SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Description Features The SK1904 is an extremely fast, stable, and accurate low skew 1:9 clock / signal distributor featuring a synchronous enable, which allows the outputs to be turned off and on without the risk of an unpredictable output pulse. The D - flip-flop is triggered on the falling edge of the clock. 1:9 Clock/Data Driver 3 GHz Fmax 3.3V / 5.2V Compatible Available in 32 pin, 5mm X5mm, TQFP Package The SK1904 outputs are 50 with source and sink capability, optimized for: Point to point, series terminated, timing critical lines Output Option 50 Source / Sink VGG 50 50 10 mA Functional Block Diagram OUT OUT * 10 mA VEE VEE Package Information OUT0 OUT0* OUT1 OUT1* 32 pin, 5 mm X 5 mm OUT2 OUT2* TQFP Package OUT3 OUT3* SEL* SEL OUT6 OUT6* OUT7 OUT7* VEE SEL VCC OUT3* SEL* CLK CLK* IN OUT3 OUT4 OUT4* OUT5* IN* VCC OUT5 VEE VEE OUT8* OUT8 OUT8 OUT8* Revision 1 / June 24, 2003 OUT2 OUT2* VEE CLK CLK* Pin Description OUT5 OUT5* 1 OUT6 VCC 1 OUT4 OUT4* OUT0* OUT1* OUT1 0 OUT7 OUT7* OUT6* D Q D* Q* VCC OUT0 IN IN* www.semtech.com SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS HIGH-PERFORMANCE Package Information PRODUCTS PRELIMINARY 32 Pin, 5mm x 5mm TQFP Package 3 D, E D1, E1 2 4 See Figure 3. b 8 Top View e A A2 SEATING PLANE A1 10 b Side View Revision 1 / June 24, 2003 2 www.semtech.com SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS HIGH-PERFORMANCE Package Information PRODUCTS (continued) 32 Pin, 5mm x 5mm TQFP Package 9 7 WITH PLATING b 02 e/2 9 9 2 R1 01 c c1 R2 S GAGE PLANE 25 03 11 00 L See Detail in Figure 2 (L1) 9 b1 Figure 1. Figure 2. Figure 3. JEDEC Variation All Dimensions in Millimeters 1. All dimensions and tolerancing conforms to ANSI Y14.5M-1982. 2. The top package body size may be smaller than the bottom package body size by as much as 0.15 mm. 3. To be determined at seating plane. 4. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. 5. Details of Pin 1 identifier optional, but must be located within the zone indicated. 6. All dimensions are in millimeters. 7. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages. 8. Exact shape of each corner is optional. 9. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 10. A1 is defined as the distance from the seating plane to the lowest point of the package body. Revision 1 / June 24, 2003 b Sy mb ol M IN MA X N ote Comments A 1.00 1.10 1.20 Package Stand Off Height A1 0.05 0.10 0.15 Air Gap A2 0.95 1.00 1.05 Package Body Thickness D 7.00 BSC 3 D1 5.00 BSC 4, 2 E 7.00 BSC 3 E1 5.00 BSC 4, 2 N 32 e b 3 N OM 0.50 BSC Lead Pitch 0.22 0.27 b1 0.17 0.20 0.23 R1 0.08 R2 0.08 00 0 01 0 02 11 03 7 Lead Thickness 0.20 o 7 o 13 o 3.5 o Package Body Width Lead Count 0.17 o Package Body Length o o 12 o 11 o 12 13 S 0.20 o c 0.09 0.20 c1 0.09 0.16 L 0.45 0.60 0.75 L1 1.00 REF aaa 0.20 bbb 0.20 ccc 0.08 ddd 0.08 www.semtech.com SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Absolute Maximum Ratings* Symbol Parameter Value U nit VEE Power Supply (VCC = 0V) - 8.0 to 0 V VCC Power Supply (VEE = 0V) +8.0 to 0 V VI Input Voltage VCC VI VEE V IOUT Output Current Continuous Surge 50 100 mA mA Tstg Storage Temperature -65 to +150 oC Tsol Solder Temperature (<2 to 3 seconds: 245oC desired) 265 oC * Maximum Ratings are those values beyond which damage to the device may occur. Note 1: Device is ESD sensitive and requires protective handling. Revision 1 / June 24, 2003 4 www.semtech.com SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS DC Characteristics (VCC - VEE = 3.0V to 5.5V; TA = 0oC to 70oC) Parameter Symbol Min VIH VIL Typ Max U n i ts VEE + 2.0 VEE VCC VCC - 0.2 V V | VIH - VIL | 0.2 4.3 V IIH IIL -5 -6 +30 +6 A A IIH, IIL -500 +500 A | OUT - OUT* | (OUT + OUT*) / 2 ISIN K ROUT 600 VCC - 1.4 7.5 40 VCC - 1.0 13 60 mV V mA 355 mA Inputs Input High Input Low (IN - IN *, CLK - CLK*, SEL - SEL*) Differential Input Voltage Timing Inputs (CLK / CLK*) Input High Current Input Low Current Functional Inputs (IN / IN *, SEL / SEL*) Input Current Outputs Digital Output Voltage Output Common Mode Range Internal Current Source Output Impedance 700 VCC -1.2 10 50 Power Supply Power Supply Current IEE Test Conditions: Outputs unterminated. AC Characteristics (VCC - VEE = 3.0V to 5.5V; TA = 0oC to 70oC) Parameter Symbol Min Typ Max U n i ts Tp d Tp d Tp d 485 300 300 630 450 450 785 600 600 ps ps ps 20 ps High Per formance Option Propagation Delay CLK to OUT (SEL = 0) CLK to OUT (SEL = 1) SEL to OUT Channel to Channel Skew tSKEW Maximum Operating Frequency (N ote 1) Fmax 3.0 GHz PW min 250 ps Ts Th 100 100 ps ps Minimum Pulse Width (N ote 1) IN to CLK Set Up Time Hold Time Output Rise and Fall Times (20% / 80% ) (N ote 1) Temperature Coefficient (N ote 1) Tr / Tf 125 Tpd /T <1 175 ps ps / oC AC TEST CONDITIONS: Outputs terminated with 50 to VCC -2.0V. Note 1: Guaranteed by characterization. Not production tested. Revision 1 / June 24, 2003 5 www.semtech.com SK1904 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Ordering Information Ordering Code Package ID SK1904ATF 32-TQFP 5 x 5 mm SK1904ATF-T Tape and Reel Notes: 1. For Tape and Reel information, see TMD Part Ordering Information Data Application Notes AN1001 - EPIC Family Product Line AN1003 - Termination Techniques for ECL / LVECL PECL / LVPECL Devices AN1004 - Interfacing Between LVDS and ECL / LVECL / PECL / LVPECL Contact Information Semtech Corporation Test and Measurement Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858) 695-1808 FAX: (858) 695-2633 Revision 1 / June 24, 2003 6 www.semtech.com