TLP281(GB-TP,F) - Toshiba - Datasheet.Directory

TLP104

TLP105

TLP108

TLP109

(

IGM

)

TLP116A

TLP117

TLP118

TLP124

TLP126

TLP127

TLP130

TLP131

TLP137

TLP148G

TLP151

TLP151A

TLP155E

TLP160G

TLP160J

TLP161G

TLP161J

TLP163J

TLP165J

TLP166J

TLP168J

TLP170A

TLP170D

TLP170G

TLP170J

TLP172A

TLP172G

TLP173A

TLP174G

TLP174GA

TLP175A

TLP176A

TLP176D

TLP176G

TLP176GA

TLP179D

TLP180

TLP181

TLP184

TLP185

TLP190B

TLP191B

TLP192A

TLP192G

TLP197A

TLP197D

TLP197G

TLP197GA

TLP199D

TLP200D

TLP202A

TLP202G

TLP2066

TLP206A

TLP206G

TLP206GA

TLP2095

TLP2098

TLP209D

TLP2105

TLP2108

TLP2116

TLP2118E

TLP2160

TLP2166A

TLP2167

TLP2168

TLP2200

TLP220A

TLP220D

TLP220G

TLP220GA

TLP220J

TLP221A

SO6

MFSOP6

SO6

MFSOP6

SO6

MFSOP6

SO6

MFSOP6

2.54SOP4

MFSOP6

2.54SOP4

SO6

2.54SOP4

MFSOP6

SO6

MFSOP6

2.54SOP6

2.54SOP8

MFSOP6

2.54SOP8

MFSOP6

2.54SOP8

SO8

DIP8

DIP4

22

20

18

21

22

18

17

18

11

14

16

14

11

37

24

34

28

27

28

14,38

11,38

39

36

29

30

18

30

20

30

21

18

19

17

19

21

30

IC

Transistor

Darlington transistor

Transistor

Thyristor

IC

Triac

MOSFET (Photorelay)

MOSFET(Photorelay)

MOSFET (Photorelay)

Transistor

Photovoltaic

MOSFET (Photorelay)

IC

MOSFET (Photorelay)

IC

MOSFET (Photorelay)

IC

MOSFET (Photorelay)

TLP222A

TLP222A-2

TLP222G

TLP222G-2

TLP224G

TLP224G-2

TLP224GA

TLP224GA-2

TLP225A

TLP227A

TLP227A-2

TLP227G

TLP227G-2

TLP227GA

TLP227GA-2

TLP2366

TLP2367

TLP2368

TLP2403

TLP2404

TLP2405

TLP2408

TLP2409

(

IGM

)

TLP2418

TLP2451

TLP2451A

TLP2466

TLP2467

TLP2468

TLP2530

TLP2531

TLP2601

TLP260J

TLP261J

TLP2630

TLP2631

TLP2766

TLP2767

TLP2768

TLP280

TLP280-4

TLP281

TLP281-4

TLP284

TLP284-4

TLP285

TLP285-4

TLP290-4

TLP291-4

TLP3022

(

S

)

TLP3023

(

S

)

TLP3042

(

S

)

TLP3043

(

S

)

TLP3052

(

S

)

TLP3062

(

S

)

TLP3063

(

S

)

TLP3064

(

S

)

TLP3082

(

S

)

TLP3100

TLP3110

TLP3111

TLP3113

TLP3114

TLP3115

TLP3116

TLP3118

TLP3119

TLP3120

TLP3121

TLP3122

TLP3123

TLP3125

TLP3130

TLP3131

TLP320

TLP320-2

TLP3203

TLP320-4

DIP4

DIP8

DIP4

DIP8

DIP4

DIP8

DIP4

DIP8

DIP4

DIP8

DIP4

DIP8

DIP4

DIP8

SO6

SO8

DIP8

MFSOP6

DIP8

SDIP6

SOP4

SOP16

SOP4

SOP16

SOP4

SOP16

SOP4

SOP16

SO16

DIP6

2.54SOP6

2.54SOP4

2.54SOP6

2.54SOP4

2.54SOP6

2.54SOP4

2.54SOP8

2.54SOP4

DIP4

DIP8

SSOP4

DIP16

30

31

30

31

30

31

30

31

30

32

30

32

19

17

19

21

22

20

21

22

18

24

19

18

19

22

19

35

20

19

18

19

14,39

14

11,39

12

11,39

11

11,39

11

39

36,40

37,40

29

28

29

15

27

15

MOSFET (Photorelay)

