www.honda-connectors.co.jp
AXA2S
1
www.honda-connectors.co.jp
ORDERING INFORMATION
Enhanced robustness and EMI resistance
achieved by the laser-welded double-sided metal
shell (SDXC card compatible, with card jump-out
and wrong insertion prevention functions)
SOCKETS FOR
SD MEMORY CARD (S TYPE)
Standard type
Reverse type
Metal shell
SDIO ground tab
contact supported
(supports SDIO)
Metal shell
Card detection
and write protect
switches
RoHS compliant
FEATURES
1. Superior EMI resistance and
terminal coplanarity achieved by the
double-sided metal shell
The laser-welded double-sided shell has
high robustness and shielding
performance. Providing a ground pattern
when mounting the socket is effective for
EMI protection.
The high resistance to reflow heat
prevents the reflow process from
degrading the terminal coplanarity.
2. The structures of the card detection
and write protection switches prevent
the card thickness from affecting the
detection accuracy.
The side detection system and the highly
dust-resistant V notch contact structure
ensure high contact reliability.
3. Equipped with the card jump-out
prevention function existence
4. Card locking structure for forced
ejection protection
The lock pin in the metal shell prevents
unwanted ejection of the card.
5. Compatible with the SDIO standard
(with ground tab)
Compatible with the SDIO standard,
allowing use for expansion modules with
an interface function
APPLICATIONS
• DSCs, DVCs, PDAs, handheld
terminals, notebook PCs, gaming
consoles, portable audio devices, etc.
that use an SD card
• What is V notch construction?
By making contact with the edges and thus
increasing the contact pressure, this
product can eliminate foreign matters more
effectively than conventional products.
[Cross Section of Contacts]
Fixed contact Two-point contact
(edge contact)
Movable
contact
(R, S type)(Conventional type)
<Product without a notch> <V notched product>
2S: Sockets for SD memory card (S type)
<Board mounting direction>
6: On board mounting reverse type (outside terminal)
7: On board mounting standard type (outside terminal)
AXA -M2S 3 0 2
<Eject type>
3: Push-push type
<Function>
2: Without card jump-out prevention function,
with card detection switch and with write protect switch
6: With card jump-out prevention function,
with card detection switch and with write protect switch
<Packing>
P: 500 pcs. embossed tape and paper reel package × 2 reels
<Standoff height>
0: Without standoff
<Terminal/Boss>
2: SMD terminal/Shell SMD/Without boss
www.honda-connectors.co.jp
AXA2S
2
PRODUCT TYPES
SPECIFICATIONS
1. Characteristics
Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.
2. Material and surface treatment
Product
name Eject type Card detection
switch
Card jump-out
prevention function Mounting type Part No. Packing quantity
Inner carton Outer carton
Sockets for
SD memory
card
(S type)
Push-push
type Available
Available
Standard
mounting type AXA2S73062∗-M
Asterisk “ ∗ ” mark on end of
Part No.;
P: 500 pieces (1 reel)
(Embossed tape package)
Asterisk “ ∗ ” mark on end of
Part No.;
P: 1,000 pieces (2 reels)
(Embossed tape package)
Reverse
mounting type AXA2S63062∗-M
Not available
Standard
mounting type AXA2S73022∗-M
Reverse
mounting type AXA2S63022∗-M
Item Specifications Condition
Electrical
characteristics
Rated Current 0.5 A/1 terminal
Contact resistance
Signal contact portion: Max. 100mΩ (Initial)
Detection contact portion: Max. 150mΩ (Initial)
(Card detection and write protection detection)
Measured based on the HP4338B measurement
method of JIS C5402
Insulation resistance Min. 1,000MΩ (Initial) Using 500V DC megger (applied for 1 min.)
Breakdown voltage 500V AC for 1 min.
Rated voltage is applied for one minute and check
for short circuit or damage with a detection current
of 1 mA.
Mechanical
characteristics
Vibration resistance
Frequency: 10 to 2,000 Hz
Acceleration: 20.0 m/s2 {2.0G}
No current interruption for more than 0.1 µs
Card insertion force Max. 40N
Card removal force Min. 1N, Max. 40N
Lifetime
characteristics
Insertion and removal
life of card
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: Max. 40mΩ (amount of change)
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insertion and removal speed are at a rate of 600
times/hour or less.
