Data Brief
For further information contact your local STMicroelectronics sales office.
May 2007 Rev 1 1/8
8
Features
■100 Mbps (typ.) data rate when driven by a
totem pole driver
■4 Mbps (typ.) data rate when driven by a Open
Drain pole driver
■Bidirectional level translation, without
direction pin
■Wide VL voltage range of 1.65V to 3.6V
■Wide VCC voltage range of 1.80V to 5.5V
■Power down mode feature – when either
supply is off, all I/Os are in High Impedance.
■Low quiescent current (max 10µA)
■Suitable to be driven by Totem Pole and Open
Drain driver.
■5.5V tolerant enable pin
■ESD Performance on all Pins : ±2kv HBM
■Small package and footprint
QFN10 ( 1.8 x 1.4 mm ) package
Application
■Low voltage system level translation
■Mobile phone
■Other mobile devices
■I2C level translation
■UART level translation
Description
ST2329 is a level translator providing level shifting
necessary to allow data transfer in a multi-voltage
system. Externally applied voltages, VCC and VL,
set the logic levels on either side of the device. It
utilizes transmission gate based design that
allows bidirectional level translation without
control pin.
The ST2329 accepts VL from 1.65V to 3.6V and
VCC from 1.80V to 5.5V, making it ideal for data
transfer between low-voltage ASICs /PLD and
higher voltage system. This device has three-
state output mode that disables all I/Os.
ST2329 supports power-down mode at either of
its supply (VL or VCC) where it will disable all I/Os
when one of the supply is off. This feature will
protect the device from current backflow through
the device.
QFN10L (1.8mm x 1.4mm)
ST2329
2-bit dual supply level translator
without control pin
www.st.com
Table 1. Device summary
Part number Package Packaging
ST2329QTR QFN10L (1.8mm x 1.4mm) Tape and Reel (3000 parts per reel)
Package mechanical data ST2329
2/8
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
ST2329 Package mechanical data
3/8
Figure 1. Package dimension
Table 2. QFN10L(1.8x1.4) Mechical data
ref. mm inch
Nom Min Max Nom Min Max
A 0.50 0.45 0.55 0.020 0.017 0.021
A1 0.02 0 0.05 0.001 0 0.002
A3 0.127 0.005 0 0
b 0.20 0.15 0.25 0.007 0.006 0.010
D 1.80 1.70 1.90 0.070 0.066 0.074
E 1.40 1.30 1.50 0.055 0.051 0.059
e 0.40 0.015
L 0.40 0.30 0.50 0.015 0.011 0.020
Package mechanical data ST2329
4/8
Figure 2. QFN10L(1.8x1.4) Foot print recommendation
Figure 3. QFN10L(1.8x1.4) carrier type
ST2329 Package mechanical data
5/8
Figure 4. QFN10L(1.8x1.4) Reel information
Package mechanical data ST2329
6/8
Figure 5. QFN10L(1.8x1.4) Reel information
ST2329 Revision history
7/8
1 Revision history
Table 2. Revision history
Date Revision Changes
05-May-2007 1 First release
ST2329
8/8
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