MOSFET (Photorelay

MOSFET (Photorelay)

IC

Triac

IC

Transistor

Triac

MOSFET (Photorelay)

Transistor

MOSFET (Photorelay)

Transistor

Part Number Package Output Part Number Package OutputPage Page

1Product Index

3

27

15

12

27

12

27

24

31

35

16

37

37,40

38

33

32

33

32

33

32

33

12

21

19

16

35

12

37

21

19

21

19

20

25

20

21

23

35

36

16

38

31

15,39

15

12

15

16,39

16

12

13

15

13

21

25

18

22

20

18

20

21

13

14

37

22

23

36

14

31

23

Part Number

TLP3212

TLP3213

TLP3214

TLP3215

TLP3216

TLP3217

TLP3218

TLP3219

TLP3220

TLP3230

TLP3231

TLP3240

TLP3241

TLP3250

TLP3275

TLP330

TLP331

TLP3312

TLP332

TLP3375

TLP350

TLP350H

TLP351

TLP351A

TLP351H

TLP352

TLP3542

TLP3543

TLP3544

TLP3545

TLP3546

TLP360J

TLP361J

TLP363J

TLP371

TLP372

TLP373

TLP3762

(

S

)

TLP3782

(

S

)

TLP3783

(

S

)

TLP3902

TLP3904

TLP3914

TLP3924

TLP4006G

TLP4007G

TLP4026G

TLP4027G

TLP4172G

TLP4176G

TLP4192G

TLP4197G

TLP4202G

TLP4206G

TLP4222G

TLP4222G-2

TLP4227G

TLP4227G-2

TLP4592G

TLP4597G

TLP504A

TLP512

TLP513

TLP523

TLP523-2

TLP523-4

TLP525G

TLP525G-2

TLP525G-4

TLP531

TLP532

TLP548J

TLP549J

TLP550

TLP551

TLP552

TLP553

TLP554

SSOP4

DIP6

USOP4

DIP6

USOP4

DIP8

DIP6

DIP4

DIP6

MFSOP6

SSOP4

DIP8

2.54SOP8

2.54SOP4

2.54SOP6

2.54SOP8

DIP4

DIP8

DIP4

DIP8

DIP6

DIP8

DIP6

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP6

DIP8

MOSFET (Photorelay)

Transistor

MOSFET (Photorelay)

Transistor

MOSFET (Photorelay)

IC

MOSFET (Photorelay)

Triac

Darlington transistor

Triac

Photovoltaic

MOSFET (Photorelay)

Transistor

IC

Darlington transistor

Triac

Transistor

Thyristor

IC

Package Output Part NumberPage Page

TLP555

TLP557

TLP558

TLP559

(

IGM

)

TLP560G

TLP560J

TLP561G

TLP561J

TLP570

TLP571

TLP572

TLP590B

TLP591B

TLP592A

TLP592G

TLP597A

TLP597G

TLP597GA

TLP598AA

TLP598GA

TLP620

TLP620-2

TLP620-4

TLP624

TLP624-2

TLP624-4

TLP626

TLP626-2

TLP626-4

TLP627

TLP627-2

TLP627-4

TLP628

TLP628-2

TLP628-4

TLP629

TLP629-2

TLP629-4

TLP630

TLP631

TLP632

TLP651

TLP700

TLP700H

TLP701

TLP701A

TLP701H

TLP705

TLP705A

TLP708

TLP714

TLP715

TLP716

TLP718

TLP719

TLP731

TLP732

TLP733

TLP734

TLP748J

TLP750

TLP751

TLP754

TLP759

(

IGM

)

