CREAT BY ART
- Low profile package
- Ideal for automated placement
- Glass passivated junction
- Excellent clamping capability
- Halogen-free according to IEC 61249-2-21
Molding compound, UL flammability classification rating 94V-0
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL UNIT
P
PK
W
P
D
W
T
J
°C
T
STG
°C
Document Number: DS_D1502001 Version: D15
Storage temperature range - 55 to +175
Note 1: Non-repetitive current pulse per fig. 3 and derated above T
A
=25°C per fig. 2
°C/W
R
θJA
R
θJL
Typcial thermal resistance 56
20
Operating junction temperature range - 55 to +175
Peak power dissipation at T
A
=25°C, tp=1ms(Note 1) 600
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
50 A
Steady state power dissipation 4
MECHANICAL DATA
Case: DO-214AC (SMA)
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER Value
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC DO-214AC (SMA)
SMA6J SERIES
Taiwan Semiconductor
600W, 10V - 30V Surface Mount Transient Volta
g
e Su
pp
ressor
FEATURES
- Fast response time: typically less than 1.0ps
- 600 watts peak pulse power capability with a
10 / 1000 μs waveform
CREAT BY ART
Note 1: "xx" defines voltage from 10V (SMA6J10A) to 30V (SMA6J30A)
Note 2: Whole series with green compound
PART NO.
Document Number: DS_D1502001 Version: D15
1,800 / 7" Plastic reel
PACKING
ORDERING INFORMATION
SMA6JxxA
(Note 1, 2)
PART NO.
PACKING CODE PACKING CODE
SUFFIX DESCRIPTION
PART NO.
SUFFIX
EXAMPLE
7,500 / 13" Plastic reel
7,500 / 13" Paper reel
SMA6J10AHR3G SMAJ26A H R3 G AEC-Q101 qualified
Green compound
G
SMA
R2 SMA
M2 SMA
EXAMPLE P/N
RATINGS AND CHARACTERISTICS CURVES (T
A
=25°C unless otherwise noted)
H
R3
SMA6J SERIES
Taiwan Semiconductor
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX PACKAGE
0
10
20
30
40
50
1 10 100
IFSM, PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT UNIDIRECTIONAL ONLY
8.3ms single half sine wave
0
20
40
60
80
100
120
140
00.511.522.533.54
PEAK PULSE CURRENT (%)
t, TIME ms
FIG. 3 CLAMPING POWER PULSE WAVEFORM
td
Peak value
IPPM
tr=10
μ
s
Half value-IPPM/2
10/1000μs, waveform
as defined by R.E.A.
Pulse width(td) is defined
as the point where the peak current
decays to 50% of IPPM
10
100
1000
10000
1 10 100
CJ, JUNCTION CAPACITANCE (pF) A
V(BR), BREAKDOWN VOLTAGE (V)
FIG. 4 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
0.1
1
10
100
0.1 1 10 100 1000 10000
PPPM, PEAK PULSE POWER, KW
tp, PULSE WIDTH, (μs)
FIG. 1 PEAK PULSE POWER RATING CURVE
Non-repetitive
pulse wave from
shown in fig.3
CREAT BY ART
Test Maximum
Current Reverse Leakage
I
T
@ V
WM
Min Max (mA) I
D
(uA)
SMA6J10A 6AX 10 11.1 12.3 1 15.7 38.2 5.0
SMA6J11A 6AZ 11 12.2 13.5 1 17.2 34.8 5.0
SMA6J12A 6BE 12 13.3 14.7 1 18.8 31.9 1.0
SMA6J13A 6BG 13 14.4 15.9 1 20.4 29.4 1.0
SMA6J15A 6BM 15 16.7 18.5 1 23.6 25.4 1.0
SMA6J16A 6BP 16 17.8 19.7 1 25.2 23.8 1.0
SMA6J17A 6BR 17 18.9 20.9 1 26.7 22.5 1.0
SMA6J18A 6BT 18 20 22.1 1 28.3 21.2 1.0
SMA6J20A 6BV 20 22.2 24.5 1 31.4 19.1 1.0
SMA6J22A 6BX 22 24.4 26.9 1 34.5 17.4 1.0
SMA6J24A 6BZ 24 26.7 29.5 1 37.8 15.9 1.0
SMA6J26A 6CE 26 28.9 31.9 1 40.9 14.7 1.0
SMA6J28A 6CG 28 31.1 34.4 1 44.0 13.6 1.0
SMA6J30A 6CK 30 33.3 36.8 1 48.4 12.3 1.0
Document Number: DS_D1502001 Version: D15
SMA6J SERIES
Taiwan Semiconductor
Device
Device
Marking
Code
Working
Peak
Reverse
Voltage
V
WM
(V)
Breakdown Voltage
Maximum
Clamping
Voltage at I
PPM
Vc (V)
Maximum
Peak Pulse
Surge Current
I
PPM
(A)
V
BR
(V)
at I
T
Min Max Min Max
A 1.27 1.58 0.050 0.062
B 4.06 4.60 0.160 0.181
C 2.29 2.83 0.090 0.111
D 1.99 2.50 0.078 0.098
E 0.90 1.41 0.035 0.056
F 4.95 5.33 0.195 0.210
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
P/N = Device Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1502001 Version: D15
MARKING DIAGRAM
Unit (inch)
0.066
0.060
0.155
0.095
0.215
C3.93
D2.41
E5.45
SUGG ESTED PAD LAY OUT
Symbol Unit (mm)
A1.68
B1.52
SMA6J SERIES
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
DO-214AC (SMA)
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1502001 Version: D15
SMA6J SERIES
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
