TVS Diode Array (SPA ® Diodes)
Enhanced ESD Discrete TVS Series
- SP3522
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/28/20
Applications
• Ultra-high speed data
lines
• USB 3.1, 3.0, 2.0
• HDMI 2.0, 1.4a, 1.3
• DisplayPort(TM)
• V-by-One®
• LVDS interfaces
• Consumer, mobile and
portable electronics
• Tablet PC and external
storage with high speed
interfaces
• Applications requiring
high ESD performance in
small packages
Functional Block Diagram
1
2
1
2
Unidirectional Bidirectional
SP3522 0.15pF 22kV ESD Protection diodes
Description
The SP3522 integrates ultra low capacitance diodes to
provide protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). This
robust component can safely absorb repetitive ESD strikes
above the maximum level specified in the IEC 61000-4-2
international standard (±8kV contact discharge) without
performance degradation. The extremely low loading
capacitance also makes it ideal for protecting high speed
signal pins such as V-By-One®, HDMI, USB3.0, USB2.0,
and IEEE 1394.
Features
ELV
RoHS
Pb
GREEN
• ESD, IEC 61000-4-2,
±22kV contact, ±22kV air
• EFT, IEC 61000-4-4, 40A
(tP=5/50ns)
• Lightning, IEC 61000-
4-5, 2nd edition, 2.5A
(tP=8/20μs)
• Low capacitance of
0.15pF (TYP) at 3GHz
• Low profile 0201 DFN
packages and SOD882
packages
• Facilitates excellent signal
integrity
• ELV Compliant
• AEC-Q101 qualified
• Halogen free, Lead free
and RoHS compliant
• Moisture Sensitivity
Level(MSL -1)
Pinout
Bottom View
1
2
1
2
SOD8820201 DFN
TVS Diode Array (SPA ® Diodes)
Enhanced ESD Discrete TVS Series
- SP3522
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/28/20
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those
indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 2.5 A
TOP Operating Temperature -45 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics - (TOP=25°C)
Parameter Test Conditions Min Ty p Max Units
Input Capacitance @ VR = 0V, f = 3GHz 0.15 pF
Breakdown Voltage VBR @ IT=1mA 9.2 V
Reverse Working Voltage IR≤1μA 7. 0 V
Reverse Leakage Current IL @ VRWM=5.0V 0.02 1 μA
Dynamic Resistance2 TLP, tP=100ns, I/O to GND 0.96 Ω
Clamping Voltage1VCL @ IPP=2.5A 14.5 V
ESD Withstand Voltage1IEC 61000-4-2 (Contact) ±22 kV
IEC 61000-4-2 (Air) ±22
Note:
1. Parameter is guaranteed by design and/or component characterization.
2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Clamping Voltage vs IPP
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
11.5 22.5
8/20μs Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
TVS Diode Array (SPA ® Diodes)
Enhanced ESD Discrete TVS Series
- SP3522
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/28/20
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
re
h
eat
Ramp-up
R
am
p
-u
p
Ramp-down
R
amp-
d
o
w
Critical Zone
T
L to TP
C
ritical Zon
e
T
L
to
T
P
Soldering Parameters
IEC 61000−4−2 +8 kV Contact ESD Clamping Voltage IEC 61000−4−2 -8 kV Contact ESD Clamping Voltage
Positive Transmission Line Pulsing (TLP) Plot
0
5
10
15
20
25
30
35
40
0 5 10 15 20 25 30 35 40 45 50 55
TLP Voltage (V)
TLP Current (A)
Negative Transmission Line Pulsing (TLP) Plot
-40
-35
-30
-25
-20
-15
-10
-5
0
-55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0
TLP Voltage (V)
TLP Current (A)
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
TVS Diode Array (SPA ® Diodes)
Enhanced ESD Discrete TVS Series
- SP3522
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/28/20
Package Dimensions — 0201 DFN
Symbol Millimeters Inches
Min Typ. Max Min Typ. Max
A0.23 0.28 0.33 0.009 0.011 0.013
A1 0.00 0.02 0.05 0.000 0.001 0.002
L1 0.12 0.18 0.24 0.005 0.007 0.009
L2 0.18 0.24 0.30 0.007 0.009 0.012
D0.55 0.60 0.65 0.022 0.024 0.026
E0.25 0.30 0.35 0.010 0.012 0.014
e0.35 (BSC) 0.014 (BSC)
h0.05 ( x 45° ) 0.002 ( x 45° )
D
E
PIN1
Top View Bottom View
Side View
e
L2
L1
A
A1
Side View
1
h
Recommended soldering pad layout
Package outline
0.14mm
0.32mm
0.24mm
Package Dimensions — SOD882
Symbol Millimeters Inches
Min Typ. Max Min Typ. Max
A0.40 0.45 0.50 0.016 0.018 0.020
A1 0.00 0.02 0.05 0.000 0.001 0.002
L1 0.20 0.25 0.30 0.008 0.010 0.012
L2 0.45 0.50 0.55 0.018 0.020 0.022
D0.90 1. 0 0 1. 10 0.035 0.039 0.043
E0.50 0.60 0.70 0.020 0.024 0.028
e0.65 (BSC) 0.026 (BSC)
h0.125 ( x 45° ) 0.005 ( x 45° )
D
E
PIN1
Top View Bottom View
Side View
1
L2
L1
e
A
A1
h
Recommended soldering pad layout
0.30mm0.40mm
1.10mm
0.65mm
Package outline
Part Numbering System
Part Marking System
+
SP 3522 01 U T G
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA Diodes)
U: 0201 DFN
E: SOD882
®
Ordering Information
Part Number Package Min. Order Qty.
SP3522-01UTG 0201 DFN 15000
SP3522-01ETG SOD882 10000
TVS Diode Array (SPA ® Diodes)
Enhanced ESD Discrete TVS Series
- SP3522
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/28/20
Embossed Carrier Tape & Reel Specification — 0201 DFN
K0
B0
T
W
P1
P0 P2 D0
F
D1
E1
A0
Symbol Millimeters
A0 0.33 min/0.41 max
B0 0.63 min/0.71 max
D0 ø 1.50 +0.10/ -0
D1 ø 0.20 +/- 0.05
E1 1.75+/-0.10
F3.50+/-0.05
K0 0.30 min/0.39 max
P0 4.00+/-0.10
P1 2.00+/-0.10
P2 2.00+/-0.05
W8.00+0.30/-0.10
T0.13 min/0.25 max
Embossed Carrier Tape & Reel Specification — SOD882
Symbol Millimeters
A0 0.70+/-0.045
B0 1.10+/-0.045
K0 0.65+/-0.045
F3.50+/-0.05
P1 2.00+/-0.10
W8.00 + 0.30 -0.10
,Ref.
,Ref.
,Ref.
8mm TAPE AND REEL
,Ref.
,Ref.
,Ref.
Device Orientation in Tape
Pin 1 Location
Device Orientation in Tape
Pin 1 Location
8mm TAPE AND REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
