AP9435GH/J RoHS-compliant Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Low Gate Charge D Simple Drive Requirement Fast Switching G BVDSS -30V RDS(ON) 50m ID - 20A S Description G Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and costeffectiveness device. D S TO-252(H) The TO-252/TO-251 package is widely used for commercial-industrial application. G D S TO-251(J) Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage - 30 V VGS Gate-Source Voltage +20 V ID@TC=25 Continuous Drain Current - 20 A ID@TC=100 Continuous Drain Current -13 A 1 IDM Pulsed Drain Current -60 A PD@TC=25 Total Power Dissipation 12.5 W Linear Derating Factor 0.1 W/ TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-c Parameter Maximum Thermal Resistance, Junction-case 3 Value Units 10 /W Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) 62.5 /W Rthj-a Maximum Thermal Resistance, Junction-ambient 110 /W Data and specifications subject to change without notice 1 200902256 AP9435GH/J Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=-250uA -30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V, ID=-10A - - 50 m VGS=-4.5V, ID=-5A - - 90 m VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance VDS=-10V, ID=-10A - 10 - S IDSS Drain-Source Leakage Current VDS=-30V, VGS=0V - - -1 uA Drain-Source Leakage Current (T j=125 C) VDS=-24V, VGS=0V - - -250 uA Gate-Source Leakage VGS=+ 20V, VDS=0V - - +100 nA ID=-10A - 8 16 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=-24V - 1.6 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 4.3 - nC VDS=-15V - 6.3 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-10A - 46 - ns td(off) Turn-off Delay Time RG=3.3,VGS=-10V - 20 - ns tf Fall Time RD=1.5 - 7.4 - ns Ciss Input Capacitance VGS=0V - 570 740 pF Coss Output Capacitance VDS=-25V - 80 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 75 - pF Min. Typ. IS=-5A, VGS=0V - - -1.3 V IS=-10A, VGS=0V, - 18 - ns dI/dt=-100A/s - 10 - nC Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Max. Units Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9435GH/J 70 80 T C =25 o C -10V o T C =150 C -8.0V 60 -ID , Drain Current (A) -ID , Drain Current (A) 60 -6.0V 40 -4.5V 20 -10V 50 -8.0V 40 -6.0V 30 -4.5V 20 V G =-4.0V V G =-4.0V 10 0 0 0 2 4 6 8 10 0 Fig 1. Typical Output Characteristics 4 6 8 Fig 2. Typical Output Characteristics 1.8 90 I D =-10A T C =25 I D = -10A V G =-10V 1.6 Normalized RDS(ON) 80 RDS(ON) (m) 2 -V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V) 70 60 1.4 1.2 50 1.0 40 0.8 30 0.6 2 4 6 8 -50 10 -V GS , Gate-to-Source Voltage (V) 100 150 T j , Junction Temperature ( C) Fig 4. Normalized On-Resistance v.s. Junction Temperature 2 8 1.8 -VGS(th) (V) 10 6 -IS(A) 50 o Fig 3. On-Resistance v.s. Gate Voltage T j =150 o C 0 T j =25 o C 4 2 1.6 1.4 1.2 0 1 0 0.2 0.4 0.6 0.8 1 1.2 -V SD , Source-to-Drain Voltage (V) Fig5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9435GH/J f=1.0MHz 1000 I D =-10A V DS =-24V 10 Ciss 8 C (pF) -VGS , Gate to Source Voltage (V) 12 6 100 Coss Crss 4 2 0 10 0 4 8 12 16 20 1 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 -V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 10 -ID(A) 100us 1ms 10ms 100ms DC 1 o T C =25 C Single Pulse Normalized Thermal Response (Rthjc) 100 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM 0.02 t T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1 -V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG -4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4