Document Number: MMA7660FC
Rev 8, 03/2012
Freescale Semiconductor
Data Sheet: Technical Data
An Energy Efficient Solution by Freescale
© 2009-2012 Freescale Semiconductor, Inc. All rights reserved.
3-Axis Orientation/Motion
Detection Sensor
The MMA7660FC is a ±1.5 g 3-Axis Accelerometer with Digital Output
(I2C). It is a very low power, low profile capacitive MEMS sensor featuring a
low pass filter, compensation for 0g offset and gain errors, and conversion to
6-bit digital values at a user configurable samples per second. The device can
be used for sensor data changes, product orientation, and gesture detection
through an interrupt pin (INT). The device is housed in a small 3mm x 3mm x
0.9mm DFN package.
Features
• Digital Output (I2C)
• 3mm x 3mm x 0.9mm DFN Package
• Low Power Current Consumption: Off Mode: 0.4 µA,
Standby Mode: 2 µA, Active Mode: 47 µA at 1 ODR
• Configurable Samples per Second from 1 to 120 samples a second.
• Low Voltage Operation:
– Analog Voltage: 2.4 V - 3.6 V
– Digital Voltage: 1.71 V - 3.6 V
• Auto-Wake/Sleep Feature for Low Power Consumption
• Tilt Orientation Detection for Portrait/Landscape Capability
• Gesture Detection Including Shake Detectio n and Tap Detection
• Robust Design, High Shocks Survivability (10,000 g)
• RoHS Compliant
• Halogen Free
• Environmentally Preferred Product
• Low Cost
Typical Applica tions
• Mobile Phone/ PMP/PDA: Orientation Detection (Portrait/Landscape),
Image Stability, Te xt Scroll, Motion Dialing, Tap to Mute
• Laptop PC: Anti-Theft
• Gaming: Motion Detection, Auto-Wake/Sleep For Low Power
Consumption
• Digital Still Camera: Image Stability
ORDERING INFORMATION
Part Number Temperature Range Package Shipping
MMA7660FCT –40 to +85°C DFN-10 Tray
MMA7660FCR1 –40 to +85°C DFN-10 7” Tape & Reel
N/C
DVDD
DVSS
SDA
SCL
RESERVED
N/C
AVDD
AVSS
INT
1
2
3
4
56
7
8
9
10
Figure 1. Pin Connectio ns
RESERVED
10 LEAD
DFN
CASE 2002-03
MMA7660FC
MMA7660FC: XYZ-AXIS
ACCELEROMETER
±1.5 g
Bottom View
Top View
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Contents
DEFINITIONS ...............................................................................................................................................................................5
ELECTRO STATIC DISCHARGE (ESD) ......................................................................................................................................7
PRINCIPLE OF OPERATION ......................................................................................................................................................9
MODES OF OPERATION ............ ... ................. .. ... ................. ... ... ................ ... ................. ... ... ....................................................10
CONFIGURABLE SAMPLES PER SECONDS AND INTERRUPT SETTINGS .........................................................................11
POWER SAVING FEATURES ...................................................................................................................................................11
TESTING THE LOGIC CHA IN ............. ... ............................ ... ............................ ... .....................................................................11
FEATURES ................................................................................................................................................................................11
Tap Detection ......................................................................................................................................................................13
Shake Detection ..................................................................................................................................................................13
Auto-Wake/Sleep ................................................................................................................................................................13
REGISTER DEFINITIONS .........................................................................................................................................................14
SERIAL INTERFACE .................................................................................................................................................................22
Serial-Addressing ................................................................................................................................................................22
Start and Stop Conditions ...................................................................................................................................................22
Bit Transfer ..........................................................................................................................................................................22
Acknowledge .......................................................................................................................................................................23
The Slave Address ..............................................................................................................................................................23
Message Format for Writing MMA7660FC ..........................................................................................................................23
Message Format for Reading MMA7660FC ........................................................................................................................24
APPENDIX A - PACKAGE REQUIREMENTS FOR MMA7660FC .............................................................................................25
Minimum Recommended Footprint for Surface Mounted Applications ...............................................................................25
Soldering And Mounting Guidelines for the DFN Accelerometer Sensor to a PC Board ....................................................25
Overview of Soldering Considerations ................................................................................................................................25
Halogen Content .................................................................................................................................................................25
PCB Mounting Recommendations ......................................................................................................................................25
APPENDIX B - SENSING DIRECTION ......................................................................................................................................27
APPENDIX C - MMA7660FC ACQUISITION CODE TABLE .....................................................................................................28
APPENDIX D - I2C AC CHARACTERISTICS ............................................................................................................................30
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List of Tables
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
ESD And Latch-up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Modes Of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Feature Summary Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Orientation Detection Logic of when Interrupt will Occu r . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Auto-Wake/Sleep Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
User Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
ASE/AWE Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Sleep Counter Timeout Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
I2C AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
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List of Figures
I2C Connection to MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Simplified Accelerometer Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Simplified Transducer Physical Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
State Machine of Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Orientation Detection Logic in 3-Dimensiona l Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
2-Wire Serial Interface Timing Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Start and Stop Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Bit Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Slave Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Single Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Multiple Bytes Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Single Byte Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Multiple Bytes Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Package Footprint, PCB Land Pattern, and Stencil Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
PCB Land Pattern Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Product Orientation on Perpendicular Axis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Product Orientations Showing Direction for Each Axis in Composite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
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MMA7660FC
Definitions
Auto-Wake: Sleep Mode (uses AMSR sample rate in SR [0x08] register)
Auto-Sleep: Run Mode (uses AWSR sample rate in SR [0x08] register)
PMP: Portable Media Player
PDA: Personal Digital Assistant
DFN: Dual Flat No Lead
ESD: Electro Static Discharge
ODR: Output Data Rate
MEMS: Microelectromechanical Systems
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Figure 1. Pinout
Table 1. Pin Description
Figure 2. I2C Connection to MCU
RESERVED
DVDD
DVSS
SDA
SCL
RESERVED
N/C
AVDD
AVSS
INT
Top View
1
2
3
4
56
7
8
9
10
Pin # Pin Name Description Pin
Status
1 RESERVED Connect to AVSS Input
2 N/C No Internal Connection, leave
unconnected or connect to Ground Input
3 AVDD Device Power Input
4 AVSS Device Ground Input
5INTInterrupt/Data Ready Output
6SCLI2C Serial Clock Input
7SDAI2C Ser ia l Data Open
Drain
8 DVSS Digital I/O Ground Input
9 DVDD Digital I/O Power Input
10 RESERVED Connect to AVSS Input
RESERVED
DVDD
DVSS
SDA
SCL
RESERVED
N/C
AVDD
AVSS
INT
1
2
3
56
7
8
9
10
4
GND
VDDVDD
VDD
GND
MMA7660FC
SDA
SCL
INT
MCU
R1
4.70 K R2
4.70 K
NOTE: A 0.1 μF ceramic capacitor can be placed connecting pin 3 (AVDD) to pin 4 (AVSS). In addition, another 0.1 μF
ceramic capacitor can be place connecting pin 9 (DVDD) to pin 8 (DVSS). The capacitors should be placed close
to the pins of the MMA7660FC and is recommended for testing and to adequately decouple the accelerometer
from noise on the power supply.
U13
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MMA7660FC
Figure 3. Simplified Accelerometer Functional Block Diagram
ELECTRO STAT IC DISC HARGE (ESD)
WARNING: This device is se ns itive to electro static discharge .
