FEATURES
DDIGITAL OUTPUT: SPI-Compatible Interface
DRESOLUTION: 12-Bit + Sign, 0.0625°C
DACCURACY:
±1.5°C from −25°C to +85°C (max)
DLOW QUIESCENT CURRENT: 50µA (max)
DWIDE SUPPLY RANGE: 2.7V to 5.5V
DTINY SOT23-6 PACKAGE
DOPERATION TO 150°C
APPLICATIONS
DPOWER-SUPPLY TEMPERATURE
MONITORING
DCOMPUTER PERIPHERAL THERMAL
PROTECTION
DNOTEBOOK COMPUTERS
DCELL PHONES
DBATTERY MANAGEMENT
DOFFICE MACHINES
DESCRIPTION
The TMP121 and TMP123 are SPI-compatible tempera-
ture sensors available in the tiny SOT23-6 package.
Requiring no external components, the TMP121 and
TMP123 are capable of measuring temperatures within
2°C of accuracy over a temperature range of −40°C to
+125°C. Low supply current, and a supply range from 2.7V
to 5.5V, make the TMP121 and TMP123 excellent
candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal
measurement in a variety of communication, computer,
consumer, environmental, industrial, and instrumentation
applications.
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
and Temp.
Register
TMP121
Tem perat ure
GND
NC
NC = No Connection(1)
1
2
3
6
5
4
V+
SO
CS
SCK
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
and Temp.
Register
TMP123
NC
GND
NC = No Connection(1)
1
2
3
6
5
4
V+
SO
CS
SCK
Temperature
(1) Pins labeled NC should be left floating or connected to GND.
TMP121
TMP123
SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
1.5°C Accurate Digital Temperature Sensor
with SPI Interface
! !
www.ti.com
Copyright 2003−2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty , and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
"#$#
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply, V+ 7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2) −0.3V to +7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Current 10mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range −55 °C to +150°C. . . . . . . . . . . . . . .
Storage Temperature Range −60 °C to +150°C. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max) +150°C. . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering) +300°C. . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure t o absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, an d
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP121 and TMP123 input
voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNAT OR PACKAGE MARKING
TMP121
T121
TMP121
SOT23-6
DBV
T121
TMP123
SOT23-6
DBV
T123
TMP123
SOT23-6
DBV
T123
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
Top View SOT23-6
Pin 1 orientation is determined by package marking.
NC
GND
V+
SO
CS
SCK
1
2
3
6
5
4
T121
SOT23−6
NC = No Connection(2)
TMP121(1)
GND
NC
V+
SOT23−6
NC = No Connection(2)
TMP123(1)
SO
CS
SCK
1
2
3
6
5
4
T123
(1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown.
(2) Pins labeled NC should be left floating or connected to GND.
"#$#
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
3
ELECTRICAL CHARACTERISTICS
At TA = −40°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted.
TMP121, TMP123
PARAMETER CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range −40 +125 °C
Accuracy (temperature error) −25°C to +85°C±0.5 ±1.5 °C
−40°C to +125°C±1.0 ±2.0 °C
−40°C to +150°C±1.5 °C
vs Supply −0.3 0.1 +0.3 °C/V
Resolution ±0.0625 °C
DIGITAL INPUT/OUTPUT
Input Logic Levels:
VIH 0.7(V+) V
VIL 0.3(V+) V
Input Current, SO, SCK, CS IIN 0V ≤ VIN ≤ V+ ±1µA
Output Logic Levels:
VOL SO ISINK = 3mA 0.4 V
VOH SO ISOURCE = 2mA (V+)−0.4 V
Resolution 12 Bits
Input Capacitance, SO, SCK, CS 2.5 pF
Conversion Time 12-Bit 240 320 ms
Conversion Period(1) 12-Bit 480 640 ms
POWER SUPPLY
Operating Range 2.7 5.5 V
Quiescent Current IQSerial Bus Inactive 35 50 µA
Shutdown Current (TMP121) ISD Serial Bus Inactive 0.1 1 µA
Shutdown Current (TMP123) ISD Serial Bus Inactive 0.1 3 µA
TEMPERATURE RANGE
Specified Range −40 +125 °C
Operating Range −55 +150 °C
Storage Range −60 +150 °C
Thermal Resistance qJA SOT23-6 Surface-Mount 200 °C/W
(1) Period indicates time between conversion starts.
