Si5345/44/42 Rev D Data Sheet
10-Channel, Any-Frequency, Any-Output Jitter Attenuator/
Clock Multiplier
These jitter attenuating clock multipliers combine fourth-generation DSPLL™ and
MultiSynth™ technologies to enable any-frequency clock generation and jitter attenu-
ation for applications requiring the highest level of jitter performance. These devices
are programmable via a serial interface with in-circuit programmable non-volatile
memory (NVM) so they always power up with a known frequency configuration. They
support free-run, synchronous, and holdover modes of operation, and offer both au-
tomatic and manual input clock switching. The loop filter is fully integrated on-chip,
eliminating the risk of noise coupling associated with discrete solutions. Furthermore,
the jitter attenuation bandwidth is digitally programmable, providing jitter perform-
ance optimization at the application level. Programming the Si5345/44/42 is easy
with Silicon Labs’ ClockBuilder Pro™ software. Factory preprogrammed devices are
also available.
Applications:
• OTN muxponders and transponders
• 10/40/100 G networking line cards
• GbE/10 GbE/100 GbE Synchronous Ethernet (ITU-T G.8262)
• Carrier Ethernet switches
• SONET/SDH line cards
• Broadcast video
• Test and measurement
• ITU-T G.8262 (SyncE) compliant
KEY FEATURES
• Generates any combination of output
frequencies from any input frequency
•Ultra-low jitter of 90 fs rms
• External Crystal: 25 to 54 MHz
• Input frequency range
• Differential: 8 kHz to 750 MHz
• LVCMOS: 8 kHz to 250 MHz
• Output frequency range
• Differential: 100 Hz to 1028 MHz
• LVCMOS: 100 Hz to 250 MHz
• Meets G.8262 EEC Option 1, 2 (SyncE)
• Highly configurable outputs compatible with
LVDS, LVPECL, LVCMOS, CML, and HCSL
with programmable signal amplitude
• Si5345: 4 input, 10 output, 64-QFN 9×9 mm
• Si5344: 4 input, 4 output, 44-QFN 7×7 mm
• Si5342: 4 input, 2 output, 44-QFN 7×7 mm
Up to 10
Output Clocks
Si5344
Si5345
I2C / SPI Control NVM
Status Flags Status Monitor
XBXA
25-54 MHz XTAL
OSC MultiSynth
MultiSynth
MultiSynth
MultiSynth
MultiSynth
DSPLL
Si5342
4 Input
Clocks
IN0
IN1
IN2
IN3/FB_IN
OUT7
OUT6
OUT5
OUT1
OUT4
OUT3
OUT2
OUT0
÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
OUT9
OUT8
÷INT
÷INT
÷FRAC
÷FRAC
÷FRAC
÷FRAC
silabs.com | Building a more connected world. Rev. 1.2
1. Features List
The Si5345/44/42 Rev D features are listed below:
• Generates any combination of output frequencies from any in-
put frequency
• Ultra-low jitter of 90 fs rms
• Input frequency range
• Differential: 8 kHz–750 MHz
• LVCMOS: 8 kHz–250 MHz
• Output frequency range
• Differential: 100 Hz to 1028 MHz
• LVCMOS: 100 Hz to 250 MHz
• Programmable jitter attenuation bandwidth: 0.1 Hz to 4 kHz
• Meets G.8262 EEC Option 1, 2 (SyncE)
• Highly configurable outputs compatible with LVDS, LVPECL,
LVCMOS, CML, and HCSL with programmable signal ampli-
tude
• Status monitoring (LOS, OOF, LOL)
• Hitless input clock switching: automatic or manual
• Locks to gapped clock inputs
• Free-run and holdover modes
• Optional zero delay mode
•Fastlock feature for low nominal bandwidths
• Glitchless on the fly output frequency changes
• DCO mode: as low as 0.001 ppb step size
• Core voltage
• VDD: 1.8 V ±5%
• VDDA: 3.3 V ±5%
• Independent output clock supply pins
• 3.3 V, 2.5 V, or 1.8 V
•Serial interface: I2C or SPI
• In-circuit programmable with non-volatile OTP memory
•ClockBuilder Pro software simplifies device configuration
• Si5345: 4 input, 10 output, 64-QFN 9×9 mm
• Si5344: 4 input, 4 output, 44-QFN 7×7 mm
• Si5342: 4 input, 2 output, 44-QFN 7×7 mm
• Temperature range: –40 to +85 °C
• Pb-free, RoHS-6 compliant
Si5345/44/42 Rev D Data Sheet
Features List
silabs.com | Building a more connected world. Rev. 1.2 | 2
2. Ordering Guide
Ordering Part Number
(OPN)
Number of Input/
Output Clocks
Output Clock Frequency
Range (MHz)
Supported Frequency
Synthesis Modes Package Temperature
Range
Si5345
Si5345A-D-GM1, 2
4/10
0.001 to 1028 MHz Integer and
Fractional 64-QFN
9×9 mm
–40 to 85 °C
Si5345B-D-GM1, 2 0.001 to 350 MHz
Si5345C-D-GM1, 2 0.001 to 1028 MHz
Integer Only
Si5345D-D-GM1, 2 0.001 to 350 MHz
Si5344
Si5344A-D-GM1, 2
4/4
0.001 to 1028 MHz Integer and
Fractional 44-QFN
7×7 mm
–40 to 85 °C
Si5344B-D-GM1, 2 0.001 to 350 MHz
Si5344C-D-GM1, 2 0.001 to 1028 MHz
Integer Only
Si5344D-D-GM1, 2 0.001 to 350 MHz
Si5342
Si5342A-D-GM1, 2
4/2
0.001 to 1028 MHz Integer and
Fractional 44-QFN
7×7 mm
–40 to 85 °C
Si5342B-D-GM1, 2 0.001 to 350 MHz
Si5342C-D-GM1, 2 0.001 to 1028 MHz
Integer Only
Si5342D-D-GM1, 2 0.001 to 350 MHz
Si5345/44/42-D-EVB
Si5345-D-EVB
— — — Evaluation
Board —Si5344-D-EVB
Si5342-D-EVB
Notes:
1. Add an R at the end of the OPN to denote tape and reel ordering options.
2. Custom, factory preprogrammed devices are available. Ordering part numbers are assigned by Silicon Labs and the ClockBuilder
Pro software. Custom part number format is “Si5345A-Dxxxxx-GM” where “xxxxx” is a unique numerical sequence representing
the preprogrammed configuration.
Si5345/44/42 Rev D Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.2 | 3
Figure 2.1. Ordering Part Number Fields
Si5345/44/42 Rev D Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.2 | 4
Table of Contents
1. Features List ...............................2
2. Ordering Guide ..............................3
3. Functional Description............................7
3.1 Frequency Configuration ..........................7
3.2 DSPLL Loop Bandwidth ...........................7
3.3 Fastlock Feature .............................7
3.4 Modes of Operation ............................7
3.4.1 Initialization and Reset ..........................8
3.4.2 Freerun Mode .............................8
3.4.3 Lock Acquisition Mode ..........................8
3.4.4 Locked Mode .............................8
3.4.5 Holdover Mode ............................9
3.5 External Reference (XA/XB) .........................9
3.6 Digitally Controlled Oscillator (DCO) Mode ....................10
3.7 Inputs (IN0, IN1, IN2, IN3) ..........................10
3.7.1 Manual Input Switching (IN0, IN1, IN2, IN3) ...................10
3.7.2 Automatic Input Selection (IN0, IN1, IN2, IN3) ..................11
3.7.3 Hitless Input Switching ..........................11
3.7.4 Ramped Input Switching .........................11
3.7.5 Glitchless Input Switching .........................11
3.7.6 Input Configuration and Terminations .....................12
3.7.7 Synchronizing to Gapped Input Clocks ....................13
3.8 Fault Monitoring .............................13
3.8.1 Input LOS Detection...........................14
3.8.2 XA/XB LOS Detection ..........................14
3.8.3 OOF Detection ............................14
3.8.4 LOL Detection.............................15
3.8.5 Interrupt Pin (INTRb) ..........................16
3.9 Outputs ................................16
3.9.1 Output Crosspoint ...........................17
3.9.2 Output Signal Format ..........................17
3.9.3 Differential Output Terminations.......................18
3.9.4 LVCMOS Output Terminations .......................18
3.9.5 Programmable Common Mode Voltage For Differential Outputs ............18
3.9.6 LVCMOS Output Impedance Selection ....................19
3.9.7 LVCMOS Output Signal Swing .......................19
3.9.8 LVCMOS Output Polarity .........................19
3.9.9 Output Enable/Disable ..........................19
3.9.10 Output Driver State When Disabled .....................19
3.9.11 Synchronous Output Disable Feature ....................19
3.9.12 Zero Delay Mode ...........................20
3.9.13 Output Divider (R) Synchronization .....................20
silabs.com | Building a more connected world. Rev. 1.2 | 5
3.10 Power Management ............................20
3.11 In-Circuit Programming...........................20
3.12 Serial Interface .............................21
3.13 Custom Factory Preprogrammed Parts .....................21
3.14 Enabling Features and/or Configuration Settings Unavailable in ClockBuilder Pro for Factory
Preprogrammed Devices ..........................21
4. Register Map ..............................23
5. Electrical Specifications ..........................24
6. Typical Application Schematic ........................39
7. Detailed Block Diagrams ..........................40
8. Typical Operating Characteristics ......................43
9. Pin Descriptions .............................45
10. Package Outlines ............................51
10.1 Si5345 9x9 mm 64-QFN Package Diagram ....................51
10.2 Si5344 and Si5342 7x7 mm 44-QFN Package Diagram ................52
11. PCB Land Pattern ............................53
12. Top Marking ..............................55
13. Device Errata ..............................56
14. Revision History............................. 57
silabs.com | Building a more connected world. Rev. 1.2 | 6
3. Functional Description
The Si5345’s internal DSPLL provides jitter attenuation and any-frequency multiplication of the selected input frequency. Fractional in-
put dividers (P) allow the DSPLL to perform hitless switching between input clocks (INx) that are fractionally related. Input switching is
controlled manually or automatically using an internal state machine. The oscillator circuit (OSC) provides a frequency reference which
determines output frequency stability and accuracy while the device is in free-run or holdover mode. The high-performance MultiSynth
dividers (N) generate integer or fractionally related output frequencies for the output stage. A crosspoint switch connects any of the
MultiSynth generated frequencies to any of the outputs. Additional integer division (R) determines the final output frequency.
3.1 Frequency Configuration
The frequency configuration of the DSPLL is programmable through the serial interface and can also be stored in non-volatile memory.
The combination of fractional input dividers (Pn/Pd), fractional frequency multiplication (Mn/Md), fractional output MultiSynth division
(Nn/Nd), and integer output division (Rn) allows the generation of virtually any output frequency on any of the outputs. All divider values
for a specific frequency plan are easily determined using the ClockBuilder Pro software.
3.2 DSPLL Loop Bandwidth
The DSPLL loop bandwidth determines the amount of input clock jitter attenuation. Register configurable DSPLL loop bandwidth set-
tings in the range of 0.1 Hz to 4 kHz are available for selection. Since the loop bandwidth is controlled digitally, the DSPLL will always
remain stable with less than 0.1 dB of peaking regardless of the loop bandwidth selection.
