MC74ACT153DR2 - ON Semiconductor L.L.C.

March, 2006 − Rev. 7

1Publication Order Number:

MC74AC153/D

MC74AC153, MC74ACT153

Dual 4−Input Multiplexer

The MC74AC153/74ACT153 is a high−speed dual 4−input

multiplexer with common select inputs and individual enable inputs

for each section. It can select two lines of data from four sources. The

two buffered outputs present data in the true (non−inverted) form. In

addition to multiplexer operation, the MC74AC153/74ACT153 can

act as a function generator and generate any two functions of three

variables.

•Outputs Source/Sink 24 mA

•′ACT153 Has TTL Compatible Inputs

wThese devices are available in Pb−free package(s). Specifications herein

apply to both standard and Pb−free devices. Please see our website at

www.onsemi.com for specific Pb−free orderable part numbers, or

contact your local ON Semiconductor sales office or representative.

1516 14 13 12 11 10

21 34567

VCC

EbS0I3b I2b I1b I0b Zb

EaS1I3a I2a I1a I0a ZaGND

Figure 1. Pinout: 16−Lead Packages Conductors

(Top View)

PIN ASSIGNMENT

PIN FUNCTION

I0a−I3a Side A Data Inputs

I0b−I3b Side B Data Inputs

S0, S1Common Select Inputs

EaSide A Enable Input

EbSide B Enable Input

ZaSide A Output

ZbSide B Output

http://onsemi.com

DIP−16

N SUFFIX

CASE 648

SO−16

D SUFFIX

CASE 751B

Device Package Shipping

ORDERING INFORMATION

MC74AC153N PDIP−16 25 Units/Rail

MC74AC153D SOIC−16 48 Units/Rail

MC74AC153DR2 2500 Tape & Reel

TSSOP−16

DT SUFFIX

CASE 948F

MC74AC153DT TSSOP−16 96 Units/Rail

MC74AC153DTR2 TSSOP−16

SOIC−16

2500 Tape & Reel

MC74ACT153N PDIP−16 25 Units/Rail

MC74ACT153D SOIC−16 48 Units/Rail

MC74ACT153DR2 2500 Tape & Reel

MC74ACT153DT TSSOP−16 96 Units/Rail

SOIC−16

See general marking information in the device marking

section on page 7 of this data sheet.

DEVICE MARKING INFORMATION

EIAJ−16

M SUFFIX

CASE 966

MC74AC153M EIAJ−16

MC74AC153MEL EIAJ−16 2000 Tape & Reel

MC74ACT153M EIAJ−16

MC74ACT153MEL EIAJ−16 2000 Tape & Reel

50 Units/Rail

MC74AC153, MC74ACT153

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TRUTH TABLE

Select

Inputs Inputs (a or b) Output

S0 S1 E I0 I1I2I3 Z

X X H X X X X L

L L L L X X X L

L L L H X X X H

H L L X L X X L

H L L X H X X H

L H L X X L X L

L H L X X H X H

H H L X X X L L

H H L X X X H H

H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

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Figure 2. Logic Symbol

EaI0a I1a I2a I3a

ZaZb

I0b I1b I2b I3b Eb

FUNCTIONAL DESCRIPTION

The MC74AC153/74ACT153 is a dual 4−input

multiplexer. It can select two bits of data from up to four

sources under the control of the common Select inputs (S0,

S1). The two 4−input multiplexer circuits have individual

active−LOW Enables (Ea,Eb) which can be used to strobe

the outputs independently. When the Enables (Ea, Eb) are

HIGH, the corresponding outputs (Za, Zb) are forced LOW.

The MC74AC153/74ACT153 is the logic implementation

of a 2−pole, 4−position switch, where the position of the

switch is determined by the logic levels supplied to the two

Select inputs. The logic equations for the outputs are shown

below.

Za = Ea•(I0a•S1•S0+I1a•S1•S0+I2a•S1•S0+I3a•S1•S0)

Zb = Eb•(I0b•S1•S0+I1b•S1•S0+I2b•S1•S0+I3b•S1•S0)

EaI0a I3a S1S0I0b I1b I2b I3b Eb

ZaZb

Figure 3. Logic Diagram

NOTE: This diagram is provided only for the understanding of logic

operations and should not be used to estimate propagation

delays.

