Actual size
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Crystal unit
Crystal unitCrystal unit
Crystal unit
Epson Toyocom
Eps o n To yo co mEps o n To yo co m
Eps o n To yo co m
S
p
ecifications
(
characteristics
)
For Clock For RF Reference
Item Symbol FA-238V FA-238 TSX-3225 Remarks
Nominal frequency range f 12.000 MHz to
15.999 MHz
16.000 MHz to
50.000 MHz
12.000 MHz to
54.000 MHz
Fundamental *1
For the out of standard specifications,
please contact us for inquiries.
Storage temperature T_stg -40 °C to +125 °C -40 °C to +85 °C Store as bare product after unpacking Temperature
Range Operating temperature T_use -40 °C to +85 °C -20 °C to +75 °C Specified equivalent series must be satisfied
Level of drive DL 10 µW to 100 µW 100 µW Max.
Frequency tolerance f_tol ±50 × 10
-6
(standard),
(±15 × 10
-6
to ±50 × 10
-6
is available) ±10 × 10
-6
+25 °C For the out of standard specifications,
please contact us for inquiries. *1
Frequency versus
temperature characteristics f_tem ±30 × 10
-6
/
-20 °C to +70 °C ±10 × 10
-6/
-20 °C to +75 °C For the out of standard specifications, please
contact us for inquiries. *1
Load capacitance CL 7 pF to ∞
(Standard:10 pF)
9 pF to ∞
(Standard: 9 pF, 12 pF, 16 pF, ∞)
For the out of standard specifications, please
contact us for inquiries.
Motional resistance (ESR) R
1
As per below table As per below table -40 °C to +85 °C, DL = 100 µW
Frequency aging f_age ±5 × 10
-6
/ year Max. ±1 × 10
-6
/ year Max.*2 +25 °C, First year
*1 FA-238: For over 40 MHz, only the standard specification applies.
*2 40 MHz ≤ f : ±2 × 10
-6
/ year Max.
Mo t ional resi stance
(
ESR
)
(FA-238V / FA-238 ) Frequency Motional resistance (TSX-3225) Frequency Motional resistance
12.0 MHz ≤ f ≤ 13.0 MHz 100 Ω Max. 12.0 MHz ≤ f < 16.0 MHz 100 Ω Max.
13.0 MHz < f < 20.0 MHz 80 Ω Max. 16.0 MHz ≤ f < 21.0 MHz 60 Ω Max.
20.0 MHz ≤ f < 25.0 MHz 60 Ω Max. 21.0 MHz ≤ f ≤ 54.0 MHz 40 Ω Max.
25.0 MHz ≤ f < 30.0 MHz 50 Ω Max.
30.0 MHz ≤ f ≤ 50.0 MHz 40 Ω Max.
External dimensions
(
Unit:mm
)
Foot
p
rint
(
Recommended
)
(
Unit:mm
)
F
A
-238V
/
F
A
-238
MHz RANGE CRYSTAL UNIT
MINIATURE SIZE LOW PROFILE SMD
FA
-
238V
/
FA
-
238
TSX
-
3225
•Frequency range : 12 MHz to 54 MHz
•Thickness : 0.6 mm Max.(TSX-3225)
•Overtone order : Fundamental
•Applications : Mobile phone, Bluetooth, W-LAN
: ISM band radio, Clock for MPU
#1
#4
#2
#3
Internal connection
(TOP VIEW)
#2 and #4 are connected to the cover.
(Please connect to ground)
0.85
0.9
#3
#4
0.7
1.3
#2
#1
0.9
0.7
#1
#3
#4
0.8
#2
1.2
C 0.3 Min.
