FEDL610Q101-01
Issue Date: Jan. 23, 2013
ML610Q101/ML610Q102
8-bit Microcontroller
1/21
GENERAL DESCRIPTION
This LSI is a high-performance 8-bit CMOS microcontroller into which rich peripheral circuits, such as timers, PWM, UART,
voltage level supervisor (VLS) function, and 10-bit successive approximation type A/D converter, are incorporated around 8-bit
CPU nX-U8/100.
The CPU nX-U8/100 is capable of efficient instruction execution in 1-intruction 1-clock mode by pipe line architecture parallel
processing.
The on-chi p debug function t hat is installed enabl es p rogr am d ebugging and programming.
FEATURES
CPU
8-bit RISC CPU (CPU name: nX-U8/100)
Instructio n s ystem: 16-bit instruction s
Instruction set:
Transfer, arithmetic operations, comparison, logic operation s, multiplication/divisio n, bit ma nipulat io ns, bit lo gic
operations, jump, conditional jump, call return stack manipulations, arithmetic shift, and so on
On-Chip debug function
Minimum instruction execution time
30.5μs (@32.768kHz system clock)
0.122μs (@8.192MHz system clock)
Internal memory
ML610Q101 : Internal 4Kbyte Flash ROM (2K×16 bits) (including unusable 32 byte test data area)
ML610Q102 : Internal 6Kbyte Flash ROM (3K×16 bits) (including unusable 32 byte test data area)
Internal 256byte data RAM (256×8 bits)
Interrupt controller
1 non-maskable interrupt source (Internal source: 1)
21 maskable interrupt sources (Internal sources: 16, External sources: 5)
Time base counter (TBC)
Low-speed time base counter ×1 channel
High-speed time base counter ×1 channel
Watchdog timer (WDT)
Non-maskable interrupt and reset
Free runnin g
Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s)
Timer
8 bits × 6 channels (16-bit configuration available)
Support Continuos timer mode/one shot timer mode
Timer start/stop function b y software or external trigger input
FEDL610Q101 -01
ML610Q101/ML610Q102
2/21
PWM
Resolution 16 bits × 1 channel
Support Continuos timer mode/one shot timer mode
PWM start/stop function b y software or external trigger input
UART
Half-duplex
TXD/RXD × 1 channels
Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits
Positive logic/ne gative logic selectable
Buil t-in baud rat e generator
Successive approximatio n type A/D converter (SA-ADC)
10-bit A/D converter
Input × 6 channels
Analog Comparator
Operating voltage: VDD = 2.7V to 5.5V
Input voltage by common mode: VDD = 0.1V to VDD - 1.5V
Hysteresis (Comparator0 only): 20mV(Typ.)
Allows selection of interrupt disabled mode,falling-edge interrupt mode,rising-edge interrupt mode,
or both-edge interrupt mode.
General-purpose ports (GPIO)
Input/output port × 11 channels (including secondary functio ns)
Reset
Reset by the RESE T_N pin
Reset by power-on detection
Reset by the watchdog timer (WDT) overflow
Reset by voltage level supervisor(VLS)
Voltage level supervisor(VLS)
Judgment accuracy: ±3.0% (Typ.)
It can be used for low level detection reset.
Clock
Low-speed clock:
Built-in RC oscillation (32.768 kHz)
High-speed clock:
Built-in PLL oscillation (16.384 MHz), external clock
The clock of the CPU is 8.192MHz(Max)
Selection of high-speed clock mode by software:
Built-in PLL oscillation, external clock
Power management
HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states).
STOP mode: Stop of low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are
stopped.)
Clock gear: The frequency of high-speed syste m clock ca n be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation
clock)
Blo ck Contr ol Func t ion: Power down (rese t registers and stop cl ock supply) the circuit s of un used peripherals.
FEDL610Q101 -01
ML610Q101/ML610Q102
3/21
Shipment
16-pin plastic SSOP
ML610Q101-xxxMB (Blank product: ML610Q101-NNNMB)
ML610Q102-xxxMB (Blank product: ML610Q102-NNNMB)
Guaranteed operating range
Operating temperature: 40°C to 85°C
Operating voltage: VDD = 2.7V to 5.5V
FEDL610Q101 -01
ML610Q101/ML610Q102
4/21
BLOCK DIAGRAM
ML610Q101 Block Diagram
Figure 1 show the block diagram of the ML610Q101.
