Low Skew, 1-to-4 LVCMOS/LVTTL
Fanout Buffer 8304I
Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20151
GENERAL DESCRIPTION
The 8304I is a low skew, 1-to-4 Fanout Buffer. The 8304I is charac-
terized at full 3.3V for input VDD, and mixed 3.3V and 2.5V for output
operating supply modes (VDDO). Guaranteed output and part-to-part
skew characteristics make the 8304I ideal for those clock distribution
applications demanding well defi ned performance and repeatability.
FEATURES
Four LVCMOS / LVTTL outputs
LVCMOS clock input
CLK can accept the following input levels: LVCMOS, LVTTL
Maximum output frequency: 166MHz
Output skew: 60ps (maximum)
Part-to-part skew: 650ps (maximum)
Small 8 lead SOIC package saves board space
3.3V input, outputs may be either 3.3V or 2.5V supply modes
-40°C to 85°C ambient operating temperature
Available in lead-free (RoHS 6) compliant package
BLOCK DIAGRAM PIN ASSIGNMENT
8304I
8-Lead SOIC
3.8mm x 4.8mm, x 1.47mm package body
M Package
Top View
VDDO
VDD
CLK
GND
1
2
3
4
Q3
Q2
Q1
Q0
8
7
6
5
Q0
Q1
Q2
Q3
CLK
Pulldown
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20152
TABLE 1. PIN DESCRIPTIONS
TABLE 2. PIN CHARACTERISTICS
Symbol Parameter Test Conditions Minimum Typical Maximum Units
CIN Input Capacitance 4pF
CPD
Power Dissipation Capacitance
(per output) VDD, VDDO = 3.465V 15 pF
RPULLDOWN Input Pulldown Resistor 51 kΩ
ROUT Output Impedance 7 Ω
Number Name Type Description
1V
DDO Power Output supply pin. Connect to 3.3V or 2.5V.
2V
DD Power Positive supply pin. Connect to 3.3V.
3 CLK Input Pulldown LVCMOS / LVTTL clock input.
4 GND Power Power supply ground. Connect to ground.
5 Q0 Output Single clock output. LVCMOS / LVTTL interface levels.
6 Q1 Output Single clock output. LVCMOS / LVTTL interface levels.
7 Q2 Output Single clock output. LVCMOS / LVTTL interface levels.
8 Q3 Output Single clock output. LVCMOS / LVTTL interface levels.
NOTE: Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20153
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VDD Power Supply Voltage 3.135 3.3 3.465 V
VDDO Output Power Supply Voltage 3.135 3.3 3.465 V
IDD Power Supply Current 18 mA
IDDO Output Supply Current 11 mA
TABLE 3C. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL Input Low Voltage -0.3 1.3 V
IIH Input High Current VDD = VIN = 3.465V 150 µA
IIL Input Low Current VDD = 3.465V, VIN = 0V -5 µA
VOH Output High Voltage
Refer to NOTE 1 2.6 V
IOH = -16mA 2.9 V
IOH = -100uA 3 V
VOL Output Low Voltage
Refer to NOTE 1 0.5 V
IOL = 16mA 0.25 V
IOL = 100uA 0.15 V
NOTE 1: Outputs terminated with 50ΩΩ to VDDO/2. See Parameter Measurement Section, “3.3V Output Load Test Circuit”.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
DD 4.6V
Inputs, VI -0.5V to VDD + 0.5 V
Outputs, VO -0.5V to VDDO + 0.5V
Package Thermal Impedance, θ
JA 112.7°C/W (0 lfpm)
Storage Temperature, T
STG -65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifi cations only. Functional
operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for ex-
tended periods may affect product reliability.
TABLE 3B. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VDD Positive Supply Voltage 3.135 3.3 3.465 V
VDDO Output Supply Voltage 2.375 2.5 2.625 V
IDD Power Supply Current 18 mA
IDDO Output Supply Current 11 mA
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20154
TABLE 3D. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = -40°C TO 85°C
TABLE 4A. AC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fMAX Output Frequency 166 MHz
tpLH
Propagation Delay,
Low-to-High; NOTE 1 ƒ 166MHz 2 3.3 ns
tjit Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
125MHz,
Integration Range
12kHz – 20MHz
0.17 ps
tsk(o) Output Skew; NOTE 2, 4 ƒ = 133MHz 50 ps
tsk(pp) Part-to-Part Skew; NOTE 3, 4 600 ps
tROutput Rise Time 30% to 70% 250 500 ps
tFOutput Fall Time 30% to 70% 250 500 ps
odc Output Duty Cycle 40 60 %
NOTE: Electrical parameters are guaranteed over the specifi ed ambient operating temperature range, which is established
when the device is mounted in a test socket with maintained transverse airfl ow greater than 500 lfpm. The device will meet
specifi cations after thermal equilibrium has been reached under these conditions.
NOTE: All parameters measured at 166MHz unless noted otherwise.
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defi ned as skew between outputs at the same supply voltage and with equal load conditions.
Measured at VDDO/2.
NOTE 3: Defi ned as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at VDDO/2.
NOTE 4: This parameter is defi ned in accordance with JEDEC Standard 65.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL Input Low Voltage -0.3 1.3 V
IIH Input High Current VDD = VIN = 3.465V 150 µA
IIL Input Low Current VDD = 3.465V, VIN = 0V -5 µA
VOH Output High Voltage; NOTE 1 2.1 V
VOL Output Low Voltage; NOTE 1 0.5 V
NOTE 1: Outputs terminated with 50ΩΩΩΩ to VDDO/2. See Parameter Measurement Section, “3.3V/2.5V Output Load Test Circuit”.