1.0
0.7
#1
#3
#4
0.8
#2
1.0
0.6 Max.
3.2±0.15
#1
#4
2.5±0.15
#2
#3
Marking
TSX-3225
3.2±0.1
#1
#4
2.5±0.1
#2
#3
0.7 Max.
2000M
2000M2000M
2000M
E66RA
E66RAE66RA
E66RA
FA-238
3.2±0.1
#1
#4
2.5±0.1
#2
#3
1200M
1200M1200M
1200M
E66RA
E66RAE66RA
E66RA
FA -238V
0.7 Max.
1.2
2.2
1.4
1.6
FA-238
FA-238V
1.2
2.4
1.4
1.9
1.15
2.2
1.4
1.6
TSX-3225
TS
X
-3225
July 2008
Product Configuration System
MHz Range Crystal Units
FA-238V 13.94446M AC-
Crystal Package Type:
High Stability Ceramic SMD
FA-238 / FA-238V
3.2 X 2.5 X 0.7 mm
Frequency:
FA-238V: 12.0000 ~ 15.9999MHz
FA-238: 16.0000 ~ 50.0000MHz
Freq. Tolerance@25C
F: +/-10ppm
A: +/-20ppm
B: +/-50ppm (standard)
Load Capacitance:
A: 12.5pF
AC: 9.0pF
C: 18pF
K: 10.0pF
W: 12.0pF
Tape & Reel Qty
Blank: Bulk
3: 250pcs/reel
0: 1000pcs/reel
5: 3000pcs/reel
A50X
Freq. Temp Char./Op Temp Range
Blank: +/-30ppm / -20C to +70C
10V: +/-10ppm / -20C to +70C
20V: +/-20ppm / -20C to +70C
23X: +/-23ppm / -40 to +85C
50X: +/-50ppm / -40C to +85C
NOTE:
Please contact your EEA representative for
other available frequencies or specifications.
15
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■
HANDLING PRECAUTIONS
When using Epson Toyocom products,it is essential to observe the operating conditions specified in their respective specifications or
catalogs.
■
Common points for all products
1. Shock resistance
Epson Toyocom’s crystal products are designed to resist physical shocks, but crystal products may be damaged under some
conditions, such as dropping from desks or receiving shocks during mounting. Please be sure to re-check the characteristics if product
has received any shocks.
2. Soldering heat resistance
Epson Toyocom’s crystal products except SMD products use solder having a +180°C to +200°C melting point. Heating up the package
more than +150°C may deteriorate the characteristics or damage the products. If the crystal products need to be soldered at
temperature of more than +150°C,SMD products are recommended. Using higher temperatures over the following reflow conditions to
crystal products, even SMD products, may cause the characteristics to deteriorate. The reflow conditions within following profile is
recommended. Always check the soldering temperature and time before mounting these products. Also, please check them again
when the mounting conditions are changed. Please contact us for inquiries about heat-resistance if crystal products need to be
soldered over the following profile.
(1) Cylinder products and DIP products
Model Soldering conditions
[ Cylinder ] C-TYPE, C-2-TYPE, C-4-TYPE,HTS-206 +280 °C or under @ Max. 5 s.
Do not heat the package at more than +150 °C.
[ Cylinder ] CA-301
[ DIP ] SG-51
/
531, SG-8002DB
/
DC,SG-8003DC
RTC-62421
/
72421
/
7301DG
+260 °C or under @ Max.10 s.
Do not heat the package at more than +150 °C.
[ DIP ] TCO-6831
/
TCO-676
/
TCO-679
TCO-6920A
/
OX-6601DL
Temperature in point of soldering iron
+370 °C or under @ Max.5 s. (Each terminal)
Do not heat the package at more than +150 °C.
(2) SMD products Reflow profile (example)
The availability of the heat resistance for reflow conditions of JEDEC-STD-020D is judged individually. Please inquire it.
Please make temperature rate as gentle a curve as possible. Also, if the package is cellular, the possibility of cracking is inevitable,
so please store it for a short duration and take measures to protect product from dampness when you store it in high humidity.
Model Type.E Type:T Type:JEDEC Remarks
FC-12M ! – Please contact us
FC-125 ! – –
FC-13E ! – –
FC-13F ! – Please contact us
FC-135 ! – Please contact us
FC-145 ! – Please contact us
FC-255 ! – Please contact us
MC-146 ! – Please contact us
MC-156 ! – Please contact us
MC-306 ! – !
MC-30A ! – !
kHz Range
Crystal unit
MC-405/406 ! – !
FA-128 ! ! !
FA-20H ! ! !
FA-23A ! – !
FA-238V ! – !
FA-238 ! – !
TSX-3225 –
! !
TSX-4025 –
! !
TSX-5032 –
! !
FA-365 ! – !
MA-306 ! – Please contact us
MA-406 ! – !
Tc=+250 ºC
MA-505/506 ! – !
Tc=+250 ºC
MHz Range
Crystal unit
FH-33H –
! !
NS-21R – –
!
NS-32R ! – !
FS-335 ! – !
FS-555 ! – Please contact us
SAW
Resonator
FS-585 ! – Please contact us
Time(s)
100 s
35 s
+170 °C
+220 °C
+260 °C Max.
+1 °C/s
to +5 °C/s
+1 °C/s
to +5°C/s
+1 °C/s
to +5 °C/s
Pre-heating area
Stabl e meltin
g
ar ea
Temperature(°C)
+150 °C
+200 °C
+250 °C
Type:E
120 s
60 s
+150 °C
+220 °C
+260 °C Max.
Pre-heating area
Stabl e meltin
g
area
+180 °C
60 s ~120 s 35 s ~ 150 s Min.
+150 °C
+2 17 °C
Tc= +260 °C Max.
+6 °C/s Max.
+3 °C/s Max.
