Javascript must be enabled to view full functionality of our site. ACCOUNT MCIMX250DJM4A Environmental Information CART Package : LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array 400 balls 0.8 mm pitch 17 mm x 17 mm x 1.18 mm body i.MX25 32-bit MPU, ARM926EJ-S core, 400MHz, MAPBGA 400 Buy Options ENGLISH Quality Information Shipping Information Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) MCIMX250DJM4A ( 935319662557 ) Yes Yes Yes D e1 REACH SVHC 838.7 MCIMX250DJM4AR2 ( 935319662518 ) Yes Yes Yes D e1 REACH SVHC 838.7 Quality Information Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering MCIMX250DJM4A ( 935319662557 ) No 3 260 40 MCIMX250DJM4AR2 ( 935319662518 ) No 3 260 40 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) CCATS MCIMX250DJM4A ( 935319662557 ) 854231 5A992 G168372 MCIMX250DJM4AR2 ( 935319662518 ) 854231 5A992 G168372 ABOUT NXP RESOURCES FOLLOW US News 26 Feb 2019 Investors Mobile Apps Press, News, Blogs Contact Us NXP Announces K32 Energy-efficient Microcontroller Series for Advanced Security and Physical Protection Careers Privacy | Terms of Use | Terms of Sale | Feedback Read More (c)2006-2019 NXP Semiconductors. All rights reserved.