Page <4> V1.105/09/19
Thick Film Chip Resistors
Newark.com/multicomp-pro
Farnell.com/multicomp-pro
Element14.com/multicomp-pro
Test and Requirements:
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56 (rated
temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing
also meets the requirements specied by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness
testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1,
subclause 5.3. Unless otherwise specied, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated ux.
Test Procedure / Test Method
Requirement
Resistor 0Ω
Electrical
Characteristics
JISC5201-1: 1998
Clause 4.8
- DC resistance values measurement
- Temperature Coefcient of Resistance (T.C.R)
Natural resistance change per change in degree centigrade.
R1 : Resistance at reference temperature (20°C +5°C / -1 °C)
R2 : Resistance at test temperature (-55°C or +155°C)
Within the specied
tolerance Refer to
"QUICK REFERENCE
DATA"
<50mΩ
Resistance to
soldering heat(R.S.H)
JISC5201-1:1998
Clause 4.18
Un-mounted chips completely immersed for 10 ±1second in a
SAC solder bath at 260°C ±5°C
±1%: ∆R/Rmax.
±(0.5%+0.05Ω )
no visible damage
<50mΩ
Solderability
JISC5201-1: 1998
Clause 4.17
Un-mounted chips completely immersed for 10 ±1second in a
SAC
solder bath at 235°C ±5°C
95% coverage min., good
tinning and no visible damage
Temperature cycling
JISC5201-1: 1998
Clause 4.19
30 minutes at -55°C ±3°C, 2-3 minutes at 20°C +5°C -1°C,
30 minutes at
+155°C ±3°C, 2-3 minutes at 20°C +5°C -1°C, total 5 continuous
cycles
±1%: ∆R/Rmax.
±(0.5%+0.05Ω)
No visible damage
<50mΩ
High Temperature
Exposure
MIL-STD-202
method 108
1,000 +48/-0 hours; without load in a temperature chamber
controlled 155 ±3°C
±1%:∆R/
Rmax.±(1%+0.1Ω)
No visible damage
<50mΩ
Bending strength
JISC5201-1: 1998
Clause 4.33
Resistors mounted on a 90mm glass epoxy resin PCB(FR4),
bending once 3mm for 10sec, 5mm for MCWR04
±1%:∆R/
Rmax.±(1%+0.05Ω)
No visual damaged
<50mΩ
Adhesion
JISC5201-1: 1998
Clause 4.32
Pressurizing force: 5N, Test time:
10
±
1sec.
No remarkable damage or
removal of the terminations
Short Time Overload
(STOL)
JISC5201-1: 1998
Clause 4.13
2.5 times RCWV or max. overload voltage, for 5seconds
±1%: ∆R/R max.
±(1%+0.05Ω)
No visible damage
<50mΩ
t1 : 20°C+5°C/-1 °C; t2 : -55°C or +155°C