Dec-15-2003
1
BBY51...
Silicon Tuning Diode
• High Q hyperabrupt tuning diode
• Designed for low tuning voltage operation
• For VCO's in mobile communications equipment
BBY51 BBY51-02L
BBY51-02W
BBY51-03W
3
1
D 2
2
D 1
1 2
Type Package Configuration LS(nH) Marking
BBY51
BBY51-02L*
BBY51-02W
BBY51-03W
SOT23
TSLP-2-1
SCD80
SOD323
common cathode
single, leadless
single
single
2
0.4
0.6
1.8
S3s
II
II
H
* Preliminary
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR7 V
Forward current IF20 mA
Operating temperature range Top -55 ... 125 °C
Storage temperature Tstg -55 ... 150
Dec-15-2003
2
BBY51...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current
VR = 6 V
VR = 6 V, TA = 85 °C
IR
-
-
-
-
10
200
nA
AC Characteristics
Diode capacitance
VR = 1 V, f = 1 MHz
VR = 2 V, f = 1 MHz
VR = 3 V, f = 1 MHz
VR = 4 V, f = 1 MHz
CT
5.05
3.4
2.7
2.5
5.4
4.2
3.5
3.1
5.75
5.2
4.6
3.7
pF
Capacitance ratio
VR = 1 V, VR = 4 V, f = 1 MHz
CT1/CT4 1.55 1.75 2.2
Capacitance difference
VR = 1 V, f = 1 MHz, VR = 4 V
C1V-C3V 1.4 1.78 2.2 pF
Capacitance difference
VR = 3 V, f = 1 MHz, VR = 4 V
C3V-C4V 0.3 0.5 0.7
Series resistance
VR = 1 V, f = 1 GHz
rS- 0.37 - Ω
Dec-15-2003
3
BBY51...
Diode capacitance CT = ƒ (VR)
f = 1MHz
V
EHD07128
R
T
C
00V
pF
2
4
6
8
10
2 4 6
Temperature coefficient of the diode
capacitance TCc = ƒ (VR)
123456V8
VR
-5
10
-4
10
-3
10
1/°C
TCc
Package SCD80
Package Outline
Foot Print
Marking Layout
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.7
0.3
1
2
marking
Cathode
0.8
±0.1
10
˚
MAX.
±0.1
0.7
±0.1
1.3 7
˚
0.13
±0.05
+0.05
-0.03
±1.5
˚
0.2
M
A
A
±0.05
0.2
0.35
0.35
1.45
Type code
Laser marking
Date code
BAR63-02W
Cathode marking
2003, July
Example
0.9
0.4 0.7
8
4
1.45
0.2
2.5
Cathode
marking
Package SCD80
62
Data Code marking for discrete packages with
one digit (SCD80, SC79) CES-Code
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02b q BQb qBQb q BQ
03crCRcrCRcrCR
04d sDSd sDSd sDS
05etETetETetET
06fuFUfuFUfuFU
07g v GVg v GVg v GV
08hxHXhxHXhxHX
09j y JYj y JYj y JY
10kzKZkzKZkzKZ
11l 2L4 l 2L4 l 2L4
12n3N5n3N5n3N5
Package SOD323
2
1
Cathode
marking
0
1.25
1.7
-0.1
±0.2
2.5
0.3
0.15 -0.06
DIN 6784
acc. to
+0.15
A
M
0.25
+0.1
-0.1
+0.2
+0.2
±0.05
+0.1
-0.05
-0.1
+0.2
0.9
0.3
A
-0.2
+0.05
1.7
0.6
0.8
0.8
Type code
Laser marking
BAR63-03W
Cathode marking
Example
0.2
4
8
2.9
1
2
1.35
0.65
Cathode
marking
Package Outline
Foot Print
Marking Layout
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
Package SOT23
Package Outline
Foot Print
Marking Layout
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
2.6 MAX.
0.25
M
BC
1.9
-0.05
+0.1
0.4 1
A
2
±0.1
3
2.9
DIN 6784
+0.2
acc. to
0.95
C
B
2
˚
30
˚
0.20
...
M
A
0.1 MAX.
10
˚
0.08...0.15
1.1 MAX.
1.3
±0.1
MAX.
10
˚
MAX.
0.8
1.2
0.91.10.9
0.8
Manufacturer
Date code (Year/Month)
Type code
2003, July
BCW66
Example
Pin 1
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Package TSLP-2-1
Code E6327: Reel ø180 mm = 15.000 Pieces/Reel
1
2
0.45
0.275
0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
Type code
Laser marking
Example
BAS16-02L
Cathode marking
0.76
4
1.16
8
0.5
Cathode
marking
Package Outline
Foot Print
Marking Layout
Packing
±0.035
0.5
0.65
±0.035
0.25
±0.035
0.25
0.4
0.05 MAX.
+0.05
Cathode
marking
2
1
1)
1)
1)
S
1) Dimension applies to plated terminals
0.03 S0.05
2x
0.6 A
0.05
0.1 B
M
A
B
M
0.1 A
B
1
B
M
0.1 A
±0.035
0.5
1)
M
0.1 BA
Top view Bottom view
2x
Impressum
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
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For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
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Life support devices or systems are intended to be implanted in the human body, or
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