Crystal unit Epson Toyocom MHz RANGE CRYSTAL UNIT MINIATURE SIZE LOW PROFILE SMD FA - 238V / FA - 238 TSX - 3225 *Frequency range *Thickness *Overtone order *Applications : 12 MHz to 54 MHz : 0.6 mm Max.(TSX-3225) : Fundamental : Mobile phone, Bluetooth, W-LAN : ISM band radio, Clock for MPU Actual size FA-238V/ FA-238 TSX-3225 Specifications (characteristics) Item For Clock FA-238V FA-238 Symbol Nominal frequency range f Temperature Storage temperature Range Operating temperature Level of drive T_stg T_use DL Frequency tolerance f_tol Frequency versus temperature characteristics 12.000 MHz to 15.999 MHz 30 x 10-6/-20 C to +70 C 7 pF to (Standard:10 pF) As per below table 5 x 10-6 / year Max. CL Motional resistance (ESR) Frequency aging 16.000 MHz to 50.000 MHz -40 C to +125 C -40 C to +85 C 10 W to 100 W 50 x 10-6 (standard), (15 x 10-6 to 50 x 10-6 is available) f_tem Load capacitance For RF Reference TSX-3225 R1 f_age Remarks Fundamental *1 For the out of standard specifications, please contact us for inquiries. Store as bare product after unpacking Specified equivalent series must be satisfied 12.000 MHz to 54.000 MHz -40 C to +85 C -20 C to +75 C 100 W Max. +25 C For the out of standard specifications, please contact us for inquiries. *1 For the out of standard specifications, please -6 10 x 10 /-20 C to +75 C contact us for inquiries. *1 9 pF to For the out of standard specifications, please (Standard: 9 pF, 12 pF, 16 pF, ) contact us for inquiries. As per below table -40 C to +85 C, DL = 100 W -6 1 x 10 / year Max.*2 +25 C, First year -6 10 x 10 *1 FA-238: For over 40 MHz, only the standard specification applies. -6 *2 40 MHz f : 2 x 10 / year Max. Motional resistance (ESR) (FA-238V / FA-238) Frequency 12.0 MHz f 13.0 MHz 13.0 MHz < f < 20.0 MHz 20.0 MHz f < 25.0 MHz 25.0 MHz f < 30.0 MHz 30.0 MHz f 50.0 MHz Motional resistance 100 Max. 80 Max. 60 Max. 50 Max. 40 Max. (TSX-3225) Frequency 12.0 MHz f < 16.0 MHz 16.0 MHz f < 21.0 MHz 21.0 MHz f 54.0 MHz Motional resistance 100 Max. 60 Max. 40 Max. External dimensions #1 #2 0.7 Max. #1 #1 0.9 0.7 #2 #2 C 0.3 Min. 0.8 #4 #3 0.9 #4 #3 1.0 #3 Footprint (Recommended) FA-238V (Unit:mm) 2.4 FA-238 1.9 TSX-3225 2.2 1.6 2.2 1.6 1.2 1.4 #2 1.0 0.7 0.85 #1 0.6 Max. 0.7 Max. #2 #1 #3 #2 and #4 are connected to the cover. (Please connect to ground) #2 3.20.15 1.2 1.3 #4 #1 #2 3.20.1 #4 0.7 3.20.1 Marking 0.8 #1 Internal connection (TOP VIEW) #3 #4 2000M E66RA 2.50.1 1200M E66RA TSX-3225 #3 #4 2.50.15 FA-238 #3 #4 2.50.1 FA-238V (Unit:mm) 1.2 1.4 http://www.epsontoyocom.co.jp 1.15 1.4 15 Product Configuration System MHz Range Crystal Units FA-238V 13.94446M FA-238V: 12.0000 ~ 15.9999MHz FA-238: 16.0000 ~ 50.0000MHz High Stability Ceramic SMD FA-238 / FA-238V - Freq. Temp Char./Op Temp Range Frequency: Crystal Package Type: 50X A AC Load Capacitance: Tape & Reel Qty Blank: +/-30ppm / -20C to +70C A: 12.5pF Blank: Bulk 10V: +/-10ppm / -20C to +70C AC: 9.0pF 3: 250pcs/reel 20V: +/-20ppm / -20C to +70C C: 18pF 0: 1000pcs/reel 23X: +/-23ppm / -40 to +85C K: 10.0pF 5: 3000pcs/reel 50X: +/-50ppm / -40C to +85C W: 12.0pF Freq. Tolerance@25C F: +/-10ppm A: +/-20ppm B: +/-50ppm (standard) NOTE: Please contact your EEA representative for other available frequencies or specifications. 3.2 X 2.5 X 0.7 mm July 2008 Application guide Epson Toyocom HANDLING PRECAUTIONS When using Epson Toyocom products,it is essential to observe the operating conditions specified in their respective specifications or catalogs. Common points for all products 1. Shock resistance Epson Toyocom's crystal products are designed to resist physical shocks, but crystal products may be damaged under some conditions, such as dropping from desks or receiving shocks during mounting. Please be sure to re-check the characteristics if product has received any shocks. 