TDA8172
TV VERTICALDEFLECTION OUTPUT CIRCUIT
May 1996
HEPTAWATT
(Plastic Package)
ORDER CODE : TDA8172
YOKE
POWER
AMPLIFIER
4
5
7THERMAL
PROTECTION
1
236
FLYBACK
GENERATOR
TDA8172
+V
S
8172-02.EPS
BLOCK DIAGRAM
.POWERAMPLIFIER
.FLYBACKGENERATOR
.THERMAL PROTECTION
7
6
5
4
3
2
1
Tab connected to Pin 4
OUTPUT STAGESUPPLY
OUTPUT
GROUND
FLYBACK GENERATOR
SUPPLY VOLTAGE
INVERTING INPUT
NON-INVERTING INPUT
8172-01.EPS
PIN CONNECTIONS (top view)
DESCRIPTION
The TDA8172 is a monolithic integrated circuit in
HEPTAWATTTM package. It is a high efficiency
power boosterfordirectdriving ofverticalwindings
of TV yokes. It is intendedfor use in Color and B &
W television as well as in monitorsand displays.
1/5
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VSSupply Voltage (pin 2) 35 V
V5,V
6Flyback Peak Voltage 60 V
V3Voltage at Pin3 + Vs
V1,V
7Amplifier InputVoltage + Vs
– 0.5 V
IoOutput Peak Current (non repetitive, t = 2 ms) 2.5 A
IoOutput Peak Current at f = 50 or 60 Hz, t ≤10 µs3A
I
o
Output Peak Current at f = 50 or 60 Hz, t > 10 µs2A
I
3
Pin 3 DC Current at V5<V
2100 mA
I3Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly ≤1.5 ms 3 A
Ptot Total Power Dissipation at Tcase =90°C20W
T
stg,T
jStorage and Junction Temperature – 40, +150 °C
8172-01.TBL
THERMAL DATA
Symbol Parameter Value Unit
Rth (j–c) Thermal Resistance Junction-case Max. 3 °C/W
8172-02.TBL
ELECTRICAL CHARACTERISTICS
(refer to the testcircuits, VS=35V, Tamb =25o
C unlessotherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I2Pin 2 Quiescent Current I3=0,I
5=0 8 16 mA 1a
I
6Pin 6 Quiescent Current I3=0,I
5= 0 16 36 mA 1a
I1Amplifier Input Bias Current V1= 1 V, V7= 2 V – 0.1 – 1 µA1a
V
1
= 2 V, V7= 1 V – 0.1 – 1 µA1a
V
3L Pin 3 Saturation Voltage to GND I3= 20 mA 1 1.5 V 1c
V5Quiescent Output Voltage Vs= 35V, Ra=39kΩ18 V 1d
V5L Output Saturation Voltage to GND I5= 1.2 A 1 1.4 V 1c
I5= 0.7 A 0.7 1 V 1c
V5H Output Saturation Voltage to Supply – I5= 1.2A 1.6 2.2 V 1b
–I
5= 0.7A 1.3 1.8 V 1b
TjJunction Temperature for Thermal Shut Down 140 °C
8172-03.TBL
TDA8172
2/5
1
2
4
5
6
7
VS
V71V
10kΩ
S1 a
b
I2I6
I1
8172-03.EPS
S1:(a) I2and I6; (b) I1
Figure 1 a : Measurementof I1;I
2;I
6
1
2
4
5
6
7
V
S
V
7I
5
1V
V5H
8172-04.EPS
Figure 1 b : Measurement of V5H
1
2
3
45
6
7
VS
V7
3V
V3L V5L
S1
a
b
I3I5
or
8172-05.EPS
S1:(a) V3L ; (b) V5L
Figure 1 c : Measurementof V3L ;V
5L
1
2
4
5
6
7
VS
V7
V5
2V
5.6kΩ
12kΩ
Ra
8172-06.EPS
Figure 1 d : Measurement of V5
Figure 1 : DCTestCircuits.
TDA8172
3/5
1
4
5
1N4001
C1 C2 D1 C3
220µF470µF0.1µF
632
7
R1
RT1
10kΩ
4.7kΩ
VS
C4
0.22µF
R7
1.5Ω
C6
4.7µF
R3 R4
R2
5.6kΩ
12kΩ8.2kΩC5
R5
R6
Ly
Iy
24.6mH
Ry
2200µF
330Ω
9.6Ω
R5 Iy
to
Vi
to
GND
IN
to
tfly
7
V
*REF
Re commended for V filtering
VREF
8.2Ω
TDA8172
8172-07.EPS
Figure 2 : ACTest Circuit
8172-08.EPS - 8172-09.EPS
Figure 3 : MountingExamples
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an externalheatsink.
Thanks to the HEPTAWATTTM package attaching
the heatsinkis very simple, a screw or a compres-
sion spring (clip) being sufficient.
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is con-
nected to Pin 4 which is ground.
TDA8172
4/5
Information furnishedis believed to be accurateand reliable. However, SGS-THOMSON Microelectronicsassumes no responsibility
for the consequences of use of such information nor for anyinfringement of patents or otherrights of third partieswhich may result
from its use. No licence is granted byimplication or otherwise under any patent or patentrights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conformsto
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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PM-HEPTV.EPS
PACKAGE MECHANICAL DATA : 9 PINS- PLASTIC HEPTAWATT
Dimensions Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 08 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.97 0.668
L1 14.92 0.587
L2 21.54 0.848
L3 22.62 0.891
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 2.8 0.110
M1 5.08 0.200
Dia. 3.65 3.85 0.144 0.152
HEPTV.TBL
TDA8172
5/5
