MSMCG5.0A thru MXLSMCG170CA, e3 Available Surface Mount 1500 Watt Transient Voltage Suppressor Screening in reference to MIL-PRF-19500 available DESCRIPTION The MSMCG5.0A thru MXLSMCG170A series of 1500 watt high-reliability controlled Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. Its gull-wing design (SMCG) in the DO-215AB package allows for visible solder connections. Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are available in a variety of screened versions. They can protect from secondary lightning effects per IEC61000-4-5 and class levels defined herein, or for inductive switching environments and induced RF protection. Since their response time is virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. Microsemi also offers numerous other products to meet higher and lower power voltage regulation applications. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * * * * * * * * High reliability controlled devices with fabrication and assembly lot traceability. 100% surge tested devices. 3 lot norm screening performed on Standby Current ID. Available in both unidirectional and bidirectional construction. Moisture classification is "Level 1" with no dry pack required per IPC/JEDEC J-STD-020B. Other screening options are available in reference to MIL-PRF-19500. (See part nomenclature for all available options). Refer to MicroNote 129 for more details on the screening options. RoHS compliant versions available. Axial-lead equivalent packages for thru-hole mounting are available as 1.5KE6.8A to 1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (contact Microsemi for other surface mount options). DO-215AB Gull-wing Package NOTE: All SMC series are equivalent to prior SMM package identifications. Also available in: Commercial DO-215AB package (Gull-Wing surface mount) SMCG5.0A thru SMCG170CAe3 Commercial DO-214AB package (J-bend surface mount) SMCJ5.0A thru SMCJ170CAe3 Hi-Rel DO-214AB package (J-bend surface mount) MSMCJ5.0A thru MXLSMCJ170CAe3 APPLICATIONS / BENEFITS * * * * * Protection from switching transients and induced RF. Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4. Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MSMCG 5.0A to MXLSMCG 170A or CA Class 2: MSMCG 5.0A to MXLSMCG 150A or CA Class 3: MSMCG 5.0A to MXLSMCG 75A or CA Class 4: MSMCG 5.0A to MXLSMCG 36A or CA Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: MSMCG 5.0A to MXLSMCG 90A or CA Class 2: MSMCG 5.0A to MXLSMCG 45A or CA Class 3: MSMCG 5.0A to MXLSMCG 24A or CA Class 4: MSMCG 5.0A to MXLSMCG 11A or CA Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance: Class 2: MSMCG 5.0A to MXLSMCG 22A or CA Class 3: MSMCG 5.0A to MXLSMCG 10A or CA RF01001, Rev. A (xxxx) (c)2012 Microsemi Corporation MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 6 MSMCG5.0A thru MXLSMCG170CA, e3 MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead (1) Thermal Resistance Junction-to-Ambient Peak Pulse Power dissipation @ 25 C (at 10/1000 s, see Figures 1, 2, and 3) Impulse Repetition Rate (duty factor) tclamping (0 volts to V(BR) min.) Unidirectional Bidirectional Off-State Power Dissipation TL = +30 C TA = +25 C (2) Maximum Forward Surge Current Solder Temperature @ 10 s Symbol TJ and TSTG RJL RJA PPP Value -65 to +150 20 80 1500 Unit C C/W C/W W df tclamping 0.01 <100 <5 6 (1) 1.56 200 260 % ps ns W PD IFSM TSP A (pk) o C Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page). 2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only). MECHANICAL and PACKAGING * * * * * * * CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0. TERMINALS: Gull-wing, tin-lead (90% Sn, 10% Pb) or RoHS compliant annealed matte-tin (100% Sn) plating. Solderable to MIL-STD-750, method 2026. MARKING: Part number marked on package. POLARITY: Cathode indicated by band. No cathode band on bi-directional devices. TAPE & REEL option: Standard per EIA-481-2 with 12 mm tape (add "TR" suffix to part number). Consult factory for quantities. WEIGHT: 0.25 grams (approximate). See Package Dimensions on last page. PART NOMENCLATURE MX SM C G 5.0 C A Reliability Level M (controlled product) MA (Avionics grade) MX (reference JANTX) MXL (MX Lite) e3 RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant +/- 5% Tolerance Level Surface Mount Package Uni/Bidirectional C = Bidirectional Blank = Unidirectional 1500 W Power Level Reverse Stand-Off Voltage (see Electrical Characteristics table) Gull-wing Lead Frame RF01001, Rev. A (xxxx) (c)2012 Microsemi Corporation Page 2 of 6 MSMCG5.0A thru MXLSMCG170CA, e3 SYMBOLS & DEFINITIONS Definition Symbol I(BR) ID IF IO IPP PPP VC V(BR) VWM Breakdown Current: The current used for measuring breakdown voltage V(BR). Standby Current: The current at the rated standoff voltage (VWM). Forward Current: The forward current dc value, no alternating component. Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180 degree conduction angle. Peak Impulse Current: The peak current during the impulse. Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP. Maximum Clamping Voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions. Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as standoff voltage. ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated MICROSEMI PART NUMBER REVERSE STAND-OFF VOLTAGE VWM MSMCG5.0A MSMCG6.0A MSMCG6.5A MSMCG7.0A MSMCG7.5A MSMCG8.0A MSMCG8.5A MSMCG9.0A MSMCG10A MSMCG11A MSMCG12A MSMCG13A MSMCG14A MSMCG15A MSMCG16A MSMCG17A MSMCG18A MSMCG20A MSMCG22A MSMCG24A MSMCG26A MSMCG28A MSMCG30A MSMCG33A MSMCG36A MSMCG40A MSMCG43A MSMCG45A MSMCG48A MSMCG51A MSMCG54A MSMCG58A MSMCG60A MSMCG64A MSMCG70A MSMCG75A Volts 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 BREAKDOWN VOLTAGE V(BR) @ I(BR) Volts I(BR) MIN. MAX. mA 6.40 - 7.00 10 6.67 - 7.37 10 7.22 - 7.98 10 7.78 - 8.60 10 8.33 - 9.21 1 8.89 - 9.83 1 9.44 - 10.4 1 10.0 - 11.1 1 11.1 - 12.3 1 12.2 - 13.5 1 13.3 - 14.7 1 14.4 - 15.9 1 15.6 - 17.2 1 16.7 - 18.5 1 17.8 - 19.7 1 18.9 - 20.9 1 20.0 - 22.1 1 22.2 - 24.5 1 24.4 - 26.9 1 26.7 - 29.5 1 28.9 - 31.9 1 31.1 - 34.4 1 33.3 - 36.8 1 36.7 - 40.6 1 40.0 - 44.2 1 44.4 - 49.1 1 47.8 - 52.8 1 50.0 - 55.3 1 53.3 - 58.9 1 56.7 - 62.7 1 60.0 - 66.3 1 64.4 - 71.2 1 66.7 - 73.7 1 71.1 - 78.6 1 77.8 - 86.0 1 83.3 - 92.1 1 MAXIMUM CLAMPING VOLTAGE @ IPP PEAK PULSE CURRENT (See Fig. 2) IPP Volts 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113 121 Amps 163.0 145.6 133.9 125.0 116.3 110.3 104.2 97.4 88.2 82.4 75.3 69.7 64.7 61.5 57.7 53.3 51.4 46.3 42.2 38.6 35.6 33.0 31.0 28.1 25.8 23.2 21.6 20.6 19.4 18.2 17.2 16.0 15.5 14.6 13.3 12.4 MAXIMUM STANDBY CURRENT @ VWM ID A 1000 1000 500 200 100 50 20 10 5 5 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Continued. RF01001, Rev. A (xxxx) (c)2012 Microsemi Corporation Page 3 of 6 MSMCG5.0A thru MXLSMCG170CA, e3 ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated (continued) MICROSEMI PART NUMBER MSMCG78A MSMCG85A MSMCG90A MSMCG100A MSMCG110A MSMCG120A MSMCG130A MSMCG150A MSMCG160A MSMCG170A REVERSE STAND-OFF VOLTAGE VWM Volts 78 85 90 100 110 120 130 150 160 170 BREAKDOWN VOLTAGE V(BR) @ I(BR) Volts I(BR) MIN. MAX. mA 86.7 - 95.8 1 94.4 - 104.0 1 100 - 111 1 111 - 123 1 122 - 135 1 133 - 147 1 144 - 159 1 167 - 185 1 178 - 197 1 189 - 209 1 MAXIMUM CLAMPING VOLTAGE @ IPP PEAK PULSE CURRENT (See Fig. 2) IPP Volts 126 137 146 162 177 193 209 243 259 275 Amps 11.4 10.4 10.3 9.3 8.4 7.8 7.2 6.2 5.8 5.5 MAXIMUM STANDBY CURRENT @ VWM ID A 1 1 1 1 1 1 1 1 1 1 NOTE 1: For bidirectional device types indicate a CA suffix after the part number. (i.e.: MSMCG170CA). Bidirectional capacitance is half that shown in Figure 4 at zero volts. NOTE 2: Microsemi Corp's MSMC series (1500 W) surface mountable packages are designed specifically for transient voltage suppression. The wide leads assure a large surface contact for good heat dissipation, and a low resistance path for surge current flow to ground. These high speed transient voltage suppressors can be used to effectively protect sensitive components such as integrated circuits and MOS device. RF01001, Rev. A (xxxx) (c)2012 Microsemi Corporation Page 4 of 6 MSMCG5.0A thru MXLSMCG170CA, e3 GRAPHS (Waveform - See Figure 2) Non-repetitive 10 1.0 0 1s 10sec 100sec 1ms tp - Pulse Time - sec Test wave form parameters tr = 10 sec. tp = 1000 sec. IPP - Peak Pulse Current - % IPP (PPP) - Peak Pulse Power - kW 100 t - Time (msec) 10ms FIGURE 2 - Pulse Waveform C - Capacitance (pF) Peak Pulse Power (PPP) or continuous Power in Percent of 25 oC Rating FIGURE 1 - Peak Pulse Power vs. Pulse Time TL Lead Temperature oC BV - Breakdown Voltage (V) FIGURE 3 - Derating Curve RF01001, Rev. A (xxxx) (c)2012 Microsemi Corporation FIGURE 4 Typical Capacitance vs. Breakdown Voltage Page 5 of 6 MSMCG5.0A thru MXLSMCG170CA, e3 PACKAGE DIMENSIONS Ltr A B C E F K Dimensions Inch Millimeters Min Max Min Max .115 .121 2.92 3.07 .260 .280 6.60 7.11 .220 .245 5.59 6.22 .077 .110 1.95 2.80 .380 .400 9.65 10.16 .025 .040 0.635 1.016 NOTES: Dimension "E" exceeds the JEDEC outline as shown. Typical Standoff Height: 0.004" - 0.008" (0.1 mm - 0.2 mm). PAD LAYOUT Ltr A B C RF01001, Rev. A (xxxx) Inch .510 .110 .150 (c)2012 Microsemi Corporation Millimeters 12.95 2.79 3.81 Page 6 of 6