2. Soldering heat resistance Epson Toyocom's crystal products except SMD products use solder having a +180C to +200C melting point. Heating up the package more than +150C may deteriorate the characteristics or damage the products. If the crystal products need to be soldered at temperature of more than +150C,SMD products are recommended. Using higher temperatures over the following reflow conditions to crystal products, even SMD products, may cause the characteristics to deteriorate. The reflow conditions within following profile is recommended. Always check the soldering temperature and time before mounting these products. Also, please check them again when the mounting conditions are changed. Please contact us for inquiries about heat-resistance if crystal products need to be soldered over the following profile. (1) Cylinder products and DIP products Model Soldering conditions +280 C or under @ Max. 5 s. Do not heat the package at more than +150 C. [ Cylinder ] C-TYPE, C-2-TYPE, C-4-TYPE,HTS-206 [ Cylinder ] [ DIP ] CA-301 SG-51 / 531, SG-8002DB / DC,SG-8003DC RTC-62421 / 72421 / 7301DG +260 C or under @ Max.10 s. Do not heat the package at more than +150 C. [ DIP ] TCO-6831 / TCO-676 / TCO-679 TCO-6920A / OX-6601DL Temperature in point of soldering iron +370 C or under @ Max.5 s. (Each terminal) Do not heat the package at more than +150 C. (2) SMD products Reflow profile (example) The availability of the heat resistance for reflow conditions of JEDEC-STD-020D is judged individually. Please inquire it. Twice reflows Temperature (C) Type:E +260 C Max. Tc= +260 C Max. Type:JEDEC Tc-5 C +250 C +200 C +150 C +260 C Max. Type:T +1 C/s to +5C/s +170 C +220 C +1 C/s to +5 C/s 100 s +1 C/s to +5 C/s +150 C 35 s +217 C +3 C/s Max. +200 C +220 C Stable melting area +180 C 60 s 120 s Stable melting area Pre-heating area Pre-heating area 30 s +6 C/s Max. +150 C 60 s ~120 s Pre-heating area 35 s ~ 150 s Min. Stable melting area Time(s) Please make temperature rate as gentle a curve as possible. Also, if the package is cellular, the possibility of cracking is inevitable, so please store it for a short duration and take measures to protect product from dampness when you store it in high humidity. Model Type.E Type:T Type:JEDEC Remarks ! FC-12M - Please contact us kHz Range ! FC-125 - - Crystal unit MHz Range Crystal unit SAW Resonator FC-13E FC-13F FC-135 FC-145 FC-255 MC-146 MC-156 MC-306 MC-30A MC-405/406 FA-128 FA-20H FA-23A FA-238V FA-238 TSX-3225 TSX-4025 TSX-5032 FA-365 MA-306 MA-406 MA-505/506 FH-33H NS-21R NS-32R FS-335 FS-555 FS-585 ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! - - - ! ! ! ! - - ! ! ! ! - - - - - - - - - - ! ! - - - ! ! ! - - - - ! - - - - - http://www.epsontoyocom.co.jp - Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us ! ! ! ! ! ! ! ! ! ! ! ! Please contact us ! ! ! ! ! ! Please contact us Please contact us Tc=+250 C Tc=+250 C Application guide Epson Toyocom Model SPXO Programmable Spread Spectrum SAW High-Stability Multi-Output VCXO TCXO OCXO Sensor SG-3030 series SG-3040 series SG-150S*E SG-211S*E SG-210 series SG-310 series SG-550 series TCO-710x series SG-710 series SG-770 series TCO-708x series SG-645 series SG-636 series SG-615 series SG-8003BA SG-8003CE SG-8003LB SG-8003CA SG-8003JF SG-8003JC SG-8003JA SG-8002CE