DATA SH EET
June 1994
INTEGRATED CIRCUITS
Philips Semiconductors
Package information
8048-based 8-bit Microcontrollers
June 1994 2
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
PACKAGE OUTLINES
Fig.1 28-lead dual in-line; plastic (SOT117).
Dimensions in mm.
h
andbook, full pagewidth
28
1
15
14
1.7 max
14.1
13.7
36.0
35.0
4.0
max 5.1
max
0.51
min
3.9
3.4
seating plane
0.254 M
0.53
max
2.54
(13x)
1.7
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA264
June 1994 3
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.2 28-lead dual in line; plastic with internal heat spreader (SOT117).
Dimensions in mm.
handbook, full pagewidth
28
1
15
14
1.7 max
14.1
13.7
36.0
35.0
4.0
max 5.1
max
0.51
min
3.9
3.4
seating plane
0.254 M
0.53
max
2.54
(13x)
1.7
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA264
June 1994 4
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.3 40-lead dual in-line; plastic (SOT129).
Dimensions in mm.
handbook, full pagewidth
40
1
21
20
1.7 max
14.1
13.7
52.50
51.50
4.0
max 4.7
max
0.51
min
3.50
3.05
seating plane
0.254 M
0.53
max
2.54
(19x)
2.25
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA266
June 1994 5
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.4 28-lead mini-pack; plastic (SO28; SOT136A).
Dimensions in mm.
handbook, full pagewidth
7.6
7.4
10.65
10.00
A
MBC236 - 1
0.3
0.1
2.45
2.25
1.1
0.5
0.32
0.23
1.1
1.0
0 to 8o
2.65
2.35
detail A
S
18.1
17.7
0.1 S
114
1528
pin 1
index
0.9
0.4 (4x)
0.25 M
(28x)
0.49
0.36
1.27
June 1994 6
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.5 24-lead small-outline; plastic (SO24L; SOT137A).
handbook, full pagewidth
7.6
7.4
10.65
10.00
A
MBC235 - 1
0.3
0.1
2.45
2.25
1.1
0.5
0.32
0.23
1.1
1.0
0 to 8o
2.65
2.35
detail A
S
15.6
15.2
0.1 S
112
1324
pin 1
index
0.9
0.4 (4x)
0.25 M
(24x)
0.49
0.36
1.27
Dimensions in mm.
June 1994 7
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.6 20-lead dual in-line; plastic (SOT146).
Dimensions in mm.
MSA258
2.54
(9x) 0.254 M
0.53
max
seating plane
3.60
3.05
2.0
max
26.92
26.54
4.2
max
3.2
max
0.51
min
8.25
7.80
0.38 max
7.62
10.0
8.3
11
10
6.40
6.22
1.73 max
20
1
June 1994 8
Philips Semiconductors Specification status
8048-based 8-bit Microcontrollers Package information
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handbook, full pagewidth
MBC823 - 1
S 0.15 S
16.0
15.3 7.6
7.5
12.3
11.8 X
pin 1
index
40 21
20
1
0.1 M
0.42
0.30
(40x)
0.762
0.51
0.41 (4x)
0.3
0.1
2.45
2.25
1.15
1.05
0.22
0.14
2.70
2.35
1.7
1.5 0 to 7o
detail X
Fig.7 40-lead mini-pack; plastic (VSO40; SOT158A).
Dimensions in mm.
June 1994 9
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.8 20-lead mini-pack; plastic (SO20; SOT163A).
Dimensions in mm.
a
ndbook, full pagewidth
7.6
7.4
10.65
10.00
A
MBC234 - 1
0.3
0.1
2.45
2.25
1.1
0.5
0.32
0.23
1.1
1.0
0 to 8o
2.65
2.35
detail A
S
13.0
12.6
0.1 S
110
1120
pin 1
index
0.9
0.4 (4x)
0.25 M
(20x)
0.49
0.36
1.27
June 1994 10
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
handbook, full pagewidth
16.66
16.51
17.65
17.40
seating plane
0.10 S 0.53
max 0.18 M
1.27
(40 x)
S
0.81
max 2939
44
1
A
6
7 17
2840
18
1.22
1.07 0.51
max (3x)
MBC653
,,
,,

,,
,,

detail A
0.32
max
0.51 min
3.04
max
4.57
max
17.65
17.40
16.66
16.51
2.15
max
1.14
0.64
R
16.00
14.99
45o
Fig.9 44-lead plastic leaded chip carrier (PLCC); (SOT187AA).