Environmental
characteristics
Ambient temperature –25°C to +90°C No freezing or condensation in low temperatures
Storage temperature –40°C to +90°C (The allowable storage temperature is –40°C to +50°C
if unopened from original packaging) No freezing or condensation in low temperatures
Resistance to soldering
heat
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less
Sockets (shell) surface temperature for using
infrared reflow soldering machine
Humidity tolerance
(mated condition)
Contact resistance:
Signal contact portion: Max. 40mΩ (amount of change)
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insulation resistance: Min. 100 MΩ
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Applicable memory card SD memory card*1
Unit weight 2.9g
Portion Material Surface
Signal contact Copper alloy
Contact portion: Ni plating on base, PdNi plating + Au flash plating
Soldering portion: Ni plating on base, Au plating on surface
Detection contact Contact/Soldering portion: Ni plating on base, Au plating on surface
Retention solder tab Stainless steel Soldering portion: Ni strike, Partial Au plating
www.honda-connectors.co.jp
AXA2S
3
DIMENSIONS (Unit: mm)
1. On board mounting standard type (Without standoff)
Part No.
AXA2S73062∗-M
(With card jump-out
prevention function)
AXA2S73022∗-M
(Without card jump-out
prevention function)
1.40
28.40
(2.10)
9.775
8.125
5.625
2.50
1.301.30 28.15
13.50
(Contact pitch)
22.55
20.30
19.00
10.202.30
2.50
(Contact pitch)
Card center
SD memory card
Te rminal coplanarity
(Signal/Detection contact
and Retention solder tab)
2.70
0.60
1.65
2.5×7=17.50
2.5×6=15.00
3.725
*1 0.08 (Standoff dimensions)
0.10
Detailed internal view
Pin No.6
Pin No.8
Pin No.2
Pin No.7
Pin No.5
Pin No.9
Pin No.1
Pin No.3
Pin No.4
3
2
1
View of set card
SD memory card
(24.00)
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
24.45±0.05
22.20±0.05
20.90±0.05
1.2±0.05
12.10±0.05
1.60±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.10±0.05
1.35±0.05
2.80±0.05 10.3 min.
8 max.
12.1 min.
31.6 ref.
10.3 max.
: Pattern forbidden
area*2
: Pattern insulation
is recommended.
(Whole area)
1.65±0.05
2.475±0.05
1.75±0.05
1.55±0.05
2.475±0.05
2.675±0.05
23.925±0.052.10±0.05
3.225±0.05
1.75±0.05
2.50±0.05 1.00±0.05
2.5×7=17.50±0.1
31.35 ref.
0.6 min.
17.3 min.
20 min.
18.3 max.
*1 Standoff dimension is the dimension that takes into account the solder resist
or silk screen printing thickness on the PC board in order to preserve the
dimension from the surface of the PC board to the bottom of the socket.
*2 This is the pattern forbidden area. It is provided to prevent the signal contact
tips from contacting the substrate surface.
Recommended metal mask pattern
Metal mask thickness: 120µm
2.50±0.05
2.475±0.05 1.65±0.05
17.50±0.05 (2.5×7)
9-1.00±0.03
1.75±0.05
3.22±0.03
2.10±0.0523.93±0.032.10±0.03
1.55±0.03 2.675±0.05
(pitch)
20.90±0.05
12.10±0.051.35±0.05
0.36±0.03
0.82±0.03
0.36±0.03
0.82±0.03
0.82±0.03
22.20±0.05
24.45±0.051.45±0.05
1.28±0.05
Metal mask opening area ratio: 80%
Metal mask opening area ratio: 75%
Metal mask opening area ratio: 100%
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2S
4
2. On board mounting reverse type (Without standoff)
Part No.