SG-8002LB SG-8002JF SG-8002CA SG-8002JC SG-8002JA SG-9001LB SG-9001CA SG-9001JC XG-1000CA XG-1000CB EG-2021CA series EG-2001CA series EG-2002CA series EG-2121CA series EG-2102CA series EG-2101CA series HG-2150CA series HG-8002JA series TCO-391J TCO-3100 series MG-5020JE VG-4231CE VG-4231CB VG-4531CB VG-4231CA VG-4501CA VG-4502CA VG-4511CA VG-1201CA TCO-291J TCO-294J TCO-2152 TCO-2000 series TCO-2100 series TG-3530SA TG-5021BA TG-5005CG TG-5010CG TG-5005CE TG-5010LH TCO-5860 series TCO-5060/5160 series OX-6501GG series XV-8000LK XV-3500CB XV-8000CB XV-8100CB Type.E Type:T Type:JEDEC ! ! - - ! ! ! - ! - - ! ! ! - - - - - - - ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! - - ! ! - - ! - - - ! - - - - - ! ! - - - ! - - - ! ! ! ! - - - - - - - ! - - ! - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ! ! - - - - - - - - - ! ! ! ! ! - ! ! ! ! - ! ! - - - - - Please contact us Please contact us ! ! ! ! ! ! ! ! ! http://www.epsontoyocom.co.jp Remarks - Please contact us ! ! ! ! ! ! ! ! ! ! Tc=+250 C Tc=+245 C Tc=+250 C Tc=+245 C - ! Please contact us ! ! ! Please contact us ! ! ! ! ! ! ! ! ! ! ! ! Please contact us ! ! ! ! ! ! ! ! ! ! ! ! ! Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us ! ! ! ! ! Tc=+250 C Tc=+245 C Tc=+250 C Tc=+245 C Tc=+245 C Tc=+245 C Tc=+245 C Tc=+245 C Tc=+245 C Tc=+250 C Tc=+245 C Tc=+250 C Application guide Epson Toyocom Model Real Time Clock Module Filter RX-4045SA RX-4045NB RX-4581NB RTC-9701JE RTC-4701JE RTC-4574SA RTC-4574JE RTC-4574NB RX-4574LC RA-4574SA RTC-4543SA RTC-4543SB RX-4575LC RX-4571LC RX-4571NB RX-4571SA RA-4565SA RX-4801SA RX-8025SA RX-8025NB RTC-8564JE RTC-8564NB RX-8564LC RA-8565SA RX-8571LC RX-8571NB RX-8571SA RX-8581SA RX-8581JE RA-8581SA RX-8731LC RX-8801SA RTC-7301SF RTC-62423 RTC-72423 HF-232A/233A HF-362A/363A HF-372A/373A HF-734 HF-J14A HF-S14A MF-372A/373A MF-722A/723A MF-734A TF-330A/C FF-32N FF-555/FF-585 TQS-557AA-7R TQS-949AD-7G TQS-471BB-7R TQS-477AA-7R TQS-472BA-7R Type.E Type:T Type:JEDEC ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! - - - - - - - - - - ! ! - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ! ! ! ! ! ! ! ! ! - - - ! ! ! ! ! Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us Please contact us ! ! ! ! ! ! ! ! ! ! Please contact us Please contact us ! ! ! ! ! Remarks Tc=+250 C Tc=+250 C Tc=+250 C Tc=+250 C Tc=+250 Tc=+250 Tc=+250 Tc=+250 C C C C Tc=+250 C Tc=+250 C Tc=+250 C Tc=+250 C Tc=+250 C Tc=+245 C Tc=+245 C Tc=+245 C Tc=+245 C 3. Mounting precautions Shocks by auto mounting Shocks caused by auto mounting and vacuuming may deteriorate the characteristics and affect the products. Please set the mounting conditions to minimize the shocks as much as possible, and be sure that there is no affect on the characteristics before mounting. Please review the conditions after the conditions are changed. Also please be sure that crystal products don't hit machines or other electric boards, etc. before or after mounting. (1) a) Ceramic package products and SON products Bending the board after soldering ceramic package products and SON products (MC-146,RTC-****NB,RX-****NB) may cause peeling off portions of soldering or package cracks by mechanical stress. Particularly, in the case of cutting boards after soldering these products, please be sure to layout the crystal on a less stressed location and use less stressed cutting method. b) Ceramic package products In the case of soldering ceramic package products on a different expansion-coefficient board (ex. Epoxy Glass),soldering crack at the foot pattern would be