Although the Freescale accelerometer contains internal 2000 V ESD protection circuitry, extra precaution must be taken by
the user to protect the chip from ESD. A charge of over 2000 V can accumulate on the human body or associated test equipment.
A charge of this magnitude can alter the performance or cause failure of the chip. When handling the accelerometer , proper ESD
precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance.
Table 2. Maximum Ratings
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating Symbol Value Unit
Maximum Acceleration (all axes, 100 μs) gmax 10,000 g
Analog Supply Voltage AVDD -0.3 to +3.6 V
Digital I/O pins Supply Voltage DVDD_IO -0.3 to +3.6 V
Drop Test Ddrop 1.8 m
Storage Temperature Range Tstg -40 to +125 °C
Table 3. ESD And Latch-up Protection Characteristics
Rating Symbol Value Unit
Human Body Model HBM ±2000 V
Machine Model MM ±200 V
Charge Device Model CDM ±500 V
Latch-up current at TA = 85°C ±100 mA
AVDD
DVDD
VSS
X-axis
Transducer
Y-axis
Transducer
Z-axis
Transducer
MUX
CONTROL LOGIC INT
C-to-V
CONVERTER AMP ADC SDA
SCL
OFFSET
TRIM
GAIN
TRIM
I2C
INTERNAL
OSC CLOCK
GEN
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Notes
1. These parameters are tested in production at final test.
2. Assuming VDD power on slope is < 1 ms.
3. A measure of the devices ability to reject an acceleration applied 90° from the true axis of sensitivity.
4. Noise is defined as quantiles given to a sample size. These are the occurrences of noise: 94% = ±1 count, 5% = ±2 counts, and 1% = ±3
counts.
Table 4. Opera ting Ch aracteristics
Unless otherwise noted: -40°C < TA < 85°C, 2.4 V < AVDD < 3.6 V, 1.71 V < DVDD < 3.6 V, Acceleration = 0g
Typical values are at AVDD = 2.8 V, DVDD = 2.8 V, TA = +25°C
Characteristics Symbol Min Typ Max Unit
Analog Supply Voltage
Standby/Operation Mode AVDD 2.4 2.8 3.6 V
Enable Bus Modeon Mode AVDD 0 V
Digital I/O Pins Supply Voltage
Standby/Operation Mode DVDD_IO 1.71 2.8 AVDD V
Enable Bus Modeon Mode DVDD_IO 1.71 1.8 3.6 V
Supply Current Drain
Off Mode IDD 0.4 µA
Power Down Mode IDD 2µA
Standby Mode(1) IDD 0 2 10 µA
Active Mode, ODR = 1 IDD 47 µA
Active Mode, ODR = 2 IDD 49 µA
Active Mode, ODR = 4 IDD 54 µA
Active Mode, ODR = 8 IDD 66 µA
Active Mode, ODR = 16 IDD 89 µA
Active Mode, ODR = 32 IDD 133 µA
Active Mode, ODR = 64 IDD 221 µA
Active Mode(1), ODR = 120 IDD 294 µA
Acceleration Range ±1.5 g
Operating Temperature Range TA-40 25 85 °C
0g Output Signal (TA = 25°C, AVDD = 2.8 V)
0g Offset ±1.5g range(1) VOFF -3 0 3 counts
0g Offset Temperature Variation
X
Y
Z
-1.3
+1.5
-1.0
mg/°C
mg/°C
mg/°C
Sensitivity(1) (TA = 25°C, AVDD = 2.8 V)
±1.5g range 6-bit 21.33 count/g
Acceleration Sensitivity at TAMB 19.62 21.33 23.04 count/g
Acceleration Sensitivity Temperature Variation ±0.01 %/°C
Input High Voltage VIH 0.7 x DVDD
Input Low Voltage VIL 0.35 x DVDD
Output Low Voltage (IOL = 6 mA + SDA, INT) VOL 0.5 V
Input Leakage Current IIH, IIL 0.025 µA
Internal Clock Frequency(1) (TA = 25°C, AVDD = 2.8 V) tCLK 135 150 165 kHz
I2C Interface Speed 400 kHz
Control Timing
Turn on time from AVDD = 0 V to AVDD = 2.5 V(2) 1.3 ms
Turn off time from Active to Standby Mode 1ms
Turn on time Standby to Active Mode 12 ms + 1/ODR ms
Timing Clock Source Accuracy (TA = 25°C, DVDD = 1.8 V) -10 10 %
Timing Clock Source Temperature Variation -15 15 %
Cross Axis Sensitivity(3) ±1 %
Noise(4) ±1 count
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MMA7660FC
PRINCIPLE OF OPERATION
The Freescale Accelerometer consists of a MEMS capacitive sensing g-cell and a signal conditioning ASIC contained in a
single package. The sensing element is sealed hermetically at the wafer level using a bulk micro machined cap wafer. The
g-cell is a mechanical structure formed from semiconductor materials (polysilicon) using masking and etching processes.
The sensor can be modeled as a movable beam that moves between two mechanically fixed beams (Figure 4). T wo gaps are
formed; one being between the movable beam and the first stationary beam and the second between the movable beam and the
second stationary beam.
The ASIC uses switched capacitor techniques to measure the g-cell capacitors and extract the acceleration data from the
difference between the two capacitors. The ASIC also signal conditions and filters (switched capacitor) the signal, providing a
digital output that is proportional to acceleration.
Figure 4. Sim plified Transd ucer Physical Model
ACCELERATION
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MMA7660FC
MODES OF OPERATION
The sensor has three power modes: Off Mode, Standby Mode, and Acti ve Mode to offer the customer different power
consumption options. The sensor is only capable of running in one of these modes at a time.
The Off Mode offers the lowest power consumption, app roximately 0.4 µA and can only be reached by powering down the
analog supply. See Figure 5. In this mode, there is no ana log supply and all I2C activity is ignored.
The Standby Mode is ideal for battery operated products. When Standby Mode is active the device outputs are turned off
providing a significant reduction in operating current. When the device is in Standby Mode the current will be reduced to
approximately 3 µA. S tandby Mode is entered as soon as both analog and digital power supplies are up. In this mode, the device
can read and write to the registers with I2C, but no new measurements can be taken. The mode of the device is controlled through
the MODE (0x07) control register by accessing the mode bit in the Mode register.
During the Active Mode, continuous measurement on all three axes is enabled. In addition, the user can choose to enable:
Shake Detection, Tap Detection, Orientation Detection, and/or Auto-Wake/Sleep Feature and in this mode the digital analysis for
any of these functions is done. The user can configure the samples per second to any of the following: 1 sample/second,
2 samples/second, 4 samples/second, 8 samples/second, 16 samples/second, 32 sample s/second, 64 samples/second, and
120 samples/second, for the Auto-Sleep state. If the user is configuring the Auto-Wake feature, the selectable ranges are:
1 sample/second, 8 samples/second, 16 samples/seconds and 32 samples/second. Depending on the samples per second
selected the power consumption will vary.
Figure 5. State Machine of Mod e s
Table 5. Modes Of Operation
Measurement and
Power Mode I²C Bus DVDD AVDD Function
Power Down
Mode DVDD is down, so I2C bus cannot be
used for other devices (MMA7660FC
clamps I2C bus to DVVD pin)
Off Off MMA7660FC is powered down in both supplies. I2C activity is
unavailable on bus.