" *" indicates secondary function, tertiary function or quaternary function of each port.
Figur e 1 ML610Q 101 Bl ock Diagram
Program
Memory
(Flash)
4kbyte
UART RXD0
TXD0*
INT
1
RAM
256byte
Interrupt
Controller
CPU (nX-U8/100)
Timing
Controller
EA
SP
On-Chip
ICE
Instruction
Decoder
BUS
Controller
Instruction
Register
TBC
INT
4
INT
1WDT
INT
68bit Timer
×6
INT
1
PWM
GPIO
PA0 to PA2
INT
5
PB0 to PB7
Data-bus
PWMC*
TEST
RESET_N
OSC
Power
RESET &
TEST
ALU
EPSW13
PSW
ELR13
LR
ECSR13
DSR/CSR
PC
GREG
015
VDD
VSS
Analog
Comparator
×2
CMP0P*
CMP0M*
INT
2
10bit-ADC
AIN0*
to
AIN5*
INT
1
VLS
1
CMP1OUT*
CMP1P*
CMP0POUT*
CMP0NOUT*
INT
1
FEDL610Q101 -01
ML610Q101/ML610Q102
5/21
ML610Q102 Block Diagram
Figure 2 show the block diagram of the ML610Q102.
" *" indicates secondary function, tertiary function or quaternary function of each port.
Figur e 2 ML610Q 102 Bl ock Diagram
Program
Memory
(Flash)
6kbyte
UART RXD0
TXD0*
INT
1
RAM
256byte
Interrupt
Controller
CPU (nX-U8/100)
Timing
Controller
EA
SP
On-Chip
ICE
Instruction
Decoder
BUS
Controller
Instruction
Register
TBC
INT
4
INT
1WDT
INT
68bit Timer
×6
INT
1
PWM
GPIO PA0 to PA2
INT
5
PB0 to PB7
Data-bus
PWMC*
TEST
RESET_N
OSC
Power
RESET &
TEST
ALU
EPSW13
PSW
ELR13
LR
ECSR13
DSR/CSR
PC
GREG
015
VDD
VSS
Analog
Comparator
×2
CMP0P*
CMP0M*
INT
2
10bit-ADC
AIN0*
to
AIN5*
INT
1
VLS
CMP0OUT*
CMP1OUT*
CMP1P*
CMP0POUT*
CMP0NOUT*
INT
1
FEDL610Q101 -01
ML610Q101/ML610Q102
6/21
PIN CONFIGURATION
ML610Q101/ML610Q102 SSOP16 Pin Layout
Figure 3 show the SSOP16 pin layout of the ML610Q101/ML610Q102.
Figure 3 ML610Q101/ML610Q102 SSOP16 Pin Configuration
RESET_N
TEST
PB0 / PWMC / OUTCLK / CMP1OUT
PB1 / TXD0
PB2 / CMP0POUT
PB3 / CMP0MOUT
PA2 / CLKI N / CMP0OUT
V
PP
1
2
3
4
5
6
7
8
PA0 / PWMC / OUTCLK / TM9OUT
PB7 / LSCLK / PWMC
VDD
VSS
PB6 / CLKIN
PB5 /
PB4 / TXD0
PA1 / LSCLK / TMFOUT
16
15
14
13
12
11
10
9
FEDL610Q101 -01
ML610Q101/ML610Q102
7/21
LIST OF PINS
Primary function Secondary function Tertiary function Quaternary function
PIN
No. Pin
name I/O Function Pin
name I/O Function Pin
name I/O Function Pin
name I/O Function
1 RESET_N I Reset input pin
2 TEST I/O Input/output
pin for testing
3
PB0/
EXI4/
AIN2/
RXD0
I/O
Input/output
port, External
interrupt 4,
ADC input 2,
UART receive
PWMC O PWMC output OUTCLK O High-speed
clock output
CMP1O
UT O CMP1 output
4
PB1/
EXI5/
AIN3
I/O
Input/output
port, External
interrupt
5,ADC input 3
TXD0 O
UART data
output
5 PB2 I/O
Input/output
port, CMP0P
OUT O CMP0_N
output
6 PB3 I/O
Input/output
port CMP0N
OUT O CMP0_N
output
7 PA2/EXI2 I/O
Input/output
port, External
interrupt
CLKIN I clock input
CMP0O
UT O CMP0 output
8 VPP
Power supply
pin for Flash
ROM
9
PA1/
EXI1/
AIN1/
CMP1P
I/O
Input port,