TLP762J

TLP763J

TLP781

TLP785

TLP797GA

TLP797J

TLP798GA

6N135

6N136

6N137

6N138

6N139

DIP8

DIP6

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP4

DIP8

DIP16

DIP6

DIP8

SDIP6

DIP6

DIP8

DIP6

DIP4

DIP6

DIP8

IC

Triac

Darlington transistor

Photovoltaic

MOSFET (Photorelay)

MOSFET (Photorelay

MOSFET (Photorelay)

Transistor

Darlington transistor

Transistor

IC

Transistor

Thyristor

IC

Triac

Transistor

MOSFET (Photorelay)

IC

Package Output

1Product Index

4

Functional Schematic (TLP2451)

2.6

6.0

3.95

5.1

1.27

2+

3–

VCC

(M1)

(M2) VO

GND

SHIELD

8

6

5

Small Surface-Mount IC-Output Photocouplers in the SO8 Package

IGBT/MOSFET Gate-Drive IC-Output Photocouplers with an Extended Operating Temperature Range

1: N.C.

2: Anode

3: Cathode

4: N.C.

5: GND

6: VO(Output)

7: N.C.

8: VCC

TLP2403

TLP2404

TLP2409

TLP2405

TLP2408

TLP2105

TLP2108

TLP2466*

TLP2160*

TLP2418

TLP2118E

TLP2468*

TLP2168*

TLP2116

TLP2166A

TLP2467*

TLP2167*

TLP2451

TLP2451A*

0.1 Mbit/s

1 Mbit/s

5 Mbit/s

15 Mbit/s

20 Mbit/s

50 Mbit/s

Driver Propagation

Delay: 0.7 μs

(max)

Driver Propagation

Delay: 0.5 μs

(max)

1-ch

2-ch

1-ch

2-ch

1-ch

2-ch

1-ch

2-ch

1-ch

2-ch

1-ch

Data rate

(typ.) Part Number # of Circuits

Darlington

Output

Up to 18 V

4.5 V to 30 V

Up to 30 V

Totem-pole 4.5 V to 20 V

Totem-pole 3.3 V/5 V

Open-collector

5 V

Open-collector 3.3 V/5 V

5 V

Totem-pole 3.3 V

Totem-pole 3.3 V/5 V

±0.6-A peak current 10 V to 30 V

Supply Voltage

TLP351H*

TLP701H*

TLP2451

TLP2451A*

TLP151*

TLP151A*

TLP700H*

TLP350H*

±0.6 A 10 V to 30 V

15 V to 30 V

Peak

Output

Current Part Number

Supply

Voltage

(VCC)

2 mA

(max)

Supply

Current

(ICC)

DIP8

SDIP6

SO8

SO6

SDIP6

DIP8

Package

700 ns

500 ns

±2.0 A

±2.5 A

500 ns

Propagation

Delay

(max)

5 mA

(max)

Input

Threshold

Current

−

Yes

UVLO

SO8

TLP351H

TLP701H

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative.

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative.

Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package.

To meet customer needs, Toshiba has released photocouplers featuring various data rates,

dual-channel configurations and power device drivers.

Printed circuit boards are becoming smaller and denser as a result of product miniaturization.

This is driving the need for electronic components with an extended operating temperature

range.

To meet this need, Toshiba has been expanding its portfolio of IC-output photocouplers that

are guaranteed up to 125°C instead of the conventional 100°C limit.