Off On MMA7660FC is powered down in digital supply but not analog
supply. I2C activity is unavailable on bus. AVDD power cycling
requires 50 msec.
Off Mode MMA7660FC will not respond, but I2C
bus can be used for other devices
(MMA7660FC does not load I2C bus)
On Off MMA7660FC is powered down in analog supply but not digital
supply. I2C activity is ignored.
Standby Mode MMA7660FC will respond to I2C bus On On MMA7660FC is powered up in both supplies, so registers can be
accessed normally to set MMA7660FC to Active Mode when
desired. MMA7660FC's sensor measurement system is idle.
Active Mode
Auto-Sleep
Auto-Wake
MMA7660FC will respond to I2C bus On On MMA7660FC is able to operate sensor measurement system at
user programmable samples per second and run all of the digital
analysis functions. Tap detection operates in Active Mode and
Auto-Sleep, but not Auto-Wake.
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MMA7660FC
CONFIGURABLE SAMPLES PER SECONDS AND INTERRUPT SETTINGS
The device can be configured in to 8 different samples per seconds including: 1 sample/second, 2 samples/second,
4 samples/second, 8 samples/second, 16 samples/second, 32 samples/second, 64 samples/second, and 120 samples/second,
The user can specify the samples per second for their particular application, deciding on the trade off between power
consumption and number of samples, this can be configured in the SR (0x08) register. Once the user configurable samples per
second is chosen, the device will update th e data for all 3 axes in the register at a resolution of 6-bits/axis.
The user can choose to enable/disable any of the following interrupts in the INTSU (0x06) register: Front/Back Interrupt,
Up/Down/Left/Right Interrupt, Tap Detection Interrupt, GINT (real-time motion tracking), Shake on X-axis, Shake on Y-axis, and
Shake on Z-axis. If the GINT is enabled, real-time motion tracking can be configured to trigger an interru pt after every sensor
data update: 1s (1 sample/second), 500 ms (2 samples/secon d ), 250 ms (4 samples/second), 125 ms (8 samples/second),
62.5 ms (16 samples/second), 31.25 ms (32 samples/second), 15.625 ms (64 samples/second), or 8.36 ms (120 samples/
second). If any of the shake axis interrupts are enabled; excessive agitation, greater than 1.3 g, will trigger an interrupt. If either
the Up/Down/Left/Right Interrupt or the Front/Back Interrupt is enabled, any change in orientation will generate an interrupt. When
the Auto-W ake feature is enabled, and the Auto-Sleep counter elapses an interrupt will occur. When the device is in Auto-Sleep
state, if a shake interrupt, tap interrupt, Delta G, or orientation detection interrupt occur, the device will go out of sleep state and
into wake state.
POWER SAVING FEATURES
The MMA7660FC includes a range of user configurable power saving features. The device’s samples per second can be set
over a wide range from 1 to 120 samples a second; the operating current is directly proportional to samples per second. The
analog supply A VDD can be powered down to put the MMA7660FC into Off Mode, which typically draws 0.4 µA. The Auto-W ake/
Sleep feature can toggle the sampling rate from a higher user selected samples per second to a lower user selected samples
per second, changing based on if mo tion is detected or not. The user can choose to use any of the above options to configure
the part and make it have the optimal power consumption level for the desired application.
TESTING THE LOGIC CHAIN
MMA7660FC can be put into Test Mode, which disables accelerometer measure m ents and instead allows the user to write
6-bit values directly to the three axis data registers, thus simulating real time accelerometer measurements. The state machine
will respond to these values according to the enabled features and functions, allowing them to be validated.
NOTE: MMA7660FC does not include an accelerometer self test function, which is typically an electrostatic force applied
to each axis to cause it to deflect.
FEATURES
The Sensor employs both analog and digital filtering to ensure low noise and accurate output when using the part for Shake,
Tap, or Orientation Detection. During Active Mode, the data is filtered and stored for each of the 3 axes at the specified following
measurement intervals: 1s (1 sample/second), 500 ms (2 samples/second), 250 ms (4 samples/second),
125 ms (8 samples/second), 62.5 ms (16 samples/second), 31.25 ms (32 samples/second), 15.625 ms (64 samples/second), or
8.36 ms (120 samples/second) or indicated in AMSR [2:0].
The 6-bit measurement data is stored in the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers and is used to update
the Shake, Alert, Tap, PoLa[2:0] (updates Up, Down, Left, and Right position), and BaFro[1:0] (updates Back and Front position)
in the TILT (0x03) register used for orientation detection. The customer can configure the part by enabling a number of user-
desired interrupts in the INTSU (0x06) register. Once the interrupts are enabled a change in filtered readings will cause an
interrupt to occur depending on the outp ut.
The filters that are being used by this sensor is the analog filtering, digital noise filtering of measurements used for orientation
detection and updated in the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers. The filtering method used is to oversample
each axis by taking 32 readings, and then calculate the average for the output measurement data as a finite impulse response
filter.
NOTE: Sensor Measurements are NOT taken in Standby Mode or in Test Mode.
Table 6. Feature Summary Table
Feature Will Generate Interrupt
Orientation Change When FBINT, PLINT = 1
Shake When SHINTX, SHINTY, SHINTZ = 1
Tap or Tilt When PDINT = 1
Auto-Wake/Sleep When ASINT = 1
X, Y, Z Data Update When GINT = 1
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MMA7660FC
Orientation Detection
Orientation Detection Logic
MMA7660FC gives the customer the capability to do orientation detection for such applications as Portrait/Landscape in
Mobile Phone/PDA/ PMP. The tilt orientation of the device is in 3 dimensions and is identified in its last known static position. This
enables a product to set its display orientation appropriately to either portrait/landscape mode, or to turn off the display if the
product is placed upside down. The sensor provides six different positions including: Left, Right, Up, Down, Back, and Fron t,
shown in Table 7. In Active Mode the data is processed and updates the orientation positions in the TIL T (0x03) register . At each
measurement interval, it computes new values for Left, Right, Up, Down, Back, and Front but it does not automatically update
these bits in the TILT (0x03) register. These values are updated depending on the deboun ce filter settings (SR Register 0x08)
configured by the customer.
In order to give the customer the ability to configure the debounce fi lter, specific to there applic ation, they can change the
following bits in the SR (0x08) register, FILT [2:0]. Please see below for a more detailed explanation of how the FILT [2:0] works
in conjunction with updating the TILT (0x03) register:
• If FILT [2:0] = 000, then the new values for Left, Right, Up, Down, Back, and Front are updated in the TILT (0x03) register
(PoLa [2:0] and BaFro [1:0]) after every reading without any further analysis.
• If FILT [2:0] = 001 – 1 11, then the sensor requires the computed values for Left, Right, Up, Down, Back, and Front to be the
same from 1-7 consecutive readings (depending on the value in FIL T [2:0], before updating the values stored in TIL T (0x03)
register (PoLa [2:0] and BaFro [1:0]). The debounce counter is reset after a mismatched reading or the TIL T (0x03) register
is updated (if the orientation condition is met).
