LS4148
500mW
Signal Diode
Quadro MELF
SUGGESTED SOLDER
PAD LAYOUT
Features
• Hermetically sealed glass
• Glass Passivated
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A.130 .146 3.30 3.70
B.008 .016 .20 .40
C.055 .063 1.40 1.60 ∅
D.067 1.70
Maximum Ratings
Reverse Voltage VR75 V
Forward Current IF150 mA
Power Dissipation
3.33mW/OC(25OC) P500 mW
Operating Junction Temp. Tj -65 to 175 OC
Storage Temp. Tstg -65 to 175 OC
Electrical Characteristics @ 25°C Unless Otherwise Specified
Minimum Breakdown
Voltage BV 100V IR=100uA
Peak Forward Surge
Current IFsurge 2.0A Tp=1.0usec.
Maximum Forward
Voltage VF 1.0V IF=10mA
Maximum Reverse
Current IR 0.025uA
5.0uA
50uA
VR=20V
VR=75V
VR=20V,Tj=150OC
Maximum Junction
Capacitance Cj 4.0pF VR=0,
f=1.0MHz
Maximum Reverse
Recovery Time trr 4.0ns
IF=10mA,
VR=6.0V,
IRR=1.0mA,
RL=100 OHM
Maximum Thermal
Resistance* RJA 500OC/W
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
.155”
.022”
.065”
A
B
Cathode Mark
C
D
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: A 2011/01/01
TM
Micro Commercial Components
www.mccsemi.com
1 of 2
•Epoxy meets UL 94 V-0 flammability rating
•Moisture Sensitivity Level 1
•Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
*On PC Board 50mmx50mmx1.6mm
NOT RECOMMENDED FOR NEW DESIGNS
MCC
Revision: A 2011/01/01
TM
Micro Commercial Components
www.mccsemi.com
2 of 2
Device Packing
Part Number-TP Tape&Reel: 2.5Kpcs/Reel
Ordering Information :
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