● Wide packaging options: SO6, SO8, SDIP6, DIP8

● Key specifications are guaranteed over –40°C to 125°C (–40°C to 110°C for the TLP151)

● Low current consumption: ICC = 2 mA (max)

to

2New Products

5

2.6

6.0

3.95

5.1

1.27

4.0

9.7

6.8

4.58

1.27

2.6

7.0

4.4

3.6

1: Anode 1

2: Cathode 1

3: Cathode 2

4: Anode 2

5: GND

6: Output 2

7: Output 1

8: VCC

1

2

3

4

8

5

7

6

VCC

GND

SHIELD

TLP2105

TLP105

1: Anode

3: Cathode

4: GND

5: VO (Output)

6: VCC

1

3

6

4

5

VCC

GND

SHIELD

1+

3–

VCC

VO

GND

6

5

4

SHIELD

Functional Schematic (TLP104)

1.27

General-Purpose 5-Mbit/s IC-Output Photocouplers

IC-output photocouplers with a date rate of 5 Mbits/s are beneficial for applications where the

user needs a data rate that is not achievable with transistor-output photocouplers. In

conjunction with various packaging options, the fast IC-output photocouplers simplify system

design and provide extra performance for future upgrades.

● Packaging options: MFSOP6, SDIP6, SO8

● Available in positive and negative polarity versions.

● Key specifications guaranteed over –40°C to 100°C

● Low input current: 1.6 mA max (3 mA for the TLP715 and TLP718)

● Totem-pole output: Eliminates the need for an external load resistor.

● Wide supply voltage range: 4.5 V to 20 V

● Available in dual-channel versions (TLP2105/TLP2108)

● EN60747-5-2-certified

IC-Output Photocouplers for IPM Drive Applications

Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the

conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay

times, a wider operating temperature range and digital output. Thus, they help to simplify

system design and improve system performance. The TLP104 and TLP2404 in a small

surface-mount package are now available in mass-production quantities, while those in the

SDIP6 and DIP8 packages will shortly be available.

● Wide packaging options: SO6, SO8, SDIP6, DIP8

● Key specifications are guaranteed over –40°C to 125°C.

● Low current consumption: 5 mA (max)

● Wide supply voltage range: 4.5 to 30 V

● Propagation delay times: tpHL = 400 ns (max), tpLH = 550 ns (max)

● Propagation delay skew: |tpHL– tpLH| = 400 ns (max)

MFSOP6

SDIP6

SO8

TLP105

TLP108

TLP715

TLP718

TLP2405

TLP2408

TLP2105

TLP2108

1-ch

2-ch

Positive

Negative

Positive

Negative

Positive

Negative

Positive

Negative

Package Part Number # of Channels Logic Polarity

TLP104

TLP2404

TLP714*

TLP754*

SO6

SO8

SDIP6

DIP8

Small surface-mount package with a 2.3-mm PCB mounted height (max)

Standard 8-pin small surface-mount package

Small surface-mount SDIP6 package

Standard DIP8 package

Part Number Package Feature

SO8

SO6

SDIP6MFSOP6

Pin Configuration

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative. 1: Anode

3: Cathode

4: GND

5: VO (Output)

6: VCC

2New Products

6

1.65

3.25

2.85

2.2

1.27

14

23

Photorelays in the Ultra-Small USOP4 Package: TLP33xx Series

There is a strong market need for smaller photorelays.

To meet this need, Toshiba has developed photorelays

in the ultra-small USOP4 package, which are suitable

for high-density board assembly. These photorelays

help to reduce system size and cost. They are ideal

for use in small measuring instruments such as

semiconductor testers that require numerous relays.

The TLP3312 and TLP3375 provide well-balanced

off-state voltage and on-state current, making them

suitable not only for tester applications but also for

various applications requiring high-density board

assembly such as battery-controlled devices.

TLP3312

TLP3375

60 V

50 V

0.4 A

0.3 A

1.5 Ω

20 pF

12 pF

Part Number Off-State Voltage

(max)

On-State Current

(max)

On-State

Resistance (max)

Total Capacitance

(typ.)