Pre-heati ng area Stable mel ting area
30 s
Tc-5 °C
+200 °C
Type:T Type:JEDEC
Twice re flows
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Model Type.E Type:T Type:JEDEC Remarks
SG-3030 series ! –
Please contact us
SG-3040 series ! –
Please contact us
SG-150S*E –
–
!
SG-211S*E –
–
!
SG-210 series !
–
!
SG-310 series !
–
!
SG-550 series !
–
!
TCO-710x series –
!
!
SG-710 series !
–
!
SG-770 series –
–
!
TCO-708x series –
!
!
SG-645 series !
–
−
SG-636 series !
–
Please contact us
Tc=+250 ºC
SPXO
SG-615 series !
–
!
Tc=+245 ºC
SG-8003BA –
–
!
SG-8003CE –
–
!
SG-8003LB –
–
!
SG-8003CA –
–
!
SG-8003JF –
–
!
SG-8003JC –
–
!
Tc=+250 ºC
SG-8003JA –
–
!
Tc=+245 ºC
SG-8002CE !
–
!
SG-8002LB !
–
!
SG-8002JF !
–
−
SG-8002CA !
–
!
SG-8002JC !
–
Please contact us Tc=+250 ºC
Programmable
SG-8002JA !
–
!
Tc=+245 ºC
SG-9001LB !
–
!
SG-9001CA !
–
!
Spread
Spectrum
SG-9001JC !
–
Please contact us
Tc=+250 ºC
XG-1000CA !
–
!
XG-1000CB !
–
!
EG-2021CA series !
–
!
EG-2001CA series !
–
!
EG-2002CA series !
–
!
EG-2121CA series !
–
!
EG-2102CA series !
–
!
SAW
EG-2101CA series !
–
!
HG-2150CA series !
–
!
HG-8002JA series !
–
!
Tc=+245 ºC
TCO-391J –
!
!
Tc=+245 ºC
High-Stability
TCO-3100 series –
!
!
Tc=+245 ºC
Multi-Output
MG-5020JE !
–
Please contact us
VG-4231CE !
–
!
VG-4231CB –
–
!
VG-4531CB –
–
!
VG-4231CA !
–
!
VG-4501CA –
–
!
VG-4502CA –
–
!
VG-4511CA –
–
!
VG-1201CA !
–
!
TCO-291J –
!
!
Tc=+245 ºC
TCO-294J –
!
!
TCO-2152 –
!
!
TCO-2000 series –
!
!
Tc=+245 ºC
VCXO
TCO-2100 series –
!
!
Tc=+245 ºC
TG-3530SA !
–
Please contact us Tc=+250 ºC
TG-5021BA !
!
Please contact us
TG-5005CG –
!
Please contact us
TG-5010CG –
!
Please contact us
TG-5005CE –
!
Please contact us
TG-5010LH !
–
Please contact us
TCO-5860 series –
!
Please contact us
TCXO
TCO-5060/5160 series –
!
Please contact us
OCXO
OX-6501GG series –
–
! Tc=+245 ºC
XV-8000LK !
–
!
Tc=+250 ºC
XV-3500CB !
–
!
XV-8000CB !
–
!
Sensor
XV-8100CB !
–
!
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Model Type.E Type:T Type:JEDEC Remarks
RX-4045SA !
–
Please contact us Tc=+250 ºC
RX-4045NB !
–
Please contact us
RX-4581NB !
–
Please contact us
RTC-9701JE !
–
Please contact us
RTC-4701JE !
–
Please contact us
RTC-4574SA !
–
Please contact us Tc=+250 ºC
RTC-4574JE !
–
Please contact us
RTC-4574NB !
–
Please contact us
RX-4574LC !
–
Please contact us
RA-4574SA !
–
Please contact us Tc=+250 ºC
RTC-4543SA !
–
Please contact us Tc=+250 ºC
RTC-4543SB !
–
Please contact us
RX-4575LC !
–
○
RX-4571LC !
–
○
RX-4571NB !
–
○
RX-4571SA !
–
○ Tc=+250 ºC
RA-4565SA !
–
○ Tc=+250 ºC
RX-4801SA !
–
○ Tc=+250 ºC
RX-8025SA !
–
Please contact us Tc=+250 ºC
RX-8025NB !
–
Please contact us
RTC-8564JE !
–
Please contact us
RTC-8564NB !
–
Please contact us
RX-8564LC !
–
Please contact us
RA-8565SA !
–
○ Tc=+250 ºC
RX-8571LC !
–
○
RX-8571NB !
–
○
RX-8571SA !
–
○ Tc=+250 ºC
RX-8581SA !
–
Please contact us Tc=+250 ºC
RX-8581JE !