Figure 6. Orientation Detection Logic in 3-Dimensional Space
Table 7. Orientation Detection Logi c of when Interrupt will Occur
Orientation Xg Yg Zg
Shake |X| > +1.3g or |Y| > +1.3g or |Z| > +1.3g
Up |Z| < 0.8g and |X| > |Y| and X < 0
Down |Z| < 0.8g and |X| > |Y| and X > 0
Right |Z| < 0.8g and |Y| > |X| and Y < 0
Left |Z| < 0.8g and |Y| > |X| and Y > 0
Back Z < -0.25g
Front Z > 0.25g
Down
Up
Front
Back
Right
Left
Down
Up
Front
Back
Right
Left
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13 Freescale Semiconductor, Inc.
MMA7660FC
Tap Detection
The MMA7660FC also includes a Tap Detection feature that can be used for a number of different customer applications such
as button replacement. For example, a single tap can stop a song from playing and a double tap can play a song. This function
detects a fast transition that exceeds a user-defined threshold (PDET (0x09) register) for a set duration (PD (0x0A) register).
Tap Detection Setup
In order to enable Tap detection in the device the user must enable the Tap Interrupt in the INTSU (0x06) register and AMSR
[2:0] = 000 in the SR (0x08) register . In this mode, TILT (0x03) register , XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers
will update at the 120 samples/second.
The user can configure Tap Detection to be detected on X and/or Y and/or Z axes. The customer can configure this by
changing the XDA, YDA, and/or ZDA bit in the PDET (0x09) register. Detection for enabled axes is decid ed on an OR basis: If
the PDINT bit is set in the INTSU (0x06) register, the device reports the first axis for which it detects a tap by the Tap bit in th e
TILT (0x03) register. When the Tap bit in the TILT (0x03) register is set, tap detection ceases, but the device will continue to
process orientation detection data. Tap detection will resume when the TILT (0x03) register is read.
NOTE: Delta G is available with any AMSR setting, when XDA = YDA = ZDA = 1 (PDET = 1). When the sampling rate
is less than 120 samples/second, the device can not detect tapping, but can detect small tilt angles (30 º angle
change) which can not be detected by orientation detection.
Shake Detection
The shake feature can be used as a button replacement to perform functions such as scrolling through images or web pages
on a Mobile Phone/PMP/PDA. The customer can enable the shake interrupt on any of the 3 axes, by enablin g the SHINTX,
SHINTY, and/or SHINTZ in the INTSU (0x06) register.
MMA7660FC detects shake by examining the current 6-bit measurement for each axis in XOUT, YOUT, and ZOUT. The axes
that are tested for shake detection are the one s enabled by SHINTX, SHINTY, and/or SHINTZ. If a selected axis measures
greater that 1.3 or less than -1.3 g, then a shake is detected for that axis and an interrupt occurs. All three axes are checked
independently, but a common Shake bit in the TILT register is set when shake is detected in any one of the selected axes.
Therefore when all three (SHINTX, SHINTY, and/or SHINTZ) are selected the sensor will not know what axis the shake occurred.
When the TILT register is read the Shake bit is cleared during the acknowledge bit of the read access to that register and shake
detection monitoring starts again.
Auto-Wake/Sleep
The MMA7660FC has the Auto-Wake/Sleep feature that can be enabled for powe r saving. In the Auto-Wake function, the
device is put into a user specified low samples per second (1 sample/second, 8 samples/second, 16 samples/second, or
32 samples/second) in order to minimize power consumption. When the Auto-Wake is enabled and activity is detected such as
a change in orientation, pulse event, Delta G acceleration or a shake event, then the device wakes up. Auto-Wake will
automatically enable Auto-Sleep when the device is in wake mode and can therefore be configured to cause an interrupt on
wake-up, by configuring the part to either wake-up with a change in orientation, shake, or if using the part at 120 samples/second
tap detection. When the device is in Auto-Wake mode, the MODE (0x07) register , bit AWE is high. When the device has detected
a change in orientation, a tap shake, or Delta G (change in acceleration), the device will enter Auto-Sl eep mode. In the Auto-
Sleep function, the device is put into any of the following user specified samples per seconds (1 sample/second, 2 samples/
second, 4 samples/second, 8 samples/second, 16 samples/second, 32 samples/second, 64 samples/second, and 120 samples/
second). In the Auto-Sleep mode, if no change in the orientation, shake or tap has occurred and the sleep counter has elapsed,
the device will go into the Auto-W ake mode. When the device is i n the Auto-Sleep mode, the MODE (0x07) register, bit ASE is
high. The device can be programmed to continually cycle between Auto-Wake/Sleep.
NOTE: The device can either be powered on in Wake/Sleep state depending on ASE/AWE settings. If the AWE bit is
set, the device is powered on in, in sleep state. If the ASW bit is set, the device is powered on in, in wake state.
Table 8. Auto-Wake/Sleep Truth Table
Trigger Wake-up Reset Sleep Counter Trigger Sleep Mode
Orientation Detection Change Yes Yes No
Shake Yes Yes No
Delta G
(set with PD (0x0A) and PDET (0x09)) Yes
(XDA = YDA = ZDA = 0) Yes No
Pulse Detect (120 samples/second) Yes Yes No
Sleep Counter Elapsed No No Yes
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Freescale Semiconductor, Inc. 14
MMA7660FC
REGISTER DEFINITIONS
NOTE: To write to the registers the MODE bit in the MODE (0x07) register must be set to 0, placing the device in Standby Mode.
$00: 6-bits output value X (Read Only when not in Test Mode)
XOUT — X Output
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
XOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
$01: 6-bits output value Y (Read Only when not in Test Mode)
YOUT — Y Output
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
YOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
$02: 6-bits output value Z (Read Only when not in Test Mode)
ZOUT — Z Output
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
ZOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
Table 9. User Register Summary
Address Name Definition Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
$00 XOUT 6-bit output value X -Alert XOUT[5] XOUT[4] XOUT[3] XOUT[2] XOUT[1] XOUT[0]
$01 YOUT 6-bit output value Y -Alert YOUT[5] YOUT[4] YOUT[3] YOUT[2] YOUT[1] YOUT[0]
$02 ZOUT 6-bit output value Z -Alert ZOUT[5] ZOUT[4] ZOUT[3] ZOUT[2] ZOUT[1] ZOUT[0]
$03 TILT Tilt Status Shake Alert Tap PoLa[2] PoLa[1] PoLa[0] BaFro[1] BaFro[0]
$04 SRST Sampling Rate Status 0 0 0 0 0 0 AWSRS AMSRS
$05 SPCNT Sleep Count SC[7] SC[6] SC[5] SC[4] SC[3] SC[2] SC[1] SC[0]
$06 INTSU Interrupt Setup SHINTX SHINTY SHINTZ GINT ASINT PDINT PLINT FBINT
$07 MODE Mode IAH IPP SCPS ASE AWE TON -MODE
$08 SR Auto-Wake/Sleep and
Portrait/Landscap e samples
per seconds and Debounce
Filter
FILT[2] FILT[1] FILT[0] AWSR[1] AWSR[0] AMSR[2] AMSR[1] AMSR[0]
$09 PDET Tap Detection ZDA YDA XDA PDTH[4] PDTH[3] PDTH[2] PDTH[1] PDTH[0]
$0A PD Tap Debounce Count PD[7] PD[6] PD[5] PD[4] PD[3] PD[2] PD[1] PD[0]
$0B-$1F Factory Reserved - - - - - - - -
D7 D6 D5 D4 D3 D2 D1 D0
- Alert XOUT[5] XOUT[4] XOUT[3] XOUT[2] XOUT[1] XOUT[0]
00000000
D7 D6 D5 D4 D3 D2 D1 D0
- Alert YOUT[5] YOUT[4] YOUT[3] YOUT[2] YOUT[1] YOUT[0]
00000000
D7 D6 D5 D4 D3 D2 D1 D0
- Alert ZOUT[5] ZXOUT[4] ZOUT[3] ZOUT[2] ZOUT[1] ZOUT[0]
000 0 0000
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MMA7660FC
$03: Tilt Status (Read only)
TILT
BaFro[1:0]
00:Unknown condition of front or back
01: Front: Equipment is lying on its front
10: Back: Equipment is lying on its back
PoLa[2:0]
000: Unknown condition of up or down or left or right
001: Left: Equipmen t is in landscape m od e to th e le ft
010: Right: Equipment is in landscape mode to the right
101: Down: Equipment standing vertically in inverted
orientation
110: Up: Equipment standing vertically in normal orientation
Tap
1: Equipment has detected a tap
0: Equipment has not detected a tap
Alert
0: Register da ta is valid
1: The register was read at the same time as MMA7660FC
was attempting to update the contents. Re-read the register
Shake
0: Equipment is not experiencing shake in one or more of the
axes enabled by SHINTX, SHINTY, and SHINTZ
1: Equipment is experiencing shake in one or more of the
axes enabled by SHINTX, SHINTY, and SHINTZ
Note: When entering active mode from standby mode, if the device is flat (±1g on Z-axis) the value for BaFro will be back (-1g)
or front (+1g) but PoLa will be in unknown condition. if the device is being held in an Up/Down/Right/Left position, the PoLa value
will be updated with current orientation, but BaFro will be in unknown condition.