AXA2S63062∗-M
(With card jump-out
prevention function)
AXA2S63022∗-M
(Without card jump-out
prevention function)
1.4028.40
(2.10)
9.775
8.125
5.625
2.50
1.301.30 28.15
13.50
(Contact pitch)
22.55
20.30
19.00
10.202.30
2.50
(Contact pitch)
Card center
SD memory card
0.60
1.65
2.5×6=15.00
3.7252.5×7=17.50
Te rminal coplanarity
(Signal/Detection contact
and Retention solder tab)
2.70
*0.08 (Standoff dimensions)
0.10
Detailed internal view
Pin No.4
Pin No.3
Pin No.1
Pin No.9
Pin No.5
Pin No.7
Pin No.2
Pin No.8
Pin No.6
3
2
1
View of set card
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
SD memory card
(24.00)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
24.45±0.05
22.20±0.05
20.90±0.05
1.20±0.05
1.60±0.05
12.10±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.10±0.05
1.35±0.05
2.80±0.05
31.6 ref.
1.65±0.05
2.475±0.052.5×7=17.50±0.1
1.75±0.05
1.55±0.052.675±0.05
2.475±0.05
2.10±0.0523.925±0.05
3.225±0.05
2.50±0.05
1.00±0.05
31.35 ref.
: Pattern insulation
is recommended.
(Whole area)
1.75±0.05
*Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Recommended metal mask pattern
Metal mask thickness: 120µm
2.50±0.05
2.475±0.05
1.65±0.05
9-1.00±0.03
1.75±0.0317.50±0.05 (2.5×7)
3.22±0.03
2.10±0.0323.93±0.032.10±0.03
1.55±0.032.675±0.03
(pitch)
20.90±0.03
1.35±0.05 12.10±0.03
0.82±0.03
0.36±0.03
0.82±0.03
0.36±0.03
22.20±0.03
24.45±0.03
1.45±0.03
1.28±0.03
Metal mask opening area ratio: 80%
Metal mask opening area ratio: 75%
Metal mask opening area ratio: 100%
0.82±0.03
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2R
5
ORDERING INFORMATION
Enhanced robustness and EMI resistance
achieved by the laser-welded double-sided metal
shell (SDXC card compatible, with card jump-out
and wrong insertion prevention functions)
SOCKETS FOR
SD MEMORY CARD (R TYPE)
Standard type
Reverse type
Metal shell SDIO ground tab
contact supported
(supports SDIO)
Metal shell
Card detection
and write protect
switches
RoHS compliant
FEATURES
1. Superior EMI resistance and
terminal coplanarity achieved by the
double-sided metal shell
The laser-welded double-sided shell has
high robustness and shielding
performance. Providing a ground pattern
when mounting the socket is effective for
EMI protection.
The high resistance to reflow heat
prevents the reflow process from
degrading the terminal coplanarity.
2. The structures of the card detection
and write protection switches prevent
the card thickness from affecting the
detection accuracy.
The side detection system and the highly
dust-resistant V notch contact structure
ensure high contact reliability.
3. Equipped with the card jump-out
prevention function existence
4. Card locking structure for forced
ejection protection
The lock pin in the metal shell prevents
unwanted ejection of the card.
5. Compatible with the SDIO standard
(with ground tab)
Compatible with the SDIO standard,
allowing use for expansion modules with
an interface function
APPLICATIONS
• DSCs, DVCs, PDAs, handheld
terminals, notebook PCs, gaming
consoles, portable audio devices, etc.
that use an SD card
• What is V notch construction?
By making contact with the edges and thus
increasing the contact pressure, this
product can eliminate foreign matters more
effectively than conventional products.
[Cross Section of Contacts]
Fixed contact Two-point contact
(edge contact)
Movable
contact
(R, S type)(Conventional type)
<Product without a notch> <V notched product>
2R: Sockets for SD memory card (R type)
<Board mounting direction>
6: On board mounting reverse type (outside terminal)
7: On board mounting standard type (outside terminal)
AXA -M2R 3 1
<Eject type>
3: Push-push type
<Function>
2: Without card jump-out prevention function,
with card detection switch and with write protect switch
6: With card jump-out prevention function,
with card detection switch and with write protect switch
<Packing>
T:
P:
35 pcs. tray package × 20 trays
350 pcs. embossed tape and paper reel package × 2 reels
<Standoff height>
0: Without standoff
3: Stand off 1.5 mm
<Terminal/Boss>
1: SMD terminal/With boss
www.honda-connectors.co.jp
AXA2R
6
PRODUCT TYPES
SPECIFICATIONS
1. Characteristics
Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.
2. Material and surface treatment
Product
name Eject type Card detection
switch
Card jump-out
prevention
function
Mounting
type
Standoff
height
(mm)
Part No.