3.3 Fastlock Feature
Selecting a low DSPLL loop bandwidth (e.g. 0.1 Hz) will generally lengthen the lock acquisition time. The fastlock feature allows setting
a temporary Fastlock Loop Bandwidth that is used during the lock acquisition process. Higher fastlock loop bandwidth settings will ena-
ble the DSPLLs to lock faster. Fastlock Loop Bandwidth settings of in the range of 100 Hz to 4 kHz are available for selection. The
DSPLL will revert to its normal loop bandwidth once lock acquisition has completed.
3.4 Modes of Operation
Once initialization is complete the DSPLL operates in one of four modes: Free-run Mode, Lock Acquisition Mode, Locked Mode, or
Holdover Mode. A state diagram showing the modes of operation is shown in Figure 3.1 Modes of Operation on page 8. The follow-
ing sections describe each of these modes in greater detail.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 7
3.4.1 Initialization and Reset
Once power is applied, the device begins an initialization period where it downloads default register values and configuration data from
NVM and performs other initialization tasks. Communicating with the device through the serial interface is possible once this initializa-
tion period is complete. No clocks will be generated until the initialization is complete. There are two types of resets available. A hard
reset is functionally similar to a device power-up. All registers will be restored to the values stored in NVM, and all circuits including the
serial interface will be restored to their initial state. A hard reset is initiated using the RSTb pin or by asserting the hard reset register bit.
A soft reset bypasses the NVM download. It is simply used to initiate register configuration changes.
No valid
input clocks
selected
Lock Acquisition
(Fast Lock)
Locked
Mode
Holdover
Mode
Phase lock on
selected input
clock is achieved
An input is
qualified and
available for
selection
No valid input
clocks available
for selection
Free-run
Valid input clock
selected
Reset and
Initialization
Power-Up
Selected input
clock fails
Yes
No
Holdover
History
Valid?
Other Valid
Clock Inputs
Available?
No
Yes
Input Clock
Switch
Figure 3.1. Modes of Operation
3.4.2 Freerun Mode
The DSPLL will automatically enter freerun mode once power is applied to the device and initialization is complete. The frequency ac-
curacy of the generated output clocks in freerun mode is entirely dependent on the frequency accuracy of the external crystal or refer-
ence clock on the XA/XB pins. For example, if the crystal frequency is ±100 ppm, then all the output clocks will be generated at their
configured frequency ±100 ppm in freerun mode. Any drift of the crystal frequency will be tracked at the output clock frequencies. A
TCXO or OCXO is recommended for applications that need better frequency accuracy and stability while in freerun or holdover modes.
3.4.3 Lock Acquisition Mode
The device monitors all inputs for a valid clock. If at least one valid clock is available for synchronization, the DSPLL will automatically
start the lock acquisition process. If the fast lock feature is enabled, the DSPLL will acquire lock using the Fastlock Loop Bandwidth
setting and then transition to the DSPLL Loop Bandwidth setting when lock acquisition is complete. During lock acquisition the outputs
will generate a clock that follows the VCO frequency change as it pulls in to the input clock frequency.
3.4.4 Locked Mode
Once locked, the DSPLL will generate output clocks that are both frequency and phase locked to their selected input clocks. At this
point, any XTAL frequency drift will not affect the output frequency. A loss of lock pin (LOL) and status bit indicate when lock is ach-
ieved. See 3.8.4 LOL Detection for more details on the operation of the loss-of-lock circuit.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 8
3.4.5 Holdover Mode
The DSPLL will automatically enter holdover mode when the selected input clock becomes invalid and no other valid input clocks are
available for selection. The DSPLL uses an averaged input clock frequency as its final holdover frequency to minimize the disturbance
of the output clock phase and frequency when an input clock suddenly fails. The holdover circuit for the DSPLL stores up to 120 sec-
onds of historical frequency data while locked to a valid clock input. The final averaged holdover frequency value is calculated from a
programmable window within the stored historical frequency data. Both the window size and the delay are programmable as shown in
the figure below. The window size determines the amount of holdover frequency averaging. The delay value allows ignoring frequency
data that may be corrupt just before the input clock failure.
Programmable delay
Clock Failure and Entry
into Holdover
time
0
Historical Frequency Data Collected
Programmable historical data window used to
determine the final holdover value
120 seconds
Figure 3.2. Programmable Holdover Window
When entering holdover, the DSPLL will pull its output clock frequency to the calculated averaged holdover frequency. While in hold-
over, the output frequency drift is entirely dependent on the external crystal or external reference clock connected to the XA/XB pins. If
the clock input becomes valid, the DSPLL will automatically exit the holdover mode and re-acquire lock to the new input clock. This
process involves pulling the output clock frequency to achieve frequency and phase lock with the input clock. This pull-in process is
glitchless and its rate is controlled by the DSPLL or the Fastlock bandwidth.
The DSPLL output frequency when exiting holdover can be ramped (recommend). Just before the exit is initiated, the difference be-
tween the current holdover frequency and the new desired frequency is measured. Using the calculated difference and a user-selecta-
ble ramp rate, the output is linearly ramped to the new frequency. The ramp rate can be 0.2 ppm/s, 40,000 ppm/s, or any of about 40
values in between. The DSPLL loop BW does not limit or affect ramp rate selections (and vice versa). CBPro defaults to ramped exit
from holdover. The same ramp rate settings are used for both exit from holdover and ramped input switching. For more information on
ramped input switching, see 3.7.4 Ramped Input Switching.
Note: If ramped holdover exit is not selected, the holdover exit is governed either by (1) the DSPLL loop BW or (2) a user-selectable
holdover exit BW.
3.5 External Reference (XA/XB)
An external crystal (XTAL) is used in combination with the internal oscillator (OSC) to produce an ultra low jitter reference clock for the
DSPLL and for providing a stable reference for the free-run and holdover modes. A simplified diagram is shown in Figure 3.3 Crystal
Resonator and External Reference Clock Connection Options on page 10. The device includes internal XTAL loading capacitors
which eliminates the need for external capacitors and also has the benefit of reduced noise coupling from external sources. Refer to
Table 5.12 Crystal Specifications on page 37 for crystal specifications. A crystal in the range of 48 MHz to 54 MHz is recommended
for best jitter performance. The Si5345/44/42 Rev D Family Reference Manual provides additional information on PCB layout recom-
mendations for the crystal to ensure optimum jitter performance.
To achieve optimal jitter performance and minimize BOM cost, a crystal is recommended on the XA/XB reference input. For SyncE
pizza box applications (e.g. loop bandwidth set to 0.1 Hz), a TCXO is required on the XA/XB reference to minimize wander and to pro-
vide a stable holdover reference. See the Si5345/44/42 Rev D Family Reference Manual for more information. Selection between the
external XTAL or REFCLK is controlled by register configuration. The internal crystal loading capacitors (CL) are disabled in the
REFCLK mode. Refer to Table 5.3 Input Clock Specifications on page 26 for REFCLK requirements when using this mode. A PREF
divider is available to accommodate external clock frequencies higher than 54 MHz. Frequencies in the range of 48 MHz to 54 MHz will
achieve the best output jitter performance.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 9
3.6 Digitally Controlled Oscillator (DCO) Mode
The output MultiSynths support a DCO mode where their output frequencies are adjustable in predefined steps defined by frequency
step words (FSW). The frequency adjustments are controlled through the serial interface or by pin control using frequency increment
(FINC) or decrement (FDEC). A FINC will add the frequency step word to the DSPLL output frequency, while a FDEC will decrement it.
Any number of MultiSynths can be updated at once or independently controlled. The DCO mode is available when the DSPLL is operat-
ing in either free-run or locked mode.
Differential XO/Clock
Connection
2xCL2xCL
XB XA
OSC
÷ PREF
25-54 MHz XO/Clock
LVCMOS XO/Clock
Connection
2xCL2xCL
XB XA
OSC
÷ PREF
R2
R1
C1
25-54 MHz XO/Clock LVCMOS
Crystal Resonator
Connection
2xCL2xCL
XB XA
OSC
÷ PREF
25-54 MHz XTAL
X1
X2 X1 X2
NC NC
X1 X2
NC NC
Note: See Pin
Descriptions for
X1/X2 connections
C1 is recommended to
increase the slew rate
at Xa
See the Reference Manual for the
recommended R1, R2, C1 values
Figure 3.3. Crystal Resonator and External Reference Clock Connection Options
Note: See Table 5.3 Input Clock Specifications on page 26.
3.7 Inputs (IN0, IN1, IN2, IN3)
There are four inputs that can be used to synchronize the DSPLL. The inputs accept both differential and single-ended clocks. Input
selection can be manual (pin or register controlled) or automatic with user definable priorities.
3.7.1 Manual Input Switching (IN0, IN1, IN2, IN3)
Input clock selection can be made manually using the IN_SEL[1:0] pins or through a register. A register bit determines input selection
as pin selectable or register selectable. The IN_SEL pins are selected by default. If there is no clock signal on the selected input, the
device will automatically enter free-run or holdover mode. When the zero delay mode is enabled, IN3 becomes the feedback input
(FB_IN) and is not available for selection as a clock input.
Table 3.1. Manual Input Selection Using IN_SEL[1:0] Pins
IN_SEL[1:0] Selected Input
Zero Delay Mode Disabled Zero Delay Mode Enabled
0 0 IN0 IN0
0 1 IN1 IN1
1 0 IN2 IN2
1 1 IN3 Reserved
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 10
3.7.2 Automatic Input Selection (IN0, IN1, IN2, IN3)
An automatic input selection state machine is available in addition to the manual switching option. In automatic mode, the selection
criteria is based on input clock qualification, input priority, and the revertive option. Only input clocks that are valid can be selected by
the automatic clock selection state machine. If there are no valid input clocks available the DSPLL will enter the holdover mode. With
revertive switching enabled, the highest priority input with a valid input clock is always selected. If an input with a higher priority be-
comes valid then an automatic switchover to that input will be initiated. With non-revertive switching, the active input will always remain
selected while it is valid. If it becomes invalid an automatic switchover to a valid input with the highest priority will be initiated.
3.7.3 Hitless Input Switching
Hitless switching is a feature that prevents a phase offset from propagating to the output when switching between two clock inputs that
have a fixed phase relationship. A hitless switch can only occur when the two input frequencies are frequency locked meaning that they
have to be exactly at the same frequency, or at a fractional frequency relationship to each other. When hitless switching is enabled, the
DSPLL simply absorbs the phase difference between the two input clocks during a input switch. When disabled, the phase difference
between the two inputs is propagated to the output at a rate determined by the DSPLL Loop Bandwidth. The hitless switching feature
supports clock frequencies down to the minimum input frequency of 8 kHz.
3.7.4 Ramped Input Switching
When switching between two plesiochronous input clocks (i.e., the frequencies are "almost the same" but not quite), ramped input
switching should be enabled to ensure a smooth transition between the two inputs. Ramped input switching avoids frequency transients
and overshoot when switching between frequencies and so is the default switching mode in CBPro. The feature should be turned off
when switching between input clocks that are always frequency locked (i.e., are always the same exact frequency). The same ramp
rate settings are used for both holdover exit and clock switching. For more information on ramped exit from holdover see 3.4.5 Holdover
Mode.