$04: Sample Rate Status Register (Read only)
SRST
AMSRS
0: Samples per second specified in AMSR[2:0] is not active
1: Samples per second specified in AMSR[2:0] is acti ve
AWSRS
0: Samples per second specified in AWSR[1:0] is not active
1: Samples per second specified in AWSR[1:0] is active
$05: Sleep Count Register (Read/Write)
SPCNT
Writing to the SPCNT (0x05) register resets the internal sleep counter.
SC[7:0]
Sets the 8-bit maximum count value for the 8-bit internal sleep counter in Auto-Sleep. When the 8-bit internal sleep counter
reaches the value set by SC[7:0], MMA7660FC will exit Auto-Sleep and switch to the samples per second specified in AWSR[1:0]
of the SR (0x08) register.
D7 D6 D5 D4 D3 D2 D1 D0
Shake Alert Tap PoLa[2] PoLa[1] PoLa[0] BaFro[1] BaFro[0]
00000000
D7 D6 D5 D4 D3 D2 D1 D0
000000AWSRSAMSRS
00000000
D7 D6 D5 D4 D3 D2 D1 D0
SC[7]SC[6]SC[5]SC[4]SC[3]SC[2]SC[1]SC[0]
00000000
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MMA7660FC
$06: Interrupt Setu p Register
INTSU
FBINT
0: Front/Back position change does no t cause an interrupt
1: Front/Back position change ca uses an interrupt
PLINT
0: Up/Down/Right/Left position change does not cause an
interrupt
1: Up/Down/Right/Left position change causes an interrupt
PDINT
0: Successful tap detection does not cause an interrupt
1: Successful tap detection causes an interrupt
ASINT
0: Exiting Auto-Sleep does not cause an interrupt
1: Exiting Auto-Sleep causes an interrupt
GINT
0: There is not an automatic interrupt after every
measurement
1: There is an automatic interrupt after every measurement,
when g-cell readings are updated in XOUT, YOUT, ZOUT
registers, regardless of whether the readings have changed
or not. This interrupt does not affect the Auto-Sleep or Auto-
Wake functions.
SHINTX
0: Shake on the X-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the X-axis causes an interrupt, and sets
the Shake bit in the TILT register
SHINTY
0: Shake on the Y-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the Y -axis causes an interrupt, and sets
the Shake bit in the TILT register
SHINTZ
0: Shake on the Z-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the Z-axis causes an interrupt, and sets
the Shake bit in the TILT register.
The active interrupt condition (IRQ = 0 if IAH = 0, IRQ = 1 if IAH = 1) is released during the acknowledge bit of the slave address
transmission of the first subsequent I2C to MMA7660FC after the interrupt was asserted.
D7 D6 D5 D4 D3 D2 D1 D0
SHINTX SHINTY SHINTZ GINT ASINT PDINT PLINT FBINT
00000000
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17 Freescale Semiconductor, Inc.
MMA7660FC
$07: Mode Register (Read/Write)
MODE
NOTE: Writing to the Mode register resets sleep timing, and clears the XOUT, YOUT, ZOUT, TILT registers.Reading to
the Mode register resets sleep timing.
NOTE: The device must be placed in Standby Mode to change the value of the registers.
NOTE: The device can only enter into Test Mode, when the previous mode was Standby Mode. If the device was in
Active mode, set MMA766FC to S tandby Mode (MODE = TON = 0), then enter Test Mode (MODE = 0, TON = 1).
MODE
0: Standby mode or Test Mode depending on state of TON
1: Active mode
Existing state of TO N bit must be 0, to write MODE = 1. Test
Mode must not be enabled.
MMA7660FC always enters Active Mode using the samples
per second specified in AMSR[2:0] of the SR (0x08) register .
When MMA7660FC enters Active Mo de with
[ASE:AWE] = 11, MMA7660FC operates Auto-Sleep
functionality first.
TON
0: Standby Mode or Active Mode dependi ng on state of
MODE
1: Test Mode
Existing state of MODE bit must be 0, to write TON = 1.
Device must be in Standby Mode.
In Test Mode (TON = 1), the data in the XOUT, YOUT and
ZOUT registers is not updated by measurement, but is
instead updated by the user through the I2C interface for test
purposes. Changes to the XOUT, YOUT and ZOUT register
data is processed by MMA7660FC to change orientation
status and generate interrupts just like Active Mode.
Debounce filter ing and shake detection are disabled in Test
Mode.
AWE
0: Auto-Wake is disabled
1: Auto-Wake is enabled.
When Auto-Wake functionality is operating, the A WSRS bit is
the SRST register is set and the device uses the samples per
second specified in AWSR[1:0] of the SR (0x08) register.
When MMA7660FC automatically exits Auto-W ake by a
selected interrupt, the device will then switch to the samples
per second specified in AMSR[2:0] of the SR (0x08) register .
If ASE = 1, then Auto-Sleep functionality is now enabled
(Table 11).
ASE
0: Auto-Sleep is disabled
1: Auto-Sleep is enabled
When Auto-Sleep functionality is operating, the AMSRS bit is
the SRST register is set and the device uses the samples per
second specified in AMSR[2:0] of the SR (0x08) register.
When MMA7660FC automatically exits Auto-Sleep because
the Sleep Counter times out, the device will then switch to the
samples per second specified in AWSR[1:0] of the SR
register. If AWE = 1, then Auto-Wake functionality is now
enabled (Table 11).