expected under repeated temperature changes for a long period. Under these conditions, be sure to check the solderability in advance. http://www.epsontoyocom.co.jp Application guide Epson Toyocom (2)Cylinder products Bending the lead on the glass or pulling the lead strongly may cause cracking of the hermetic seal glass at the root of the lead and may cause the airtightness and the characteristics to deteriorate. When the lead of crystal products need to be bent as in the figure below, leave more than 0.5 mm of lead from the case and hold the lead to prevent the lead from cracks. When the lead needs to be repaired, do not pull it, and hold the bent part to correct it. Giving undue pressure on this portion of hermetic seal may cause the airtightness to deteriorate. Please avoid applying pressure. Gluing the case of products on the electric board is recommended to prevent the airtightness from deteriorating. Installation example More than 0.5 mm Direct soldering to the case may deteriorate the characteristics. Printed circuit board solder (3)DIP products Deformed leads cannot be inserted into board holes. Avoid applying stress sufficient to deform leads. (4)SOJ Products and SOP products Please avoid applying stress sufficient to deform the leads. Deformed leads may cause incorrect soldering. Particularly SOP products need to be handled with the greatest care. 4. Ultrasonic cleaning *Products using AT-cut crystal and SAW resonator/filter can be cleaned by ultrasonic methods. But under some conditions, the crystal characteristics may be affected and internal wiring may be damaged. Please be sure to check the suitability of your system in advance. *Products using tuning-fork crystals and gyro sensors cannot be guaranteed if cleaned using ultrasonic methods, because crystal may be destroyed. *Do not wash open-type products. *With washable products, avoid the use of cleaners or solvents that may negatively affect the product. 5. The affect of mechanical vibration While there is any given shock or mechanical vibration periodically to crystal products, such as, a piezo sounder, a piezo buzzer, and speaker, to crystal products, output frequency and amplitude can be changed. Especially the quality of telecommunication equipment could be affected by this phenomenon. Although Epson Toyocom's crystal products are designed to minimize the effect of mechanical vibration, Epson Toyocom recommends to check them in advance and then follow the Mounting guidelines as below. Mounting guidelines (1) Ideally, the mechanical buzzer source should be mounted on a separate PCB from the crystal device. (2) It is advisable to use cushion or cutting PCB, if you mount on same PCB. (3) Traveling mechanical vibration differs when applied to the PCB only vs. inside the body. Last of all, it is advisable to conform to inside body characteristics. 6. Storage (1) Storing the crystal products under higher or lower temperature or high humidity for a long period may affect frequency stability or solderability. Please store the crystal products at the normal temperature and humidity, avoid storing them for a long period and mount them as soon as possible after unpacking. Normal temperature and humidity: Temp,+15 C to+35 C, humidity 25 % RH to 85 % RH(refer to the standard conditions of test site JIS Z-8703) (2) Please carefully handle the inner and outer boxes and reel. External pressure may cause deformation of reel and tape. 7.Radiation Exposure to radiation can cause deterioration in performance, so avoid irradiation. 