3 mA

LED Trigger

Current (max)

Pin Configuration

1. Anode

2. Cathode

3. Drain

4. Drain

USOP4

SSOP4

High-ION Photorelays: TLP354x Series (Under Development)

Package

VOFF

ION

RON

BVS

V

A

mΩ

Vrms

40

2.5

100

2500

20

4

50

2500

40

3.5

60

2500

60

3

70

2500

100

2

200

2500

DIP6

Characteristic Symbol Unit Available Under Development

Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current.

Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc

current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems.

Peak Off-State Voltage

(min)

On-State Current

(max)

On-State Resistance

(max)

Isolation Voltage

(min)

TLP3542 TLP3543 TLP3544 TLP3545 TLP3546

−−

Scheduled for mass production in April

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative.

7

2.3

7.0

4.55

3.7

1.27

TLP104

TLP109

TLP116A

TLP2366*

TLP118

TLP2368*

TLP2367*

1 Mbit/s Open-collector, optimized for IPM drive

Open-collector

Totem-pole inverting logic

Open-collector inverting logic

Totem-pole inverting logic

1 Mbit/s

20 Mbit/s

50 Mbit/s

20 Mbit/s

4.5 V to 30 V

5 V

3.3 V/5 V

5 V

3.3 V/5 V

Part Number Data rate

(typ.) Output Supply voltage

5 mA

−

5 mA

Input Threshold

Current (max)

SO6

IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation

Despite the same footprint size as the MFSOP6 package, the new SO6 package provides

reinforced insulation, offering clearance and creepage distances of ≥ 5 mm; an internal

isolation thickness of ≥ 0.4 mm; and an isolation voltage of 3750 Vrms.

Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately

20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile

applications.

● Clearance/creepage: ≥ 5 mm

● Thin package: ≤ 2.3 mm

● Internal Faraday shield: ≥ 0.4 mm

● Thin package: ≤ 2.3 mm

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative.

*Under development. Specifications subject to change without notice.

For the latest information, please contact your nearest Toshiba sales representative.

General-Purpose Photorelays Certified for Reinforced Insulation:

TLP220 Series and TLP221A (Under Development)

Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter

applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage

between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays

save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V

and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current.

Package

VOFF

ION

RON

BVS

V

A

Ω

Vrms

60

0.5

2

5000

350

0.12

50

5000

60

0.5

2

5000

200

0.25

8

5000

350

0.1

50

5000

400

0.12

35

5000

600

0.09

60

5000

60

1.5

0.2

5000

DIP4

Characteristic Symbol Unit

Existing Photorelay Examples

Under Development

Peak Off-State Voltage

(min)

On-State Current

(max)

On-State Resistance

(max)

Isolation Voltage

(min)

TLP222A TLP222G TLP220A TLP220D TLP220G TLP220GA TLP221ATLP220J

−−

Scheduled for mass production in June to August

2 New Products

8

VCC

GND

Vcc

GND

ZC

Photocoupler Product Tree

DIP4

SDIP6

SO6

SO8

DIP8

DIP16

DIP6

SOP16

SO16

SOP16

2.54SOP8

2.54SOP6

2.54SOP4

SSOP4

USOP4

SSOP4

MFSOP6

SOP4

● General-purpose packages

●

Lead-forming options for surface mounting

Package

Transistor-Output

Transistor-Output IC-Output

Photorelays

Thyristor- and Triac-Output Photovoltaic-Output

Triac Output Thyristor Output Photovoltaic-Output

Darlington-Transistor Output

Logic Output

Gate Drive

Photorelays

●≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness

● 6-pin SMD package (1.27-mm lead pitch)

●≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness

● 5-pin SMD package (1.27-mm lead pitch); low-profile

● SMD package (1.27-mm lead pitch)

● SMD package (2.54-mm lead pitch)

● Ultra-small; SMD package (1.27-mm lead pitch)

USOP4 ● Ultra-small; SMD package (1.27-mm lead pitch)

● 4-pin SMD package (1.27-mm lead pitch)

