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Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table 1.
Test Name
Stress Test
Conditions
Total
Device Hrs.
Units
Tested
Total
Failed
Point Typical Performance
MTBF
Failure Rate
(% /1K Hours)
High Temperature
Operating Life
VCC = 5.5 V,
VA = VB = 3.5 V
TA = 100°C
1000 hours
1,405,000 1,405 2 702,500 0.142
Temperature
Humidity
Operating Life
VCC = 5.5 V
VA = VB = 3.5 V
1,000 hours
TA = 85°C
RH = 85%
1,495,000 1,495 10 149,500 0.669
Table 1. Life Tests
Demonstrated Performance
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
TJ (°C) = TA (°C) + θJA PAVG
where
TA = ambient temperature in °C
θJA = thermal resistance of
junction-to-ambient in °C/watt
PAVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-217).
HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
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Table 2.
Ambient
Temperature (°C)
Junction
Temperature (°C)
Point Typical Performance [1]
in Time
Performance in Time [2]
(90% Condence)
MTBF [1]
Failure Rate
(%/1K Hours) MTBF [2]
Failure Rate
(%/1K Hours)
+100 +110 703,000 0.142 264,000 0.379
+90 +100 996,000 0.100 374,000 0.267
+80 +90 1,440,000 0.069 541,000 0.185
+70 +80 2,126,000 0.047 799,000 0.125
+60 +70 3,210,000 0.031 1,206,000 0.083
+50 +60 4,968,000 0.020 1,867,000 0.054
+40 +50 7,901,000 0.013 2,969,000 0.034
+30 +40 12,942,000 0.008 4,863,000 0.021
+20 +30 21,903,000 0.005 8,230,000 0.012
Notes:
1. The point typical MTBF (which represents 60% condence level) is the total device hours divided by the number of failures. In the case of zero
failures, one failure is assumed for this calculation.
2. The 90% Condence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This condence
interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is
commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures
are failures to meet an electrical characteristic as specied in product catalog such as output voltage, duty or state errors.
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is:
(8 hours/day) x (5 days/week) / (168 hours/week) = 0.25
The point failure rate per year (8760 hours) at 50°C ambient temperature is:
(0.020% / 1K hours) x 0.25 x (8760 hours/year) = 0.044% per year
Similarly, 90% condence level failure rate per year at 50°C:
(0.054% / 1K hours) x 0.25 x (8760 hours/year) = 0.118% per year
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Test Name
MIL-STD-883C
Reference Test Conditions
Units
Tested
Units
Failed
ESD - Human Body Model 3015.2 1.5 KΩ, 100 pF, 5 positive and 5 negative dis-
charges per pin. VZ = 3.0 KV
35 0
Table 3. Environmental Tests
Table 4. Mechanical Tests
Table 5. Electrical Tests
Test Name
MIL-STD-883C
Reference Test Conditions
Units
Tested
Units
Failed
Temperature Cycle 1010 -40°C to +100°C, 15 minute dwell,
5 minute transfer,
5 cycles
200 cycles
500 cycles
9,512
1,570
1,570
0
3
9
Solder Heat Resistance 2003 Sn/Pb 60/40 Solder; 260°C peak;
10 sec., 20 temp cycles @ -40°C to 85°C
38 0
High Temperature N/A TA = +105°C 77 0
Storage Life 2,000 hours
Test Name
MIL-STD-883C
Reference Test Conditions
Units
Tested
Units
Failed
Mechanical Shock 2002 5 blows; X, Y, Z axes, 1500 g, 0.5 msec. 5 0
Vibration Variable Frequency 2007 3 cycles, 4 min. each X, Y, Z axes, 20 g min.
20 to 2000 Hz
5 to 1000 Hz
26
10
0
0
Terminal Strength 2004 Condition A 1 lb. for 30 seconds 15 0
Lead Fatigue 2004, Cond. B 3 bends, 15° minimum 15 0
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Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5965-2775E
5965-9642E - December 11, 2006