3.7.5 Glitchless Input Switching
The DSPLL has the ability of switching between two input clock frequencies that are up to ±500 ppm apart. The DSPLL will pull-in to the
new frequency using the DSPLL Loop Bandwidth or using the Fastlock Loop Bandwidth if enabled. The loss of lock (LOL) indicator will
assert while the DSPLL is pulling-in to the new clock frequency. There will be no abrupt phase change at the output during the transi-
tion.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 11
3.7.6 Input Configuration and Terminations
Each of the inputs can be configured as differential or single-ended LVCMOS. The recommended input termination schemes are shown
in Figure 14. Differential signals must be ac-coupled, while single-ended LVCMOS signals can be ac- or dc-coupled. Unused inputs can
be disabled and left unconnected when not in use.
3.3V, 2.5V, 1.8V
LVCMOS
INx
50
Standard AC-Coupled Differential (IN0-IN3)
INx
50
Pulsed CMOS
Standard
50
R1
Pulsed CMOS
Standard
See the Reference Manual for details on R1 and R2 values.
RS matches the CMOS driver to a 50 ohm
transmission line (if used)
Standard AC-Coupled Single-Ended (IN0-IN3)
Pulsed CMOS DC-Coupled Single Ended only for Frequencies < 1MHz
RS
LVDS, LVPECL, CML
INxb
INxb
When 3.3V LVCMOS driver is present, C1 (optional), R1 and R2 may be needed to keep the signal at
INx < 3.6 Vpp_se. See the Reference Manual for details.
INx
3.3/2.5/1.8V LVCMOS
Pulsed CMOS
Standard
R1
50
RS
RS matches the CMOS driver to a 50 ohm
transmission line (if used)
C1
INxb
R2
R2
Figure 3.4. Termination of Differential and LVCMOS Input Signals
Note: See Table 5.3 Input Clock Specifications on page 26 and the Si5345/44/42 Rev D Family Reference Manual for more informa-
tion.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 12
3.7.7 Synchronizing to Gapped Input Clocks
The DSPLL supports locking to an input clock that has missing periods. This is also referred to as a gapped clock. The purpose of
gapped clocking is to modulate the frequency of a periodic clock by selectively removing some of its cycles. Gapping a clock severely
increases its jitter so a phase-locked loop with high jitter tolerance and low loop bandwidth is required to produce a low-jitter periodic
clock. The resulting output will be a periodic non-gapped clock with an average frequency of the input with its missing cycles. For
example, an input clock of 100 MHz with one cycle removed every 10 cycles will result in a 90 MHz periodic non-gapped output clock.
This is shown in the following figure. For more information on gapped clocks, see “AN561: Introduction to Gapped Clocks and PLLs”.
DSPLL
100 ns 100 ns
1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9
100 MHz clock
1 missing period every 10
90 MHz non-gapped clock
10 ns 11.11111... ns
Gapped Input Clock Periodic Output Clock
Period Removed
Figure 3.5. Generating an Averaged Clock Output Frequency from a Gapped Clock Input
A valid gapped clock input must have a minimum frequency of 10 MHz with a maximum of two missing cycles out of every eight. Lock-
ing to a gapped clock will not trigger the LOS, OOF, and LOL fault monitors. Clock switching between gapped clocks may violate the
hitless switching specification in Table 5.8 Performance Characteristics on page 32 when the switch occurs during a gap in either
input clock.
3.8 Fault Monitoring
All four input clocks (IN0, IN1, IN2, IN3/FB_IN) are monitored for loss of signal (LOS) and out-of-frequency (OOF) as shown in the fig-
ure below. The reference at the XA/XB pins is also monitored for LOS since it provides a critical reference clock for the DSPLL. There is
also a Loss Of Lock (LOL) indicator which is asserted when the DSPLL loses synchronization.
DSPLL
LPFPD
÷M
IN0
IN0b
Precision
Fast
OOF
LOS
÷P0
IN1
IN1b
Precision
Fast
OOF
LOS
÷P1
IN3/FB_IN
IN3/FB_INb
Precision
Fast
OOF
LOS
÷P3
IN2
IN2b
Precision
Fast
OOF
LOS
÷P2
LOL
XB
XA
OSC
LOS
Si5345/44/42
Figure 3.6. Si5345/44/42 Fault Monitors
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 13
3.8.1 Input LOS Detection
The loss of signal monitor measures the period of each input clock cycle to detect phase irregularities or missing clock edges. Each of
the input LOS circuits has its own programmable sensitivity which allows ignoring missing edges or intermittent errors. Loss of signal
sensitivity is configurable using the ClockBuilder Pro software.
The LOS status for each of the monitors is accessible by reading a status register. The live LOS register always displays the current
LOS state and a sticky register always stays asserted until cleared. An option to disable any of the LOS monitors is also available.
LOS
en
Monitor
LOS
LOS
Sticky
Live
Figure 3.7. LOS Status Indicators
3.8.2 XA/XB LOS Detection
A LOS monitor is available to ensure that the external crystal or reference clock is valid. By default the output clocks are disabled when
XAXB_LOS is detected. This feature can be disabled such that the device will continue to produce output clocks when XAXB_LOS is
detected.
3.8.3 OOF Detection
Each input clock is monitored for frequency accuracy with respect to a OOF reference which it considers as its “0_ppm” reference. This
OOF reference can be selected as either:
• XA/XB pins
• Any input clock (IN0, IN1, IN2, IN3)
The final OOF status is determined by the combination of both a precise OOF monitor and a fast OOF monitor as shown in the figure
below. An option to disable either monitor is also available. The live OOF register always displays the current OOF state, and its sticky
register bit stays asserted until cleared.
en
en
Precision
Fast
OOF
Monitor
LOS
OOF
Sticky
Live
Figure 3.8. OOF Status Indicator
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 14
3.8.3.1 Precision OOF Monitor
The precision OOF monitor circuit measures the frequency of all input clocks to within ±1/16 ppm accuracy with respect to the selected
OOF frequency reference. A valid input clock frequency is one that remains within the OOF frequency range which is register configura-
ble up to ±500 ppm in steps of 1/16 ppm. A configurable amount of hysteresis is also available to prevent the OOF status from toggling
at the failure boundary. An example is shown in the figure below. In this case, the OOF monitor is configured with a valid frequency
range of ±6 ppm and with 2 ppm of hysteresis. An option to use one of the input pins (IN0–IN3) as the 0 ppm OOF reference instead of
the XA/XB pins is available. This option is register configurable.
OOF Reference
Hysteresis Hysteresis
OOF Declared
OOF Cleared
-6 ppm
(Set)
-4 ppm
(Clear)
0 ppm +4 ppm
(Clear)
+6 ppm
(Set)
fIN
Figure 3.9. Example of Precise OOF Monitor Assertion and Deassertion Triggers
3.8.3.2 Fast OOF Monitor
Because the precision OOF monitor needs to provide 1/16 ppm of frequency measurement accuracy, it must measure the monitored
input clock frequencies over a relatively long period of time. This may be too slow to detect an input clock that is quickly ramping in
frequency. An additional level of OOF monitoring called the Fast OOF monitor runs in parallel with the precision OOF monitors to quick-
ly detect a ramping input frequency. The Fast OOF monitor asserts OOF on an input clock frequency that has changed by greater than
±4000 ppm.
3.8.4 LOL Detection
The Loss Of Lock (LOL) monitor asserts a LOL register bit when the DSPLL has lost synchronization with its selected input clock.
There is also a dedicated loss of lock pin that reflects the loss of lock condition. The LOL monitor functions by measuring the frequency
difference between the input and feedback clocks at the phase detector. There are two LOL frequency monitors, one that sets the LOL
indicator (LOL Set) and another that clears the indicator (LOL Clear). An optional timer is available to delay clearing of the LOL indicator
to allow additional time for the DSPLL to completely lock to the input clock. The timer is also useful to prevent the LOL indicator from
toggling or chattering as the DSPLL completes lock acquisition. A block diagram of the LOL monitor is shown in the figure below. The
live LOL register always displays the current LOL state and a sticky register always stays asserted until cleared. The LOL pin reflects
the current state of the LOL monitor.
DSPLL
LPFPD
÷M Si5345/44/42
LOL
Clear
LOL
Set
Timer
LOLb
LOS
LOL
Sticky
Live
LOL Monitor
fIN
Feedback
Clock
Figure 3.10. LOL Status Indicators
The LOL frequency monitors have an adjustable sensitivity which is register configurable from 0.1 ppm to 10,000 ppm. Having two sep-
arate frequency monitors allows for hysteresis to help prevent chattering of LOL status.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 15
An example configuration where LOCK is indicated when there is less than 0.1 ppm frequency difference at the inputs of the phase
detector and LOL is indicated when there’s more than 1 ppm frequency difference is shown in the following figure.
Phase Detector Frequency Difference (ppm)
Hysteresis
LOL
LOCKED
Clear LOL
Threshold
Set LOL
Threshold
Lock Acquisition
0
Lost Lock
10,0000.1 1
Figure 3.11. LOL Set and Clear Thresholds
Note: In this document, the terms, LVDS and LVPECL, refer to driver formats that are compatible with these signaling standards.
An optional timer is available to delay clearing of the LOL indicator to allow additional time for the DSPLL to completely lock to the input
clock. The timer is also useful to prevent the LOL indicator from toggling or chattering as the DSPLL completes lock acquisition. The
configurable delay value depends on frequency configuration and loop bandwidth of the DSPLL and is automatically calculated using
the ClockBuilder Pro software.
3.8.5 Interrupt Pin (INTRb)
An interrupt pin (INTRb) indicates a change in state of the status indicators (LOS, OOF, LOL, HOLD). Any of the status indicators are
maskable to prevent assertion of the interrupt pin. The state of the INTRb pin is reset by clearing the status register that caused the
interrupt.
3.9 Outputs
Each driver has a configurable voltage swing and common mode voltage covering a wide variety of differential signal formats. In addi-
tion to supporting differential signals, any of the outputs can be configured as single-ended LVCMOS (3.3 V, 2.5 V, or 1.8 V) providing
up to 20 single-ended outputs, or any combination of differential and single-ended outputs.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 16
3.9.1 Output Crosspoint
A crosspoint allows any of the output drivers to connect with any of the MultiSynths as shown in the figure below. The crosspoint config-
uration is programmable and can be stored in NVM so that the desired output configuration is ready at power up.
OUT2b
VDDO2
OUT2
VDDO3
VDDO0
OUT0b
OUT0
÷R2
OUT3b
OUT3
÷R3
OUT1b
VDDO1
OUT1
÷R1
OUT5b
VDDO5
OUT5
VDDO6
÷R5
OUT6b
OUT6
÷R6
OUT4b
VDDO4
OUT4
÷R4
OUT7b
VDDO7
OUT7
VDDO8
÷R7
OUT8b
OUT8
÷R8
÷R0
Multi
Synth ÷N0n
N0d
Multi
Synth
Multi
Synth
Multi
Synth
÷N2n
N2d
÷N3n
N3d
÷N4n
N4d
Multi
Synth ÷N1n
N1d
OUT9b
OUT9
÷R9
VDDO9
Figure 3.12. MultiSynth to Output Driver Crosspoint
3.9.2 Output Signal Format
The differential output swing and common mode voltage are both fully programmable covering a wide variety of signal formats including
LVDS and LVPECL. In addition to supporting differential signals, any of the outputs can be configured as LVCMOS (3.3 V, 2.5 V, or 1.8
V) drivers providing up to 20 single-ended outputs, or any combination of differential and single-ended outputs.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 17
3.9.3 Differential Output Terminations
The differential output drivers support both ac-coupled and dc-coupled terminations as shown in the figure below.
Note: In this document, the terms, LVDS and LVPECL, refer to driver formats that are compatible with these signaling standards.
