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TEST AND MEASUREMENT PRODUCTS
Revision 1 / June 24, 2003
SK1904
1:9 Signal Distribution
L
11
(L1)
R2
GAGE PLANE
25
R1
01
02
2
S
03
00
97
9
b
c
9
b1
9
c1
WITH
PLATING
e / 2
b
See Detail in
Figure 2
1. All dimensions and tolerancing conforms
to ANSI Y14.5M-1982.
2. The top package body size may be smaller
than the bottom package body size by as
much as 0.15 mm.
3. To be determined at seating plane.
4. Dimensions D1 and E1 do not include
mold protrusion. Allowable protrusion
is 0.25 mm per side. D1 and E1 are
maximum plastic body size dimensions
including mold mismatch.
5. Details of Pin 1 identifier optional, but
must be located within the zone indicated.
6. All dimensions are in millimeters.
7. Dimension b does not include Dambar
protrusion. Allowable Dambar protrusion
shall not cause the lead width to exceed
the maximum b dimension by more than
0.08 mm. Dambar cannot be located
on the lower radius or the foot. Minimum
space between protrusion and an
adjacent lead is 0.07 mm for 0.4 mm and
0.5 mm pitch packages.
8. Exact shape of each corner is optional.
9. These dimensions apply to the flat
section of the lead between 0.10 mm
and 0.25 mm from the lead tip.
10. A1 is defined as the distance from the
seating plane to the lowest point of the
package body.
Figure 1. Figure 2. Figure 3.
lobmySNIMMONXAMetoNstnemmoC
A00.101.102.1thgieHffOdnatSegakcaP
1A50.001.051.0paGriA
2A59.000.150.1ssenkcihTydoBegakcaP
DCSB00.73
1DCSB00.52,4htgneLydoBegakcaP
ECSB00.73
1ECSB00.52,4htdiWydoBegakcaP
N23tnuoCdaeL
eCSB05.0hctiPdaeL
b71.022.072.07 ssenkcihTdaeL
1b71.002.032.0
1R80.0
2R80.002.0
000
o
5.3
o
7
o
100
o
2011
o
21
o
31
o
3011
o
21
o
31
o
S02.0
c90.002.0
1c90.061.0
L54.006.057.0
1LFER00.1
aaa02.0
bbb02.0
ccc80.0
ddd80.0
JEDEC Variation
All Dimensions in Millimeters
32 Pin, 5mm x 5mm TQFP Package
HIGH-PERFORMANCE PRODUCTS
Package Information (continued)