External
interrupt 1,
ADC input 1,
Comparator1
non-inverting
input
LSCLK O Low speed
clock output
TMF
OUT O timer F
output
10 PB4/
CMP0P I/O
Input/output
port,
Comparator0
non-inverting
input
TXD0 O UART data
output
11
PB5/
RXD0/
CMP0M
I/O
Input/output
port, UART
data receive,
Comparator1
inverting input
12 PB6/
AIN4 I/O
Input/output
port, ADC
input 4
CLKIN I clock input
13 Vss
Negative
power supply
pin
14 VDD Positive power
supply pin
15 PB7/
AIN5 I/O
Input/output
port, ADC
input 5
LSCLK O
Low-speed
clock output PWMC O
PWMC
output
16
PA0/
EXI0/
AIN0
I/O
Input port,
External
interrupt 0,
ADC input 0
PWMC O PWMC output OUTCLK O High-speed
clock output
TM9OU
T O timer 9
output
FEDL610Q101 -01
ML610Q101/ML610Q102
8/21
PIN DESCRIPTION
Pin name I/O Description
Primary/
Secondary/
Tertiary/
Quaternary
Logic
System
RESET_N I
Reset input pin. When this pin is set to a “L” level, system reset mode is set and
the internal section is initialized. When this pin is set to a “H” level subsequently,
program execution starts. A pull-up resistor is internally connected.
— Negative
CLKIN I
High-speed clock output pin. This pin is used as the tertiary function of the PA2
or the secondary function of PB6 pin.
Secondary/
Tertiary
LSCLK O
Low-speed clock output pin. This pin is used as the tertiary function of the PA1
or the secondary function of the PB7 pin.
Secondary/
Tertiary
OUTCLK O
High-speed clock output pin. This pin is used as the tertiary function of the PA0
or PB0 pin. Tertiary —
General-purpose input/output port
PA0 to PA2
PB0 to PB7 I/O
General-purpose input/output port.
Since these pins have secondary functions and tertiary functions and quaternary
functions, the pins cannot be used as a port when the secondary functions and
tertiary functions and quaternary functions are used.
Primary Positive
UART
TXD0 O UART0 data output pin. This pin is used as the tertiary function of the PB1 or
PB4 pin. Tertiary Positive
RXD0 I UART0 data input pin. This pin is used as the primary function of the PB0 or PB5
or the quaternary function of the PB7 pin. Primary Positive
PWM
PWMC O PWMC output pin. This pin is used as the secondary function of the PB0 or PA0
or the quaternary function of the PB7 pin.
Secondary
Quaternary Positive
External interrupt
EXI0 to 2 I
External maskable interrupt input pins. Interrupt enable and edge selection can
be performed for each bit by software. These pins are used as the primary
functions of the PA0 – PA2 pins.
Primary Positive/
negative
EXI4,5 I
External maskable interrupt input pins. Interrupt enable and edge selection can
be performed for each bit by software. These pins are used as the primary
functions of the PB0, PB1 pins.