Dimensions in mm.
June 1994 11
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
handbook, full pagewidth
25.27
25.02
24.33
24.13
25.27
25.02
seating plane
0.10 S 0.53
max 0.18 M
1.27
(64 x)
S
0.81
max 4460
1
A
9
10 26
43
61
1.22
1.07 0.51
max (3x)
24.33
24.13
2.15
max
1.14
0.64
R
23.6
22.6
MBC652 - 1
detail A
0.27
max
0.51 min
3.3
max
5.08
max
45o27
,
,
68
Fig.10 68-lead plastic leaded chip carrier (PLCC); (SOT188AA, AGA).
Dimensions in mm.
June 1994 12
Philips Semiconductors Specification status
8048-based 8-bit Microcontrollers Package information
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
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handbook, full pagewidth
11.1
11.0
15.8
15.2
X
9.80
9.65
22.0
21.5
S 0.15 S
pin 1
index
56 29
28
1
0.1 M
0.42
0.30
(56x)
0.75
0.75
0.55 (4x)
MBC821 - 1
3.0
2.8 0.3
0.1
1.45
1.30
0.22
0.14
3.3
2.9
1.6
1.4 0 to 7o
detail X
1.1
0.9
Fig.11 56-lead mini-pack; plastic (VSO56; SOT190).
Dimensions in mm.
June 1994 13
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.12 44-lead quad flat-pack; plastic (SOT205AG).
handbook, full pagewidth
2.0
1.2
MBC659 - 1
detail X
1.2
0.9
0.25
0.14
2.60
2.15
0 to 7o
2.3
2.1 0.25
0.05
S
0.15 S
seating plane
X
A
B
19.2
18.2
2.4
1.8 (4x)
14.1
13.9 19.2
18.2
0.15 M B
0.50
0.35
2.4
1.8 (4x)
14.1
13.9
pin 1 index
1
44 34
33
23
22
12
11
0.50
0.35 0.15 M A
1.0
1.0
Dimensions in mm.
June 1994 14
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
1.55
0.85
MBC658 - 1
detail X
1.45
1.15
0.25
0.14
3.2
2.7
0 to 7o
2.85
2.65 0.30
0.05
A
B
pin 1 index
19.2
18.2
1.2
0.8 (4x)
20.1
19.9 25.2
24.2
1.0
0.15 M B
0.50
0.35
1.2
0.8 (4x)
14.1
13.9
0.50
0.35 0.15 M A
1
64 52
51
33
3220
19
1.0
S
0.15 S
seating plane
X
Fig.13 64-lead quad flat-pack; plastic (SOT208).
Dimensions in mm.
June 1994 15
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.14 24-lead shrink dual in-line; plastic (SDIL24; SOT234A).
24
1
13
12
1.3 max
9.1
8.7
22.3
21.4
3.8
max 4.7
max
0.51
min
3.2
2.8
seating plane
0.18 M
0.53
max
1.778
(11x)
1.6
max
10.7
10.2
0.32 max
10.16
12.2
10.5
MSA263
Dimensions in mm.
June 1994 16
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
Fig.15 42-lead shrink dual in-line; plastic (SDIL42; SOT270).
handbook, full pagewidth
1
22
21
1.3 max
14.1
13.7
4.57
max 5.08
max
0.51
min
3.2
2.9
seating plane
0.18 M
0.53
max
1.778
(40x)
1.73
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA268 - 1
42
39.0
38.4
Dimensions in mm.
June 1994 17
Philips Semiconductors
8048-based 8-bit Microcontrollers Package information
SOLDERING
Plastic mini-packs, plastic quad flat-packs and
plastic leaded chip carriers
BYWAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.