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20155
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fMAX Output Frequency 166 MHz
tpLH Propagation Delay, Low-to-High; NOTE 1 ƒ 166MHz 2.3 3.7 ns
tsk(o) Output Skew; NOTE 2, 4 ƒ = 133MHz 60 ps
tsk(pp) Part-to-Part Skew; NOTE 3, 4 650 ps
tROutput Rise Time 30% to 70% 250 500 ps
tFOutput Fall Time 30% to 70% 250 500 ps
odc Output Duty Cycle 40 60 %
NOTE: Electrical parameters are guaranteed over the specifi ed ambient operating temperature range, which is established
when the device is mounted in a test socket with maintained transverse airfl ow greater than 500 lfpm. The device will meet
specifi cations after thermal equilibrium has been reached under these conditions.
All parameters measured at 166MHz unless noted otherwise.
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defi ned as skew between outputs at the same supply voltage and with equal load conditions.
Measured at VDDO/2.
NOTE 3: Defi ned as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at VDDO/2.
NOTE 4: This parameter is defi ned in accordance with JEDEC Standard 65.
TABLE 4B. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = -40°C TO 85°C
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20156
ADDITIVE PHASE JITTER
The spectral purity in a band at a specifi c offset from the fundamental
compared to the power of the fundamental is called the dBc Phase
Noise. This value is normally expressed using a Phase noise plot
and is most often the specifi ed plot in many applications. Phase
noise is defi ned as the ratio of the noise power present in a 1Hz
band at a specifi ed offset from the fundamental frequency to the
power value of the fundamental. This ratio is expressed in decibels
As with most timing specifi cations, phase noise measurements has
issues relating to the limitations of the equipment. Often the noise
oor of the equipment is higher than the noise fl oor of the device.
(dBm) or a ratio of the power in the 1Hz band to the power in the
fundamental. When the required offset is specifi ed, the phase noise
is called a dBc value, which simply means dBm at a specifi ed offset
from the fundamental. By investigating jitter in the frequency domain,
we get a better understanding of its effects on the desired application
over the entire time record of the signal. It is mathematically possible
to calculate an expected bit error rate given a phase noise plot.
This is illustrated above. The device meets the noise fl oor of what
is shown, but can actually be lower. The phase noise is dependent
on the input source and measurement equipment.
Additive Phase Jitter @
125MHz (12kHz to 20MHz) = 0.17ps typical
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20157
PARAMETER MEASUREMENT INFORMATION
2.5V OUTPUT LOAD AC TEST CIRCUIT3.3V OUTPUT LOAD AC TEST CIRCUIT
OUTPUT SKEW
OUTPUT RISE/FALL TIME OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
PROPAGATION DELAY
PART-TO-PART SKEW
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20158
TRANSISTOR COUNT
The transistor count for 8304I is: 416
TABLE 5. θJAVS. AIR FLOW TABLE
θJA by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 153.3°C/W 128.5°C/W 115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 112.7°C/W 103.3°C/W 97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
RELIABILITY INFORMATION
TABLE 6. PACKAGE DIMENSIONS - SUFFIX M
Reference Document: JEDEC Publication 95, MS-012
PACKAGE OUTLINE - SUFFIX M FOR 8 LEAD SOIC
SYMBOL Millimeters
MINIMUN MAXIMUM
N8
A 1.35 1.75
A1 0.10 0.25
B 0.33 0.51
C 0.19 0.25
D 4.80 5.00
E 3.80 4.00
e 1.27 BASIC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.27
α
PACKAGE OUTLINE AND DIMENSIONS
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 20159
TABLE 7. ORDERING INFORMATION
Part/Order Number Marking Package Shipping Packaging Temperature
8304AMILF 8304AMIL 8 lead “Lead Free” SOIC Tube -40°C to +85°C
8304AMILFT 8304AMIL 8 lead “Lead Free” SOIC Tape and Reel -40°C to +85°C
8304I Data Sheet
©2015 Integrated Device Technology, Inc December 10, 201510
REVISION HISTORY SHEET
Rev Table Page Description of Change Date
B3B 3 LVCMOS/LVTTL DC Characteristics Table, added IOH and IOL Test Conditions
to VOH and VOL rows. 4/4/02
BT7
1
8
Features Section - added lead-free bullet.
Ordering Information Table - added lead-free part number, marking and note.
Updated datasheet format.
11/09/06
C
T4A
T7
4
6
9
3.3V AC Characteristics Table - added Buffer Additive Phase Jitter spec.
Added Buffer Additive Phase Jitter Plot.
Ordering Information - Deleted “ICS” from the Part/Order number column.
2/11/09
DT1
T2
1
2
2
Pin Assignment - corrected “pullup” label to “pulldown” label.
Pin Description Table - deleted pullup from note.
Pin Characteristics Table - deleted Rpullup row.
10/29/10
D
T7 9
Removed ICS in the part numbers.
Removed LF note at the bottom of the Ordering Information table.
Removed the quantity of 2500 from the Tape & Reel in the Ordering information
table.
Updated datasheet header and footer.
12/10/15
8304I Data Sheet
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operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided
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