Primary Positive/
negative
Timer
TnTG I External clock input pin used for both Timer E and Timer F.These pins are used
as the primary function of the PA0-PA2, PB0-PB7 pins. Primary —
TM9OUT O Timer 9 output pin. This pin is used as the quaternary function of the PA0 pin. Quaternary Positive
TMFOUT O Timer F output pin. This pin is used as the quaternary function of the PA1 pin. Quaternary Positive
FEDL610Q101 -01
ML610Q101/ML610Q102
9/21
Pin name I/O Description
Primary/
Secondary/
Tertiary/
Quaternary
Logic
Successive approximation type A/D converter
AIN0 I
Channel 0 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PA0 pin. Primary —
AIN1 I
Channel 1 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PA1 pin. Primary —
AIN2 I
Channel 2 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PB0 pin. Primary —
AIN3 I
Channel 3 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PB1 pin. Primary —
AIN4 I
Channel 4 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PB6 pin. Primary —
AIN5 I
Channel 5 analog input for successive approximation type A/D converter. This
pin is used as the primary function of the PB7 pin. Primary —
Conparator
CMP0P I
Non-inverting input for comparator0. This pin is used as the primary function of
the PB4 pin. Primary —
CMP0M I
Inverting input for comparator0. This pin is used as the primary function of the
PB5 pin. Primary —
CMP0OUT O
Output for comparator0. This pin is used as the quaternary function of the PA2
pin. Quaternary
CMP0OUT O
Output for comparator0. This pin is used as the quaternary function of the PB2
pin. Quaternary
CMP0OUT O
Output for comparator0. This pin is used as the quaternary function of the PB3
pin. Quaternary
CMP1P I
Non-inverting input for comparator1. This pin is used as the primary function of
the PA1 pin. Primary —
CMP1OUT O
Output for comparator1. This pin is used as the quaternary function of the PB0
pin. Quaternary
For testing
TEST I/O
Input/output pin for testing. A pull-down resistor is internally connected. — Positive
Power supply
VSS
Negative power supply pin. — —
VDD
Positive power supply pin. — —
VPP
Power supply pin for Flash ROM — —
FEDL610Q101 -01
ML610Q101/ML610Q102
10/21
ML610Q101/ML610Q102 TERMINATION OF UNUSED PINS
Table 3 shows methods of terminating the unused pins for ML610Q101/ML610Q102.
Table 3 Termination of Unused Pins
Pin Recommended pin termination
RESET_N Open
TEST Open
PA0 to PA2 Open
PB0 to PB7 Open
VPP Open
Note:
It is recommended to set the unused input por ts and input/output po rts to the inputs with pull-do wn resistors/pull-up resi stors or
the output mode since the supply current may become excessively large if the pins are left open in the high impedance input
setting.
FEDL610Q101 -01
ML610Q101/ML610Q102
11/21
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
(VSS = 0V)
Parameter Symbol Condition Rating Unit
Power supply voltage 1 VDD Ta = 25°C 0.3 to +7.0 V
Power supply voltage 2 VPP Ta = 25°C 0.3 to +9.5 V
Input voltage VIN Ta = 25°C 0.3 to VDD+0.3 V
Output voltage VOUT Ta = 25°C 0.3 to VDD+0.3 V
Output current 1 IOUT1 Ta = 25°C 12 to +11 mA
Power dissipation PD Ta = 25°C 0.5 mW
Storage temperature TSTG 55 to +150 °C
RECOMMENDED OPERATING CONDITIONS
(VSS = 0V)
Parameter Symbol Condition Range Unit
Operating temperature TOP 40 to +85 °C
Operating voltage VDD 2.7 to 5.5 V
Operating frequency (CPU) fOP V
DD = 2.7V to 5.5V 30k to 8.4M Hz
OPERATING CONDITIONS OF FLASH MEMORY
(VSS=0V)
Rating
Parameter Symbol Condition Min. Typ. Max. Unit
Operating temperature TOP At write/erase 0 +40 °C
VDD At write/erase 4.5 5.5 V
Operating voltage VPP At write/erase 7.7 8.3
Rewrite counts CEP 80 cycles
Data retention*1 YDR 10 years
*1 : However, please keep active time of the flash memory from exceeding ten years.
Vpp pin has internal pull-down resistor.
FEDL610Q101 -01
ML610Q101/ML610Q102
12/21
DC CHARACTERISTICS (1/4)
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition Min. Typ. Max.
Unit Measuring
circuit
Low-speed RC oscillation
frequency fRCL Ta = 25°C 31 32.768 34 kHz
Ta = 25°C Typ.
1% 16.384 Typ.