I1a I2a

MC74AC153, MC74ACT153

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MAXIMUM RATINGS*

Symbol Parameter Value Unit

VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V

VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V

VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V

IIN DC Input Current, per Pin ±20 mA

IOUT DC Output Sink/Source Current, per Pin ±50 mA

ICC DC VCC or GND Current per Output Pin ±50 mA

Tstg Storage Temperature −65 to +150 °C

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recom-

mended Operating Conditions.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage

′AC 2.0 5.0 6.0

′ACT 4.5 5.0 5.5

VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) 0−VCC V

tr, tfInput Rise and Fall Time (Note 1)

′AC Devices except Schmitt Inputs

VCC @ 3.0 V −150 −

VCC @ 4.5 V −40 −ns/V

VCC @ 5.5 V −25 −

tr, tfInput Rise and Fall Time (Note 2)

′ACT Devices except Schmitt Inputs

VCC @ 4.5 V −10 −

ns/V

VCC @ 5.5 V −8.0 −

TJJunction Temperature (PDIP) − − 140 °C

TAOperating Ambient Temperature Range −40 25 85 °C

IOH Output Current − High − − −24 mA

IOL Output Current − Low − − 24 mA

1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

MC74AC153, MC74ACT153

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74AC 74AC

Unit Conditions

TA = +25°C

TA =

−40°C to

+85°C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage

3.0 1.5 2.1 2.1 VOUT = 0.1 V

4.5 2.25 3.15 3.15 V or VCC − 0.1 V

5.5 2.75 3.85 3.85

VIL Maximum Low Level

Input Voltage

3.0 1.5 0.9 0.9 VOUT = 0.1 V

4.5 2.25 1.35 1.35 V or VCC − 0.1 V

5.5 2.75 1.65 1.65

VOH Minimum High Level

Output Voltage

3.0 2.99 2.9 2.9 IOUT = −50 mA

4.5 4.49 4.4 4.4 V

5.5 5.49 5.4 5.4

*VIN = VIL or VIH

3.0 −2.56 2.46 −12 mA

4.5 −3.86 3.76 IOH −24 mA

5.5 −4.86 4.76 −24 mA

VOL Maximum Low Level

Output Voltage

3.0 0.002 0.1 0.1 IOUT = 50 mA

4.5 0.001 0.1 0.1 V

5.5 0.001 0.1 0.1

*VIN = VIL or VIH

3.0 −0.36 0.44 12 mA

4.5 −0.36 0.44 IOL 24 mA

5.5 −0.36 0.44 24 mA

IIN Maximum Input

Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND

IOLD †Minimum Dynamic

Output Current

5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 −8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.

MC74AC153, MC74ACT153

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AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)

Symbol Parameter VCC*

(V)

74AC 74AC

Unit Fig.

No.

TA = +25°C

CL = 50 pF

TA = −40°C

to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH

Propagation Delay

Sn to Zn

3.3 2.5 9.5 15.0 2.5 17.5 ns 3−6

5.0 2.0 6.5 11.0 2.0 12.5

tPHL

Propagation Delay

Sn to Zn

3.3 3.0 8.5 14.5 2.5 16.5 ns 3−6

5.0 2.5 6.5 11.0 2.0 12.0

tPLH

Propagation Delay

En to Zn

3.3 2.5 8.0 13.5 2.0 16.0 ns 3−6

5.0 1.5 5.5 9.5 1.5 11.0

tPHL

Propagation Delay

En to Zn

3.3 2.5 7.0 11.0 2.0 12.5 ns 3−6

5.0 2.0 5.0 8.0 1.5 9.0

tPLH

Propagation Delay

In to Zn

3.3 2.5 7.5 12.5 2.0 14.5 ns 3−5

5.0 1.5 5.5 9.0 1.5 10.5

tPHL

Propagation Delay

In to Zn

3.3 1.5 7.0 11.5 1.5 13.0 ns 3−5

5.0 1.5 5.0 8.5 1.5 10.0

*Voltage Range 3.3 V is 3.3 V ±0.3 V.

