(Page 1/17) HGDEST021B Standard Specification This specification is subject to change without notice. DSGD. 2010-02-09 M.YAMAZAKI 6 1 SYMB. Taping dimensions change etc. Change of record CHKD. 2010-02-09 MY APPD. 2010-02-09 K.SESHIMO 2011-07-25 TO Date KS APPD. CHKD. DSGD. T.ONODERA (Page 2/ ) Asking that exports this product For the export of products which are controlled items subject to foreign and domestic export laws and regulations, you must obtain approval and/or follow the formalities of such laws and regulations. Products must not be used for military and/or antisocial purposes such as terrorism, and shall not be supplied to any party intending to use the products for such purposes. AV Unless provided otherwise, the products have been designed and manufactured for application to equipment and devices which are sold to end-users in the market, such as AV (audio visual) equipment, home electric equipment, office and commercial electronic equipment, information and communication equipment or amusement equipment. The products are not intended for use in, and must not be used for, any application of nuclear equipment, driving control equipment for aerospace or any other unauthorized use. With the exception of the above mentioned banned applications, for applications involving high levels of safety and liability such as medical equipment, burglar alarm equipment, disaster prevention equipment and undersea equipment, please contact an Alps sales representative and/or evaluate the total system on the applicability. Also, implement a fail-safe design, protection circuit, redundant circuit, malfunction protection and/or fire protection into the complete system for safety and reliability of the total system. Before using products which were not specifically designed for use in automotive applications, please contact an Alps sales representative. Magnetic Sensor Specifications 1. ALPS product No. HGDEST021B 2. Application This specifications applies to single polarity single output type for Magnetic sensor, switching output type. 1 3. Content of specifications 3-1. Electric/Magnetic specification page 4 , 5 3-2. Functional block diagram page 5 3-3. Full view, Laser marker , page 6 , 7 3-4. Inner Structure and Cross Section page 8 3-5. Reliability specification page 9, 10 3-6. Soldering conditions (Recommendation) page 11 3-7. Packing specification page 12 - 16 Reference page 17 (Page 3/ ) Magnetic Sensor Specifications (Page 4/ ) 3-1. Electric/Magnetic specification (1). Absolute Maximum Ratings Item Symbol Supply voltage VDD Output Iout Operating Temperature Range Topr Storage Temperature Tstg Unit. Specification Min. Typ. Max. V -0.3 - 4.0 mA -0.5 - +0.5 -40 - +85 -40 - +125 Condition (2). VDD=1.8V/3.0V Ta=25 Electric/Magnetic specification @VDD=1.8V/3.0V Ta=25 Specification Item Symbol Unit. Condition Min. Typ. Max. Supply voltage VDD V 1.6 1.8 3.6 Supply current Drive pulse period Pulse width Operating Temperature Range Output voltage Operating Magnetic Field IDD - 3 5 - 5 9 A Tp ms 30 50 100 Td s 15 25 50 - -40 25 85 VDD-0.2 0 1.3 0.5 2.0 1.2 VDD 0.2 2.7 1.9 V Hi V Low Hon(+) Hoff(+) V mT VDD:1.8V () VDD:1.8V (Average) VDD:3.0V () VDD:3.0V (Average) Io=0.5mA Io=0.5mA Ta=25 VDD1.8V/3.0V Magnetic Sensor Specifications (Page 5/ ) IDD Pulse Driving MAX 5.0mA@1.8V Top view GND 3 [OUT] +H SOT 0 Direction of magnetic field 3-2. Low 1 VDD (1). Hoff Hon +H 2 OUT Functional Block Diagram Interval Switch VDD CLK Input Function Amp Latch OUT GND (2). Circuit condition GND 3 0.1F Bypass Capacitor GND VDD 1 VDD OUT 2 Magnetic