–
Please contact us
RA-8581SA !
–
Please contact us Tc=+250 ºC
RX-8731LC !
–
○
RX-8801SA !
–
○ Tc=+250 ºC
RTC-7301SF !
–
Please contact us
RTC-62423 !
–
Please contact us Tc=+245 ºC
Real
Time
Clock
Module
RTC-72423 !
–
Please contact us Tc=+245 ºC
HF-232A/233A –
!
!
HF-362A/363A –
!
!
HF-372A/373A –
!
!
HF-734 –
!
!
HF-J14A –
!
!
Tc=+245 ºC
HF-S14A –
!
!
Tc=+245 ºC
MF-372A/373A –
!
!
MF-722A/723A –
!
!
MF-734A –
!
!
TF-330A/C –
–
!
FF-32N !
–
Please contact us
FF-555/FF-585 !
–
Please contact us
TQS-557AA-7R –
!
!
TQS-949AD-7G –
!
!
TQS-471BB-7R –
!
!
TQS-477AA-7R –
!
!
Filter
TQS-472BA-7R –
!
!
3. Mounting
precautions
Shocks by auto mounting
Shocks caused by auto mounting and vacuuming may deteriorate the characteristics and affect the products. Please set the
mounting conditions to minimize the shocks as much as possible, and be sure that there is no affect on the characteristics before
mounting. Please review the conditions after the conditions are changed. Also please be sure that crystal products don’t hit machines
or other electric boards, etc. before or after mounting.
(1) a) Ceramic package products and SON products
Bending the board after soldering ceramic package products and SON products (MC-146,RTC-****NB,RX-****NB) may cause
peeling off portions of soldering or package cracks by mechanical stress. Particularly, in the case of cutting boards after soldering
these products, please be sure to layout the crystal on a less stressed location and use less stressed cutting method.
b) Ceramic package products
In the case of soldering ceramic package products on a different expansion-coefficient board (ex. Epoxy Glass),soldering crack at
the foot pattern would be expected under repeated temperature changes for a long period. Under these conditions, be sure to
check the solderability in advance.
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(2)Cylinder products
Bending the lead on the glass or pulling the lead strongly may cause cracking of the hermetic seal glass at the root of the lead and
may cause the airtightness and the characteristics to deteriorate. When the lead of crystal products need to be bent as in the figure
below, leave more than 0.5 mm of lead from the case and hold the lead to prevent the lead from cracks. When the lead needs to be
repaired, do not pull it, and hold the bent part to correct it. Giving undue pressure on this portion of hermetic seal may cause the
airtightness to deteriorate. Please avoid applying pressure. Gluing the case of products on the electric board is recommended to
prevent the airtightness from deteriorating.
●
Installation example
(3)DIP products
Deformed leads cannot be inserted into board holes. Avoid applying stress sufficient to deform leads.
(4)SOJ Products and SOP products
Please avoid applying stress sufficient to deform the leads.
Deformed leads may cause incorrect soldering.
Particularly SOP products need to be handled with the greatest care.
4. Ultrasonic cleaning
•Products using AT-cut crystal and SAW resonator/filter can be cleaned by ultrasonic methods. But under some conditions, the
crystal characteristics may be affected and internal wiring may be damaged. Please be sure to check the suitability of your system
in advance.
•Products using tuning-fork crystals and gyro sensors cannot be guaranteed if cleaned using ultrasonic methods, because crystal
may be destroyed.
•Do not wash open-type products.
•With washable products, avoid the use of cleaners or solvents that may negatively affect the product.
5. The affect of mechanical vibration
While there is any given shock or mechanical vibration periodically to crystal products, such as, a piezo sounder, a piezo buzzer, and
speaker, to crystal products, output frequency and amplitude can be changed. Especially the quality of telecommunication equipment
could be affected by this phenomenon. Although Epson Toyocom’s crystal products are designed to minimize the effect of
mechanical vibration, Epson Toyocom recommends to check them in advance and then follow the Mounting guidelines as below.
●
Mounting guidelines
(1) Ideally, the mechanical buzzer source should be mounted on a separate PCB from the crystal device.
(2) It is advisable to use cushion or cutting PCB, if you mount on same PCB.
(3) Traveling mechanical vibration differs when applied to the PCB only vs. inside the body. Last of all, it is advisable
to conform to inside body characteristics.
6. Storage
(1) Storing the crystal products under higher or lower temperature or high humidity for a long period may affect frequency stability or
solderability. Please store the crystal products at the normal temperature and humidity, avoid storing them for a long period and
mount them as soon as possible after unpacking.
Normal temperature and humidity:
Temp,+15 °C to+35 °C, humidity 25 % RH to 85 % RH(refer to the standard conditions of test site JIS Z-8703)
(2) Please carefully handle the inner and outer boxes and reel. External pressure may cause deformation of reel and tape.