+1%
Ta = -10 to +85°C Typ.
-2% 16.384 Typ.
+2%
PLL oscillation frequency*1 fPLL
Ta = 40 to +85°C Typ.
2.5% 16.384 Typ.
+2.5%
MHz
Reset pulse width TRST 100
Reset noise elimination
pulse width TNRST 0.4 μs
Power-on reset activation
power rise time TPOR 10 ms
1
*1 : 1024 clock average. CPU clk is fPLL /2 max.
RESET
PRST
RESET_N
RESET_N pin reset
VDD
0.9*VDD
0.3*VDD
VDD
0.9*VDD
0.1*VDD
TPOR
Power on reset
PRST
0.3*VDD
0.3*VDD
FEDL610Q101 -01
ML610Q101/ML610Q102
13/21
DC CHARACTERISTICS (2/4)
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition Min. Typ. Max.
Unit Measuring
circuit
Ta=25°C , VDD=fall
Typ
3.0
%
2.85
Typ
+3.0
%
VVLS0F
VDD=fall
Typ.
5.0
%
2.85
Typ.
+5.0
%
Ta=25°C , VDD=rise
Typ.
3.0
%
2.92
Typ.
+3.0
%
VVLS0R
VDD=rise
Typ.
5.0
%
2.92
Typ.
+5.0
%
VLS0=0 3.295
Ta=25°C
VLS0=1
Typ
3.0
% 3.625
Typ
+3.0
%
VLS0=0 3.295
VLS Judgment
voltage
VVLS1
VLS0=1
Typ
5.0
% 3.625
Typ
+5.0
%
V 1
Comparator0
In-phase input
voltage range
VCMR 0.1 VDD
-1.5 V
Ta=25°C , VDD = 5.0V 10 20 30
Comparator0
hysteresis VHYSP
VDD = 5.0V 5 20 35
Comparator0
Input offset
voltage
VCMOF Ta=25°C , VDD = 5.0V 7
Ta=25°C -25 25
Comparator
Reference-
voltage error*3
VCMREF
-50 50
mV
4
Supply current 1 IDD1
CPU: In STOP state.
Low-speed/high-speed
oscillation: stopped.
Ta=-40 to
+85°C 1 30 μA
Supply current 2 IDD2
CPU: In 32.768kHz operating
state.*1
High-speed oscillation:
Stopped.
Ta=-40 to
+85°C 3.7 6 mA
1
*1 : LTBC and WDT are operating ,and significant bits of BLKCON0 to BLKCON4 registers are all “1”.
*2 : When the CPU operating rate is 100%. Minimum instruction execution time: Approx 0.122 μs (at 8.192MHz system clock)
*3 :Comparator input offset voltage is included.
FEDL610Q101 -01
ML610Q101/ML610Q102
14/21
DC CHARACTERISTICS (3/4)
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition Min. Typ. Max. Unit Measuring
circuit
VOH IOH1 = 3.0mA, VDD = 4.5V *1 VDD
0.7
Output voltage
VOL IOL1 = +8.5mA, VDD = 4.5V *1 0.6
V 2
IOOH VOH = VDD (in high-impedance state) +1
Output leakage IOOL VOL = VSS (in high-impedance state) 1 μA 3
IIH1 VIH1 = VDD 1
Input current 1
(RESET_N) IIL1 VIL1 = VSS, VDD = 5.0V 650 500 350
IIH1 VIH1 = VDD = 5.0V 20 115 200
Input current 1
(TEST) IIL1 VIL1 = VSS 1
IIH2 VIH2 = VDD = 5.0V
(when pulled-down) 20 115 200
Input current 2
(PA0-PA2)
(PB0-PB7) IIL2 VIL2 = VSS, VDD=5.0V
(when pulled-up) 200 100 20
μA 4
*1 : When the one terminal output state.