Packing quantity
Inner carton Outer carton
Sockets for
SD memory
card
(R type)
Push-push
type Available
Available
Standard
mounting
type
0 AXA2R73061∗-M
Asterisk “ ∗ ” mark on end of
Part No.;
P: 350 pieces (1 reel)
(Embossed tape package)
T: 35 pieces (1 tray)
(Tray package)
Asterisk “ ∗ ” mark on end of
Part No.;
P: 700 pieces (2 reels)
(Embossed tape package)
T: 700 pieces (20 trays)
(Tray package)
1. 5 AXA2R73361∗-M
Reverse
mounting
type
0 AXA2R63061∗-M
1.5 AXA2R63361∗-M
Not available
Standard
mounting
type
0 AXA2R73021∗-M
1.5 AXA2R73321∗-M
Reverse
mounting
type
0 AXA2R63021∗-M
1.5 AXA2R63321∗-M
Item Specifications Condition
Electrical
characteristics
Rated Current 0.5 A/1 terminal
Contact resistance
Signal contact portion: Max. 100mΩ (Initial)
Detection contact portion: Max. 150mΩ (Initial)
(Card detection and write protection detection)
Measured based on the HP4338B measurement
method of JIS C5402
Insulation resistance Min. 1,000MΩ (Initial) Using 500V DC megger (applied for 1 min.)
Breakdown voltage 500V AC for 1 min.
Rated voltage is applied for one minute and check
for short circuit or damage with a detection current
of 1 mA.
Mechanical
characteristics
Vibration resistance
Frequency: 10 to 55 Hz
Acceleration: 20.0 m/s2 {2.0G}
No current interruption for more than 0.1 µs
Card insertion force Max. 40N
Card removal force Min. 1N, Max. 40N
Lifetime
characteristics
Insertion and removal
life of card
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: 40mΩ (amount of change)
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insertion and removal speed are at a rate of 600
times/hour or less.
Environmental
characteristics
Ambient temperature –25°C to +90°C No freezing or condensation in low temperatures
Storage temperature –40°C to +90°C (The allowable storage temperature is –40°C to +50°C
if unopened from original packaging) No freezing or condensation in low temperatures
Resistance to soldering
heat
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less
Sockets (shell) surface temperature for using
infrared reflow soldering machine
Humidity tolerance
(mated condition)
Contact resistance:
Signal contact portion: 40mΩ (amount of change)
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insulation resistance: Min. 100MΩ
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Applicable memory card SD memory card*1
Unit weight 2.9g
Portion Material Surface
Signal contact Copper alloy
Contact portion: Ni plating on base, PdNi plating + Au flash plating
Soldering portion: Ni plating on base, Au plating on surface
Detection contact Contact/Soldering portion: Ni plating on base, Au plating on surface
Retention solder tab Stainless steel Soldering portion: Ni strike, Partial Au plating
www.honda-connectors.co.jp
AXA2R
7
DIMENSIONS (Unit: mm)
1. On board mounting standard type (Without standoff)
Part No.
AXA2R73061∗-M
(With card jump-out prevention function)
AXA2R73021∗-M
(Without card jump-out prevention function)
0.60
1.40
28.40
(29.80)
(14.65)
13.50
28.15
(2.10)
8.10
9.40
18.20
(17.50)
14.55
27.95
(0.625)
1.65±0.1
(Contact pitch) 2.50±0.1
Card center
SD memory card
19.15
17.50
0.625 9.375
2.50
Te rminal coplanarity
(Signal/Detection contact)
(3.40)
1.2
0.70
5.3
2.70
*1 0.08 (Standoff dimensions)
0.10
Detailed internal view View of set card
Pin No.4
Pin No.3
Pin No.1
Pin No.9
Pin No.5
Pin No.7
Pin No.2
Pin No.8
Pin No.6
3
2
1
SD memory card
(24.00)
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
PC board both side
Substrate edge
Socket edge
Through hole
2.50±0.05 (Pitch)
0.625±0.05
1.60±0.05
(0.50)
5.30±0.05
1.40±0.05
1.60±0.05
3.30
0.60±0.05
0.40±0.05
1.00±0.05
17.50±0.05
19.15±0.05
1.60±0.05
1.20±0.05
1.10±0.05
0.50±0.05
0.50±0.05
1.10±0.05
8.10±0.05
10.40±0.05
30.30±0.05
18.20±0.05
9.40±0.05
8.10±0.05
(30.15)
10.37 7.48 1.60
1.60
(15.65)
8.58
12.25±0.05
0.60±0.05
0.40±0.05
1.60±0.05 14.55±0.05
27.95±0.05
1.75±0.05
2.10
1.55±0.05 12.45±0.05
(R)
(R)
: Pattern forbidden
area*2
: Pattern insulation
is recommended.
