TDA8172 TV VERTICAL DEFLECTION OUTPUT CIRCUIT .. . POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION DESCRIPTION The TDA8172 is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays. HEPTAWATT (Plastic Package) ORDER CODE : TDA8172 PIN CONNECTIONS (top view) 8172-01.EPS NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT 7 6 5 4 3 2 1 Tab connected to Pin 4 BLOCK DIAGRAM + VS 2 6 3 FLYBACK GENERATOR 1 POWER AMPLIFIER THERMAL P ROTECTION YOKE 5 7 TDA8172 8172-02.EPS 4 May 1996 1/5 TDA8172 ABSOLUTE MAXIMUM RATINGS Parameter Value Unit VS Supply Voltage (pin 2) 35 V V5 , V6 Flyback Peak Voltage 60 V V3 V1 , V7 Voltage at Pin 3 + Vs Amplifier Input Voltage + Vs - 0.5 V 2.5 A A Io Output Peak Current (non repetitive, t = 2 ms) Io Output Peak Current at f = 50 or 60 Hz, t 10 s 3 Io Output Peak Current at f = 50 or 60 Hz, t > 10 s 2 A I3 Pin 3 DC Current at V5 < V2 100 mA I3 Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly 1.5 ms 3 A Total Power Dissipation at Tcase = 90 C 20 W - 40, +150 C Ptot Tstg, Tj Storage and Junction Temperature 8172-01.TBL Symbol Symbol Rth (j-c) Parameter Thermal Resistance Junction-case Value Unit 3 C/W Max. 8172-02.TBL THERMAL DATA ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified) Parameter Test Conditions Typ. Max. Unit Fig. I2 Pin 2 Quiescent Current I3 = 0, I5 = 0 8 16 mA 1a I6 Pin 6 Quiescent Current I3 = 0, I5 = 0 16 36 mA 1a I1 Amplifier Input Bias Current V1 = 1 V, V7 = 2 V - 0.1 -1 A 1a V1 = 2 V, V7 = 1 V - 0.1 -1 A 1a V3L Pin 3 Saturation Voltage to GND I3 = 20 mA 1 1.5 V 1c V5 Quiescent Output Voltage Vs = 35V, Ra = 39 k 18 V 1d V5L Output Saturation Voltage to GND 1c V5H Output Saturation Voltage to Supply I5 = 1.2 A 1 1.4 V I5 = 0.7 A 0.7 1 V 1c - I5 = 1.2 A 1.6 2.2 V 1b 1.3 1.8 V 1b - I5 = 0.7 A Tj 2/5 Min. Junction Temperature for Thermal Shut Down 140 C 8172-03.TBL Symbol TDA8172 Figure 1 : DC Test Circuits. Figure 1 a : Measurement of I1 ; I2 ; I6 Figure 1 b : Measurement of V5H VS I2 VS I6 2 2 6 6 V5H 5 10k S1 1 5 1V a 1 b 4 1V I5 V7 8172-03.EPS V7 4 7 I1 8172-04.EPS 7 S1 : (a) I2 and I6 ; (b) I1 Figure 1 c : Measurement of V3L ; V5L Figure 1 d : Measurement of V5 VS VS 2 I 3 or I 5 2 6 S1 6 12k 1 a 3 b 5 2V 1 4 7 3V V5 V7 5 Ra 4 V 3L V 5L 5.6k 8172-06.EPS V7 8172-05.EPS 7 S1 : (a) V3L ; (b) V5L 3/5 TDA8172 Figure 2 : AC Test Circuit 1N4001 VS C1 0.1 F C2 470F 2 6 3 TDA8172 5 10k R7 1.5 4 RT1 4.7k R3 IN 12k R2 5.6k to C4 0.22F 1 to V7 Iy R1 Vi t fly 7 VREF GND C3 220F D1 Ly 24.6mH R6 330 Ry 9.6 R4 C6 4.7 F 8.2k C5 2200F *Re comme nde d for VREF filtering to 8172-07.EPS R 5 Iy R5 8.2 MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin 4 which is ground. 8172-08.EPS - 8172-09.EPS Figure 3 : Mounting Examples 4/5 TDA8172 PM-HEPTV.EPS PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min. Millimeters Typ. 2.4 1.2 0.35 0.6 2.41 4.91 7.49 2.54 5.08 7.62 10.05 Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4 Min. 0.094 0.047 0.014 0.024 0.095 0.193 0.295 Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 0.668 0.587 0.848 0.891 3 15.8 6.6 0.102 0.594 0.236 2.8 5.08 3.65 0.100 0.200 0.300 0.396 16.97 14.92 21.54 22.62 2.6 15.1 6 Inches Typ. 0.118 0.622 0.260 0.110 0.200 3.85 0.144 HEPTV.TBL Dimensions 0.152 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5