INTEGRATED CIRCUITS DATA SHEET Package information 8048-based 8-bit Microcontrollers June 1994 Philips Semiconductors Philips Semiconductors 8048-based 8-bit Microcontrollers Package information PACKAGE OUTLINES 15.80 15.24 seating plane 36.0 35.0 handbook, full pagewidth 4.0 5.1 max max 3.9 3.4 0.51 min 1.7 max 0.53 max 2.54 (13x) 0.254 M 0.32 max 15.24 1.7 max 17.15 15.90 28 15 14.1 13.7 1 14 Dimensions in mm. Fig.1 28-lead dual in-line; plastic (SOT117). June 1994 2 MSA264 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information 15.80 15.24 seating plane 36.0 35.0 handbook, full pagewidth 4.0 5.1 max max 3.9 3.4 0.51 min 1.7 max 0.53 max 2.54 (13x) 0.254 M 0.32 max 15.24 1.7 max 17.15 15.90 28 15 14.1 13.7 1 14 Dimensions in mm. Fig.2 28-lead dual in line; plastic with internal heat spreader (SOT117). June 1994 3 MSA264 Philips Semiconductors seating plane 8048-based 8-bit Microcontrollers handbook, full pagewidth Package information 52.50 51.50 15.80 15.24 4.0 4.7 max max 3.50 3.05 0.51 min 2.25 max 0.53 max 2.54 (19x) 0.254 M 15.24 17.15 15.90 1.7 max 40 21 14.1 13.7 1 20 Dimensions in mm. Fig.3 40-lead dual in-line; plastic (SOT129). June 1994 0.32 max 4 MSA266 Philips Semiconductors 8048-based 8-bit Microcontrollers handbook, full pagewidth Package information 18.1 17.7 7.6 7.4 A 10.65 10.00 0.1 S S 0.9 (4x) 0.4 28 15 2.45 2.25 1.1 1.0 0.3 0.1 2.65 2.35 0.32 0.23 pin 1 index 1 1.1 0.5 14 detail A 1.27 0.49 0.36 0.25 M (28x) Dimensions in mm. Fig.4 28-lead mini-pack; plastic (SO28; SOT136A). June 1994 5 0 to 8o MBC236 - 1 Philips Semiconductors 8048-based 8-bit Microcontrollers handbook, full pagewidth Package information 15.6 15.2 7.6 7.4 10.65 10.00 0.1 S S A 0.9 (4x) 0.4 24 13 2.45 2.25 1.1 1.0 0.3 0.1 2.65 2.35 0.32 0.23 pin 1 index 1 1.1 0.5 12 detail A 1.27 0.49 0.36 0.25 M (24x) Dimensions in mm. Fig.5 24-lead small-outline; plastic (SO24L; SOT137A). June 1994 6 0 to 8o MBC235 - 1 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information seating plane 26.92 26.54 8.25 7.80 3.2 max 3.60 3.05 4.2 max 0.51 min 2.0 max 2.54 (9x) 0.53 max 0.254 M 0.38 max 7.62 1.73 max 10.0 8.3 MSA258 20 11 6.40 6.22 1 10 Dimensions in mm. Fig.6 20-lead dual in-line; plastic (SOT146). June 1994 7 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 0.15 S X 12.3 11.8 40 21 Philips Semiconductors S 7.6 7.5 8048-based 8-bit Microcontrollers June 1994 16.0 15.3 1.15 1.05 2.45 2.25 1 2.70 2.35 0.22 0.14 0.3 0.1 20 1.7 1.5 0 to 7o MBC823 - 1 0.51 (4x) 0.41 0.42 0.30 (40x) 0.1 M Fig.7 40-lead mini-pack; plastic (VSO40; SOT158A). Specification status Dimensions in mm. 0.762 Package information detail X handbook, full pagewidth 8 pin 1 index Philips Semiconductors 8048-based 8-bit Microcontrollers Package information 13.0 12.6 andbook, full pagewidth 7.6 7.4 10.65 10.00 0.1 S S A 0.9 (4x) 0.4 20 11 2.45 2.25 1.1 1.0 0.3 0.1 2.65 2.35 0.32 0.23 pin 1 index 1 1.1 0.5 10 detail A 1.27 0.49 0.36 0.25 M (20x) Dimensions in mm. Fig.8 20-lead mini-pack; plastic (SO20; SOT163A). June 1994 9 0 to 8 o MBC234 - 1 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information 17.65 17.40 handbook, full