AC Coupled LVDS/LVPECL
AC Coupled CMLDC Coupled LVDS
AC Coupled HCSL
VDDRX
Standard
HCSL
Receiver
R1
OUTx
OUTxb
R1
R2 R2
VDDO = 3.3V, 2.5V, 1.8V
50
50
50
50
VDD – 1.3V
5050
OUTx
OUTxb
VDDO = 3.3V, 2.5V
50
50
OUTx
OUTxb
VDDO = 3.3V, 2.5V, 1.8V
50
50
Internally
self-biased
OUTx
OUTxb
LVDS: VDDO = 3.3V, 2.5V, 1.8V
LVPECL: VDDO = 3.3V, 2.5V
100
100
Figure 3.13. Supported Differential Output Terminations
Note: See the Si5345/44/42 Rev D Family Reference Manual for resistor values.
3.9.4 LVCMOS Output Terminations
LVCMOS outputs are dc-coupled, as shown in the following figure.
3.3V, 2.5V, 1.8V
LVCMOS
VDDO = 3.3V, 2.5V, 1.8V
50
Rs
50
Rs
DC Coupled LVCMOS
OUTx
OUTxb
Si5345/44/42
Figure 3.14. LVCMOS Output Terminations
3.9.5 Programmable Common Mode Voltage For Differential Outputs
The common mode voltage (VCM) for the differential modes are programmable so that LVDS specifications can be met and for the best
signal integrity with different supply voltages. When dc coupling the output driver, it is essential that the receiver have a relatively high
common mode impedance so that the common mode current from the output driver is very small.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 18
3.9.6 LVCMOS Output Impedance Selection
Each LVCMOS driver has a configurable output impedance to accommodate different trace impedances. A source termination resistor
is recommended to help match the selected output impedance to the trace impedance, where Rs = Transmission line impedance – ZO.
There are three programmable output impedance selections (CMOS1, CMOS2, CMOS3) for each VDDO option as shown in the
following table.
Table 3.2. Typical Output Impedance (ZS)
VDDO CMOS Drive Selections
OUTx_CMOS_DRV = 1 OUTx_CMOS_DRV = 2 OUTx_CMOS_DRV = 3
3.3 V 38 Ω 30 Ω 22 Ω
2.5 V 43 Ω 35 Ω 24 Ω
1.8 V — 46 Ω 31 Ω
3.9.7 LVCMOS Output Signal Swing
The signal swing (VOL/VOH) of the LVCMOS output drivers is set by the voltage on the VDDO pins. Each output driver has its own
VDDO pin allowing a unique output voltage swing for each of the LVCMOS drivers.
3.9.8 LVCMOS Output Polarity
When a driver is configured as an LVCMOS output, it generates a clock signal on both pins (OUTx and OUTxb). By default, the clock
on the OUTx pin is generated with the same polarity (in phase) as the clock on the OUTxb pin. The polarity of these clocks is configura-
ble, enabling complementary clock generation and/or inverted polarity with respect to other output drivers.
3.9.9 Output Enable/Disable
The OEb pin provides a convenient method of disabling or enabling the output drivers. When the OEb pin is held high, all outputs are
disabled. When held low, the outputs are enabled. Outputs in the enabled state can be individually disabled through register control.
3.9.10 Output Driver State When Disabled
The disabled state of an output driver is configurable as disable low or disable high.
3.9.11 Synchronous Output Disable Feature
The output drivers provide a selectable synchronous disable feature. Output drivers with this feature turned on will wait until a clock
period has completed before the driver is disabled. This prevents unwanted runt pulses from occurring when disabling an output. When
this feature is turned off, the output clock will disable immediately without waiting for the period to complete.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 19
3.9.12 Zero Delay Mode
A zero delay mode is available for applications that require fixed and consistent minimum delay between the selected input and outputs.
The zero delay mode is configured by opening the internal feedback loop through software configuration and closing the loop externally
as shown in the figure below.
This helps to cancel out the internal delay introduced by the dividers, the crosspoint, the input, and the output drivers. Any one of the
outputs can be fed back to the FB_IN pins, although using the output driver that achieves the shortest trace length will help to minimize
the input-to-output delay. The OUT9 and FB_IN pins are recommended for the external feedback connection. The FB_IN input pins
must be terminated and ac-coupled when zero delay mode is used. A differential external feedback path connection is necessary for
best performance. Note that the hitless switching feature is not available when zero delay mode is enabled.
VDDO7
OUT7b
OUT7
÷R7
OUT0b
VDDO0
OUT0
÷R0
Si5345/44/42
IN0
IN0b
IN1
IN1b
IN2
IN2b
÷P1
÷P0
÷P2
DSPLL
LPFPD
÷M
IN3/FB_IN
÷P3
100
IN3/FB_INb
÷N0
÷N1
÷N2
÷N3
÷N4
OUT2b
VDDO2
OUT2
÷R2
External Feedback Path
OUT1b
VDDO1
OUT1
÷R1
OUT8b
VDDO8
OUT8
÷R8
OUT9b
VDDO9
OUT9
÷R9
Figure 3.15. Si5345 Zero Delay Mode Setup
3.9.13 Output Divider (R) Synchronization
All the output R dividers are reset to a known state during the power-up initialization period. This ensures consistent and repeatable
phase alignment across all output drivers. Resetting the device using the RSTb pin or asserting the hard reset bit will have the same
result.
3.10 Power Management
Unused inputs and output drivers can be powered down when unused. Consult the Si5345/44/42 Rev D Family Reference Manual and
ClockBuilder Pro software for details.
3.11 In-Circuit Programming
The Si5345/44/42 is fully configurable using the serial interface (I2C or SPI). At power-up the device downloads its default register val-
ues from internal non-volatile memory (NVM). Application specific default configurations can be written into NVM allowing the device to
generate specific clock frequencies at power-up. Writing default values to NVM is in-circuit programmable with normal operating power
supply voltages applied to its VDD and VDDA pins. The NVM is two time writable. Once a new configuration has been written to NVM,
the old configuration is no longer accessible. Refer to the Si5345/44/42 Rev D Family Reference Manual for a detailed procedure for
writing registers to NVM.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 20
3.12 Serial Interface
Configuration and operation of the Si5345/44/42 is controlled by reading and writing registers using the I2C or SPI interface. The
I2C_SEL pin selects I2C or SPI operation. Communication with both 3.3 V and 1.8 V host is supported. The SPI mode operates in
either 4-wire or 3-wire. See the Si5345/44/42 Rev D Family Reference Manual for details.
3.13 Custom Factory Preprogrammed Parts
For applications where a serial interface is not available for programming the device, custom pre-programmed parts can be ordered
with a specific configuration written into NVM. A factory preprogrammed part will generate clocks at power-up. Custom, factory-preprog-
rammed devices are available. The ClockBuilder Pro software can be used to quickly and easily generate a custom part number for
your configuration.
In less than three minutes, you will be able to generate a custom part number with a detailed data sheet addendum matching your
design’s configuration. Once you receive the confirmation email with the data sheet addendum, simply place an order with your local
Silicon Labs sales representative. Samples of your preprogrammed device will typically ship in about two weeks.
3.14 Enabling Features and/or Configuration Settings Unavailable in ClockBuilder Pro for Factory Preprogrammed Devices
As with essentially all modern software utilities, the ClockBuilder Pro software is continually being updated and enhanced. By register-
ing at www.silabs.com, you will be notified about changes and their impact. This update process will ultimately enable ClockBuilder Pro
software users to access all features and register setting values documented in this data sheet and the Si5345/44/42 Rev D Family
Reference Manual.
However, if you must enable or access a feature or register setting value so that the device starts up with this feature or a register
setting, but the feature or register setting is not yet available in CBPro, you must contact a Silicon Labs applications engineer for assis-
tance. One example of this type of feature or custom setting is the customizable output amplitude and common voltages for the clock
outputs. After careful review of your project file and requirements, the Silicon Labs applications engineer will email back your CBPro
project file with your specific features and register settings enabled using what's referred to as the manual "settings override" feature of
CBPro. "Override" settings to match your request(s) will be listed in your design report file. Examples of setting "overrides" in a CBPro
design report are shown in the following table.
Table 3.3. Setting Overrides
Location Name Type Target Dec Value Hex Value
0x04535[0] FORCE_HOLD No NVM N/A 1 0x1
0x0B48[0:4] OOF_DIV_CLK_DIS User OPN&EVB 0 0x00
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 21
Once you receive the updated design file, simply open it in CBPro. The device will begin operation after startup with the values in the
NVM file. The flowchart for this process is shown in the following figure.
Do I need a
pre-programmed device with
a feature or setting which is
unavailable in ClockBuilder
Pro?
No
Yes
Contact Silicon Labs
Technical Support
to submit & review
your
non-standard
configuration
request & CBPro
project file
Configure device
using CBPro
Load project file
into CBPro and test
Receive
updated CBPro
project file
from
Silicon Labs
with “Settings
Override”
Generate
Custom OPN
in CBPro
Does the updated
CBPro Project file
match your
requirements?
Yes
End: Place
sample order
Start
Figure 3.16. Process for Requesting Non-Standard CBPro Features
Note: Contact Silicon Labs Technical Support at www.silabs.com/support/Pages/default.aspx.
Si5345/44/42 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.2 | 22
5. Electrical Specifications
Table 5.1. Recommended Operating Conditions1
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Min Typ Max Unit
Ambient Temperature TA–40 25 85 °C
Junction Temperature TJMAX — — 125 °C
Core Supply Voltage
VDD 1.71 1.80 1.89 V
VDDA 3.14 3.30 3.47 V
Clock Output Driver Supply Voltage VDDO
3.14 3.30 3.47 V
2.37 2.50 2.62 V
1.71 1.80 1.89 V
Status Pin Supply Voltage VDDS
3.14 3.30 3.47 V
1.71 1.80 1.89 V
Note:
1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical val-
ues apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 24
Table 5.2. DC Characteristics
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, VDDO = 1.8 V ±5%, 2.5 V ±5%, or 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Core Supply Current1, 2, 3
IDD — 135 260 mA
IDDA — 120 130 mA
Output Buffer Supply Current IDDOx
LVPECL Output4
@ 156.25 MHz
— 22 26 mA
LVDS Output4
@ 156.25 MHz
— 15 18 mA
3.3 V LVCMOS Output5
@ 156.25 MHz
— 22 30 mA
2.5 V LVCMOS Output5
@ 156.25 MHz
— 18 23 mA
1.8 V LVCMOS Output5
@ 156.25 MHz
— 12 16 mA
Total Power Dissipation6Pd
Si53451— 900 1200 mW
Si53442— 730 1000 mW
Si53423— 670 950 mW
Notes:
1. Si5345 test configuration: 7 x 2.5 V LVDS outputs enabled at 156.25 MHz. Excludes power in termination resistors.
2. Si5344 test configuration: 4 x 2.5 V LVDS outputs enabled at 156.25 MHz. Excludes power in termination resistors.
3. Si5342 test configuration: 2 x 2.5 V LVDS outputs enabled at 156.25 MHz. Excludes power in termination resistors.
4. Differential outputs terminated into an AC-coupled 100 Ω load.
5. LVCMOS outputs measured into a 5-inch 50 Ω PCB trace with 4.7 pF load. The LVCMOS outputs were set to
OUTx_CMOS_DRV = 3, which is the strongest driver setting. Refer to the Si5345/44/42 Rev D Family Reference Manual for
more details on register settings.
