SPEC NO:DSAC1537 REV NO: V.1 DATE: DEC/12/2002 PAGE: 1 OF 4
APPROVED: J.Lu CHECKED:Allen Liu DRAWN: X.T.HU
3.2x1.6mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!3.2mmx1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE : 2000PCS / REEL.
Package Dimensions
AP3216SEC/E HYPER ORANGE
Description
The Hyper Orange source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
SPEC NO:DSAC1537 REV NO: V.1 DATE: DEC/12/2002 PAGE: 2 OF 4
APPROVED: J.Lu CHECKED:Allen Liu DRAWN: X.T.HU
Electrical / Optical Characteristics at TA=25°°
°°
°C
Absolute Maximum Ratings at TA=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
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SPEC NO:DSAC1537 REV NO: V.1 DATE: DEC/12/2002 PAGE: 3 OF 4
APPROVED: J.Lu CHECKED:Allen Liu DRAWN: X.T.HU
Hyper Orange AP3216SEC/E
SPEC NO:DSAC1537 REV NO: V.1 DATE: DEC/12/2002 PAGE: 4 OF 4
APPROVED: J.Lu CHECKED:Allen Liu DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AP3216SEC/E
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