pagewidth seating plane 16.66 16.51 S 0.10 S 39 1.27 (40 x) 0.81 max 0.53 max 0.18 M R 1.14 0.64 29 40 28 44 16.00 14.99 1 A 16.66 17.65 16.51 17.40 ,, ,,,, 2.15 max 45 6 o 1.22 1.07 18 7 17 0.51 (3x) max 0.32 max 4.57 max 3.04 max 0.51 min detail A Dimensions in mm. Fig.9 44-lead plastic leaded chip carrier (PLCC); (SOT187AA). June 1994 10 MBC653 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information 25.27 25.02 handbook, full pagewidth seating plane 24.33 24.13 S 0.10 S 60 1.27 (64 x) 0.81 max 0.53 max 0.18 M R 1.14 0.64 44 61 43 68 24.33 25.27 24.13 25.02 23.6 22.6 1 A 2.15 max 45 o 9 1.22 1.07 27 10 26 0.51 (3x) max ,, 0.27 max 5.08 max 3.3 max 0.51 min detail A Dimensions in mm. Fig.10 68-lead plastic leaded chip carrier (PLCC); (SOT188AA, AGA). June 1994 11 MBC652 - 1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 0.15 S X 9.80 9.65 15.8 15.2 56 29 3.0 2.8 1 1.45 1.30 1.1 0.9 0.3 0.1 1.6 1.4 28 detail X 0.42 0.30 (56x) 0.1 M Fig.11 56-lead mini-pack; plastic (VSO56; SOT190). 3.3 2.9 0 to 7 o MBC821 - 1 Specification status Dimensions in mm. 0.75 0.22 0.14 Package information 0.75 (4x) 0.55 handbook, full pagewidth 12 pin 1 index Philips Semiconductors S 11.1 11.0 8048-based 8-bit Microcontrollers June 1994 22.0 21.5 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information handbook, full pagewidth seating plane S 0.15 S 19.2 18.2 44 34 B 33 1 2.4 (4x) 1.8 pin 1 index 0.15 M B 1.0 14.1 13.9 19.2 18.2 23 11 0.50 0.35 22 12 1.0 2.4 (4x) 1.8 0.50 0.35 X 0.15 M A 14.1 13.9 A 2.3 2.1 1.2 0.9 0.25 0.05 2.0 1.2 detail X Dimensions in mm. Fig.12 44-lead quad flat-pack; plastic (SOT205AG). June 1994 13 2.60 2.15 0.25 0.14 0 to 7o MBC659 - 1 Philips Semiconductors 8048-based 8-bit Microcontrollers seating plane Package information S 0.15 S 19.2 18.2 B 64 52 51 1 1.2 (4x) 0.8 pin 1 index 0.15 M B 1.0 20.1 25.2 19.9 24.2 0.50 0.35 33 19 20 32 1.0 0.50 0.35 0.15 M A 1.2 0.8 (4x) 14.1 13.9 X A 2.85 2.65 1.45 1.15 0.30 0.05 1.55 0.85 detail X Dimensions in mm. Fig.13 64-lead quad flat-pack; plastic (SOT208). June 1994 14 3.2 2.7 0.25 0.14 0 to 7 o MBC658 - 1 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information seating plane 22.3 21.4 10.7 10.2 3.8 max 4.7 max 3.2 2.8 0.51 min 1.6 max 0.53 max 1.778 (11x) 0.18 M 0.32 max 10.16 1.3 max 12.2 10.5 MSA263 24 13 9.1 8.7 1 12 Dimensions in mm. Fig.14 24-lead shrink dual in-line; plastic (SDIL24; SOT234A). June 1994 15 Philips Semiconductors seating plane 8048-based 8-bit Microcontrollers handbook, full pagewidth Package information 39.0 38.4 15.80 15.24 4.57 5.08 max max 3.2 2.9 0.51 min 1.73 max 0.53 max 1.778 (40x) 0.18 M 15.24 17.15 15.90 1.3 max 22 42 MSA268 - 1 14.1 13.7 1 21 Dimensions in mm. Fig.15 42-lead shrink dual in-line; plastic (SDIL42; SOT270). June 1994 0.32 max 16 Philips Semiconductors 8048-based 8-bit Microcontrollers Package information SOLDERING Plastic dual in-line packages Plastic mini-packs, plastic quad flat-packs and plastic leaded chip carriers BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. REPAIRING SOLDERED JOINTS A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. June 1994 17