50
50
100
OUT
OUTb
IDDO
Differential Output Test Configuration
0.1 uF
0.1 uF
LVCMOS Output Test Configuration
OUTx
OUTxb
IDDO
499
56
4.7pF
50 Scope Input
50
499
56
4.7pF
50 Scope Input
50
Trace length 5
inches
6. Detailed power consumption for any configuration can be estimated using ClockBuilder Pro when an evaluation board (EVB) is
not available. All EVBs support detailed current measurements for any configuration.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 25
Table 5.3. Input Clock Specifications
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Standard AC-Coupled Differential or Single-Ended (IN0/IN0b, IN1/IN1b, IN2/IN2b, IN3/IN3b, FB_IN/FB_INb)
Input Frequency Range fIN
Differential 0.008 — 750 MHz
All Single-ended signals
(including LVCMOS)
0.008 — 250 MHz
Voltage Swing1VIN
Differential AC-coupled
fIN < 250 MHz
100 — 1800 mVpp_se
Differential AC-coupled
250 MHz < fIN < 750 MHz
225 — 1800 mVpp_se
Single-ended AC-coupled
fIN < 250 MHz
100 — 3600 mVpp_se
Slew Rate2, 3 SR 400 — — V/µs
Duty Cycle DC 40 — 60 %
Input Capacitance CIN — 2.4 — pF
Input Resistance Differential RIN_DIFF — 16 — kΩ
Input Resistance Single-Ended RIN_SE — 8 — kΩ
LVCMOS / Pulsed CMOS, DC-Coupled, Single-Ended (IN0, IN1, IN2, IN3, FB_IN)3
Input Frequency
fIN_LVCMOS 0.008 — 250 MHz
fIN_PULSED_CMOS 0.008 — 1.0 MHz
Input Voltage
VIL –0.2 — 0.4 V
VIH 0.8 — — V
Slew Rate2, 3 SR 400 — — V/µs
Minimum Pulse Width PW Pulse Input 1.6 — — ns
Input Resistance RIN — 8 — kΩ
REFCLK (Applied to XA/XB)
REFCLK Frequency fIN_REF
Full operating range. Jitter
performance may be re-
duced.
24.97 — 54.06 MHz
Range for best jitter. 48 — 54 MHz
TCXO frequency for SyncE
applications. Jitter perform-
ance may be reduced.
— 40 — MHz
Input Single-ended Voltage
Swing VIN_SE 365 — 2000 mVpp_se
Input Differential Voltage Swing VIN_DIFF 365 2500 mVpp_diff
Slew Rate2, 3 SR 400 — — V/µs
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 26
Parameter Symbol Test Condition Min Typ Max Unit
Input Duty Cycle DC 40 — 60 %
Note:
1. Voltage swing is specified as single-ended mVpp.
OUTxb
OUTx
Vpp_se
Vpp_se
Vpp_diff = 2*Vpp_se
Vcm
Vcm
2. Recommended for specified jitter performance. Jitter performance could degrade if the minimum slew rate specification is not
met. (See the Si5345/44/42 Rev D Family Reference Manual for more information.)
3. Rise and fall times can be estimated using the following simplified equation: tr/tf80-20 = ((0.8 – 0.2) x VIN_Vpp_se) / SR. Pulsed
CMOS mode is intended primarily for single-ended LVCMOS input clocks < 1 MHz that must be dc-coupled because they have a
duty cycle significantly less than 50%. A typical application example is a low-frequency video frame sync pulse. Since the input
thresholds (VIL, VIH) of this buffer are non-standard (0.4 and 0.8 V, respectively) refer to the input attenuator circuit for dc-coupled
pulsed LVCMOS in the Si5345/44/42 Rev D Family Reference Manual. Otherwise, for standard LVCMOS input clocks, use the
Standard Differential or Single-Ended ac-coupled input mode.
Table 5.4. Control Input Pin Specifications
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, VDDS = 3.3 V ±5%, 1.8 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Si5345 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, A1, SCLK, A0/CSb, FINC, FDEC, SDA/SDIO)
Input Voltage
VIL — — 0.3 ×
VDDIO1V
VIH
0.7 ×
VDDIO1— — V
Input Capacitance CIN — 1.5 — pF
Input Resistance RIN — 20 — kΩ
Minimum Pulse Width PW RSTb, FINC and FDEC 100 — — ns
Update Rate TUR FINC and FDEC 1 — — µs
Si5344/42 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, A1, SCLK, A0/CSb, SDA/SDIO)
Input Voltage
VIL — — 0.3 ×
VDDIO1V
VIH
0.7 ×
VDDIO1— — V
Input Capacitance CIN — 1.5 — pF
Input Resistance RIN — 20 — kΩ
Minimum Pulse Width PW RSTb 100 — — ns
Note:
1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. See the Si5345/44/42 Rev D Family Reference
Manual for more details on the proper register settings.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 27
Table 5.5. Differential Clock Output Specifications
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, VDDO = 1.8 V ±5%, 2.5 V ±5%, or 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Si5345/44/42
Output Frequency fOUT
MultiSynth not used
0.0001 — 720 MHz
733.33 — 800.00 MHz
825 — 1028 MHz
MultiSynth used 0.0001 — 720 MHz
Duty Cycle DC
fOUT < 400 MHz 48 — 52 %
400 MHz < fOUT < 1028
MHz 45 — 55 %
Output-Output Skew
Using Same MultiSynth TSKS
Outputs on same
MultiSynth
(Measured at 712.5 MHz)
— 0 75 ps
OUT-OUTb Skew TSK_OUT Measured from the positive
to negative output pins — 0 50 ps
Output Voltage Swing1VOUT
VDDO = 3.3 V,
2.5 V, 1.8 V LVDS 350 430 510 mVpp_se
VDDO = 3.3 V,
2.5 V LVPECL 640 750 900 mVpp_se
Common Mode Voltage1, 2
(100 Ω load line-to-line)
VCM
VDDO = 3.3 V
LVDS 1.10 1.2 1.3 V
LVPECL 1.90 2.0 2.1 V
VDDO = 2.5 V
LVPECL
LVDS
1.1 1.2 1.3 V
VDDO = 1.8 V sub-LVDS 0.8 0.9 1.0 V
Rise and Fall Times
(20% to 80%)
tR/tF — 100 150 ps
Differential Output Impedance ZO — 100 — Ω
Power Supply Noise Rejec-
tion2PSRR
10 kHz sinusoidal noise — –101 — dBc
100 kHz sinusoidal noise — –96 — dBc
500 kHz sinusoidal noise — –99 — dBc
1 MHz sinusoidal noise — –97 — dBc
Output-output Crosstalk3XTALK
Si5345 — –72 — dBc
Si5342/44 — –88 — dBc
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 28
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Output amplitude and common-mode settings are programmable through register settings and can be stored in NVM. Each out-
put driver can be programmed independently. Note that the maximum LVDS single-ended amplitude can be up to 110 mV higher
than the TIA/EIA-644 maximum. Refer to the Si5345/44/42 Rev D Family Reference Manual for more suggested output settings.
Not all combinations of voltage amplitude and common mode voltages settings are possible.
OUTxb
OUTx
Vpp_se
Vpp_se
Vpp_diff = 2*Vpp_se
Vcm
Vcm
2. Measured for 156.25 MHz carrier frequency. 100 mVpp sinewave noise added to VDDO = 3.3 V and noise spur amplitude meas-
ured.
3. Measured across two adjacent outputs, both in LVDS mode, with the victim running at 155.52 MHz and the aggressor at 156.25
MHz. Refer to “AN862: Optimizing Si534x Jitter Performance in Next Generation Internet Infrastructure Systems” for guidance on
crosstalk optimization. Note that all active outputs must be terminated when measuring crosstalk.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 29
Table 5.6. LVCMOS Clock Output Specifications
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, VDDO = 1.8 V ±5%, 2.5 V ±5%, or 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Output Frequency fOUT 0.0001 — 250 MHz
Duty Cycle DC
fOUT <100 MHz 48 — 52 %
100 MHz < fOUT < 250 MHz 45 — 55 %
Output Voltage High1, 2, 3 VOH
VDDO = 3.3 V
OUTx_CMOS_DRV = 1 IOH = –10 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV = 2 IOH = –12 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV = 3 IOH = –17 mA VDDO x 0.85 — — V
VDDO = 2.5 V
OUTx_CMOS_DRV = 1 IOH = –6 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV = 2 IOH = –8 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV = 3 IOH = –11 mA VDDO x 0.85 — — V
VDDO = 1.8 V
OUTx_CMOS_DRV = 2 IOH = –4 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV = 3 IOH = –5 mA VDDO x 0.85 — — V
Output Voltage Low1, 2, 3 VOL
VDDO = 3.3 V
OUTx_CMOS_DRV = 1 IOL = 10 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV = 2 IOL = 12 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV = 3 IOL = 17 mA — — VDDO x 0.15 V
VDDO = 2.5 V
OUTx_CMOS_DRV = 1 IOL = 6 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV = 2 IOL = 8 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV = 3 IOL = 11 mA — — VDDO x 0.15 V
VDDO = 1.8 V
OUTx_CMOS_DRV = 2 IOL = 4 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV = 3 IOL = 5 mA — — VDDO x 0.15 V
LVCMOS Rise and Fall
Times3
(20% to 80%)
tr/tf
VDDO = 3.3V — 400 600 ps
VDDO = 2.5 V — 450 600 ps
VDDO = 1.8 V — 550 750 ps
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 30
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. Driver strength is a register programmable setting and stored in NVM. Options are OUTx_CMOS_DRV = 1, 2, 3. Refer to the
Si5345/44/42 Rev D Family Reference Manual for more details on register settings.
2. IOL/IOH is measured at VOL/VOH as shown in the dc test configuration.
3. A series termination resistor (Rs) is recommended to help match the source impedance to a 50 Ω PCB trace. A 5 pF capacitive
load is assumed. The LVCMOS outputs were set to OUTx_CMOS_DRV = 3, at 156.25 MHz.
Zs
IOL/IOH
VOL/VOH
LVCMOS Output Test Configuration
OUTx
OUTxb
IDDO
499
56
4.7pF
50 Scope Input
50
499
56
4.7pF
50 Scope Input
50
Trace length 5
inches
Table 5.7. Output Status Pin Specifications
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, VDDS = 3.3 V ±5%, 1.8 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
Si5345 Status Output Pins (LOLb, INTRb, SDA/SDIO1, SDO)
Output Voltage
VOH IOH = –2 mA VDDIO2 x
0.85 — — V
VOL IOL = 2 mA — — VDDIO2 x
0.15 V
Si5344/42 Status Output Pins (INTRb, SDA/SDIO11, SDO)
Output Voltage
VOH IOH = –2 mA VDDIO2 x
0.85 — — V
VOL IOL = 2 mA — — VDDIO2 x
0.15 V
Si5344 Status Output Pins (LOLb, LOS_XAXBb)
Si5342 Status Output Pins (LOLb, LOS_XAXBb, LOS0b, LOS1b, LOS2b, LOS3b)
Output Voltage
VOH IOH = –2 mA VDDS x 0.85 — — V
VOL IOL = 2 mA — — VDDS x 0.15 V
Notes:
1. The VOH specification does not apply to the open-drain SDA/SDIO output when the serial interface is in I2C mode or is unused
with I2C_SEL pulled high. VOL remains valid in all cases.
2. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. See the Si5345/44/42 Rev D Family Reference
Manual for more details on the proper register settings.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 31
Table 5.8. Performance Characteristics
VDD = 1.8 V ±5%, VDDA = 3.3 V ±5%, TA = –40 to 85 °C
Parameter Symbol Test Condition Min Typ Max Unit
PLL Loop Bandwidth Program-
ming Range1fBW 0.1 — 4000 Hz
Initial Start-Up Time tSTART Time from power-up to when the device
generates free-running clocks — 30 45 ms
PLL Lock Time2tACQ fIN = 19.44 MHz — 280 300 ms
POR to Serial Interface Ready3tRDY — — 15 ms
Jitter Peaking JPK
Measured with a frequency plan run-
ning a 25 MHz input, 25 MHz output,
and a Loop Bandwidth of 4 Hz
— — 0.1 dB
Jitter Tolerance JTOL
Compliant with G.8262 Options 1 and 2
Carrier Frequency = 10.3125 GHz
Jitter Modulation Frequency = 10 Hz
— 3180 — UI pk-pk
Maximum Phase Transient
During a Hitless Switch tSWITCH
Manual or automatic switch between
two input clocks at same frequency5— — 2.0 ns
Pull-in Range ωP— 500 — ppm
Zero-Delay Mode
Input-to-Output Delay tZDELAY
Delay between reference and feedback
input with both clocks at 10 MHz and
same slew rate. Ref clock rise time
must be <200 ps.6
— 110 — ps
RMS Phase Jitter4JGEN
Integer Mode
12 kHz to 20 MHz
— 90 145 fs rms
Fractional Mode
12 kHz to 20 MHz
— 120 170 fs rms
Note:
1. Actual loop bandwidth might be lower; please refer to CBPro for actual value for your frequency plan.
2. Lock Time can vary significantly depending on several parameters, such as bandwidths, LOL tresholds, etc. For this case, lock
time was measured with nominal and fastlock bandwidths set to 100 Hz, LOL set/clear thresholds of 6/0.6 ppm respectively, us-
ing IN0 as clock reference by removing the reference and enabling it again, then measuring the delta time between the first rising
edge of the clock reference and the LOL indicator deassertion.
3. Measured as time from valid VDD/VDDA rails (90% of their value) to when the serial interface is ready to respond to commands.
4. Jitter generation test conditions: fIN = 19.44 MHz, fOUT = 156.25 MHz LVPECL, loop bandwidth = 100 Hz, FXTAL = 48 MHz.
5. For input frequency configurations that have Fpfd > 1 MHz, consult your CBPro design report for the Fpfd frequency of your con-
figuration.
6. Delay is dependent on frequency configuration. Using Fpfd < 64 kHz will result in higher delay values.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 32
Table 5.9. I2C Timing Specifications (SCL,SDA)
Parameter Symbol Test Condition
Standard Mode
100 kbps
Fast Mode
400 kbps Unit
Min Max Min Max
SCL Clock Frequency fSCL — 100 — 400 kHz
SMBus Timeout — When Timeout is
Enabled 25 35 25 35 ms
Hold time (Repeated)
START condition tHD:STA 4.0 — 0.6 — µs
Low Period of the SCL Clock tLOW 4.7 — 1.3 — µs
HIGH Period of the SCL
Clock tHIGH 4.0 — 0.6 — µs
Setup Time for a Repeated
START Condition tSU:STA 4.7 — 0.6 — µs
Data Hold Time tHD:DAT 100 — 100 — ns
Data Setup Time tSU:DAT 250 — 100 — ns
Rise Time of both SDA and
SCL Signals tr— 1000 20 300 ns
Fall Time of both SDA and
SCL Signals tf— 300 — 300 ns
Setup Time for STOP Condi-
tion tSU:STO 4.0 — 0.6 — µs
Bus Free Time between a
STOP and START Condition tBUF 4.7 — 1.3 — µs
Data Valid Time tVD:DAT — 3.45 — 0.9 µs
Data Valid Acknowledge
Time tVD:ACK — 3.45 — 0.9 µs
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 33
Figure 5.1. I2C Serial Port Timing Standard and Fast Modes
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 34
Table 5.10. SPI Timing Specifications (4-Wire)
VDD = 1.8 V ±5%, VDDA = 3.3V ±5%, TA = –40 to 85 °C
Parameter Symbol Min Typ Max Unit
SCLK Frequency fSPI — — 20 MHz
SCLK Duty Cycle TDC 40 — 60 %
SCLK Period TC50 — — ns
Delay Time, SCLK Fall to SDO Active TD1 — 12.5 18 ns
Delay Time, SCLK Fall to SDO TD2 — 10 15 ns
Delay Time, CSb Rise to SDO Tri-State TD3 — 10 15 ns
Setup Time, CSb to SCLK TSU1 5 — — ns
Hold Time, SCLK Fall to CSb TH1 5 — — ns
Setup Time, SDI to SCLK Rise TSU2 5 — — ns
Hold Time, SDI to SCLK Rise TH2 5 — — ns
Delay Time Between Chip Selects (CSb) TCS 2 — — TC
SCLK
CSb
SDI
SDO
TSU1 TD1
TSU2
TD2
TC
TCS
TD3
TH2
TH1
Figure 5.2. 4-Wire SPI Serial Interface Timing
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 35
Table 5.11. SPI Timing Specifications (3-Wire)
VDD = 1.8 V ±5%, VDDA = 3.3V ±5%, TA = –40 to 85 °C
Parameter Symbol Min Typ Max Unit
SCLK Frequency fSPI — — 20 MHz
SCLK Duty Cycle TDC 40 — 60 %
SCLK Period TC50 — — ns
Delay Time, SCLK Fall to SDIO Turn-on TD1 — 12.5 20 ns
Delay Time, SCLK Fall to SDIO Next-bit TD2 — 10 15 ns
Delay Time, CSb Rise to SDIO Tri-State TD3 — 10 15 ns
Setup Time, CSb to SCLK TSU1 5 — — ns
Hold Time, CSb to SCLK Fall TH1 5 — — ns
Setup Time, SDI to SCLK Rise TSU2 5 — — ns
Hold Time, SDI to SCLK Rise TH2 5 — — ns
Delay Time Between Chip Selects (CSb) TCS 2 — — TC
SCLK
CSb
SDIO
TSU1
TD1
TSU2
TD2
TC
TCS
TD3
TH2
TH1
Figure 5.3. 3-Wire SPI Serial Interface Timing
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 36
Table 5.12. Crystal Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Crystal Frequency Range fXTAL Full operating range. Jit-
ter performance may be
reduced.
24.97 — 54.06 MHz
Range for best jitter. 48 — 54 MHz
Load Capacitance CL— 8 — pF
Crystal Drive Level dL— — 200 µW
Equivalent Series Resistance
Shunt Capacitance
rESR
CO
Refer to the Si5345-44-42 Family Reference Manual to determine ESR and shunt
capacitance.
Note:
1. Refer to the Si534x/8x Jitter Attenuators Recommended Crystal, TCXO and OCXOs Reference Manual for recommended 48 to
54 MHz crystals. The Si5345/44/42 are designed to work with crystals that meet these specifications.
Table 5.13. Thermal Characteristics
Parameter Symbol Test Condition 1 Value Unit
Si5345-64QFN
Thermal Resistance
Junction to Ambient
θJA
Still Air 22 °C/W
Air Flow 1 m/s 19.4 °C/W
Air Flow 2 m/s 18.3 °C/W
Thermal Resistance
Junction to Case
θJC 9.5 °C/W
Thermal Resistance
Junction to Board
θJB 9.4 °C/W
ΨJB 9.3 °C/W
Thermal Resistance
Junction to Top Center
ΨJT 0.2 °C/W
Si5344, Si5342-44QFN
Thermal Resistance
Junction to Ambient
θJA
Still Air 22.3 °C/W
Air Flow 1 m/s 19.4 °C/W
Air Flow 2 m/s 18.4 °C/W
Thermal Resistance
Junction to Case
θJC 10.9 °C/W
Thermal Resistance
Junction to Board
θJB 9.3 °C/W
ΨJB 9.2 °C/W
Thermal Resistance
Junction to Top Center
ΨJT 0.23 °C/W
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 37
Parameter Symbol Test Condition 1 Value Unit
Note:
1. Based on PCB Dimension: 3" x 4.5" PCB Thickness: 1.6 mm, PCB Land/Via: 36, Number of Cu Layers: 4
Table 5.14. Absolute Maximum Ratings 1, 2, 3
Parameter Symbol Test Condition Value Unit
DC Supply Voltage
VDD –0.5 to 3.8 V
VDDA –0.5 to 3.8 V
VDDO –0.5 to 3.8 V
VDDS –0.5 to 3.8 V
Input Voltage Range
VI1 4 IN0–IN3/FB_IN –1.0 to 3.8 V
VI2
IN_SEL1, IN_SEL0, RSTb,
OEb, I2C_SEL, FINC, FDEC,
SDI, SCLK, A0/CSb, A1,
SDA/SDIO
–0.5 to 3.8 V
VI3 XA/XB –0.5 to 2.7 V
Latch-up Tolerance LU JESD78 Compliant
ESD Tolerance HBM 100 pF, 1.5 kΩ 2.0 kV
Storage Temperature Range TSTG –55 to 150 °C
Maximum Junction Temperature in Operation TJCT 125 °C
Soldering Temperature
(Pb-free profile)5
TPEAK 260 °C
Soldering Temperature Time at TPEAK
(Pb-free profile)5
TP20–40 s
Note:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to
the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for ex-
tended periods may affect device reliability.
2. 64-QFN and 44-QFN packages are RoHS-6 compliant.
3. Moisture sensitivity level is MSL2. For more packaging information, go to the Silicon Labs RoHS information page.
4. The minimum voltage at these pins can be as low as –1.0 V when an ac input signal of 8 kHz or greater is applied. See Table