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
4
TYPICAL CHARACTERISTICS
At TA = +25°C and V+ = 5.0V, unless otherwise noted.
50
40
30
20
10
QUIESCENT CURRENT vs TEMPERATURE
Temperature (_C)
−60 −40 −20 0 20 40 60 80 100 120 140
IQ(µA)
Serial Bus Inactive
V+ = 5V
V+ = 2.7V
400
300
200
100
CONVERSION TIME vs TEMPERATURE
Temperature (_C)
−60 −40 −200 20406080100120140
Conversion Time (ms)
V+ = 5V
V+ = 2.7V
12−Bit Resolution
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
−0.1
SHUTDOWN CURRENT vs TEMPERATURE
Temperature (_C)
−60 −40 −20 0 20 40 60 80 100 120 140
ISD (µA)
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
TEMPERATURE ACCURACY vs TEMPERATURE
Temperature (_C)
−60 −40 −20 0 20 40 60 80 100 120 160140
Temperature Error (_C)
3 Typical Units 12−Bit Resolution
"#$#
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
5
APPLICATIONS INFORMATION
The TMP121 and TMP123 are 12-bit plus sign read-only
digital temperature sensors optimal for thermal
management and thermal protection applications. The
TMP121 and the TMP123 communicate through a serial
interface that is SPI-compatible. Temperature is converted
to a 12-bit plus sign data word with 0.0625°C resolution.
The TMP121 and TMP123 are specified for a temperature
range of −40°C to +125°C, with operation extending from
−55°C to +150°C.
The TMP121 and TMP123 are optimal for low power
applications, with a 0.5s conversion period for reduced
power consumption. The TMP121 and TMP123 are
specified for a supply voltage range of 2.7V to 5.5V, and
also feature a hardware shutdown to provide additional
power savings.
The TMP121 and TMP123 require no external
components for operation, though a 0.1µF supply bypass
capacitor is recommended. Figure 1 shows typical
connections for the TMP121 and TMP123.
TMP121
0.1µF
V+
GND
2
5
1
3
CS
NC(1)
4
6
SCK
SO TMP123
0.1µF
V+
GND
1
5
2
3
CS
NC = No Connection
NC(1)
4
6
SCK
SO
NOTE: (1) Pins labeled NC should be left floating or connected to GND.
Figure 1. Typical Connections of the TMP121 and
TMP123
The sensing device of both the TMP121 and TMP123 is
the chip itself; the die flag of the lead frame is thermally
connected to pin 2 of the TMP121, and of the TMP123.
Thermal paths run through the package leads as well as
the plastic package, and the lower thermal resistance of
metal causes the leads to provide the primary thermal
path. The GND pin (pin 2) of the TMP121 and the NC pin
(pin 2) o f the TMP123 are thermally connected to the metal
lead frame, and are the best choice for thermal input.
To maintain accuracy in applications requiring air or
surface temperature measurement, care should be taken
to isolate the package and leads from ambient air
temperature.
TEMPERATURE REGISTER
The Temperature Register of the TMP121 and TMP123 is
a 16-bit, signed read-only register that stores the output of
the most recent conversion. Up to 16 bits can be read to
obtain data and are described in Table 1. The first 13 bits
are used to indicate temperature with bits D2 = 0, and D1,
D0 in a high impedance state. Data format for temperature
is summarized in Table 2. Following power-up or reset, the
Temperature Register will read 0°C until the first
conversion is complete.