DC CHARACTERISTICS (4/4)
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition Min. Typ. Max. Unit Measuring
circuit
VIH1 0.7
×VDD VDD
Input voltage 1
(RESET_N)
(TEST)
(PA0 to PA2)
(PB0,to PB7) VIL1 0 0.3
×VDD
V 2
Input pin
capacitance
(PA0 to PA2)
(PB0 to PB7)
CIN f = 10kHz
Ta = 25°C 20 pF
FEDL610Q101 -01
ML610Q101/ML610Q102
15/21
MEASURING CIRCUITS
MEASURING CIRCUIT 1
MEASURING CIRCUIT 2
A
VDD VSS
CV1μF
CV
Input pins
VDD VSS
VIH
VIL
Output pins
*1: Input logic circuit to determine the specified measuring conditions.
*2: Measured at the specified output pins.
(*2)
(*1) Current load
V
FEDL610Q101 -01
ML610Q101/ML610Q102
16/21
MEASURING CIRCUIT 3
MEASURING CIRCUIT 4
Input pins
A
VDD VSS
Output pins
*3: Measured at the specified output pins.
(*3)
Input pins
A
VDD VSS
VIH
VIL
Output pins
*1: Input logic circuit to determine the specified measuring conditions.
*2: Measured at the specified output pins.
(*2)
(*1)
FEDL610Q101 -01
ML610Q101/ML610Q102
17/21
AC CHARACTERISTICS (External Interrupt)
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition Min. Typ. Max. Unit
External interrupt disable period TNUL
Interrupt: Enabled (MIE = 1),
CPU: NOP operation
System clock: 32.768kHz
2.5 x
sysclk 3.5 x
sysclk μs
tNUL
PA0 to PA2, PB0 to PB1
(Rising-edge interrupt)
(Falling-edge interrupt)
P00 ,P01,PB0 – PB2
(Both-edge interrupt) tNUL
tNUL
PA0 to PA2, PB0 to PB1
PA0 to PA2, PB0 to PB1
FEDL610Q101 -01
ML610Q101/ML610Q102
18/21
Electrical Characteristics of Successive Approximation Type A/D Converter
(VDD=2.7 to 5.5V, VSS=0V, Ta=40 to +85°C, unless otherwise specified)
Rating
Parameter Symbol Condition
Min. Typ. Max. Unit
Resolution n 10 bit
Integral non-linearity error INL RI5k, HSCLK=8.192MHz 4 +4
Differential non-linearity error DNL RI5k, HSCLK=8.192MHz 3 +3
Zero-scale error VOFF R
I5k, HSCLK=8.192MHz4 +4
Full-scale error FSE RI5k, HSCLK=8.192MHz4 +4
LSB
Conversion time tCONV 102 φ/CH
φ: fPLL/4
A
VDD
VSS
Analog input
RI
5k
Ω
AIN0
to
AIN7
0.1
μ
F
+
10
μ
F
FEDL610Q101 -01
ML610Q101/ML610Q102
19/21
PACKAGE DIMENSIONS
(Unit: mm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore,
before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin
number, package code and desired mounting conditions (reflow method, temperature and times).
FEDL610Q101 -01
ML610Q101/ML610Q102
20/21
REVISION HISTORY
Page
Document No. Date Previous
Edition
Current
Edition
Description
FEDL610Q101-1 Jan,23,2013 Final edition 1
FEDL610Q101 -01
ML610Q101/ML610Q102
21/21
NOTES
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co.,
Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and
operations of the Products. The perip heral conditions must b e taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any
damage arising from any inaccuracy or misprint o f suc h info rmation, LAPIS Semiconductor shall bear no responsibility for such
damage.
The technical infor mation spe cified herein is intended o nly to show the t ypical functions o f and examples o f application circuits
for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual
property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility
whatsoever for any dispute arising from the use of such technical information.
The Products specified in this docu ment are intended to be used with general-use electronic equipment or devices (such as audio
visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical
injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and
fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the
prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely
high level of reliability the failure or malfunction of which may result in a direct threat to human life o r create a risk of human
injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller
or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the
above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales
representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign
Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Copyright 2013 LAPIS Semiconductor Co., Ltd.
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ROHM Semiconductor:
ML610Q101-NNNMBZ0ATL ML610Q102-NNNMBZ0ATL ML610Q101-NNNGDZ0ANL ML610Q102-NNNGDZ0ANL
ML610Q102 reference board