4= 4 Channels Date code Pin1 Package Dimensions -- Mechanical Drawings and Recommended Solder Pad Outline Package LF SOIC Pins 8 JEDEC MS-012 Millimetres o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.70 5.10 0.185 0.201 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e L 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification -- SOIC Package Millimetres User Feeding Direction E Pin 1 Location Max 1.65 1.85 0.065 0.073 5.4 5.6 0.213 0.22 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 P0 1.50 Min 3.9 4.1 40.0 +/- 0.20 0.059 Min 0.154 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t 4 Min F 10P0 Revision: January 21, 2013 Max P2 D1 SRDA05 Series Inches Min 0.30 +/- 0.05 0.012 +/- 0.002 (c)2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Littelfuse: SRDA05-4BTG