8.Chemicals / pH Do not use or store the product in a pH range that may cause corrosion or dissolution of the materials or packaging. 9.Adhesive Do not use an adhesive that may cause corrosion of the packing materials, terminals, components, glass materials, and vapor deposited materials used in the products. (For example, a chlorine-based adhesive may corrode the metal parts "lid" of a crystal unit to diminish the hermetic qualities, lowering the performance.) 10.Halogen Compound Do not use products in halogen gas. Even a slight amount of halogen gas, such as that found in chlorine gas in the air or in metal parts used in the package, may corrode. Also, do not use any resin that emits halogen gas. http://www.epsontoyocom.co.jp Application guide Epson Toyocom Crystal unit / Resonator 1. Drive level Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Circuit design must be such as to maintain a proper drive level.(refer to page "Drive level") 2. Negative resistance Unless adequate negative resistance is allocated in the oscillation circuit, oscillation or oscillation start up time may increase (refer to page "Allowance for Oscillation".) 3. Load capacitance Differences in the load capacitance in the oscillation circuit may result in deviations in the oscillation frequency from the desired frequency. Attempting to tune by force may merely cause abnormal oscillation. Before use, please specify the load capacitance of the oscillation circuit.(refer to page "Load capacitance" ) Crystal Oscillator and real time clock module All crystal oscillators and real time clock modules are provided with a CMOS IC. Please pay attention to the following points. 1. Static electricity Although an anti-static-electricity protection circuit is provided in the circuit, excessive levels of static electricity may damage the IC. Choose conductive materials for containers and packing material. Use a soldering gun and a measuring circuit free from high-voltage leakage and provide grounding connection when working with them. 2. Noise Applying excessive level of extraneous noise to power source or input terminal may cause latch up or spurious phenomenon, which results in malfunction and breakdown. To maintain stable operation, provide by-pass capacitor with more than 0.1 F at a location as near as possible to the power source terminal of the crystal products (between VCC - GND). Do not permit any objects which emit a high level of noise in a location near the crystal oscillator. 3. Power supply line Line impedance of a power supply should be as low as possible. 4. Output Load It is recommended that output load is installed as close as possible to an oscillator (within 20 mm). 5. Treatment of unused input terminals Unused pins that are left open may collect noise, thereby resulting in malfunction. Also, power consumption may increase when both P-channel and N-channel are turned on, therefore connect unused input terminals to VCC or GND. 6. Heat impact Repeated large changes in temperature may degrade the characteristics of a deteriorated crystal unit and cause breakage of wires inside the plastic mold. This must be avoided. 7. Mounting direction Incorrect mounting of the oscillator may cause malfunction and breakdown, so please check the mounting direction when installing. 