D15 D14 D13 D12 D11 D10 D9 D8
T12 T11 T10 T9 T8 T7 T6 T5
D7 D6 D5 D4 D3 D2 D1 D0
T4 T3 T2 T1 T0 0 Z Z
Table 1. Temperature Register
TEMPERATURE
(°C) DIGITAL OUTPUT(1)
(BINARY) HEX
150 0100 1011 0000 0000 4B00
125 0011 1 110 1000 0000 3E80
25 0000 1100 1000 0000 0C80
0.0625 0000 0000 0000 1000 0008
00000 0000 0000 0000 0000
−0.0625 1111 1111 1111 1000 FFF8
−25 1111 0011 1000 0000 F380
−55 11 10 0100 1000 0000 E480
(1) The last two bits are high impedance and are shown as 00 in the
table.
Table 2. Temperature Data Format
COMMUNICATING WITH THE TMP121
The TMP121 and TMP123 continuously convert
temperatures to digital data while CS is high. CS must be
high for a minimum of one conversion time (320ms max)
to update the temperature data. Reading temperature data
from the TMP121 and TMP123 is initiated by pulling CS
low, which will cause any conversion in progress to
terminate, and place the device into analog shutdown.
Quiescent current is reduced to 1µA during analog
shutdown. Once CS is pulled low, temperature data from
the last completed conversion prior to dropping CS is
latched into the shift register and clocked out at SO on the
falling SCK edge. The 16-bit data word is clocked out sign
bit first, followed by the MSB. Any portion of the 16-bit word
can be read before raising CS. The TMP121 and TMP123
typically require 0.25s to complete a conversion and
consume 50µA of current during this period. If CS is held
high for longer than one conversion time period the
TMP121 and TMP123 will go into idle mode for 0.25s,
requiring only 20µA of current. A new conversion begins
every 0.5s. Figure 2 describes the conversion timing for
the TMP121 and TMP123.
"#$#
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
6
0.25s
0.5s
50µA(active)
20µA(idle)
Figure 2. Conversion Time and Period
The serial data of the TMP121 and TMP123 consists of
12-bit plus sign temperature data followed by a
confirmation bit and two high impedance bits. Data is
transmitted in Binary Two’s Complement format. Figure 3
describes the output data of the TMP121 and TMP123.
Timing Diagrams
The TMP121 and TMP123 are SPI-compatible. Figure 4
and Figure 5 describe the various timing requirements,
with parameters defined in Table 3.
PARAMETER MIN MAX UNITS
SCK Period t1100 ns
SCK Falling Edge to Output Data Delay t230 ns
CS to Rising Edge SCK Set-Up Time t340 ns
CS to Output Data Delay t430 ns
CS Rising Edge to Output High Impedance t530 ns
Table 3. Timing Description
SO/I
SCK
CS
ZZ1D3D4D5D6D7D8D9D10D11D12D13D14D15Z
Figure 3. Data READ
SCK
CS
SO
t1
t3
t2
t4
Figure 4. Output Data Timing Diagram
SCK
CS
SO
t5t5
SCK
CS
SO
Figure 5. High Impedance Output Timing Diagram
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TMP121AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP121 :
•Enhanced Product: TMP121-EP
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP121AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
TMP121AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
TMP123AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
TMP123AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP121AIDBVR SOT-23 DBV 6 3000 190.5 212.7 31.8
TMP121AIDBVT SOT-23 DBV 6 250 190.5 212.7 31.8
TMP123AIDBVR SOT-23 DBV 6 3000 190.5 212.7 31.8
TMP123AIDBVT SOT-23 DBV 6 250 190.5 212.7 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TMP121AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP121AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP123AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2012
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP121 :
•Enhanced Product: TMP121-EP
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP121AIDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TMP121AIDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Apr-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP121AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TMP121AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Apr-2012
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP®Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
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