Semiconductor Components Industries, LLC, 1999
January, 2021 − Rev. 4 1Publication Order Number:
NC7WZ17/D
TinyLogic UHS Dual Buffer
with Schmitt Trigger Inputs
NC7WZ17
Description
The NC7WZ17 is a dual buffer with Schmitt trigger inputs from
ON Semiconductor’s Ultra−High Speed (UHS) series of TinyLogic
products. The device is fabricated with advanced CMO S technology t o
achieve ultra−high speed with high output drive, while maintaining
low static power dissipation over a very broad VCC operating range.
The device is specified to operate over the 1.65 V to 5.5 V VCC range.
The inputs and outputs are high−impedance when VCC is 0 V. Inputs
tolerate voltages up to 5.5 V, independent of VCC operating voltage.
Schmitt trigger inputs achieve 1 V typical hysteresis between the
positive− and negative−going input threshold voltage at 5 V.
Features
•Ultra−High Speed: tPD = 3.6 ns (Typical) into 50 pF at 5 V VCC
•High Output Drive: ±24 mA at 3 V VCC
•Broad VCC Operating Range: 1.65 V to 5.5 V
•Matches Performance of LC X when Operated at 3.3 V VCC
•Power Down High−Impedance Inputs / Outputs
•Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
•Proprietary Noise / EMI Reduction Circuitry
•Ultra−Small MicroPak Packages
•Space−Saving SC−88 Package
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
1Y1
A1
IEEC / IEC
Y2
A21
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SC−88
CASE 419B−02
SIP6 1.45x1.0
CASE 127EB
UDFN6
1.0X1.0, 0.35P
CASE 517DP
A5KK
XYZ
A5KK
XYZ
A5, Z17 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
M = Date Code
•= Pb−Free Package
(Microdot may be in either location)
Pin 1
Pin 1
Z17 M•
•
1
6
NC7WZ17
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2
Pin Configurations
NOTES:
1. AAA represents Product Code Top Mark (see ordering code).
2. Orientation o f Top Mark determines Pin One location. Read the
top product code mark left to right, Pin One is the lower left pin.
Figure 2. SC−88 (Top View)
AAA
Pin One
A1 1 6 Y1
GND 2 5 VCC
A2 3 4 Y2
A1Y1
GND VCC
A2Y2
1
2
3
6
5
4
Figure 3. MicroPak (Top Through View)
Figure 4. SC−88 Pin 1 Orientation
PIN DEFINITIONS
Pin # SC70
Pin # MicroPak
Name
Description
1
1
A
1
Input
2
2
GND
Ground
3
3
A
2
Input
4
4
Y
2
Output
5
5
V
CC
Supply Voltage
6
6
Y
1
Output
FUNCTION TABLE (Y = A)
Inputs
Output
A
Y
L
L
H
H
H = HIGH Logic Level
L = LOW Logic Level
NC7WZ17
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3
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Unit
V
CC
Supply Voltage
V
V
IN
DC Input Voltage
V
V
OUT
DC Output Voltage
V
I
IK
DC Input Diode Current
V
IN
< 0 V
mA
I
OK
DC Output Diode Current
V
OUT
< 0 V
mA
I
OUT
DC Output Current
±
mA
I
CC
or I
GND
DC V
CC
or Ground Current
±
mA
T
STG
Storage Temperature Range
°
C
T
J
Junction Temperature Under Bias
°
C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
°
C
PDPower Dissipation in Still Air
SC−88
mW
MicroPak−6
MicroPak2
−6
ESD
Human Body Model, JEDEC: JESD22−A114
V
Charge Device Model, JEDEC: JESD22−C101
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
Supply Voltage Operating
1.65
5.50
V
Supply Voltage Data Retention
1.50
5.5
V
IN
Input Voltage
0
5.5
V
V
OUT
Output Voltage
0
V
CC
V
T
A
Operating Temperature
−40
+85
°
C
qJA Thermal Resistance
SC−88
−
377
°C/W
MicroPak−6
−
154
MicroPak2−6
−
154
°
C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
Symbo
l
Parameter VCC (V) Conditions
T
A
= 25
°
C
T
A
= −40 to 85
°
C
Unit
Min
Typ
Max
Min
Max
VP Positive Threshold Voltage
1.65
−
1.00
1.40
−
1.40
V
1.80
−
1.07
1.50
−
1.50
2.30
−
1.38
1.80
−
1.80
3.00
−
1.74
2.20
−
2.20
4.50
−
2.43
3.10
−
3.10
5.50
−
2.88
3.60
−
3.60
NC7WZ17
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4
DC ELECTICAL CHARACTERISTICS (continued)
TA = −40 to 85°CTA = 25°C
Symbol Unit
MaxMinMaxTypMin
ConditionsVCC (V)Parameter
VN Negative Threshold Voltage
1.65
0.20
0.50
−
0.20
−
V
1.80
0.25
0.56
−
0.25
−
2.30
0.40
0.75
−
0.40
−
3.00
0.60
0.98
−
0.60
−
4.50
1.00
1.42
−
1.00
−
5.50
1.20
1.68
−