8. Power on It is not recommended to power on from intermediate electric potential and / or extreme fast power on. Powering on under such conditions may cause no oscillation and / or malfunction. Optical device 1.Chemicals Do not use chemicals that may negatively affect the glass materials,vapor deposited materials,or adhesives used in the product. http://www.epsontoyocom.co.jp Application guide Epson Toyocom PRECAUTIONS IN DESIGNING OSCILLATION CIRCUITS 1. Drive level Drive level denotes electric power required to oscillate a crystal unit, which can be calculated using the following formula. Drive level ( P ) = i2 * Re Where i stands for current to pass in the crystal unit, Re for effective resistance of crystal unit, and Re=R1 (1+Co/CL )2 . If the Drive level (P) exceeds the specified level, oscillation frequency will shift. This occurs because an excessive level of power causes stress for the crystal and, consequently, temperature rises. If excessive drive level of power is applied to the crystal unit, this may deteriorate or damage the characteristics. Equivalent circuit of crystal unit Oscillation circuit Rf L1 C1 R1 i RD X'tal C0 CG CD 2. Allowance for oscillation Unless adequate negative resistance is allocated in the oscillation circuit, oscillation start-up time may be increased, oscillation may occur. In order to avoid this, provide enough negative resistance in the circuitry design. Crystal unit and Oscillator or No Check of Negative resistance Rf Oscillator Crystal unit 1. Connect the resistance (r) to the circuit in series with the crystal unit. CL L 2. Adjust (r) so that oscillation can start (or stop). RD r CI(Re) 3. Measure (r) when oscillation just starts (or stops) in (2) above. 4. Recommended (r) -R X'tal CG (r) > CI x(5 to 10) CD 3. Load capacitance Differences in the load capacitance of the oscillation circuit may result in a different oscillation frequency from the desired one, as shown in the figure below. Approximate expression of the load capacitance of the circuit CL CG x CD / (CG +CD)+CS. Where CS Stands for stray Capacity of the circuit. Frequency and load capacitance characteristics Reference for setting parameters of oscillation circuit Rf Frequency f_tol (1x10-6 ) 100 Symbol Rf (M) RD (k) CG (pF) CD (pF) Frequency range 50 RD 0 CG 5 10 Load capacitance (pF) 15 20 500 10 10 60 kHz to 165 kHz 10 300 10 10 515 515 1 0.5 510 510 5.5 MHz to 30 MHz (Fundamental) X'tal -50 20 kHz to 60 kHz CD 30 MHz50 MHz (Fundamental) IC: equivalent to TC74HCU04 (Unbuffer) IC: equivalent to TC74VHCU04 (Unbuffer) (30 MHz to 50 MHz) (TC74HCU04 and TC74VHCU04 are product number of Toshiba Corp.) http://www.epsontoyocom.co.jp Application guide Epson Toyocom WORKING FOR EU RoHS / Pb FREE EU RoHS / Pb Free Products of Epson Toyocom Epson Toyocom's standard product offering is compliant with EU RoHS directives. We provide the following two EU RoHS directive compliances. The appropriate symbol is displayed on individual product pages as applicable. Pb free. Complies with EU RoHS directive. Pb free terminal designed. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.) Complies with EU RoHS directive. DISTINCTIONS Distinctions between the products with Pb plating terminals and the products that comply with EU RoHS directives. *Plastic packaged type products. Marking (year part lot No.) will be changed as follows. Products with Pb plating terminals (Terminal Plating ; Sn-Pb) Products Complied with EU RoHS directive (Terminal Plating ; Sn-Bi or Sn-Ag) Products Complied with EU RoHS directive (Terminal Plating ; Sn) Numeric 1 2 3 4 5 6 7 8 9 0 Alphabet A B C D E F G H J K Alphabet M N R S T U V W X Z *Cylinder type products The color of glass plug will be changed as follows. Terminal Pb Plating products Complies with EU RoHS directive products Blue or Green etc Gray or White Temrminal materials of