(Whole area)
*1 Standoff dimension is the dimension that takes into account the solder resist
or silk screen printing thickness on the PC board in order to preserve the
dimension from the surface of the PC board to the bottom of the socket.
*2 This is the pattern forbidden area. It is provided to prevent the signal contact
tips from contacting the substrate surface.
Recommended metal mask pattern
Metal mask thickness: 120µm
Metal mask opening area ratio: 75%
Metal mask opening area ratio:100%
Metal mask opening area ratio: 80%
Socket edge
(R)
9-1.0±0.03
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
(R)
29.95±0.05
1.60±0.03
1.60±0.03
1.31±0.03
6.27±0.05 5.88±0.05
(3.9)
1.55±0.03
1.75±0.03
26.40±0.05
4.20±0.05
5.50±0.05
14.30±0.05
3.30±0.03
1.28±0.03
0.35±0.03
1.2±0.03
0.82±0.03
0.35±0.03
0.82±0.03
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2R
8
2. On board mounting standard type (Standoff 1.5mm)
Part No.
AXA2R73361∗-M
(With card jump-out prevention function)
AXA2R73321∗-M
(Without card jump-out prevention function)
Card center
SD memory card
Te rminal coplanarity
0.10
(Signal/Detection contact)
0.7
1.2
1.7
5.3
8.10
9.40
18.20
(2.10)
19.15
17.50
2.50
9.3750.625
1.40
(29.80)
28.40
14.6513.50
28.15
(Contact pitch) 2.50±0.1
1.65±0.1
14.55
(0.625)
(17.50)
27.95
0.60
(4.90)
2.70
*1.58 (Standoff dimensions)
Detailed internal view View of set card
Pin No.4
Pin No.3
Pin No.1
Pin No.9
Pin No.5
Pin No.7
Pin No.2
Pin No.8
Pin No.6
3
2
1
SD memory card
(24.00)
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
Through hole
PC board both side
Substrate edge
Socket edge
0.60±0.05
0.40±0.05
14.55±0.05
1.60±0.05
1.60±0.05
1.40±0.05
5.30±0.05
3.30
(0.50)
0.60±0.05
0.40±0.05
12.45±0.05
1.00±0.05
1.10±0.05
0.50±0.05
0.50±0.05
1.10±0.05
1.55±0.05
12.25±0.05
1.60±0.05
8.10±0.05
9.40±0.05
18.20±0.05
30.30±0.05
1.20±0.05
19.15±0.05
17.50±0.05
0.625±0.05
2.50±0.05 (Pitch)
1.75±0.05
27.95±0.05
1.60±0.05
(R)
(R)
*Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Recommended metal mask pattern
Metal mask thickness: 120µm
Metal mask opening area ratio: 75%
Metal mask opening area ratio:100%
Metal mask opening area ratio: 80%
Socket edge
(R)
9-1.0±0.03
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
(R)
29.95±0.05
1.60±0.03
1.60±0.03
1.31±0.03
6.27±0.05 5.88±0.05
(3.9)
1.55±0.03
1.75±0.03
26.40±0.05
4.20±0.05
5.50±0.05
14.30±0.05
3.30±0.03
1.28±0.03
0.35±0.03
1.2±0.03
0.82±0.03
0.35±0.03
0.82±0.03
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2R
9
3. On board mounting reverse type (Without standoff)
Part No.