Sensor Specifications (Page 6/ ) [] Side view 3-3. (1) Full view Unit [mm] [] Top view [] Front view Note 1. XY Max. 0.1mm Cap offset : Max. 0.1mm both of XY. [] Bottom view [] 2. Max. 0.1mm Unevenly of lead length : Max. 0.1mm Pin No. Name 1pin VDD 2pin OUT 3pin GND Recommended Mount Pad Dimension of Resist-open. Unit [mm] ( ( ) ) The dimensions assume it reference value. Function Supply Voltage Output Voltage GND Magnetic Sensor Specifications (Page 7/ ) 3-3. (2) Laser Marking specifications : 10:6 Character type: Helvetica medium condensation part correction (2)-1. Layout Character fineness ratio 10:6 Unit [mm] PKG Markings on the PKG Top surface. (2)-2. Content of indication No. Laser Marking No. Indication item Wafer No. Product Division mark Content of indication Wafer No. 219, AZ shows Wafer No. by two digits (figure 1-9 and alphabet AZ combinations). HGDEST021B"AD" 12.0mT HGDEST021B is marked as "AD". It indicates type of Single Polarity Single output sensor, and Hon is 2.0mT. Magnetic Sensor Specifications (Page 8/ ) 3-4. Inner Structure and Cross Section Internal structural figure seen from the back Chip Au wire Lead Frame Lead plating Mold Resin Ag paste / Parts name Material name Chip Si Ag paste Ag Lead Frame Cu Wire Bonding Au wire Au Molding Mold Resin Epoxy Lead plating Nonleaded solder Sn-Bi Process Die-mount Magnetic Sensor Specifications 3-5. Reliability specification (1). Pre-treatment of Reliability Test sample 125x24Hr (855855%)x168Hr + 2 Baking 125x24Hr Moisture absorption (855855%)x168Hr + Reflow 2times Temperature() Pre-treatment Reflow condition Pre heat 60180sec T min: 150 Tp : 260 TL : 220 tL : 60150sec Ts max: 200 Heating Time (Page 9/ ) Magnetic Sensor Specifications (Page 10/ ) (2). Criterion Hon Hoff VDD Voltage (3). 0.2V max VDD-0.2V min Test contents Parameter Conforming standard Test Condition Test Time / Qty./Pretreat JEITA ED-4701 / 100-103 1000Hr 22 / 1000Hr 22 / 1000Hr 22 / x 1000Hr 22 / 1000Hr 22 / x 1000Hr 22 / 50cycles 22 / --- 11 / High Humidity High Temp. High Temp. Bias High Temp. Storage High Temp. High Humidity Bias Low Temp. strage Low Temp. Bias Thermal cycle Reflow --JEITA ED-4701 / 100-201 JEITA ED-4701 / 100-102 JEITA ED-4701 / 200-202 --JEITA ED-4701 / 100-105 --- +855 +855 +855 855% VDD=3.6V VDD=3.6V (bias) +1255 +855 855% VDD=3.6V +855 855% VDD=3.6V (bias) -405( 1Hr ) -405 (test operated after leave 1hour normal temp ) -405 VDD=3.6V -405 VDD=3.6V (bias) -405[30min](normal temp)[5min]+1255 [30min](normal temp)[5min] : 1cycle 2 2times 105510Hz 1min Vibration () ESD (HBM) () ESD (MM) Impact Substrate bending test Electrode clinging test --JEITA ED-4701 / 300-304 JEITA ED-4701 / 300-305 JEITA ED-4701 / 400-404 JEITA ED-4702 JEITA ED-4702 Sweeping rate=10->55->10[Hz] 1min X,Y,Z 2 11 / Amplitude=1.5[mm], Direction=XYZ , 2hours Direction=XYZ , each 2hours 1000V 100pF 1.5k --- 5/x --- 5/x --- 11 / 1500cycles 5/ --- 5/ 1.5mm X,Y,Z 2 200V 200pF 0 5 200V 200pF 0 Five times of each terminal 100G 6msec X Y Z 3 100G 6msec Three times in XYZ direction 3mm/1s 1mm/s 3mm, Hold=1[sec], bend speed=1[mm/s] 5N/10s Magnetic Sensor Specifications 3-6. Soldering conditions (Recommendation) Temperature Peak temperature Pre-Heat Heating Time (Page 11/ ) Magnetic Sensor Specifications (Page 12/ ) 3-7. Packing specification (1). Component orientation Emboss Tape Feeding direction Product (2). Feeding direction Barcode Label Feeding direction (3). -1 1 Trailer area Taping-1 Storage area Empty area Cover tape area End tape 1 *JIS C 0806 It conforms to JIS C 0806. * Missing components 0.1% 