7.Radiation
Exposure to radiation can cause deterioration in performance, so avoid irradiation.
8.Chemicals / pH
Do not use or store the product in a pH range that may cause corrosion or dissolution of the materials or packaging.
9.Adhesive
Do not use an adhesive that may cause corrosion of the packing materials, terminals, components, glass materials, and vapor
deposited materials used in the products.
(For example, a chlorine-based adhesive may corrode the metal parts “lid” of a crystal unit to diminish the hermetic qualities, lowering
the performance.)
10.Halogen Compound
Do not use products in halogen gas. Even a slight amount of halogen gas, such as that found in chlorine gas in the air or in metal
parts used in the package, may corrode. Also, do not use any resin that emits halogen gas.
More than 0.5 mm
Direct soldering to the case may deteriorate t he characteristics.
Print ed circuit board so lde r
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■
Crystal unit / Resonator
1. Drive level
Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Circuit design must be such
as to maintain a proper drive level.(refer to page “Drive level”)
2. Negative resistance
Unless adequate negative resistance is allocated in the oscillation circuit, oscillation or oscillation start up time may increase (refer to
page “Allowance for Oscillation”.)
3. Load capacitance
Differences in the load capacitance in the oscillation circuit may result in deviations in the oscillation frequency from the desired
frequency. Attempting to tune by force may merely cause abnormal oscillation. Before use, please specify the load capacitance of the
oscillation circuit.(refer to page ”Load capacitance” )
■
Crystal Oscillator and real time clock module
All crystal oscillators and real time clock modules are provided with a CMOS IC. Please pay attention to the following points.
1. Static electricity
Although an anti-static-electricity protection circuit is provided in the circuit, excessive levels of static electricity may damage the IC.
Choose conductive materials for containers and packing material. Use a soldering gun and a measuring circuit free from high-voltage
leakage and provide grounding connection when working with them.
2. Noise
Applying excessive level of extraneous noise to power source or input terminal may cause latch up or spurious phenomenon,
which results in malfunction and breakdown.
To maintain stable operation, provide by-pass capacitor with more than 0.1 µF at a location as near as possible to the power source
terminal of the crystal products (between V
CC
- GND). Do not permit any objects which emit a high level of noise in a location near
the crystal oscillator.
3. Power supply line
Line impedance of a power supply should be as low as possible.
4. Output Load
It is recommended that output load is installed as close as possible to an oscillator (within 20 mm).
5. Treatment of unused input terminals
Unused pins that are left open may collect noise, thereby resulting in malfunction. Also, power consumption may increase when both
P-channel and N-channel are turned on, therefore connect unused input terminals to V
CC
or GND.
6. Heat impact
Repeated large changes in temperature may degrade the characteristics of a deteriorated crystal unit and cause breakage of wires
inside the plastic mold. This must be avoided.
7. Mounting direction
Incorrect mounting of the oscillator may cause malfunction and breakdown, so please check the mounting direction when installing.
8. Power on
It is not recommended to power on from intermediate electric potential and / or extreme fast power on. Powering on under such
conditions may cause no oscillation and / or malfunction.
■
Optical device
1.Chemicals
Do not use chemicals that may negatively affect the glass materials,vapor deposited materials,or adhesives used in the product.
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PRECAUTIONS IN DESIGNING OSCILLATION CIRCUITS
1. Drive level
Drive level denotes electric power required to oscillate a crystal unit, which can be calculated using the following formula.
Drive level ( P ) = i
2
•
Re
Where i stands for current to pass in the crystal unit, Re for effective resistance of crystal unit, and Re=R
1
(1+Co/C
L
)
2
.
If the Drive level (P) exceeds the specified level, oscillation frequency will shift. This occurs because an excessive level of power
causes stress for the crystal and, consequently, temperature rises. If excessive drive level of power is applied to the crystal unit,
this may deteriorate or damage the characteristics.
Equivalent circuit of crystal unit Oscillation circuit
2. Allowance for oscillation
Unless adequate negative resistance is allocated in the oscillation circuit, oscillation start-up time may be increased, or No
oscillation may occur. In order to avoid this, provide enough negative resistance in the circuitry design.
●
Crystal unit and Oscillator
●
Check of Negative resistance
3. Load capacitance
Differences in the load capacitance of the oscillation circuit may result in a different oscillation frequency from the desired one, as
shown in the figure below. Approximate expression of the load capacitance of the circuit C
L
C
G
× C
D
/ (C
G
+C
D
)+C
S
.
Where CS Stands for stray Capacity of the circuit.