AXA2R63061∗-M
(With card jump-out prevention function)
AXA2R63021∗-M
(Without card jump-out prevention function) 0.60
1.40
28.40
(29.80)
14.65 13.50
28.15
8.10
9.40
18.20
17.50
14.55
27.95
(0.625)
1.65±0.1
(Contact pitch) 2.50±0.1
Card center
19.15
17.50
0.625
9.375
2.50
(2.10)
1.20
1.70
0.70
5.30
(3.40)
2.70
SD memory card
0.10
*0.08 (Standoff dimensions)
Te rminal coplanarity
(Signal/Detection contact)
Detailed internal view View of set card
Pin No.4
Pin No.3
Pin No.1
Pin No.9
Pin No.5
Pin No.7
Pin No.2
Pin No.8
Pin No.6
3
2
1
SD memory card
(24.00)
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
14.55±0.05
27.95±0.05
0.60±0.05
0.40±0.05
1.60±0.05
PC board both side
: Pattern insulation
is recommended.
(Whole area)
Substrate edge
Socket edge Through hole
30.30±0.05
18.20±0.05
9.40±0.05
8.10±0.05 1.60±0.05
2.50±0.05 (Pitch)
0.625±0.05
1.60±0.05
1.10±0.05
0.50±0.05
1.10±0.05
1.20±0.05
0.50±0.05
0.60±0.05
(0.50)
(R)
(R)
5.30±0.05
1.40±0.05
1.60±0.05
3.30
0.40±0.05
17.50±0.05
12.25±0.05
12.45±0.05
1.75±0.05
1.55±0.05
1.00±0.05
(15.65)
19.15±0.05
(30.15)
*Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Recommended metal mask pattern
Metal mask thickness: 120µm
Metal mask opening area ratio: 80%
Metal mask opening area ratio: 100%
Metal mask opening area ratio: 75%
Socket edge
(R)
(R)
9-1.0±0.03
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
29.95±0.05
1.60±0.031.60±0.03
1.31±0.03
(3.9)
6.27±0.05
5.88±0.05
1.75±0.03
1.55±0.03
26.40±0.05
14.30±0.05
5.50±0.05
4.20±0.05
0.82±0.03
1.28±0.03
0.35±0.03
0.82±0.03
0.35±0.03
1.2±0.03
3.30±0.03
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2R
10
4. On board mounting reverse type (Standoff 1.5mm)
Part No.
AXA2R63361∗-M
(With card jump-out prevention function)
AXA2R63321∗-M
(Without card jump-out prevention function)
Card center
8.10
9.40
18.20
19.15
17.50
2.50
9.375 0.625
1.40
(29.80)
28.40
14.65 13.50
28.15
17.50
(Contact pitch) 2.50±0.1 1.65±0.1
14.55 (0.625)
27.95
0.60 Te rminal coplanarity
(Signal/Detection contact)
SD memory card
0.10
2.70
0.70
1.20
1.70
5.30
(2.10)
(4.90)
*1.58 (Standoff dimensions)
Detailed internal view View of set card
Pin No.4
Pin No.3
Pin No.1
Pin No.9
Pin No.5
Pin No.7
Pin No.2
Pin No.8
Pin No.6
3
2
1
SD memory card
(24.00)
(0.80) (Push stroke)
(35.10) (Set condition)
(6.00) (Eject stroke)
Circuit schematic
No. 3
No. 2
No. 1
Recommended PC board pattern (TOP VIEW)
PC board both side
Substrate edge
Socket edge Through hole
0.60±0.05
0.40±0.05
14.55±0.05
1.60±0.05
1.60±0.05
1.40±0.05
5.30±0.05
3.30
(0.50)
0.60±0.05
0.40±0.05
12.45±0.05
1.00±0.05
1.10±0.05
0.50±0.05
0.50±0.05
1.10±0.05
1.20±0.05
1.55±0.05
12.25±0.05
1.60±0.05
8.10±0.05
9.40±0.05
18.20±0.05
30.30±0.05
19.15±0.05
17.50±0.05
0.625±0.05
2.50±0.05 (Pitch)
1.75±0.05
27.95±0.05
1.60±0.05
(R)
(R)
*Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Recommended metal mask pattern
Metal mask thickness: 120µm
Metal mask opening area ratio: 80%
Metal mask opening area ratio: 100%
Metal mask opening area ratio: 75%
Socket edge
(R)
(R)
9-1.0±0.03
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
29.95±0.05
1.60±0.031.60±0.03
1.31±0.03
(3.9)
6.27±0.05
5.88±0.05
1.75±0.03
1.55±0.03
26.40±0.05
14.30±0.05
5.50±0.05
4.20±0.05
0.82±0.03
1.28±0.03
0.35±0.03
0.82±0.03
0.35±0.03
1.2±0.03
3.30±0.03
Contact status of the card detection and write protect switches
Card attachment
condition
Write protect switch Card detection
switch
Write unable Write enable
Card not attached Open Open Open
Card attached Open Closed Closed
Te r minal number 1–21–3
www.honda-connectors.co.jp
AXA2S/AXA2R
11
EMBOSSED TAPE AND REEL (Unit: mm)
NOTES
• Tape dimensions
<S type> <R type>
(2.00)
(4.00)
1.55±0.05 dia.