1.20
−
VH Hysteresis Voltage
1.65
0.10
0.48
0.90
0.10
0.90
V
1.80
0.15
0.51
1.00
0.15
1.00
2.30
0.25
0.62
1.10
0.25
1.10
3.00
0.40
0.76
1.20
0.40
1.20
4.50
0.60
1.01
1.50
0.60
1.50
5.50
0.70
1.20
1.70
0.70
1.70
VOH HIGH Level Output Voltage
1.65
VIN = VP or VN,
IOH = −100 mA
1.55
1.65
−
1.55
−
V
1.80
1.70
1.80
−
1.70
−
2.30
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
1.65
I
OH
= −4 mA
1.29
1.52
−
1.29
−
2.30
I
OH
= −8 mA
1.90
2.14
−
1.90
−
3.00
I
OH
= −16 mA
2.40
2.75
−
2.40
−
3.00
I
OH
= −24 mA
2.30
2.62
−
2.30
−
4.50
I
OH
= −32 mA
3.80
4.13
−
3.80
−
VOL LOW Level Output Voltage
1.65
VIN = VP or VN,
IOL = 100 mA
−
0.00
0.10
−
0.10
V
1.80
−
0.00
0.10
−
0.10
2.30
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
1.65
I
OL
= 4 mA
−
0.08
0.24
−
0.24
2.30
I
OL
= 8 mA
−
0.10
0.30
−
0.30
3.00
I
OL
= 16 mA
−
0.16
0.40
−
0.40
3.00
I
OL
= 24 mA
−
0.24
0.55
−
0.55
4.50
I
OL
= 32 mA
−
0.25
0.550
−
0.55
I
IN
Input Leakage Current
1.65 to 5.5
V
IN
= 5.5 V, GND
−
−
±
0.1
−
±
1.0
m
A
I
OFF
Power Off Leakage Current
0
V
IN
or V
OUT
= 5.5 V
−
−
1
−
10
m
A
I
CC
Quiescent Supply Current
1.65 to 5.50
V
IN
= 5.5 V, GND
−
−
1
−
10
m
A
NC7WZ17
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5
AC ELECTRICAL CHARACTERISTICS
T
A
= 25
°
C
T
A
= −40 to 85
°
C
Symbol
Parameter
V
CC
(V)
Conditions
Min
Typ
Max
Min
Max
Unit
tPLH, tPHL Propagation Delay
(Figure 5, 6)
1.65
CL = 15 pF,
RL = 1 MW
−
8.3
14.3
−
15.8
ns
1.80
−
6.9
11.9
−
13.1
2.50
±
0.20
−
4.8
8.2
−
9.0
3.30
±
0.30
−
3.7
5.6
−
6.2
5.00
±
0.50
−
3.0
4.7
−
5.2
3.30
±
0.30
CL = 50 pF,
RL = 500 W
−
4.3
6.6
−
7.3
5.00
±
0.50
−
3.6
5.6
−
6.2
C
IN
Input Capacitance
0
−
2.5
−
−
−
pF
CPD Power Dissipation Capacitance
(Note 4) (Figure 7)
3.30
−
10.0
−
−
−
pF
5.00
−
12.0
−
−
−
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
NOTE:
5. CL includes load and stray capacitance;
Input PRR = 1.0 MHz, tW = 500 ns
Figure 5. AC Test Circuit Figure 6. AC Waveforms
NOTE:
6. Input = A C Waveform; tr = t f = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
A
INPUT
VCC
Figure 7. ICCD Test Circuit
VCC
CLRL
INPUT OUTPUT
tr = 3 ns
90%
10%
90%
10%
INPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
50%
tPLH tPHL
50%
tW
50% 50%
NC7WZ17
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6
DEVICE ORDERING INFORMATION
Packages
Shipping†
6−Lead SC70, EIAJ SC−88, 1.25 mm Wide
3000 / Tape & Reel
6−Lead MicroPak, 1.00 mm Wide
5000 / Tape & Reel
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13590G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SIP6 1.45X1.0
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
Cddd M
123
A1
A
c
654
E
b
6X
XXXMG
G
XXX = Specific Device Code
M = Date Code*
G= Pb−Free Package
GENERIC
MARKING DIAGRAM*
1
6
STYLES ON PAGE 2
1
DIM MIN NOM MAX
MILLIMETERS
A−−− −−− 1.10
A1 0.00 −−− 0.10
ddd
b0.15 0.20 0.25
C0.08 0.15 0.22
D1.80 2.00 2.20
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.10 0.004
E1 1.15 1.25 1.35
e0.65 BSC
L0.26 0.36 0.46
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.078 0.082 0.086
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.66
6X
DIMENSIONS: MILLIMETERS
0.30
PITCH
2.50
6X
RECOMMENDED
TOP VIEW
SIDE VIEW END VIEW
bbb H
B
SEATING
PLANE
DETAIL A E
A2 0.70 0.90 1.00 0.027 0.035 0.039
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
A-B D
aaa C
2X 3 TIPS
D
E1
D
e
A
2X
aaa H D
2X
D
L
PLANE
DETAIL A
H
GAGE
L2
C
ccc C
A2
6X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42985B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
SC−88/SC70−6/SOT−363
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 3:
CANCELLED
STYLE 2:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42985B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
SC−88/SC70−6/SOT−363
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13593G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
UDFN6 1.0X1.0, 0.35P
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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