● 16-pin SMD package (1.27-mm lead pitch)

SO16

SO8 ● 8-pin SMD package (1.27-mm lead pitch)

● 16-pin SMD package (1.27-mm lead pitch)

Output Choices

3 Photocoupler Product Tree

9

Transistor-Output and Darlington-Transistor-Output Photocouplers

1

Isolation Voltage Channel Single Quad Single Single Single Dual Quad

SOP4 SOP16SOP16

Quad

SO16 MFSOP6

Single

SO6 DIP4DIP6 DIP8 DIP16

5000 Vrms

4000 Vrms

3750 Vrms

2500 Vrms

TLP280 TLP280-4

TLP284 TLP284-4 TLP184*

TLP290-4*

TLP285

TLP124

TLP137

TLP131

TLP181

TLP126

TLP130

TLP180

TLP127

TLP731

TLP732

TLP733

TLP734

TLP331

TLP332

TLP631

TLP632

TLP624

TLP781

TLP785

TLP624-2 TLP624-4

TLP330 TLP320 TLP320-2

TLP281 TLP281-4

TLP285-4 TLP185*

TLP291-4*TLP531

TLP532

TLP504A

TLP630

TLP626 TLP626-2 TLP626-4

TLP620 TLP620-2 TLP620-4

TLP320-4

TLP570

TLP571

TLP572

TLP523 TLP523-2 TLP523-4

TLP371

TLP372

TLP373

TLP627 TLP627-2 TLP627-4

TLP628 TLP628-2 TLP628-4

TLP629 TLP629-2 TLP629-4

High VCEO

General-purpose

High IF

Low IF

AC input

Low IF

Darlington

High VCEO

Package

Features

*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.

4Selection Guide

10

4

1

3

2

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

4

1

3

2

4

1

3

2

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

1

64

3

6

1

54

3

6

1

54

3

6

1

4

3

New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package

(≥ 5-mm Clearance/Creepage and ≥ 0.4-mm Internal Isolation Thickness)

Part Number Pin Configuration Features VCEO BVs

Rank Min Max VDE BSI IEC

Safety Standards(2)

TÜV

CTR (%)(3)

@IF, VCE

UL/

C

UL

Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.

Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.

Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011

EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved

TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011

EN 60747-5-2-approved with option V4 or D4

For the latest information, please contact your nearest Toshiba sales representative.

Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.

Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.

±5 mA,

5 V

GB 100

TLP284-4

– 50 600

600

SOP16

4-channel version of

the TLP284

Lead pitch = 1.27 mm

AC Input

SEMKO-approved

3750

Vrms

80 V /(1)

– 50 600

Y 50 150

GR 100 300

BL 200

GB 100

600

TLP284(4)

SOP4

Lead pitch = 1.27 mm

AC Input

SEMKO-approved

TST part recm’ed

±5 mA,

5 V

3750

Vrms

80 V / (1)

TLP285(4)

SOP4

Lead pitch = 1.27 mm

SEMKO-approved

TST part recm’ed

– 50 600

Y 50 150

GR 100 300

BL 200

GB 100

YH 75 150

GRL 100 200

GRH 150 300

BLL 200 400

600

600 5 mA,

5 V

3750

Vrms

80 V /(1)(1)

5 mA,

5 V

GB 100

TLP285-4

– 50 600

600

SOP16

4-channel version of

the TLP285

Lead pitch = 1.27 mm

SEMKO-approved

3750

Vrms

80 V /(1)

General-Purpose, Transistor-Output Photocouplers

Part Number Pin Configuration Features VCEO BVs

Rank Min Max VDE BSI IEC

Safety Standards(2)

TÜV

CTR (%)(3)