5.3 Input Clock Specifications on page 26 for single-ended ac-coupled fIN < 250 MHz.
5. The device is compliant with JEDEC J-STD-020.
Si5345/44/42 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.2 | 38
6. Typical Application Schematic
CPU/NPU
FPGA/ASIC/
SWITCH
1G PHY
1G PHY
10G PHY
10G PHY
125 MHz (LVPECL)
125 MHz (LVPECL)
100 MHz (HCSL)
133.333 MHz (CMOS)
83.333 MHZ (CMOS)
50 MHz (CMOS)
156.25 MHz (LVDS)
156.25 MHz (LVDS)
2.048 MHz
19.44 MHz
125 MHz
100 MHz
156.525 MHz (LVDS)
155.52 MHz (LVDS)
PCIe 3.0
DSPLL
Si5345
MultiSynth
MultiSynth
MultiSynth
MultiSynth
MultiSynth
Figure 6.1. 10G Ethernet Data Center Switch and Compute Blade Schematic
Si5348
Telecom or
Ethernet
Backplane
Wander Filtering
Hitless Switching
Holdover
8 kHz
19.44 MHz
25 MHz
A
B
BITS A
Line Recovered Timing
BITS B
LAN / WAN
SyncE Line Card
Line
Recovered
Clocks
155.52 MHz
156.25 MHz
161.1328125 MHz
10GbE
PHY
Si5345
Tx Timing Path
Rx Timing Path
8 kHz
19.44 MHz
25 MHz
Jitter Filtering
Hitless Switching
Frequency Translation
10GbE
PHY
A
B
Redundant
Timing Cards
SONET / SDH / PDH Line Card
Line
Recovered
Clocks
77.76 / 155.52 MHz
1.544 / 2.048 MHz
OC-3 / 12
Si5345
Tx Timing Path
Rx Timing Path
8 kHz
19.44 MHz
25 MHz
Jitter Filtering
Hitless Switching
Frequency Translation
A
B
T1 / E1
Si5348
TCXO/
OCXO
Figure 6.2. Sync E Line Card
Si5345/44/42 Rev D Data Sheet
Typical Application Schematic
silabs.com | Building a more connected world. Rev. 1.2 | 39
7. Detailed Block Diagrams
Si5345
IN_SEL[1:0]
DSPLL
LPFPD
Optional
External
Feedback
VDD
VDDA
3
OUT2b
VDDO2
OUT2
VDDO3
VDDO0
OUT0b
OUT0
÷R2
OUT3b
OUT3
÷R3
OUT1b
VDDO1
OUT1
÷R1
OUT5b
VDDO5
OUT5
VDDO6
÷R5
OUT6b
OUT6
÷R6
OUT4b
VDDO4
OUT4
÷R4
OUT7b
VDDO7
OUT7
VDDO8
÷R7
OUT8b
OUT8
÷R8
÷R0
Status
Monitors
INTRb
Multi
Synth ÷N0n
N0d
Multi
Synth
Multi
Synth
Multi
Synth
÷N2n
N2d
÷N3n
N3d
÷N4n
N4d
Multi
Synth ÷N1n
N1d
IN0
IN0b
IN1
IN1b
÷P0n
P0d
÷P1n
P1d
IN2
IN2b
IN3/FB_IN
IN3/FB_INb ÷P3n
P3d
÷P2n
P2d
OUT9b
OUT9
÷R9
VDDO9
RSTb
OEb
FDEC
FINC
÷Mn
Md
SDA/SDIO
A1/SDO
SCLK
A0/CSb
I2C_SEL
SPI/
I2CNVM
LOLb
48-54MHz XTAL or
REFCLK
OSC
XBXA
÷PREF
Figure 7.1. Si5345 Block Diagram
Si5345/44/42 Rev D Data Sheet
Detailed Block Diagrams
silabs.com | Building a more connected world. Rev. 1.2 | 40
Si5344
IN_SEL[1:0]
DSPLL
LPFPD
Optional
External
Feedback
IN0
IN0b
IN1
IN1b
÷P0n
P0d
÷P1n
P1d
IN2
IN2b
IN3/FB_IN
IN3/FB_INb ÷P3n
P3d
÷P2n
P2d
RSTb
OEb
VDD
VDDA
42
OUT2b
VDDO2
OUT2
VDDO3
VDDO0
OUT0b
OUT0
÷R2
OUT3b
OUT3
÷R3
OUT1b
VDDO1
OUT1
÷R1
÷R0
Multi
Synth ÷N0n
N0d
Multi
Synth
Multi
Synth
÷N2n
N2d
÷N3n
N3d
Multi
Synth ÷N1n
N1d
SDA/SDIO
A1/SDO
SCLK
A0/CSb
I2C_SEL
SPI/
I2C
NVM
÷Mn
Md
Status
Monitors
LOS_XAXBb
VDDS
LOLb
INTRb
48-54MHz XTAL or
REFCLK
OSC
XBXA
÷PREF
Figure 7.2. Si5344 Block Diagram
Si5345/44/42 Rev D Data Sheet
Detailed Block Diagrams
silabs.com | Building a more connected world. Rev. 1.2 | 41
Si5342
IN_SEL[1:0]
DSPLL
LPFPD
Optional
External
Feedback
IN0
IN0b
IN1
IN1b
÷P0n
P0d
÷P1n
P1d
IN2
IN2b
IN3/FB_IN
IN3/FB_INb ÷P3n
P3d
÷P2n
P2d
RSTb
OEb
VDD
VDDA
42
VDDO0
OUT0b
OUT0
OUT1b
VDDO1
OUT1
÷R1
÷R0
Multi
Synth ÷N0n
N0d
Multi
Synth ÷N1n
N1d
÷Mn
Md
Status
Monitors
LOS0b
LOS1b
LOS2b
LOS_XAXBb
SDA/SDIO
A1/SDO
SCLK
A0/CSb
I2C_SEL
SPI/
I2C
NVM
LOS3b
VDDS
LOLb
INTRb
3
48-54MHz XTAL or
REFCLK
OSC
XBXA
÷PREF
Figure 7.3. Si5342 Block Diagram
Si5345/44/42 Rev D Data Sheet
Detailed Block Diagrams
silabs.com | Building a more connected world. Rev. 1.2 | 42
8. Typical Operating Characteristics
The phase noise plots below were taken under the following conditions: VDD = 1.8 V; VDDA = 3.3 V; VDDS = 3.3 V, 1.8 V; TA = 25 °C.
Figure 8.1. Input = 25 MHz; Output = 625 MHz, 2.5 V LVDS
Si5345/44/42 Rev D Data Sheet
Typical Operating Characteristics
silabs.com | Building a more connected world. Rev. 1.2 | 43
Figure 8.2. Input = 25 MHz; Output = 156.25 MHz, 2.5 V LVDS
Figure 8.3. Input = 25 MHz; Output = 155.52 MHz, 2.5 V LVDS
Si5345/44/42 Rev D Data Sheet
Typical Operating Characteristics
silabs.com | Building a more connected world. Rev. 1.2 | 44
9. Pin Descriptions
GND
Pad
IN1
IN1b
IN_SEL0
IN_SEL1
RSVD
RSTb
X1
XA
XB
X2
OEb
INTRb
VDDA
IN2
IN2b
SCLK
FINC
LOLb
VDD
OUT6
OUT6b
VDDO6
OUT5
OUT5b
VDDO5
I2C_SEL
OUT4
OUT4b
VDDO4
OUT3
OUT3b
VDDO3
VDDO7
OUT7b
OUT7
VDDO8
OUT8b
OUT8
OUT9b
OUT9
VDDO9
VDD
IN3/FB_IN
IN3b/FB_INb
IN0
IN0b
Si5345
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
A0/CSb
SDA/SDIO
VDD
RSVD
RSVD
VDDO0
OUT0b
OUT0
VDDO1
OUT1b
OUT1
FDEC
VDDO2
OUT2b
OUT2
A1/SDO
RSVD
RSVD
GND
Pad
IN1
IN1b
IN_SEL0
INTRb
X1
XA
XB
X2
OEb
RSTb
VDDA
VDDA
IN2
A0/CSb
SDA/SDIO
A1/SDO
OUT0b
OUT0
VDDO0 I2C_SEL
OUT1
OUT1b
VDDO1
VDDO3
OUT3b
OUT3
IN3/FB_IN
IN3b/FB_INb
IN0
IN0b
Si5344 44QFN
Top View
1
2
3
4
5
6
7
8
9
10
33
32
31
30
29
28
27
26
25
24
12
13
14
15
16
17
18
19
20
21
44
43
42
41
40
39
38
37
36
35
VDD
OUT2
OUT2b
VDDO2
VDDS
LOLb
LOS_XAXBb
VDD
IN_SEL1
IN2b 11 23
NC 22
VDD
VDD
34
SCLK
GND
Pad
IN1
IN1b
IN_SEL0
INTRb
X1
XA
XB
X2
OEb
RSTb
VDDA
VDDA
IN2
A0/CSb
SDA/SDIO
A1/SDO
OUT0b
OUT0
VDDO0 I2C_SEL
OUT1
OUT1b
VDDO1
VDDS
LOS2b
LOS3b
IN3/FB_IN
IN3b/FB_INb
IN0
IN0b
Si5342 44QFN
Top View
1
2
3
4
5
6
7
8
9
10
33
32
31
30
29
28
27
26
25
24
12
13
14
15
16
17
18
19
20
21
44
43
42
41
40
39
38
37
36
35
VDD
LOS1b
LOS0b
VDDS
VDDS
LOLb
LOS_XAXBb
VDD
IN_SEL1
IN2b 11 23
NC 22
VDD
VDD
34
SCLK
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 45
Table 9.1. Si5345/44/42 Pin Descriptions
Pin Name
Pin Number
Pin Type1Function
Si5345 Si5344 Si5342
Inputs
XA 8 5 5 I Crystal Input. Input pins for external crystal (XTAL). Alternatively
these pins can be driven with an external reference clock
(REFCLK). An internal register bit selects XTAL or REFCLK
mode. Default is XTAL mode.
XB 9 6 6 I
X1 7 4 4 I XTAL Shield. Connect these pins directly to the XTAL ground
pins. X1, X2 and the XTAL ground pins should be separated from
the PCB ground plane. Refer to the Si5345/44/42 Rev D Family
Reference Manual for layout guidelines. These pins should be left
disconnected when connecting XA/XB pins to an external refer-
ence clock (REFCLK).
X2 10 7 7 I
IN0 63 43 43 I
Clock Inputs. These pins accept an input clock for synchronizing
the device. They support both differential and single-ended clock
signals. Refer to 3.7.6 Input Configuration and Terminations for
input termination options. These pins are high-impedance and
must be terminated externally. The negative side of the differen-
tial input must be grounded through a capacitor when accepting a
single-ended clock.
IN0b 64 44 44 I
IN1 1 1 1 I
IN1b 2 2 2 I
IN2 14 10 10 I
IN2b 15 11 11 I
IN3/FB_IN 61 41 41 I Clock Input 3/External Feedback Input. By default these pins
are used as the fourth clock input (IN3/IN3b). They can also be
used as the external feedback input (FB_IN/FB_INb) for the op-
tional zero delay mode. See 3.9.12 Zero Delay Mode for details
on the optional zero delay mode.
IN3b/FB_INb 62 42 42 I
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 46
Table 9.2. Si5345/44/42 Pin Descriptions
Pin Name
Pin Number
Pin Type1Function
Si5345 Si5344 Si5342
Outputs
OUT0 24 20 20 O
Output Clocks. These output clocks support a programmable
signal swing and common mode voltage. Desired output signal
format is configurable using register control. Termination recom-
mendations are provided in 3.9.3 Differential Output Terminations
and 3.9.4 LVCMOS Output Terminations. Unused outputs should
be left unconnected.
OUT0b 23 19 19 O
OUT1 28 25 25 O
OUT1b 27 24 24 O
OUT2 31 31 — O
OUT2b 30 30 — O
OUT3 35 36 — O
OUT3b 34 35 — O
OUT4 38 — — O
OUT4b 37 — — O
OUT5 42 — — O
OUT5b 41 — — O
OUT6 45 — — O
OUT6b 44 — — O
OUT7 51 — — O
OUT7b 50 — — O
OUT8 54 — — O
OUT8b 53 — — O
OUT9 59 — — O
OUT9b 58 — — O
Serial Interface
I2C_SEL 39 38 38 I
I2C Select2. This pin selects the serial interface mode as I2C
(I2C_SEL = 1) or SPI (I2C_SEL = 0). This pin is internally pulled
up by a ~ 20 kΩ resistor to the voltage selected by the
IO_VDD_SEL register bit.
SDA/SDIO 18 13 13 I/O
Serial Data Interface2
This is the bidirectional data pin (SDA) for the I2C mode, or the
bidirectional data pin (SDIO) in the 3-wire SPI mode, or the input
data pin (SDI) in 4-wire SPI mode. When in I2C mode, this pin
must be pulled-up using an external resistor of at least 1 kΩ. No
pull-up resistor is needed when is SPI mode. Tie low when un-
used.
