MHz Band Quartz Crystal
(KSX-35 Series)
Features
• Reference frequency for telecommunication
system is in product line up
• Reflow soldering available
• Using Ceramic Package of which reliability is
high
• Small, low profile and market standard
dimensions
Applications
• Mobile phone IC Card GPS
How to Order
KSX-35-13000K C A-Q C 0 R
qSeries
wNominal Frequency
eLoad Capacitance
rFrequency Stability
tOperating Temperature
yFrequency Temperature Stability
uFrequency Offset
iPackaging
wq ert y u i
Dimensions (Unit : mm)
Recommended Land Pattern (Unit : mm) Recommended Reflow profile
Packaging
• Reel (Unit : mm) • Taping (Unit : mm)
C12pF
A±10ppm
Q−30˚C to +85˚C
C±15ppm
00Hz(Standard)
RTaping
5.0±0.2
#4 pin
#1 pin
#3 pin
#1 pin #2 pin
#4 pin #3 pin
#2 pin
<PIN CONNECTION>
TOP VIEW
3.2±0.2
0.9max
1.4
1.2
2.6
1.2±0.2
2.2±0.2
2.0±0.2
φ330.0±2.0 13.5±0.2
2.2±0.1
4.0±0.1
8.0±0.1 1.2±0.1
5.45±0.1
0.2(max)
0.2(max) 0.2(max)
5˚(max)
5˚(max)
5.5±0.1 1.75±0.1
12.0±0.3
3.6±0.1 0.3±0.05φ1.5
φ1.55±0.05
2.0±0.1
φ21.0±0.8
φ100.0±2.0
13.0±0.2
R1
1.8±0.2
1.2±0.2
0.8
Marking #2, #4 is
connected with metal
cap of top.
50
12345
100
200
250
Temp (˚C)
Time (min)
150
Ramp-Up 1-3˚C/s
Hold-Time 1-2min
260˚C±5˚C 10sec(MAX)
200˚C Over 30-45sec
Cool Down 2.5-5˚C/s
+0.1
−0.0
0.2(max)
Specifications
Parameters Symbol Specification Remark
Nominal Frequency f0 13 to 26MHz
Mode of Vibration Fundamental Standard
Load Capacitance CL 12.0pF Standard
Frequency Stability ∆f/f ±10.0ppm +25˚C±2˚C
Storage Temperature
Tstg −40˚C to +85˚C
Operating Temperature
Topr −30˚C to +85˚C for Mobile phone
Frequency Temperature Stability
∆f/T ±15.0ppm for Mobile phone
Series Resistance CI 50Ω(max) Different by Nominal frequency
Code Freq.(MHz) Code Freq.(MHz)
13000K 13.000000 19440K 19.440000
14400K 14.400000 19680K 19.680000
16800K 16.800000 19800K 19.800000
19200K 19.200000 26000K 26.000000
• Please ask sales if you request other frequency.
MHz Band Quartz Crystal
(KSX-36 Series)
Features
• Reference frequency for telecommunication
system is in product line up
• Reflow soldering available
• Using Ceramic Package of which reliability is
high
• Small, low profile and market standard
dimensions
Applications
• Mobile phone IC Card GPS
How to Order
KSX-36-13000K C A-Q C 0 R
qSeries
wNominal Frequency
eLoad Capacitance
rFrequency Stability
tOperating Temperature
yFrequency Temperature Stability
uFrequency Offset
iPackaging
wq ert y u i
Dimensions
Specifications
(Unit : mm)
Recommended Land Pattern (Unit : mm) Recommended Reflow profile
Packaging
• Reel (Unit : mm) • Taping (Unit : mm)
C12pF
A±10ppm
Q−30˚C to +85˚C
C±15ppm
00Hz(Standard)
RTaping
Parameters Symbol Specification Remark
Nominal Frequency f0 13 to 27.8208MHz
Mode of Vibration Fundamental Standard
Load Capacitance CL 12.0pF Standard
Frequency Stability ∆f/f ±10.0ppm +25˚C±2˚C
Storage Temperature
Tstg −40˚C to +85˚C
Operating Temperature
Topr −30˚C to +85˚C for Mobile phone
Frequency Temperature Stability
∆f/T ±15.0ppm for Mobile phone
Series Resistance CI 50Ω(max) Different by Nominal frequency
2.0±0.2
φ330.0±2.0 13.5±0.2
2.2±0.1
4.0±0.1
8.0±0.1 1.2±0.1
6.35±0.1
0.2(max)
0.2(max) 0.2(max)
5˚(max)
5˚(max)
5.5±0.1 1.75±0.1
12.0±0.3
3.9±0.1 0.3±0.05φ1.5
φ1.55±0.05
2.0±0.1
φ21.0±0.8
φ100.0±2.0
13.0±0.2
R1
<PIN CONNECTION>
TOP VIEW
Marking #2, #4 is
connected with metal
cap of top.
+0.1
−0.0
0.2(max)
6.0±0.2
4-R0.2
#4
#2
#3
#1
#4
#1
#3
#2
3.5±0.21.5 1.05max0.1
0.1
1.4
3.0
4.4
1.3±0.2
2.6±0.2
1.7±0.2
1.5±0.2
Code Freq.(MHz) Code Freq.(MHz)
13000K 13.000000 19680K 19.680000
14400K 14.400000 19800K 19.800000
16800K 16.800000 26000K 26.000000
19200K 19.200000 27820K 27.820800
19440K 19.440000
50
12345
100
200
250
Temp (˚C)
Time (min)
150
Ramp-Up 1-3˚C/s
Hold-Time 1-2min
260˚C±5˚C 10sec(MAX)
200˚C Over 30-45sec
Cool Down 2.5-5˚C/s