SCPS
0: The prescaler is divide-by-1. The 8-bit internal Sleep
Counter input clock is the samples per second set by
AMSR[2:0], so the clock range is 120 Hz to 1 Hz depending
on AMSR[2:0] setting. Sleep Counter timeout range is
256 times the prescaled clock (see Table 12).
1: Prescaler is divide-by-16. The 8-bit Sleep Counter input
clock is the samples per second set by AMSR[2:0] divided by
16, so the clock range is 4 Hz to 0.0625 Hz depending on
AMSR[2:0] setting. Sleep Counter timeout range is 256 times
the prescaled clock (see Table 12).
IPP
0: Interrupt output INT is open-drain.
1: Interrupt output INT is push-pull
NOTE: Do NOT connect pull-up resistor from INT to
higher voltage than DVDD.
IAH
0: Interrupt output INT is active low
1: Interrupt output INT is active high
The active interrupt condition (IRQ = 0 if IAH = 0, IRQ = 1 if IAH = 1) is released during the acknowledge bit of the slave address
transmission of the first subsequent I2C to the device after the interrupt was asserted.
D7 D6 D5 D4 D3 D2 D1 D0
IAH IPP SCPS ASE AWE TON - MODE
00000000
Table 10. Modes
Mode of Operation D0 - MODE D2 - TON
Standby Mode 0 0
Test Mode 0 1
Active Mode 1 0
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MMA7660FC
NOTE: If interrupts are enabled, interrupts will behave normal ly in all conditions stated in Table 11.
Table 12. Sleep Counter Timeout Ra nges
$08: Auto-Wake and Active Mode Portrait/Landscape Samples per Seconds Register (Read/Write)
SR — Sample Rate Register
Table 11. ASE/AWE Conditions
Condition Auto-Wake (Sleep Mode) Auto-Sleep (Run Mode)
AWE = 0, ASE = 0 X
AWE = 1, ASE = 0 X
AWE = 0, ASE = 1 X X
AWE = 1, ASE = 1 X X
AMSR SCPS = 0 SCPS = 1
Minimum Range (20) Maximum Range (28) Minimum Range (20) Maximum Range (28)
1 SPS 1 s 256 s 16 s 4096 s
2 SPS 0.5 s 128 s 8 s 2048 s
4 SPS 0.25 s 34 s 4 s 1024 s
8 SPS 0.125 s 32 s 2 s 512 s
16 SPS 0.625 s 16 s 1 s 256 s
32 SPS 0.03125 s 8 s 0.5 s 128 s
64 SPS 0.0156 s 4 s 0.25 s 64 s
120 SPS 0.00836 s 2.14 s 0.133 s 34.24 s
D7 D6 D5 D4 D3 D2 D1 D0
FILT[2] FILT[1] FILT[0] AWSR[1] AWSR[0] AMSR[2] AMSR[1] AMSR[0]
000 0 0 0 0 0
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MMA7660FC
AMSR[2:0] NAME DESCRIPTION
000 AMPD Tap Detection Mode and 120 Samples/Second Active and Auto-Sleep Mode
Tap Detection Sampling Rate: The device takes readings continually at a rate of nominally 3846 g-cell
measurements a second. It then filters these high speed measurements by maintaining continuous rolling averages of
the current and last g-cell measurements. The averages are updated every 260 µs to track fast moving accelerations.
Tap detection: itself compares the two filtered axis responses (fast and slow) described above for each axis. The
absolute (unsigned) difference between the fast and slow axis responses is compared against the tap detection delta
threshold value PDTH[4:0] in the PDET (0x09) register.
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 8.36 ms in Active
Mode and Auto-Sleep. The update rate is 120 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
001 AM64 64 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measur ements every
15.625 ms in Active Mode and Auto-Sleep. The update rate is 64 samples per second. These measurements update
the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers also.
010 AM32 32 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 31.25 ms in Active
Mode and Auto-Sleep. The update rate is 32 samples per second. These measurements update XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
011 AM16 16 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 62.5 ms in Active
Mode and Auto-Sleep. The update rate is 16 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
100 AM8 8 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 125 ms in Active
Mode and Auto-Sleep. The update rate is 8 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
101 AM4 4 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 250 ms in Active
Mode and Auto-Sleep. The update rate is 4 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
110 AM2 2 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 500 ms in Active
Mode and Auto-Sleep. The update rate is 2 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
111 AM1 1 Sample/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 1000 ms in Active
Mode and Auto-Sleep. The update rate is 1 sample per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
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MMA7660FC
AWSR[1:0] NAME DESCRIPTION
00 AW32 32 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 31.25 ms in
Auto-Wake. The update rate is 32 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
01 AW16 16 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 62.5 ms in
Auto-Wake. The update rate is 16 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
10 AW8 8 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 125 ms in
Auto-Wake. The update rate is 8 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
11 AW1 1 Sample/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 1000 ms in
Auto-Wake. The update rate is 1 sample per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
FILT[2:0] DESCRIPTION
000 Tilt debounce filtering is disabled. The device updates portrait/landscape every reading at the rate set by AMSR[2:0] or
AWSR[1:0]
001 2 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
010 3 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
011 4 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
100 5 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
101 6 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
110 7 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
111 8 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
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MMA7660FC
$09: Tap/Pulse Detection Register (Read/Write)
PDET
NOTE: If XDA = YDA = ZDA = 0, samples per second is 120 samples/second, and Auto-Wake/Sleep feature is enabled,
the tap interrupt will reset the sleep counter.
XDA
1: X-axis is disabled for tap detection
0: X-axis is enabled for tap detection
YDA
1: Y-axis is disabled for tap detection
0: Y-axis is enabled for tap detection
ZDA
1: Z-axis is disab l ed for tap detection
0: Z-axis is enabled for tap detection
$0A: PD: Tap/Pulse Debounce Count Register (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
ZDA YDA XDA PDTH[4] PDTH[3] PDTH[2] PDTH[1] PDTH[0]
00000000
PDTH[4:0] DESCRIPTION
00000 Tap detection threshold is ±1 count
00001
00010 Tap detection threshold is ±2 counts
00011 Tap detection threshold is ±3 counts
... ... and so on up to...
11101 Tap detection threshold is ±29 counts
11110 Tap detection threshold is ±30 counts
11111 Tap detection threshold is ±31 counts
D7 D6 D5 D4 D3 D2 D1 D0
PD[7] PD[6] PD[5] PD[4] PD[3] PD[2] PD[1] PD[0]
00000000
PD[4:0] DESCRIPTION
00000000 The tap detection debounce filtering requires 2 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 0.52 ms.
00000001
00000010 Tap detection debounce filtering requires 3 adjacent tap detection tests to be the same to trigger a tap event and set the Tap
bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 0.78 ms.
00000011 Tap detection debounce filtering requires 4 adjacent tap detection tests to be the same to trigger a tap event and set the Tap
bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 1.04 ms.
... ... and so on up to...
11111101 Tap detection debounce filtering requires 254 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.04 ms.
11111110 Tap detection debounce filtering requires 255 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.3 ms.
11111111 Tap detection debounce filtering requires 256 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.56 ms.
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Freescale Semiconductor, Inc. 22
MMA7660FC
SERIAL INTERFACE
Serial-Addressing
MMA7660FC operates as a slave that sen ds and receives data through an I2C 2-wire inte rfa c e . Th e i nterface uses a Seria l
Data Line (SDA) and a Serial Clock Line (SCL) to achieve bi-directional communication be tween master(s) and slave(s). A
master (typically a microcontroller) initiates all data transfers to and from the device, and generates the SCL clock that
synchronizes the data transfer.