R
D
C
G
C
D
X’tal
R
f
Frequency range
20 kHz to 60 kHz
C
G
(pF) R
D
(kΩ)
60 kHz to 165 kHz
5.5 MHz to 30 MHz
(Fundamental)
R
f
(MΩ)
30 MHz～50 MHz
(Fundamental)
C
D
(pF)
20
10
1
500
300
0.5
10
5～15
5～10
5～15
5～10
10
10 10
Reference for setting parameters of oscillation circuit
IC: equivalent to TC74HCU04 (Unbuffer)
IC: equivalent to TC74VHCU04 (Unbuffer) (30 MHz to 50 MHz)
(TC74HCU04 and TC74VHCU04 are product number of
Toshiba Corp.)
Symbol
r
R
D
C
G
C
D
X’tal
R
f
1. Connect the resistance (r) to the circuit in series with the crystal unit.
2. Adjust (r) so that oscillation can start (or stop).
3. Measure (r) when oscillation just starts (or stops) in (2) above.
4. Recommended (r)
(r) > CI ×(5 to 10)
-R
L
CI(Re)
CL
Crystal unit Oscillator
-50
50
100
0
5 10 15
Load capacitance (pF)
Frequency f_tol (1×10
-6
)
Frequency and load capacitance
characteristics
R
1
L
1
C
1
C
0
R
D
C
G
C
D
X’tal
R
f
i
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Application guide
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Epson Toyocom
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Epson Toyocom
WORKING FOR EU RoHS / Pb FREE
■
EU RoHS / Pb Free Products of Epson Toyocom
Epson Toyocom's standard product offering is compliant with EU RoHS directives.
We provide the following two EU RoHS directive compliances.
The appropriate symbol is displayed on individual product pages as applicable.
●
●●
●Pb free.
●
●●
●Complies with EU RoHS directive.
●
●●
●Pb free terminal designed.
Contains Pb in products exempted by EU RoHS directive.
(Contai ns Pb in seal ing glass, high melt i ng temper at ure type sol der or other.)
●
●●
●Complies with EU RoHS directive.
■
DISTINCTIONS
Distinctions between the products with Pb plating terminals and the products that comply with EU RoHS directives.
•
Plastic packaged type products.
Marking (year part lot No.) will be changed as follows.
Products with Pb plating terminals
(Terminal Plating ; Sn-Pb)
Numeric 1 2 3 4 5 6 7 8 9 0
Products Complied with EU RoHS directive
(Terminal Plating ; Sn-Bi or Sn-Ag)
Alphabet A B C D E F G H J K
Products Complied with EU RoHS directive
(Terminal Plating ; Sn)
Alphabet M N R S T U V W X Z
•
Cylinder type products
The color of glass plug will be changed as follows.
Terminal Pb Plating products
Blue or Green etc
Complies with EU RoHS directive products
Gray or White
■
Temrmi nal mat erials of Epso n To yocom products th at comply with E U RoHS directive
We will deliver products that comply with EU RoHS directives for new orders.
Sn plating of terminals is our standard for the products that offer two types of plating.
Model Te r m i n a l
Material
Te r m i n a l
Plating
Complies
With
EU RoHS
directive
Pb
Free
Remarks
(Contains Pb in products exempted
by RoHS directive.)
Reference
weight
(Typ.)
C-001R Fe-Ni-Co Sn-Cu ! !
148 mg
C-002RX / C-2-TYPE Fe-Ni-Co Sn-Cu ! !
52 mg
C-004R/C-4-TYPE Fe-Ni-Co Sn-Cu ! !
30 mg
C-005R Fe-Ni-Co Sn-Cu
! !
17 mg
FC-12M W or Mo Au
! !
5 mg
FC-125 W or Mo Au
! !
6 mg
FC-13E W Au
! !
8 mg
FC-13F W Au
!
Contains Pb in sealing glass exempted by RoHS directive.
8 mg
FC-135 W Au
!
Contains Pb in sealing glass exempted by RoHS directive.
11 mg
FC-145 W Au
!
Contains Pb in sealing glass exempted by RoHS directive.
15 mg
FC-255 W Au
!
Contains Pb in sealing glass exempted by RoHS directive.
22 mg
MC-146 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
29 mg
MC-156 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
50 mg
MC-306/MC-30A 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
126 mg
kHz range
Crystal
units
MC-405/MC-406 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
229 mg
CA-301 Fe-Ni-Co Sn-Cu
! !
172 mg
FA-128 W Au
! !
7 mg
FA-20H W Au
! !
11 mg
FA-23A W Au
! !
23 mg
FA-238V W Au
! !
18 mg
FA-238 W Au
! !
16 mg
TSX-3225 W Au
! !
17 mg
TSX-4025 W Au
! !
24 mg
TSX-5032 W Au
! !