@IF, VCE

UL/

C

UL

Mini-flat

MFSOP6

Low input drive current

1 mA,

0.5 V

BV

200

TLP124

–

100

1200

3750

Vrms

80 V /

–

50

600

Y

50

150 5 mA,

5 V

GR

100

300

BL

200

GB

100

TLP131

600

Mini-flat

MFSOP6

Internal base

connection

3750

Vrms

80 V /

Mini-flat

MFSOP6

Low input drive current

Internal base

connection BV

200

TLP137

–

100

3750

Vrms

1 mA,

0.5 V

1200

80 V /

–

50

600

Y

50

150

GR

100

300

BL

200

GB

100

YH

75

150

GRL

100

200

GRH

150

300

BLL

200

400

600

TLP181(4)

Mini-flat

MFSOP6

SEMKO-approved

TST part recm’ed

5 mA,

5 V

3750

Vrms

80 V /(1)

TLP281(4)

SOP4

Lead pitch = 1.27 mm

SEMKO-approved

TST part recm’ed

– 50 600

Y 50 150

GR 100 300

BL 200

GB 100

YH 75 150

GRL 100 200

GRH 150 300

BLL 200 400

600

600 5 mA,

5 V

2500

Vrms

80 V /(1)(1)

11

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

1

65

43

7

2

6

1

54

32

6

1

54

32

6

1

54

32

6

1

54

32

4

1

3

2

8

1

65

43

7

2

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

4

1

3

2

Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.

Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.

Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011

EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved

TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011

EN 60747-5-2-approved with option V4 or D4

For the latest information, please contact your nearest Toshiba sales representative.

Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.

General-Purpose, Transistor-Output Photocouplers (Continued)

Part Number Pin Configuration Features VCEO BVs

Rank Min Max VDE BSI IEC

Safety Standards(2)

TÜV

CTR (%)(3)

@IF, VCE

UL/

C

UL

5 mA,

5 V

GB 100

TLP281-4

– 50 600

600

SOP16

4-channel version

of the TLP281

Lead pitch = 1.27 mm

SEMKO-approved

2500

Vrms

80 V /(1)

–50

GB 100

TLP504A DIP8 5 mA,

5 V

2500

Vrms

600

55 V / –

DIP6

Low input drive current

Internal base

connection

DIP6

Low input drive current

BV 200

TLP332

– 100

TLP331

– 100

1 mA,

0.5 V

5000

Vrms

1200

55 V /

1 mA,

0.5 V

5000

Vrms

1200

55 V /

TLP531

50 600

Y50 150

GR 100 300

BL 200

GB 100

600

DIP6

Internal base

connection

5 mA,

5 V

2500

Vrms

55 V /

5 mA,

5 V

2500

Vrms

55 V /

TLP532

50 600

Y50 150

GR 100 300

BL 200

GB 100

600

DIP6

High EMI immunity

–

600

TLP624 DIP4

Low input drive current

1 mA,

5 V

BV 200

– 100 1200

1200

5000

Vrms

55 V / −

BV 200

TLP624-2

–100 1200

DIP8

Dual-channel version

of the TLP624

1 mA,

5 V

5000

Vrms

55 V / –

1200

BV 200

TLP624-4

–100

DIP16

4-channel version of

the TLP624

1 mA,

5 V

5000

Vrms

1200

55 V / –

DIP4

High VCEO

GB 100

TLP628

–50 5 mA,

5 V

5000

Vrms

600

350 V / –

1200

600

4Selection Guide

12

4

1

3

2

8

1

65

43

7

2

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

6

1

54

32

8

1

65

43

7

2

16

1

15

2

14

3

13

4

12

5

11

6

10

7

9

8

6

1

54

32

6

1

54

32

6

1

54

32

6

1

54

32

DIP4

High input current

IF = 150 mA

TLP629 100 mA,

1 V

5000

Vrms

–2080 55 V / –

80

TLP629-2 –20

DIP8

Dual-channel version

of the TLP629

100 mA,

1 V

5000

Vrms

55 V / –

TLP629-4

DIP16

4-channel version of

the TLP629

100 mA,

1 V

5000

Vrms

–2080 55 V / –

–50 600

600

GR 100 300