Figure 7. 2-Wire Serial Inter f ace T imin g Details
The device’s SDA line operates as both an input and an open-drain output. A pull-up resistor, typically 4.7 kΩ, is required on
SDA. The device’s SCL line operates only as an input. A pull-up resistor , typically 4.7 kΩ, is required on SCL if there are multiple
masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.
Each transmission consists of a START condition (Figure 7) sent by a master, followed by MMA7660FC's 7-bit slave address
plus R/W bit, a register address byte, one or more data bytes, and finally a STOP condition.
Figure 8. Start and Stop Conditi ons
Start and Stop Co nditions
Both SCL and SDA remain high when the interface is not busy. A master signals the beginn ing of a transmission with a
START (S) condition by transitioning SDA from high to low while SCL is high. When the master has finished communicating with
the slave, it issues a STOP (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another
transmission.
Bit Transfer
One data bit is transferred during each clock tap. See Figure 9. The data on SDA must remain stable while SCL is high.
Figure 9. Bit Transfer
SCL
SDA
tLOW
tHIGH
tF
tR
tHD STA
tHD DAT
tHD STA
tSU DAT tSU STA
tBUF
tSU STO
START
CO NDIT IO N
STOP
CO NDIT IO N
REPEATED START
CO NDIT IO N
START
CO NDIT IO N
DATA LINE STABLE
DATA VALID CHANGE OF
DATA ALLOWED
SDA
SCL
START
CONDITION
SDA
SCL
STOP
CONDITION
PS
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23 Freescale Semiconductor, Inc.
MMA7660FC
Acknowledge
The acknowledge bit is a clocked 9th bit, shown in Figure 10, which the recipient uses to handshake a receipt of each byte of
data. Thus each byte transferred effectively requires 9-bits. The master generates the 9th clock tap, and the recipient pulls down
SDA during the acknowledge clock tap, such that the SDA line is stable low during the high period of the clock tap. When the
master is transmitting to MMA7660FC, it generates the acknowledge bit because it is the recipient. Whe n the device is
transmitting to the master, the master generates the acknowledge bit because the ma ster is the recipient.
Figure 10. Acknowledge
The Slave Address
MMA7660FC has a 7-bit long slave address, shown in Figure 11. The bit following the 7-bit slave address (bit eight) is the
R/W bit, which is low for a write command and high for a read command. The device has a factory set I2C slave address which
is normally 1001 100 (0x4C). Contact the factory to request a different I2C slave address, which is available in the range 0001000
to 111 0111 (0x08 to 0xEF), by metal mask option.
Figure 11. Slave Address
The device monitors the bus continuously, waiting for a START condition followed by its slave address. When the device
recognizes its slave address, it acknowledges and is the n ready for continued communication.
Message Format for Writing MMA7660FC
A write to MMA7660FC comprises the transmission of the device’s keyscan slave address with the R/W bit set to 0, followed
by at least one byte of information. The first byte of information is the register address of the first internal register that is to be
updated. The Master Write address is 1001 1000 (0x98). If a STOP condition is detected after just the register address is
received, then MMA7660FC takes no action. See Figure 12. MMA7660FC clears its internal register address pointer to register
0x00 when a STOP condition is detected, so a single byte write has no net effect because the register address given in this first
and only byte is replaced by 0x00 at the STOP condition. The internal register address pointer is not, however, cleared on a
repeated start condition. Use a single byte write followed by a repeated start to read back data from a register.
Any bytes received after the register address are data bytes. The first data byte goes into the internal register of the device
selected by the register address. See Figure 12.
Figure 12. Single Byte Write
Master ST Device Address [6:0] W Register Address [6:0] Data [7:0] SP
Slave AK AK AK
START
CONDITION
SDA
BY TRANSMITTER
S
12 89
CLOCK PULSE FOR
ACKNOWLEDGEMENT
SDA
BY RECEIVER
SCL
CLOCK TAP FOR
SDA
1 R/W ACK
MSB
SCL
010100
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Freescale Semiconductor, Inc. 24
MMA7660FC
If multiple data bytes are transmitted before a STOP condition is detected, these bytes are generally stored in subsequent
MMA7660FC internal registers because the register address generally auto-in crements.
Figure 13. Multiple Bytes Write
Message Format for Read ing MMA7660FC
MMA7660FC is read using it’s internally stored register address as address pointer , the same way the stored register address
is used as address pointer for a write. The pointer generally auto-i ncrements after each data byte is read using the same rules
as for a write. Thus, a read is initiated by first configuring the device’s register address by performing a write (Figure 12) followed
by a repeated start. The Master Write address is 1001 1001 (0x99). The master can now read 'n' consecutive bytes from it, with
the first data byte being read from the register addressed by the initialized register address.
Figure 14. Single Byte Read
Figure 15. Multiple Bytes Read
Master ST Device Address [6:0] W Register Address [6:0] Data [7:0] Data [7:0] SP
Slave AK AK AK AK
Master ST Device Address [6:0] W Register Address [6:0] SR Device Address [6:0] R NAK SP
Slave AK AK AK Data [7:0]
Master ST Device Address [6:0] W Register Address [6:0] SR Device Address [6:0] R AK
Slave AK AK AK Data [7:0]
Master AK AK NAK SP
Slave Data [7:0] Data [7:0] Data [7:0]
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25 Freescale Semiconductor, Inc.
MMA7660FC
APPENDIX A – PA CKA GE REQUIRE MENTS FOR MMA7660FC
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self-align when subjected to a solder reflow process. It is alwa ys recommended to design boards with a solder
mask layer to avoid bridging and shorting between solder pads.
Soldering And Mounting Guidelines for the DFN Accelerometer Sensor to a PC Board
These guidelines are for soldering and mounting the Dual Flat No-Lead (DFN) package inertial sensors to printed circuit
boards (PCBs). The purpose is to minimize the stress on the package after board mounting. The MMA7660 digital output
accelerometer uses the DFN package platform. This section describes suggested methods of soldering these devices to the PC
board for consumer applications. Pages 31, 32, and 33 show the package outline drawing for the package.
Overview of Soldering Consideration s
Information provided here is based on experiments executed on DFN devices. They do not represent exact conditions present
at a customer site. Hence, information herein should be used as guidan ce only and process and design optimizations are
recommended to develop an application specific solution. It should be noted that with the proper PCB footprint and solder stencil
designs the package will self-align during the solder reflow process. The following are the recommended guidelines to follow for
mounting DFN sensors for con su me r applications.
Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that
no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight
or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
Note: Halogen Free is only compliant to the MMA7660 FC, not to the packaging material.
PCB Mounting Recommenda ti ons
1. The PCB land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 16 and Figure 17.
2. No additional via pattern underneath package.
3. PCB land pad is 0.825 mm x 0.3 mm as shown in Figure 16 and Figure 17.
4. Do not solder down smaller side tabs on either end of the package.
5. The solder mask opening is equa l to the size of the PCB land pad plus 0.15 mm.
6. The stencil aperture size is equal to the PCB land pad – minus 0.03 mm total.
7. Stencil thickness should be 75 μm.
8. Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
9. Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.15 mm width and minimum 0.5 mm length for all PCB land pads
near the package are recommended as shown in Figure 16 and Figure 17. Wider trace can be continued after the 0.5 mm
zone.