40 mg
FA-365 W Au
!
Contains Pb in sealing glass exempted by RoHS directive.
84 mg
MA-306 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
124 mg
MA-406 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
330 mg
MA-505/MA-506 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
505 mg
MHz range
Crystal
units
FH-33H W Au
! !
38 mg
NS-21R W Au
! !
13 mg
NS-32R W Au
! !
49 mg
FS-335 W Au
! !
56 mg
FS-555 W Au
! !
112 mg
Resonator
FS-585 W Au
! !
112 mg
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Epson Toyocom
Model Te r m i n a l
Material
Te r m i n a l
Plating
Complies
With
EU RoHS
directive
Pb
Free
Remarks
(Contains Pb in products exempted
by RoHS directive.)
Reference
weight
(Typ.)
SG-150 series Cu Au ! !
9 mg
SG-211 series W Au ! !
13 mg
SG-210 series W Au ! !
15 mg
SG-310 series W Au ! !
26 mg
SG-550 series 42 Alloy Sn-Bi ! !
41 mg
TCO-710x series W Au ! !
53 mg
SG-770 series W Au ! !
166 mg
TCO-708x series W Au ! !
158 mg
SG-645 series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
98 mg
SG-636 series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
241 mg
SG-615 series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
917 mg
SG-531 series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
698 mg
SG-51 series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
952 mg
SG-8003BA Cu Au
! !
9 mg
SG-8002CE/SG-8003CE W Au ! !
27 mg
SG-8002LB/SG-8003LB 42 Alloy Sn-Bi ! !
41 mg
SG-8002JF 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
98 mg
SG-8002CA/SG-8003CA W Au ! !
148 mg
SG-8002JC 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
234 mg
SG-8002JA 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
894 mg
SG-8002DC 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
699 mg
SG-8002DB 42 Alloy Sn orSn-Bi
!
High melting temperature type solder. (Pb85%)
942 mg
SG-8003JF 42 Alloy Sn or Sn-Bi ! !
98 mg
SG-8003JC 42 Alloy Sn or Sn-Bi ! !
234 mg
SG-8003JA 42 Alloy Sn or Sn-Bi ! !
894 mg
SG-8003DC 42 Alloy Sn or Sn-Bi ! !
699 mg
SG-9001LB 42 Alloy Sn-Bi
! !
41 mg
SG-9001CA W Au
! !
155 mg
SG-9001JC 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
239 mg
XG-1000CA W Au
! !
126 mg
XG-1000CB W Au
! !
56 mg
EG-2021CA series W Au ! !
135 mg
EG-2001CA series W Au ! !
130 mg
EG-2002CA series W Au ! !
135 mg
EG-2121CA series W Au ! !
133 mg
EG-2102CA series W Au ! !
129 mg
EG-2101CA series W Au ! !
134 mg
HG-2150CA series W Au ! !
153 mg
HG-8002JA series 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
896 mg
TCO-391J Sn-P-Cu Sn or Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
742 mg
TCO-3100 series Sn-P-Cu Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
1018 mg
MG-5020JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
120 mg
SG-3030LC/3040LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
SG-3030JF 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
90 mg
SPXO
SG-3030JC/3040JC 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
239 mg
VG-4231CE W Au ! !
26 mg
VG-4231CB W Au
! !
54 mg
VG-4531CB W Au
! !
53 mg
VG-4231CA W Au
! !
153 mg
VG-4501CA W Au ! !
169 mg
VG-4502CA W Au ! !
164 mg
VG-4511CA W Au
! !
169 mg
VG-1201CA W Au
! !
158 mg
TCO-291J Sn-P-Cu Sn
!
Contains Pb in sealing glass exempted by RoHS directive.
742 mg
TCO-294J Cu Au
!
Contains Pb in sealing glass exempted by RoHS directive.
358 mg
TCO-2152 Ag-Pd Au
!
Contains Pb in sealing glass exempted by RoHS directive.
152 mg
TCO-2000 series Sn-P-Cu Sn or Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
971 mg
VCXO
TCO-2100 series Sn-P-Cu Sn or Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
1018 mg
TG-3530SA 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
290 mg
TG-5021BA Cu Au
! !
9 mg
TG-5005CG W Au
! !
16 mg
TG-5010CG W Au
! !
16 mg
TG-5005CE W Au
! !
29 mg
TG-5010LH 42 Alloy Sn-Bi
! !
22 mg
TCO-5860 series W Au ! !
29 mg
TCXO
TCO-5060 / 5160 series W Au ! !
214 mg
TCO-6831 Fe-Ni(50 %) Sn-Cu
!
Contains Pb in sealing glass exempted by RoHS directive.
55.5 g
OX-6501GG Cu Au
!