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74ACT 74ACT

Unit Conditions

TA = +25°C

TA =

−40°C to

+85°C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage

4.5 1.5 2.0 2.0 VVOUT = 0.1 V

5.5 1.5 2.0 2.0 or VCC − 0.1 V

VIL Maximum Low Level

Input Voltage

4.5 1.5 0.8 0.8 VVOUT = 0.1 V

5.5 1.5 0.8 0.8 or VCC − 0.1 V

VOH Minimum High Level

Output Voltage

4.5 4.49 4.4 4.4 VIOUT = −50 mA

5.5 5.49 5.4 5.4

*VIN = VIL or VIH

4.5 −3.86 3.76 V IOH

−24 mA

5.5 −4.86 4.76 −24 mA

VOL Maximum Low Level

Output Voltage

4.5 0.001 0.1 0.1 VIOUT = 50 mA

5.5 0.001 0.1 0.1

*VIN = VIL or VIH

4.5 −0.36 0.44 V IOL

24 mA

5.5 −0.36 0.44 24 mA

IIN Maximum Input

Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 −1.5 mA VI = VCC −2.1 V

IOLD †Minimum Dynamic

Output Current

5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 −8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

MC74AC153, MC74ACT153

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AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)

Symbol Parameter VCC*

(V)

74ACT 74ACT

Unit Fig.

No.

TA = +25°C

CL = 50 pF

TA = −40°C

to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay

Sn to Zn

5.0 3.0 7.0 11.5 2.0 13.5 ns 3−6

tPHL Propagation Delay

Sn to Zn

5.0 3.0 7.0 11.5 2.5 13.5 ns 3−6

tPLH Propagation Delay

En to Zn

5.0 2.0 6.5 10.5 2.0 12.5 ns 3−6

tPHL Propagation Delay

En to Zn

5.0 3.0 6.0 9.5 2.5 11.0 ns 3−6

tPLH Propagation Delay

In to Zn

5.0 2.5 5.5 9.5 2.0 11.0 ns 3−5

tPHL Propagation Delay

In to Zn

5.0 2.0 5.5 9.5 2.0 11.0 ns 3−5

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter Value

Typ Unit Test Conditions

CIN Input Capacitance 4.5 pF VCC = 5.0 V

CPD Power Dissipation Capacitance 65 pF VCC = 5.0 V

MARKING DIAGRAMS

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

AC153

AWLYWW

MC74AC153N

AWLYYWW AC

153

ALYW

ACT153

AWLYWW ACT

153

ALYW

MC74ACT153N

AWLYYWW

DIP−16 SO−16 TSSOP−16 EIAJ−16

74AC153

ALYW

74ACT153

ALYW

MC74AC153, MC74ACT153

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

−A−

16 PL

SEATING

916

PLANE

−T−

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.740 0.770 18.80 19.55

B0.250 0.270 6.35 6.85

C0.145 0.175 3.69 4.44

D0.015 0.021 0.39 0.53

F0.040 0.70 1.02 1.77

G0.100 BSC 2.54 BSC

H0.050 BSC 1.27 BSC

J0.008 0.015 0.21 0.38

K0.110 0.130 2.80 3.30

L0.295 0.305 7.50 7.74

M0 10 0 10

S0.020 0.040 0.51 1.01

____

PDIP−16

N SUFFIX

16 PIN PLASTIC DIP PACKAGE

CASE 648−08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

16 9

SEATING

PLANE

RX 45_

8 PLP

−B−

−A−

0.25 (0.010) B S

−T−

16 PL

0.25 (0.010) A S

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

SO−16

D SUFFIX

16 PIN PLASTIC SOIC PACKAGE

CASE 751B−05

ISSUE J

MC74AC153, MC74ACT153

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PACKAGE DIMENSIONS

TSSOP−16

DT SUFFIX

16 PIN PLASTIC TSSOP PACKAGE

CASE948F−01

ISSUE O

ÇÇÇ

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.18 0.28 0.007 0.011

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE −W−.

___ _

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

16 9

DETAIL E

ÉÉÉ

DETAIL E

2X L/2

−U−

U0.15 (0.006) T

0.10 (0.004) V S

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

EIAJ−16

M SUFFIX

16 PIN PLASTIC EIAJ PACKAGE

CASE966−01

ISSUE O

DIM MIN MAX MIN MAX

INCHES

−−− 2.05 −−− 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.18 0.27 0.007 0.011

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0.70 0.90 0.028 0.035

−−− 0.78 −−− 0.031

_10 _0

_10 _

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

DETAIL P

VIEW P

0.13 (0.005) 0.10 (0.004)

16 9

MC74AC153, MC74ACT153

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Notes

MC74AC153, MC74ACT153

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Notes

MC74AC153, MC74ACT153

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Notes

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MC74AC153/D

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