LM567/LM567C Tone Decoder General Description The LM567 and LM567C are general purpose tone decoders designed to provide a saturated transistor switch to ground when an input signal is present within the passband. The circuit consists of an I and Q detector driven by a voltage controlled oscillator which determines the center frequency of the decoder. External components are used to independently set center frequency, bandwidth and output delay. Features 20 to 1 frequency range with an external resistor Logic compatible output with 100 mA current sinking capability Bandwidth adjustable from 0 to 14% High rejection of out of band signals and noise Immunity to false signals Highly stable center frequency Center frequency adjustable from 0.01 Hz to 500 kHz Applications Touch tone decoding Precision oscillator Frequency monitoring and control Wide band FSK demodulation Ultrasonic controls Carrier current remote controls Communications paging decoders Connection Diagrams Metal Can Package Dual-In-Line and Small Outline Packages 697501 Top View Order Number LM567H or LM567CH See NS Package Number H08C OBSOLETE (c) 2012 Texas Instruments Incorporated 6975 SNOSBQ4C 697502 Top View Order Number LM567CM See NS Package Number M08A Order Number LM567CN See NS Package Number N08E www.ti.com LM567/LM567C Tone Decoder March 25, 2012 LM567/LM567C LM567H LM567CH, LM567CM, LM567CN Soldering Information Dual-In-Line Package Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Supply Voltage Pin Power Dissipation (Note 2) V8 V3 V3 Storage Temperature Range Operating Temperature Range -55C to +125C 0C to +70C Soldering (10 sec.) Small Outline Package 9V 1100 mW 15V -10V V4 + 0.5V -65C to +150C 260C Vapor Phase (60 sec.) 215C Infrared (15 sec.) 220C See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of soldering surface mount devices. Electrical Characteristics AC Test Circuit, TA = 25C, V+ = 5V Parameters LM567 Conditions Power Supply Voltage Range LM567C/LM567CM Units Min Typ Max Min Typ Max 4.75 5.0 9.0 4.75 5.0 9.0 V Power Supply Current Quiescent RL = 20k 6 8 7 10 mA Power Supply Current Activated RL = 20k 11 13 12 15 mA 25 mVrms Input Resistance 18 Smallest Detectable Input Voltage IL = 100 mA, fi = fo Largest No Output Input Voltage IC = 100 mA, fi = fo Largest Simultaneous Outband Signal to Inband Signal Ratio Minimum Input Signal to Wideband Noise Bn = 140 kHz Ratio 20 10 Largest Detection Bandwidth 12 Largest Detection Bandwidth Skew Largest Detection Bandwidth Variation with Temperature Largest Detection Bandwidth Variation with Supply Voltage 20 15 25 15 20 10 mVrms 6 6 dB -6 -6 dB 14 16 1 2 1 Highest Center Frequency 100 Center Frequency Stability (4.75-5.75V) 0 < TA < 70 -55 < TA < +125 Center Frequency Shift with Supply Voltage 4.75V-6.75V 4.75V-9V 10 2 500 0.5 14 18 % of fo 2 3 % of fo 0.1 1 100 35 60 35 140 Fastest ON-OFF Cycling Rate k 15 0.1 4.75-6.75V 20 1.0 2.0 fo/20 %/C 5 %V 500 kHz 35 60 35 140 ppm/C ppm/C 0.4 2.0 2.0 %/V %/V fo/20 Output Leakage Current V8 = 15V 0.01 25 0.01 25 A Output Saturation Voltage ei = 25 mV, I8 = 30 mA ei = 25 mV, I8 = 100 mA 0.2 0.6 0.4 1.0 0.2 0.6 0.4 1.0 V Output Fall Time 30 30 ns Output Rise Time 150 150 ns Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 2: The maximum junction temperature of the LM567 and LM567C is 150C. For operating at elevated temperatures, devices in the TO-5 package must be derated based on a thermal resistance of 150C/W, junction to ambient or 45C/W, junction to case. For the DIP the device must be derated based on a thermal resistance of 110C/W, junction to ambient. For the Small Outline package, the device must be derated based on a thermal resistance of 160C/W, junction to ambient. Note 3: Refer to RETS567X drawing for specifications of military LM567H version. www.ti.com 2 LM567/LM567C Schematic Diagram 697503 3 www.ti.com LM567/LM567C Typical Performance Characteristics Typical Frequency Drift Typical Bandwidth Variation 697511 697510 Typical Frequency Drift Typical Frequency Drift 697513 697512 Bandwidth vs Input Signal Amplitude Largest Detection Bandwidth 697515 697514 www.ti.com 4 LM567/LM567C Detection Bandwidth as a Function of C2 and C3 Typical Supply Current vs Supply Voltage 697517 697516 Greatest Number of Cycles Before Output Typical Output Voltage vs Temperature 697518 697519 5 www.ti.com LM567/LM567C Typical Applications Touch-Tone Decoder 697505 Component values (typ) R1 6.8 to 15k R2 4.7k R3 20k C1 0.10 mfd C2 1.0 mfd 6V C3 2.2 mfd 6V C4 250 mfd 6V www.ti.com 6 LM567/LM567C Oscillator with Quadrature Output Oscillator with Double Frequency Output 697506 697507 Connect Pin 3 to 2.8V to Invert Output Precision Oscillator Drive 100 mA Loads 697508 AC Test Circuit Applications Information The center frequency of the tone decoder is equal to the free running frequency of the VCO. This is given by The bandwidth of the filter may be found from the approximation Where: Vi = Input voltage (volts rms), Vi 200mV C2 = Capacitance at Pin 2(F) 697509 fi = 100 kHz + 5V *Note: Adjust for fo = 100 kHz. 7 www.ti.com LM567/LM567C LM567C MDC MWC Tone Decoder 697523 Die Layout (C - Step) Die/Wafer Characteristics Fabrication Attributes General Die Information Physical Die Identification LM567C Bond Pad Opening Size (min) 91m x 91m Die Step C Bond Pad Metalization 0.5% COPPER_BAL. ALUMINUM Passivation VOM NITRIDE Back Side Metal BARE BACK Physical Attributes Wafer Diameter 150mm Dise Size (Drawn) 1600m x 1626m Back Side Connection 63.0mils x 64.0mils Thickness 406m Nominal Min Pitch 198m Nominal Floating Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (C - Step) (Referenced to die center, coordinates in m) NC = No Connection, N.U. = Not Used SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE X Y X Y OUTPUT FILTER 1 -673 686 91 x 91 LOOP FILTER 2 -673 -419 91 x 91 INPUT 3 -673 -686 91 x 91 V+ 4 -356 -686 91 x 91 TIMING RES 5 673 -122 91 x 91 TIMING CAP 6 673 76 91 x 91 GND 7 178 686 117 x 91 OUTPUT 8 -318 679 117 x 104 www.ti.com 8 LM567/LM567C IN U.S.A Tel #: 1 877 Dial Die 1 877 342 5343 Fax: 1 207 541 6140 IN EUROPE Tel: 49 (0) 8141 351492 / 1495 Fax: 49 (0) 8141 351470 IN ASIA PACIFIC Tel: (852) 27371701 IN JAPAN Tel: 81 043 299 2308 9 www.ti.com LM567/LM567C Physical Dimensions inches (millimeters) unless otherwise noted Metal Can Package (H) Order Number LM567H or LM567CH NS Package Number H08C www.ti.com 10 LM567/LM567C Small Outline Package (M) Order Number LM567CM NS Package Number M08A Molded Dual-In-Line Package (N) Order Number LM567CN NS Package Number N08E 11 www.ti.com LM567/LM567C Tone Decoder Notes www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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