1
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Devices)
Revision: January 21, 2013
Lightning Surge Protection- SRDA05 Series
SRDA05
SRDA05 Series
Description
Applications
The SRDA05 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect I/O pins against
ESD and lightning induced surge events. This robust device
can safely absorb up to 30A per IEC61000-4-5 (tp=8/20μs)
without performance degradation and a minimum ±30kV
ESD per IEC61000-4-2 international standard. Its low
loading capacitance makes it ideal for high-speed interface
protection.
Features
• Lightning protection,
IEC61000-4-5, 30A
(8/20µs)
• EFT, IEC61000-4-4, 50A
(5/50ns)
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• Low clamping voltage
• Low leakage current
• SOIC-8 surface mount
package (JEDEC MS-012)
• Tertiary (IC Side)
Protection:
- T1/E1/T3/E3
- HDSL/SDSL
- Ethernet
• RS232, RS485
• Video Line Protection
• Security Cameras
• Storage DVRs
• Network Equipment
• Instrumentation, Medical
Equipment
Functional Block Diagram
Pinout
Note: Pinout diagrams above shown as device footprint on circuit board.
SRDA05 Series 8pF 30A Diode Array
SOIC-8 (Top View)
1
2
3
54
6
7
8
I/O 1
I/O 2
I/O 3
I/O 4
Ref 1
Ref 1
Ref 2
Ref 2
I/O 1
I/O 3
I/O 2
I/O 4Ref2
Ref 1
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Application Example
RoHS
Pb
GREEN
14
58
SRDA05-4
T1/E1/T3/E3 Interface Protection
T1/E1/T3/E3
Transceiver
R Tip
R Ring
T Tip
T Ring
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
2
TVS Diode Arrays (SPA® Devices)
Revision: January 21, 2013
Lightning Surge Protection- SRDA05 Series
SRDA05 Series
SP4040
Absolute Maximum Ratings
Symbol Parameter Value Units
Ppk Peak Pulse Power (8/20µs) 600 W
Ipp Peak Pulse Current (8/20µs) 30 A
Top Operating Temperature -40 to °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP = 25°C)
Thermal Information
Parameter Rating Units
SOIC Package 170 °C/W
Operating Temperature Range -40 to °C
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
260 °C
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Stand-Off Voltage VRWM IT≤1µA - - 5.0 V
Reverse Leakage Current IRVR= 5V - - 10 µA
Reverse Breakdown Voltage VBR It = 1mA 6 - - V
Clamping Voltage, Line-Ground1 VCIPP= 1A, tp=8/20 µs - 9.2 - V
Clamping Voltage, Line-Ground1 VCIPP= 2A, tp=8/20 µs - 10.0 - V
Clamping Voltage, Line-Ground1 VCIPP= 10A, tp=8/20 µs - 14.5 - V
Clamping Voltage, Line-Ground1 VCIPP= 25A, tp=8/20 µs - 21.0 - V
Dynamic Resistance, Line-Ground1 RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.8 - Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact Discharge) ±30 - - kV
IEC61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1
CI/O-I/O Reverse Bias=0V - 4.0 - pF
CI/O-GND Reverse Bias=0V - 8.0 - pF
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
1 Parameter is guaranteed by design and/or device characterization.
0.01
0.1
1
10
0.11 10 1001000
Pulse Duration-tp(µS)
Peak Pulse Power-Ppk (kW)
Variation of Capacitance vs. Reverse Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time
0.00.5 1.01.5 2.02.5 3.03.5 4.04.5 5.0
Bias Voltage (V)
Capacitance (pF) Cj(VR)/Cj(VR=0)
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.5
0.8
0.6
0.4
0.2
0.0
125125
125125
3
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Devices)
Revision: January 21, 2013
Lightning Surge Protection- SRDA05 Series
SRDA05
SRDA05 Series
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Ordering Information
Part Number Package Marking Min. Order Qty.
SRDA05-4BTG SOIC-8 LF SRDA05
SYYWW 2500
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0255075 100 12
51
50
Ambient Temperature-TA (oC)
% of Rated Power or IPP
Clamping Voltage vs. IPP
0.00
5.00
10.00
15.00
20.00
25.00
1.010.020.030.0
Peak Pulse Current-I
PP
(A)
Clamp Voltage (V
C
)
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
4
TVS Diode Arrays (SPA® Devices)
Revision: January 21, 2013
Lightning Surge Protection- SRDA05 Series
SRDA05 Series
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package SOIC
Pins 8
JEDEC MS-012
Millimetres Inches
Min Max Min Max
A1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 1.65 0.050 0.065
B0.31 0.51 0.012 0.020
c0.17 0.25 0.007 0.010
D4.70 5.10 0.185 0.201
E5.80 6.20 0.228 0.244
E1 3.80 4.00 0.150 0.157
e1.27 BSC 0.050 BSC
L0.40 1.27 0.016 0.050
o
Recommended
Soldering Pad Outline
(Reference Only)
F
L
Embossed Carrier Tape & Reel Specification — SOIC Package
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D1. 5 1. 6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 +/- 0.20 1.574 +/- 0.008
W11. 9 12.1 0.468 0.476
P7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t0.30 +/- 0.05 0.012 +/- 0.002
User Feeding Direction
Pin 1 Location
Part Numbering System
SRDA 05 B TG
TVS Diode Arrays
(SPA® Devices)
Voltage
Package
B = SOIC-8
T= Tape & Reel
G= Green
4
Channel
4= 4 Channels
Part Marking System
Marking
L
SRDA05
SYYWW
Date code
Pin1
F