Top cover
tape
Emboss
carrier tape
Pocket pitch=36.00
165° to 180°
44.00
40.40
20.20 (1.75)
Pull-out direction
Socket for SD memory card
(S type)
(2.00)
(4.00)
1.55±0.05 dia.
Top cover
tape
Emboss
carrier tape
Pocket pitch=36.00
165° to 180°
44.00
40.40
20.20
Socket for SD memory card (R type)
(1.75)
Pull-out direction
• Reel dimensions (Conforming to JIS C0806-1)
<S and R type>
Label
Emboss carrier tape
Taping reel
Top cover tape
Cavity
Tape
(44.4)
370 dia.
+2
0
1.Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Reflow soldering
• Screen-printing method is
recommended for cream solder printing.
• Use the recommended foot pattern for
cream solder printing (screen thickness:
0.12 mm).
• The metal mask opening ratio for the
Com contact (one) and No contacts (two)
must be 75%.
• When applying the different thickness of
a screen, please consult us.
• The following diagram shows the
recommended reflow soldering
temperature profile.
The recommended conditions for the
reflow temperature profile
• Measure the temperature at the
connector surface.
• If the reverse side of the board
undergoes reflow soldering after the
socket is reflow-soldered, fix the socket
with tape or adhesive; otherwise, the
socket may drop. The socket can
withstand two iterations of reflow
soldering.
2) Hand soldering
• Set the soldering tip to 300°C, and
solder for no more than 5 seconds.
• Be aware that for the 0 mm standoff
type, solder creeping at the retention
solder tab sections may occur if soldering
is conducted for long periods or if too
much solder is used.
4. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PC board and soldered terminals is
possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PC boards or
storing them in block assemblies, make
sure that undue weight is not exerted on
a stacked socket.
3) Be sure not to allow external pressure
to act on sockets when assembling PC
boards or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
3) Repeated bending of the terminals
may break them.
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
180 to 200°C
155 to 165°C
250°C max.
Within 30 sec.
www.honda-connectors.co.jp
AXA2S/AXA2R
12 Printed in JapanSpecifications are subject to change without notice.
Address : 6-18-12, Megurohoncho, Meguro-Ku, Tokyo 152-8520, Japan / Telephone : +81-3-3714-1166/1161 / Fax : +81-3-5721-7090
7. Card fitting
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket’s card.
Doing so will cause a decrease in
anchoring ability of the molded part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
5) Please include notes to the following
effect in your user manuals.
6) The card ejection protection lock does
not work for MMC.
7) The socket does not have a wrong
insertion protection structure for MMC.
Be careful about the insertion direction.
8) If an MMC is inserted, it is possible
that a short circuit between the socket’s
signal contacts No. 7 and 8 and the
MMC’s contact No. 7 may be caused.
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Card jump-out prevention function
1) This socket has a card jump-out
prevention function that works under
defined conditions. However, we strongly
recommend that you instruct users to
carefully handle the product to avoid
accidents due to improper use or product
liability risks.
2) The life of the card jump-out prevention
function is not guaranteed under the
following conditions: (1) while the card is
inserted incompletely, (2) while the card
is inserted in the wrong direction, and (3)
after the card is inserted in the wrong
direction
3) In order to prevent card jump-out,
resistance has been added that affects
card insertion and removal. Therefore,
you will feel resistance when inserting
and removing the card. This is normal.
10. Others
If you coat the PC board after soldering
for insulation and to prevent wear, make
sure that the coating does not adhere to
the connector.