0.1% or less of non consecutive missing components shall be allowed, except leader and trailer area. Consecutive missing component shall not be allowed, except leader and trailer area. Replacement of defective components shall be allowed. Magnetic Sensor Specifications (Page 13/ ) (4). -2 : Taping-2 : Mending Cut the cover-tape around PKG that is required to mend. Cutting shape shall be "" Turn over the tape and replace PKG. Return a piece of cover-tape, then cover the replaced portion by mending tape. 5chip Length of mending tape shall cover 5pcs of both sides including replaced component. Cover the enough cutting area by mending tape. Emboss Tape Direction of winding up Cut shape "" 5Chip Topcover Tape Mendingtape 5Chip Heat press bonding area (5). Peel strength 300mm/min 0.1N(10g)0.7N(70g) Peel strength of cover tape shall be 0.1N(10g)0.7N(70g) for 300mm/min. Peeling direction of Topcover tape The emboss tape is fixed. (6). Topcover tape offset Emboss tape Emboss tape Topcover tape A = MAX 0.5mm B = MAX 0.5mm Discrepancy to sending hole Bulge of top cover tape Magnetic Sensor Specifications (Page 14/ ) (7)-1. Packing .3,000 This product is delivered by the taping wrapping (3,000 pieces/reel). . This product is delivered by a non damp-proof packing. . The barcode label is put on each reel. .1( 3,000pcs/ ) 1 reel stored in the carton box. ( carton/with 3,000pcs) . This packing form is adopted to the shipment in Japan (7)-2. 1 Packing .3,000 This product is packed by tape wrapping (3,000 pcs/reel). . The barcode label is put on each reel. .11Bag One reel is stored in one Bag. .Bag15( max. 45,000pcs/ ) 15 bags are put in 1 carton ( max. 45,000pcs/carton) . The cushion is stored in the top and bottom of the carton. . This packing form is adopted to the shipment to overseas. Cushion C-3 C-3 lavel Bag * Dimension of carton Cushion (8). Recommended storage condition 30- 85% 1 30- 85%, less than 1year (9). Stacking height of carton Shipment to Japan 10max Shipment to Overseas 5max Maximum 10cartons Maximum 5cartons Magnetic Sensor Specifications (10). Bar code label specification (10)-1. Bar code specification Content Spec Kind of code 39 Code39 0.2mm Thickness of minute bar 0.2mm or less : Ratio 1 : 2.2 (10)-2. Content of label indication 1 1 (11). Components for packing Common Component Emboss tape Material PS() Polystyren (Conductive) PS() TopCover Tape Reel Barcode Label End Tape Japan Component Carton Overseas Component Bag Carton Cushion Hot gluing film (Electrification prevention) PS Conductive reel(Black) EIAJ-C-3 C-3 Label Paper 1 Material Cardboard Material Polystyren (Antistatic treatment) () Corrugated cardboard 4mm t=4mm (Page 15/ ) Magnetic Sensor Specifications (Page 16/ ) (12). (13). Emboss Tape Dimensions Reel dimension : EIAJ-RRM08BC Unit [mm] Unit [mm] Magnetic Sensor Specifications (Page 17/17 ) Reference Precautions 1. Storage Environment Products should be stored at an appropriate temperature and humidity (Recommended storage condition). Keep products away from chlorine and corrosive gas. There is a thing that influences product features when keeping it in an improper environment. 1 2. 1 Long-term Storage Long-term storage may result in poor lead solder ability and degraded electrical performance even under proper conditions. For those parts that are stored more than one year, solder ability should be checked before use. For storage longer than one year, storage in a nitrogen atmosphere is recommended. The product's leads can be oxidized by atmospheric oxygen resulting in decreased solder ability.