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 47
Pin Name
Pin Number
Pin Type1Function
Si5345 Si5344 Si5342
A1/SDO 17 15 15 I/O
Address Select 1/Serial Data Output2
In I2C mode, this pin functions as the A1 address input pin and
does not have an internal pull-up or pull-down resistor. In 4-wire
SPI mode this is the serial data output (SDO) pin and drives high
to the voltage selected by the IO_VDD_SEL bit. Leave discon-
nected when unused.
SCLK 16 14 14 I
Serial Clock Input2
This pin functions as the serial clock input for both I2C and SPI
modes. When in I2C mode, this pin must be pulled-up using an
external resistor of at least 1 kΩ. No pull-up resistor is needed
when in SPI mode. Tie high or low when unused.
A0/CSb 19 16 16 I
Address Select 0/Chip Select2
This pin functions as the hardware controlled address A0 in I2C
mode. In SPI mode, this pin functions as the chip select input (ac-
tive low). This pin is internally pulled-up by a ~20 kΩ resistor and
can be left unconnected when not in use.
Control/Status
INTRb 12 33 33 O
Interrupt2
This pin is asserted low when a change in device status has oc-
curred. It should be left unconnected when not in use.
RSTb 6 17 17 I
Device Reset2
Active low input that performs power-on reset (POR) of the de-
vice. Resets all internal logic to a known state and forces the de-
vice registers to their default values. Clock outputs are disabled
during reset. This pin is internally pulled-up and can be left un-
connected when not in use.
OEb 11 12 12 I
Output Enable2
This pin disables all outputs when held high. This pin is internally
pulled low and can be left unconnected when not in use.
LOLb
47 — — O
Loss Of Lock (Si5345)2
This output pin indicates when the DSPLL is locked (high) or out-
of-lock (low). It can be left unconnected when not in use.
— 27 27 O
Loss Of Lock (Si5344/42)3
This output pin indicates when the DSPLL is locked (high) or out-
of-lock (low). It can be left unconnected when not in use.
LOS0b — — 30 O
Loss Of Signal for IN03
This pin indicate a loss of clock at the IN0 pin when low.
LOS1b — — 31 O
Loss Of Signal for IN13
This pin indicate a loss of clock at the IN1 pin when low.
LOS2b — — 35 O
Loss Of Signal for IN23
This pin indicate a loss of clock at the IN2 pin when low.
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 48
Pin Name
Pin Number
Pin Type1Function
Si5345 Si5344 Si5342
LOS3b — — 36 O
Loss Of Signal for IN33
This pin indicate a loss of clock at the IN3 pin when low.
LOS_XAXBb — 28 28 O
Loss Of Signal on XA/XB Pins3
This pin indicates a loss of signal at the XA/XB pins when low.
FINC 48 — — I
Frequency Increment Pin2
This pin is used to step-up the output frequency of a selected out-
put. The affected output and its frequency change step size is
register configurable. This pin is internally pulled low and can be
left unconnected when not in use.
FDEC 25 — — I
Frequency Decrement Pin2
This pin is used to step-down the output frequency of a selected
output. The affected output driver and its frequency change step
size is register configurable. This pin is internally pulled low and
can be left unconnected when not in use.
IN_SEL0 3 3 3 I Input Reference Select2
The IN_SEL[1:0] pins are used in manual pin controlled mode to
select the active clock input as shown in Table 3.1 Manual Input
Selection Using IN_SEL[1:0] Pins on page 10. These pins are in-
ternally pulled low.
IN_SEL1 4 37 37 I
RSVD
5 — — —
Reserved
These pins are connected to the die. Leave disconnected.
20 — — —
21 — — —
55 — — —
56 — — —
NC — 22 22
No Connect
These pins are not connected to the die. Leave disconnected.
Power
VDD
32 21 21 P Core Supply Voltage
The device operates from a 1.8 V supply. A 1.0 µF bypass capac-
itor should be placed very close to this pin. See the Si5345/44/42
Rev D Family Reference Manual for power supply filtering recom-
mendations.
46 32 32 P
60 39 39 P
— 40 40 P
VDDA
13 8 8 P Core Supply Voltage 3.3 V
This core supply pin requires a 3.3 V power source. A 1 µF by-
pass capacitor should be placed very close to this pin. See the
Si5345/44/42 Rev D Family Reference Manual for power supply
filtering recommendations.
— 9 9 P
VDDS
— 26 26 P Status Output Voltage
The voltage on this pin determines VOL/VOH on the Si5342/44
LOL_A and LOL_B outputs. Connect to either 3.3 V or 1.8 V. A
1.0 µF bypass capacitor should be placed very close to this pin.
— — 29 P
— — 34 P
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 49
Pin Name
Pin Number
Pin Type1Function
Si5345 Si5344 Si5342
VDDO0 22 18 18 P
Output Clock Supply Voltage
Supply voltage (3.3 V, 2.5 V, 1.8 V) for OUTn, OUTn outputs. For
unused outputs, leave VDDO pins unconnected. An alternative
option is to connect the VDDO pin to a power supply and disable
the output driver to minimize current consumption.
VDDO1 26 23 23 P
VDDO2 29 29 — P
VDDO3 33 34 — P
VDDO4 36 — — P
VDDO5 40 — — P
VDDO6 43 — — P
VDDO7 49 — — P
VDDO8 52 — — P
VDDO9 57 — — P
GND PAD — — — P
Ground Pad
This pad provides connection to ground and must be connected
for proper operation. Use as many vias as practical, and keep the
via length to an internal ground plane as short as possible.
Note:
1. I = Input, O = Output, P = Power.
2. The IO_VDD_SEL control bit (0x0943 bit 0) selects 3.3 V or 1.8 V operation.
3. The voltage on the VDDS pin(s) determines 3.3 V or 1.8 V operation.
4. Refer to the Si5345/44/42 Rev D Family Reference Manual for more information on register setting names.
5. All status pins except I2C and SPI are push-pull.
Si5345/44/42 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.2 | 50
10. Package Outlines
10.1 Si5345 9x9 mm 64-QFN Package Diagram
The following figure illustrates the package details for the Si5345. The table lists the values for the dimensions shown in the illustration.
Figure 10.1. 64-Pin Quad Flat No-Lead (QFN)
Table 10.1. Package Dimensions
Dimension Min Nom Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 9.00 BSC
D2 5.10 5.20 5.30
e 0.50 BSC
E 9.00 BSC
E2 5.10 5.20 5.30
L 0.30 0.40 0.50
aaa — — 0.10
bbb — — 0.10
ccc — — 0.08
ddd — — 0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5345/44/42 Rev D Data Sheet
Package Outlines
silabs.com | Building a more connected world. Rev. 1.2 | 51
10.2 Si5344 and Si5342 7x7 mm 44-QFN Package Diagram
The following figure illustrates the package details for the Si5344 and Si5342. The table lists the values for the dimensions shown in the
illustration.
Figure 10.2. 44-Pin Quad Flat No-Lead (QFN)
Table 10.2. Package Dimensions
Dimension Min Nom Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 7.00 BSC
D2 5.10 5.20 5.30
e 0.50 BSC
E 7.00 BSC
E2 5.10 5.20 5.30
L 0.30 0.40 0.50
aaa — — 0.10
bbb — — 0.10
ccc — — 0.08
ddd — — 0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5345/44/42 Rev D Data Sheet
Package Outlines
silabs.com | Building a more connected world. Rev. 1.2 | 52
11. PCB Land Pattern
The following figure illustrates the PCB land pattern details for the devices. The table lists the values for the dimensions shown in the
illustration.
Si5345 Si5344 and Si5342
Figure 11.1. PCB Land Pattern
Si5345/44/42 Rev D Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.2 | 53
Table 11.1. PCB Land Pattern Dimensions
Dimension Si5345 (Max) Si5344/42 (Max)
C1 8.90 6.90
C2 8.90 6.90
E 0.50 0.50
X1 0.30 0.30
Y1 0.85 0.85
X2 5.30 5.30
Y2 5.30 5.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition is calculated based on a fabrication
Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electropolished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 3x3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the center ground pad.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5345/44/42 Rev D Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.2 | 54
12. Top Marking
Figure 12.1. Si5345/44/42 Top Marking
Table 12.1. Top Marking Explanation
Line Characters Description
1 Si534fg-
Base part number and Device Grade for Any-frequency, Any-output, Jitter
Cleaning Clock (single PLL):
f = 5: 10-output Si5345: 64-QFN
f = 4: 4-output Si5344: 44-QFN
f = 2: 2-output Si5342: 44-QFN
g = Device Grade (A, B, C, D). See 2. Ordering Guide for more information.
– = Dash character.
2 Rxxxxx-GM
R = Product revision. (Refer to 2. Ordering Guide for latest revision).
xxxxx = Customer specific NVM sequence number. Optional NVM code as-
signed for custom, factory pre-programmed devices.
Characters are not included for standard, factory default configured devices.
See 2. Ordering Guide for more information.
-GM = Package (QFN) and temperature range (–40 to +85 °C)
3 YYWWTTTTTT
YYWW = Characters correspond to the year (YY) and work week (WW) of
package assembly.
TTTTTT = Manufacturing trace code.
4
Circle w/ 1.6 mm (64-QFN) or 1.4
mm (44-QFN) diameter Pin 1 indicator; left-justified
e4
TW
Pb-free symbol; Center-Justified
TW = Taiwan; Country of Origin (ISO Abbreviation)
Si5345/44/42 Rev D Data Sheet
Top Marking
silabs.com | Building a more connected world. Rev. 1.2 | 55
14. Revision History
Revision 1.2
September, 2018
• Updated Figure 3.3 Crystal Resonator and External Reference Clock Connection Options on page 10.
• Updated Figure 3.4 Termination of Differential and LVCMOS Input Signals on page 12.
• Updated Figure 3.13 Supported Differential Output Terminations on page 18.
• Removed Output Skew Control section.
• Updated Table 5.2 DC Characteristics on page 25
• Updated Note 5 and LVCMOS Output Test Configuration circuit.
• Updated Table 5.3 Input Clock Specifications on page 26.
• Updated Table 5.4 Control Input Pin Specifications on page 27.
• Updated Input Capacitance specification.
• Updated Table 5.5 Differential Clock Output Specifications on page 28.
• Updated Table 5.6 LVCMOS Clock Output Specifications on page 30.
• Updated LVCMOS Output Test Configuration under Note 3.
• Updated Table 5.8 Performance Characteristics on page 32.
• Changed "Input-to-Output Delay" specification to "Zero-Delay Mode Input-to-Output Delay".
•Updated Table 5.12 Crystal Specifications on page 37.
•Updated Table 5.14 Absolute Maximum Ratings 1, 2, 3 on page 38.
Revision 1.1
August, 2017
• Refer to AN1006 for a list of changes from Rev B to Rev D.
• Updated block diagram on the front page.
• Minor changes to the following tables:
•Table 5.3 Input Clock Specifications on page 26
•Table 5.8 Performance Characteristics on page 32
•Table 5.12 Crystal Specifications on page 37
•Table 5.14 Absolute Maximum Ratings 1, 2, 3 on page 38
Revision 1.0
July, 2016
• Initial release.
Si5345/44/42 Rev D Data Sheet
Revision History
silabs.com | Building a more connected world. Rev. 1.2 | 57
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