ES2A
THRU
ES2M
2 Amp Super Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
Features
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Superfast Recovery Times For High Efficiency
Maximum Ratings
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV) 2.0A TJ= 75°C
Peak Forward Surge
Current
IFSM 50A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
VFIFM = 2.0A;
TJ = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR5µA
150µA
TJ = 25°C
TJ= 100°C
Typical Junction
Capacitance
CJ25pF Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
• Operating Temperature: -50°C to +150°C
• Storage Temperature: -50°C to +150°C
• Maximum Thermal Resistance; 20°C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
ES2M 1000V 700V 1000V
ES2A ES2A 50V 35V 50V
ES2B ES2B 100V 70V 100V
ES2C ES2C 150V 105V 150V
ES2D ES2D 200V 140V 200V
ES2G ES2G 400V 280V 400V
ES2J ES2J 600V 420V 600V
ES2K ES2K 800V 560V 800V
Maximum Reverse
Recovery Time
Trr IF=0.5A, IR=1.0A,
Irr=0.25A
ES2M
DO-214AC
(HSMA) (High Profile)
H
J
E
F
G
A
B
D
C
Cathode Band
0.070”
0.090”
0.085”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .078 .116 1.98 2.95
B .067 .089 1.70 2.25
C .002 .008 .05 .20
D --- .02 --- .51
E .035 .055 .89 1.40
F .065 .0961.65 2.45
G .205 .224 5.21 5.69
H .160 .180 4.06 4.57
J .100 .112 2.57 2.84
ES2A-D 50ns
ES2G-J 60ns
ES2K-M 100ns
ES2A-D .975V
ES2G-J 1.35V
ES2K-M 1.70V
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: 4 2006/05/18
TM
Micro Commercial Components
www.mccsemi.com
1 of 4
x Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
ES2A thru ES2M
Average Forward Rectified Current - Amperesversus
Ambient Temperature - °C
Figure 2
Forward Derating Curve
015025 50 75 100
0
.2
.4
.6
.8
1.0
1.2
1.4
Single Phase, Half Wave
60Hz Resistive or Inductive Load
Amps
°C
125
1.6
1.8
2.0
2.2
2.4
Instantaneous Forward Current - Amperes versus
Instantaneous Forward Voltage - Volts
Figure 1
Typical Forward Characteristics
4
6
20
10
Amps
.2 .4 .6 .8 1.0 1.2
.01
.02
.04
.06
.1
.2
.4
.6
1
2
25°C
Volts
Figure 3
Junction Capacitance
.1 .2 1.4 2 10 20 404 100 200
1
2
6
10
20
100
Junction Capacitance - pF versus
Reverse Voltage - Volts
pF
Volts
60
40
4
400 1000
TJ=25°C
MCC
Revision: 4 2006/05/18
TM
Micro Commercial Components
www.mccsemi.com
2 of 4
ES2A thru ES2M
Figure 5
New SMA Assembly
Round Lead
Process
trr
+0.5A
0
-0.25
-1.0
1cm
Set Time Base for 20/100ns/cm
25Vdc
1Ω
50Ω10Ω
Oscilloscope
Note 1
Pulse
Generator
Note 2
Notes:
1. Rise Time = 7ns max.
Input impedance = 1 megohm, 22pF
2. Rise Time = 10ns max.
Source impedance = 50 ohms
3. Resistors are non-inductive
Figure 6
Reverse Recovery Time Characteristic And Test Circuit Diagram
1 100
4
0
10
20
30
8
Figure 4
Peak Forward Surge Current
Peak Forward Surge Current - Amperes versus
Number Of Cycles At 60Hz - Cycles
Amps
Cycles
2610 20 60 80
40
40
50
MCC
Revision: 4 2006/05/18
TM
Micro Commercial Components
www.mccsemi.com
3 of 4
MCC
Revision: 4 2006/05/18
TM
Micro Commercial Components
www.mccsemi.com
4 of 4
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