10. Use a standard pick and place process and equipment. Do not use a hand soldering process.
11. It is recommended to use a no clean solder paste.
12. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
the pack age.
13. The PCB should be rated for the multiple lead-free reflow condition with max 260°C tempera ture.
14. No copper traces on top layer of PCB under the package. This will cause planarity issues with board mount.
Freescale DFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free moldi ng
compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-
copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for
soldering the devices.
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Freescale Semiconductor, Inc. 26
MMA7660FC
Figure 16. Package Footprint, PCB Land Pattern, and Stencil Design
Figure 17. PCB Land Pattern Detail
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27 Freescale Semiconductor, Inc.
MMA7660FC
APPENDIX B - SENSING DIRECTION
Figure 18. Product Orientation on Perpendicular Axis
Figure 19. Product Orientations Showing Direction for Each Axis in Composite
Direction of Earth’s Gravity
Top View
XOUT @ -1g
YOUT @ 0g
ZOUT @ 0g
XOUT @ 0g
YOUT @ -1g
ZOUT @ 0g
XOUT @ +1g
YOUT @ 0g
ZOUT @ 0g
XOUT @ 0g
YOUT @ +1g
ZOUT @ 0g
XOUT @ 0g
YOUT @ 0g
ZOUT @ +1g
XOUT @ 0g
YOUT @ 0g
ZOUT @ -1g
Side View
-Z
+X
-Y
+Y
+Z
-X
-Y
+Z
-X
+Y
-Z
+X
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MMA7660FC
APPENDIX C - MMA7660FC ACQUISITION CODE TABLE
6-bit result Binary 2's Comp g value Angle X or Y Angle Z
0 0 0 0.000g 0.00° 90.00°
1 1 1 0.047g 2.69° 87.31°
2 10 2 0.094g 5.38° 84.62°
3 11 3 0.141g 8.08° 81.92°
4 100 4 0.188g 10.81° 79.19°
5 101 5 0.234g 13.55°
Z-axis must be in the range
76.45°
6 110 6 0.281g 16.33° 73.67°
7 111 7 0.328g 19.16° 70.84°
8 1000 8 0.375g 22.02° 67.98°
9 1001 9 0.422g 24.95° 65.05°
10 1010 10 0.469g 27.95° 62.05°
11 1011 11 0.516g 31.04° 58.96°
12 1100 12 0.563g 34.23° 55.77°
13 1101 13 0.609g 37.54° 52.46°
14 1110 14 0.656g 41.01° 48.99°
15 1111 15 0.703g 44.68° 45.32°
16 10000 16 0.750g 48.59° 41.41°
17 10001 17 0.797g 52.83° 37.17°
18 10010 18 0.844g 57.54° 32.46°
19 10011 19 0.891g 62.95° 27.05°
20 10100 20 0.938g 69.64° 20.36°
21 10101 21 0.984g 79.86° 10.14°
22 10110 22 1.031g
23 10111 23 1.078g
24 11000 24 1.125g
25 11001 25 1.172g
26 11010 26 1.219g
27 11011 27 1.266g
28 11100 28 1.313g Shaken
29 11101 29 1.359g Shaken
30 11110 30 1.406g Shaken
31 11111 31 1.453g Shaken
63 111111 -1 -0.047g -2.69° -87.31°
62 111110 -2 -0.094g -5.38° -84.62°
61 111101 -3 -0.141g -8.08° -81.92°
60 111100 -4 -0.188g -10.81° -79.19°
59 111011 -5 -0.234g -13.55° -76.45°
58 111010 -6 -0.281g -16.33° -73.67°
57 111001 -7 -0.328g -19.16° -70.84°
56 111000 -8 -0.375g -22.02° -67.98°
55 110111 -9 -0.422g -24.95° -65.05°
54 110110 -10 -0.469g -27.95° -62.05°
53 110101 -11 -0.516g -31.04° -58.96°
52 110100 -12 -0.563g -34.23° -55.77°
51 110011 -13 -0.609g -37.54° -52.46°
50 110010 -14 -0.656g -41.01° -48.99°
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29 Freescale Semiconductor, Inc.
MMA7660FC
APPENDIX C - MMA7660FC ACQUISITION CODE TABLE, continued
49 110001 -15 -0.703g -44.68° -45.32°
48 110000 -16 -0.750g -48.59° -41.41°
47 101111 -17 -0.797g -52.83° -37.17°
46 101110 -18 -0.844g -57.54° -32.46°
45 101101 -19 -0.891g -62.95° -27.05°
44 101100 -20 -0.938g -69.64° -20.36°
43 101011 -21 -0.984g -79.86° -10.14°
42 101010 -22 -1.031g
41 101001 -23 -1.078g
40 101000 -24 -1.125g
39 100111 -25 -1.172g
38 100110 -26 -1.219g
37 100101 -27 -1.266g
36 100100 -28 -1.313g Shaken
35 100011 -29 -1.359g Shaken
34 100010 -30 -1.406g Shaken
33 100001 -31 -1.453g Shaken
32 100000 -32 -1.500g Shaken
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Freescale Semiconductor, Inc. 30
MMA7660FC
APPENDIX D - I2C AC CHARACTERISTICS
This section includes informati on about I2C AC Characteristic s.
Table 1. I2C AC Characteristics
(Typical Operating Circuit, VDD = 1.71 V to 2.75 V, TA = TMIN to TMAX, unless otherwise noted. Typical current values are at
VDD = 1.8 V, TA = +25°C.)
Parameter Symbol Min Typ Max Units
Serial Clock Frequency(1)
1. Parameters tested 100% at final test at room temperature; limits at -40°C and +85°C, verified by characterization, not test in production.
fSCL 400 kHz
Bus Free Time Between a STOP and a START Condition(2)
2. Limits verified by characterization, not tested in production.
tBUF 1.3 µs
Hold Time, (Repeated) START Condition(2) tHD, STA 0.6 µs
Repeated START Condition Setup Time(2) tSU, STA 0.6 µs
STOP Condition Setup Time(2) tSU, STO 0.6 µs
Data Hold Time(2) tHD, DAT 0.9 µs
Data Setup Time(2) tSU, DAT 100 ns
SCL Clock Low Period(2) tLOW 1.3 µs
SCL Clock High Period(2) tHIGH 0.7 µs
Rise Time of Both SDA and SCL Signals, Receiving(2) tR20+0.1Cb300 ns
Fall Time of Both SDA and SCL Signals, Receiving(2) tF20+0.1Cb300 ns
Fall Time of SDA Transmitting(2) tF.TX 20+0.1Cb250 ns
Pulse Width of Spike Suppressed(2) tSP 25 ns
Capacitive Load for Each Bus Line(2) Cb400 pF
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MMA7660FC
PACKAGE DIMENSIONS
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MMA7660FC
PACKAGE DIMENSIONS
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33 Freescale Semiconductor, Inc.
MMA7660FC
PACKAGE DIMENSIONS
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MMA7660FC
Table 2. Revision History
Revision
number Revision
date Description of changes
9 03/2012 • Changed pin 10 from N/C to RESERVED on page 1, Figure 1, Figure 2 and Table 1: Pin
description.
MMA7660FC
Rev. 8
03/2012
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