Epson Toyocom products that comply with EU RoHS directive We will deliver products that comply with EU RoHS directives for new orders. Sn plating of terminals is our standard for the products that offer two types of plating. Model kHz range Crystal units MHz range Crystal units Resonator C-001R C-002RX / C-2-TYPE C-004R/C-4-TYPE C-005R FC-12M FC-125 FC-13E FC-13F FC-135 FC-145 FC-255 MC-146 MC-156 MC-306/MC-30A MC-405/MC-406 CA-301 FA-128 FA-20H FA-23A FA-238V FA-238 TSX-3225 TSX-4025 TSX-5032 FA-365 MA-306 MA-406 MA-505/MA-506 FH-33H NS-21R NS-32R FS-335 FS-555 FS-585 Terminal Material Terminal Plating Fe-Ni-Co Fe-Ni-Co Fe-Ni-Co Fe-Ni-Co W or Mo W or Mo W W W W W 42 Alloy 42 Alloy 42 Alloy 42 Alloy Fe-Ni-Co W W W W W W W W W 42 Alloy 42 Alloy 42 Alloy W W W W W W Sn-Cu Sn-Cu Sn-Cu Sn-Cu Au Au Au Au Au Au Au Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn-Cu Au Au Au Au Au Au Au Au Au Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Au Au Au Au Au Au Complies With EU RoHS directive ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! Remarks (Contains Pb in products exempted by RoHS directive.) Pb Free ! ! ! ! ! ! ! Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! ! ! ! ! ! ! Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! ! ! ! http://www.epsontoyocom.co.jp Reference weight (Typ.) 148 mg 52 mg 30 mg 17 mg 5 mg 6 mg 8 mg 8 mg 11 mg 15 mg 22 mg 29 mg 50 mg 126 mg 229 mg 172 mg 7 mg 11 mg 23 mg 18 mg 16 mg 17 mg 24 mg 40 mg 84 mg 124 mg 330 mg 505 mg 38 mg 13 mg 49 mg 56 mg 112 mg 112 mg Application guide SPXO VCXO TCXO OCXO Epson Toyocom Model Terminal Material Terminal Plating SG-150 series SG-211 series SG-210 series SG-310 series SG-550 series TCO-710x series SG-770 series TCO-708x series SG-645 series SG-636 series SG-615 series SG-531 series SG-51 series SG-8003BA SG-8002CE/SG-8003CE SG-8002LB/SG-8003LB SG-8002JF SG-8002CA/SG-8003CA SG-8002JC SG-8002JA SG-8002DC SG-8002DB SG-8003JF SG-8003JC SG-8003JA SG-8003DC SG-9001LB SG-9001CA SG-9001JC XG-1000CA XG-1000CB EG-2021CA series EG-2001CA series EG-2002CA series EG-2121CA series EG-2102CA series EG-2101CA series HG-2150CA series HG-8002JA series TCO-391J TCO-3100 series MG-5020JE SG-3030LC/3040LC SG-3030JF SG-3030JC/3040JC VG-4231CE VG-4231CB VG-4531CB VG-4231CA VG-4501CA VG-4502CA VG-4511CA VG-1201CA TCO-291J TCO-294J TCO-2152 TCO-2000 series TCO-2100 series TG-3530SA TG-5021BA TG-5005CG TG-5010CG TG-5005CE TG-5010LH TCO-5860 series TCO-5060 / 5160 series TCO-6831 OX-6501GG TCO-6600 series TCO-6730 TCO-676 series TCO-679 series TCO-6920A Cu W W W 42 Alloy W W W 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy Cu W 42 Alloy 42 Alloy W 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy W 42 Alloy W W W W W W W W W 42 Alloy Sn-P-Cu Sn-P-Cu 42 Alloy 42 Alloy 42 Alloy 42 Alloy W W W W W W W W Sn-P-Cu Cu Ag-Pd Sn-P-Cu Sn-P-Cu 42 Alloy Cu W W W 42 Alloy W W Fe-Ni(50 %) Cu Fe-Ni(50 %) Fe-Ni(50 %) Fe-Ni(50 %) Fe-Ni-Co Fe-Ni(50 %) Au Au Au Au Sn-Bi Au Au Au Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Au Au Sn-Bi Sn or Sn-Bi Au Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn orSn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn-Bi Au Sn or Sn-Bi Au Au Au Au Au Au Au Au Au Sn or Sn-Bi Sn or Sn-Cu Sn-Cu Sn-Ag Sn or Sn-Ag Sn or Sn-Bi Sn or Sn-Bi Au Au Au Au Au Au Au Au Sn Au Au Sn or Sn-Cu Sn or Sn-Cu Sn-Ag Au Au Au Au Sn-Bi Au Au Sn-Cu Au Sn-Cu Sn-Cu Sn-Cu Sn-Ag-Cu Sn-Cu Complies With EU RoHS directive ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! Remarks (Contains Pb in products exempted by RoHS directive.) Pb Free ! ! ! ! ! ! ! ! High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! High melting temperature type solder. (Pb85%) ! High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! ! ! ! High melting temperature type solder. (Pb85%) ! ! ! ! ! ! ! ! ! High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! ! ! ! ! ! Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) ! ! ! ! ! ! ! Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. http://www.epsontoyocom.co.jp Reference weight (Typ.) 9 mg 13 mg 15 mg 26 mg 41 mg 53 mg 166 mg 158 mg 98 mg 241 mg 917 mg 698 mg 952 mg 9 mg 27 mg 41 mg 98 mg 148 mg 234 mg 894 mg 699 mg 942 mg 98 mg 234 mg 894 mg 699 mg 41 mg 155 mg 239 mg 126 mg 56 mg 135 mg 130 mg 135 mg 133 mg 129 mg 134 mg 153 mg 896 mg 742 mg 1018 mg 120 mg 25 mg 90 mg 239 mg 26 mg 54 mg 53 mg 153 mg 169 mg 164 mg 169 mg 158 mg 742 mg 358 mg 152 mg 971 mg 1018 mg 290 mg 9 mg 16 mg 16 mg 29 mg 22 mg 29 mg 214 mg 55.5 g 7.0 g 27.5 g 82.5 g 10.0 g 4.5 g 91.0 g Application guide Model Real Time Clock Module Crystal Filter (MCF) SAW Filter Sensor RX-4045SA RX-4045NB RX-4581NB RTC-9701JE RTC4701JE RTC-4701NB RTC-4574SA RTC-4574JE RTC-4574NB RX-4574LC RA-4574SA RTC-4543SA RTC-4543SB RX-4575LC RX-4571LC RX-4571NB RX-4571SA RA-4565SA RX-4801SA RX-8025SA RX-8025NB RTC-8564JE RTC-8564NB RX-8564LC RA-8565SA RX-8571LC RX-8571NB RX-8571SA RX-8581SA RX-8581JE RX-8581NB RA-8581SA RX-8731LC RX-8801SA RTC-7301SF RTC-7301DG RTC-62423 RTC-72423 RTC-62421 / 72421 HF-232A/233A HF-362A/363A HF-372A/373A HF-734 HF-J14A HF-S14A MF-372A/373A MF-722A/723A MF-734A TF-330A/C FF-32N FF-555/FF-585 TQS-570AA-7R TQS-566AA-7R TQS-557AA-7R TQS-949AD-7G TQS-471BB-7R TQS-477AA-7R TQS-472BA-7R XV-8000LK XV-3500CB XV-8000CB XV-8100CB HTS-206 TSU-20G TSU-70G TSU-100G Epson Toyocom Terminal Material Terminal Plating 42Alloy Cu Alloy Cu Alloy 42 Alloy 42 Alloy Cu Alloy 42Alloy 42 Alloy Cu Alloy 42 Alloy 42Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy Cu Alloy 42Alloy 42Alloy 42Alloy 42Alloy Cu Alloy 42 Alloy Cu Alloy 42 Alloy 42Alloy 42 Alloy Cu Alloy 42Alloy 42Alloy 42 Alloy Cu Alloy 42Alloy 42 Alloy 42Alloy Cu Alloy 42 Alloy 42 Alloy 42 Alloy 42 Alloy W W W W W W W W W W W W W W W W W W W 42 Alloy W W W Fe-Ni-Co Cu Cu Cu Sn or Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn-Ag Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn or Sn-Ag Sn or Sn-Ag Sn-Ag Sn Sn Sn Sn or Sn-Ag Sn-Ag Sn or Sn-Ag Sn-Ag Sn or Sn-Ag Sn Sn or Sn-Ag Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Sn or Sn-Bi Au Au Au Au Au Au Au Au Au Au Au Au Au Au Au Au Au Au Au Sn-Ag Au Au Au Sn-Pb Sn Sn Sn Complies With EU RoHS directive ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! Remarks (Contains Pb in products exempted by RoHS directive.) Pb Free High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) High melting temperature type solder. (Pb85%) ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! High melting temperature type solder. (Pb85%) Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. Contains Pb in sealing glass exempted by RoHS directive. http://www.epsontoyocom.co.jp Reference weight (Typ.) 290 mg 84 mg 84 mg 123 mg 120 mg 83 mg 289 mg 118 mg 83 mg 25 mg 289 mg 291 mg 238 mg 25 mg 25 mg 83 mg 309 mg 309 mg 313 mg 292 mg 84 mg 119 mg 83 mg 25 mg 309 mg 25 mg 84 mg 311 mg 289 mg 111 mg 84 mg 289 mg 25 mg 313 mg 233 mg 1082 mg 656 mg 661 mg 1090 mg 16 mg 25 mg 42 mg 129 mg 1025 mg 3690 mg 42 mg 150 mg 124 mg 33 mg 49 mg 112 mg 33 mg 33 mg 34 mg 18 mg 30 mg 35 mg 170 mg 191 mg 65 mg 65 mg 65 mg 54 mg 200 g 200 g 200 g