HSMx-C680
Right Angle Surface Mount ChipLEDs
Data Sheet
Description
The HSMx-C680 series of chip-type LEDs are designed to
illuminate at a right angle to the direction of mounting.
When mounted on a PC board, these devices will emit
light in a direction parallel to the board.
The small 3.0 x 1.0 x 2.0mm footprint of the HSMx-C680
is designed for applications where space is limited. These
devices are available in four colors and use untinted, non-
diused optics.
The HSMx-C680 series of parts are compatible with IR
reow soldering process only.
Package Dimensions
Features
• Right Angle Mounting
• Compatible with IR Reow Soldering Process
• Available in a Wide Variety of Colors
• Available in 8 mm Tape on 178mm (7”) Diameter Reels
Applications
• LCD backlighting
• Keypad Side/Backlighting
• Light Piping
• Right Angle Indicator
Device Selection Guide
Part Number Parts per Reel Color
HSMA-C680 3000 AlInGaP Amber
HSMC-C680 3000 AlInGaP Red
HSMG-C680 3000 GaP Green
HSMH-C680 3000 AS AlGaAs Red
HSML-C680 3000 AlInGaP Orange
HSMS-C680 3000 GaP High Eciency Red, HER
HSMY-C680 3000 GaP Yellow
CAUTION: HSMx-C680 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appro-
priate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
POLARITY MARK
TO REINFORCE SOLDERING
ANODE
(CATHODE FOR
HSMH-C680)
3.0
1.0
0.3 0.3
1.0
2.0
0.88
0.250.25
R 0.45
CATHODE
(ANODE FOR
HSMH-C680)
2.0
ANODECATHODE
(NON-PIN CONNECTION)
2
Absolute Maximum Ratings at TA = 25°C
Parameter AlInGaP GaP AS AlGaAs Units
DC Forward Current 30 25 25 mA
Power Dissipation 72 65 65 mW
Reverse Voltage (IR = 100mA) 5 5 5 V
LED Junction Temperature 95 95 95 °C
Operating Temperature Range -30 to 85°C
Storage Temperature Range -40 to 85 °C
Soldering Temperature See reow soldering prole (Figure 6 & 7)
Electrical Characteristics at TA = 25°C
Part Number
Forward Voltage
VF (Volts) [1]
@ IF = 20mA
Reverse Breakdown
VR (Volts)
@ IR = 100mA
Thermal Resistance
RqJ-P (°C/W)
Typ. Max. Typ. Typ.
AlInGaP Amber 2.0 2.4 5 500
AlInGaP Red 2.0 2.4 5 500
GaP Green 2.2 2.6 5 300
AS AlGaAs Red 1.8 2.6 5 300
AlInGaP Orange 2.0 2.4 5 500
GaP HER 2.0 2.6 5 300
GaP Yellow 2.1 2.6 5 300
Notes:
1. VF tolerance : ±0.1V
Optical Characteristics at TA = 25°C
Part Number
Luminous Intensity
IV [1] (mcd)
@ 20mA
Color, Dominant
Wavelength
ld [2] (nm)
Typical
Color,
Peak Wavelength
lPeak [(nm)
Typical
Viewing Angle
2q1/2 [3]
(Degrees)
TypicalMin. Typ.
AlInGaP Amber 28.5 76.9 591 594 115
AlInGaP Red 28.5 62.3 630 643 115
GaP Green 4.5 13.3 573 568 125
AS AlGaAs Red 7.2 30.7 642 657 125
AlInGaP Orange 28.5 108.6 604 611 115
GaP HER 2.8 5.1 621 636 125
GaP Yellow 2.8 9.3 589 588 125
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. q1/2 is the o-axis angle where the luminous intensity is ½ the peak intensity.
3
Color Bin Limits [1]
AlIn GaP Amber
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Tolerance : ±1nm
AlInGaP Red
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
- 620.0 635.0
Tolerance : ±1nm
GaP Green
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance : ± 1nm
AS AlGaAs HER
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
- 630.0 650.0
Tolerance : ±1nm
AlInGaP Orange
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Tolerance : ± 1nm
GaP HER
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
- 620.0 635.0
Tolerance : ± 1nm
GaP Yellow
Bin ID
Dominant Wavelength (nm)
Minimum Maximum
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Tolerance : ±1nm Notes:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on current available bins.
Light Intensity (IV) Bin Limits [1]
Bin ID
Intensity (mcd)
Minimum Maximum
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
Tolerance : ±15%
Notes:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on current available bins.
4
Figure 1. Relative intensity vs. wavelength..
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward current.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
AlInGaP Red
AlInGaP Amber
AlInGaP Orange
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
GaP Green
GaP Yellow
AS AlGaAs
GaP HER
0.1
1
10
100
0123
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
AlInGaP Red
AlInGaP
Amber & Orange
0.1
1
10
100
1.5 1.7 1.9 2.1 2.3 2.5
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
AS AlGaAs Red
GaP Yellow
GaP Green
GaP HER
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 5 10 15 20 25 30
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
AlInGaP Orange
AlInGaP Red & Amber
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 5 10 15 20 25 30
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
GaP & AlGaAs
5
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specied.
Figure 4. Maximum forward current vs. ambient temperature.
Figure 5.. Recommended reow soldering prole. Figure 6. Recommended Pb-free reow soldering prole.
AlInGaP
Figure 7. Recommended soldering land pattern.
0
25
020 60 80 100
20
5
FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
40
30
10
15
230 C MAX.
10 SEC. MAX.
4 C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4 C/SEC. MAX.
140-160 C
–3 C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE
EMITTED DIRECTION
6
Figure 8. Reeling orientation.
Figure 9. Reel dimensions.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
7
Figure 10. Carrier Tape Dimensions
Figure 11. Tape leader and trailer dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.20
0.20
DIM. B
(SEE TABLE)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004) 1.50 + 0.100
(0.059 + 0.004)
Ø
CATHODE
(ANODE FOR HSMH-C680)
Ø1.1
END START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
TABLE 1
DIM. A DIM. B DIM. C
PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C680 3.35 (0.132) 2.30 (0.091) 1.20 (0.047)
DIMENSIONS IN MILLIMETERS (INCHES)
Reow Soldering:
For more information on reow soldering, refer to Ap-
plication Note AN-1060, Surface Mounting SMT LED
Indicator Components.
Storage Condition:
5 to 30°C @ 60%RH max.
Baking is required before mounting, if:
1. Humidity Indicator Card is > 10% when read at 23 ±
5°C.
2. Device expose to factory conditions <30°C/60%RH
more than 672 hours
Recommended baking condition:
60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved.
AV02-0481EN - January 29, 2008