Contains Pb in sealing glass exempted by RoHS directive.
7.0 g
TCO-6600 series Fe-Ni(50 %) Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
27.5 g
TCO-6730 Fe-Ni(50 %) Sn-Cu
!
Contains Pb in sealing glass exempted by RoHS directive.
82.5 g
TCO-676 series Fe-Ni(50 %) Sn-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
10.0 g
TCO-679 series Fe-Ni-Co Sn-Ag-Cu !
Contains Pb in sealing glass exempted by RoHS directive.
4.5 g
OCXO
TCO-6920A Fe-Ni(50 %) Sn-Cu
!
Contains Pb in sealing glass exempted by RoHS directive.
91.0 g
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Epson Toyocom
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Epson Toyocom
Model Te r m i n a l
Material
Te r m i n a l
Plating
Complies
With
EU RoHS
directive
Pb
Free
Remarks
(Contains Pb in products exempted
by RoHS directive.)
Reference
weight
(Typ.)
RX-4045SA 42Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
290 mg
RX-4045NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
84 mg
RX-4581NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
84 mg
RTC-9701JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
123 mg
RTC4701JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
120 mg
RTC-4701NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
83 mg
RTC-4574SA 42Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
289 mg
RTC-4574JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
118 mg
RTC-4574NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
83 mg
RX-4574LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RA-4574SA 42Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
289 mg
RTC-4543SA 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
291 mg
RTC-4543SB 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
238 mg
RX-4575LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RX-4571LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RX-4571NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
83 mg
RX-4571SA 42Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
309 mg
RA-4565SA 42Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
309 mg
RX-4801SA 42Alloy Sn
!
High melting temperature type solder. (Pb85%)
313 mg
RX-8025SA 42Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
292 mg
RX-8025NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
84 mg
RTC-8564JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
119 mg
RTC-8564NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
83 mg
RX-8564LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RA-8565SA 42Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
309 mg
RX-8571LC 42 Alloy Sn
!
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RX-8571NB Cu Alloy Sn
!
High melting temperature type solder. (Pb85%)
84 mg
RX-8571SA 42Alloy Sn
!
High melting temperature type solder. (Pb85%)
311 mg
RX-8581SA 42Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
289 mg
RX-8581JE 42 Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
111 mg
RX-8581NB Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
84 mg
RA-8581SA 42Alloy Sn-Ag
!
High melting temperature type solder. (Pb85%)
289 mg
RX-8731LC 42 Alloy Sn or Sn-Ag !
Contains Pb in sealing glass exempted by RoHS directive.
25 mg
RX-8801SA 42Alloy Sn
!
High melting temperature type solder. (Pb85%)
313 mg
RTC-7301SF Cu Alloy Sn or Sn-Ag !
High melting temperature type solder. (Pb85%)
233 mg
RTC-7301DG 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
1082 mg
RTC-62423 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
656 mg
RTC-72423 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
661 mg
Real
Ti me
Clock
Module
RTC-62421 / 72421 42 Alloy Sn or Sn-Bi !
High melting temperature type solder. (Pb85%)
1090 mg
HF-232A/233A W Au
! !
16 mg
HF-362A/363A W Au
! !
25 mg
HF-372A/373A W Au
! !
42 mg
HF-734 W Au
! !
129 mg
HF-J14A W Au !
1025 mg
HF-S14A W Au
!
3690 mg
MF-372A/373A W Au
! !
42 mg
MF-722A/723A W Au
! !
150 mg
Crysta l Filter
(MCF)
MF-734A W Au
! !
124 mg
TF-330A/C W Au
! !
33 mg
FF-32N W Au
! !
49 mg
FF-555/FF-585 W Au
! !
112 mg
TQS-570AA-7R W Au
!
33 mg
TQS-566AA-7R W Au
! !
33 mg
TQS-557AA-7R W Au
! !
34 mg
TQS-949AD-7G W Au
! !
18 mg
TQS-471BB-7R W Au
! !
30 mg
TQS-477AA-7R W Au
! !
35 mg
SAW Filter
TQS-472BA-7R W Au
!
170 mg
XV-8000LK 42 Alloy Sn-Ag
! !
191 mg
XV-3500CB W Au
! !
65 mg
XV-8000CB W Au
! !
65 mg
XV-8100CB W Au
! !
65 mg
HTS-206 Fe-Ni-Co Sn-Pb
!
High melting temperature type solder. (Pb85%)
54 mg
TSU-20G Cu Sn
!
Contains Pb in sealing glass exempted by RoHS directive.
200 g
TSU-70G Cu Sn
!
Contains Pb in sealing glass exempted by RoHS directive.
200 g
Sensor
TSU-100G Cu Sn
!
Contains Pb in sealing glass exempted by RoHS directive.
200 g
