EMIF02-MIC03F2 2-line IPADTM, EMI filter and ESD protection Datasheet - production data * High reliability offered by monolithic integration * High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards: * IEC 61000-4-2 level 4, on input pins - 15 kV (air discharge) - 8 kV (contact discharge) * IEC 61000-4-2 Level 1, on output pins - 2 kV (air discharge) - 2 kV (contact discharge) Flip-Chip package * MIL STD 883E - Method 3015-6 Class 3 Figure 1. Pin configuration (bump side) and basic cell configuration 3 2 1 I2 I1 GND O2 Description B The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. Low-pass Filter Input Output Ri/o = 68 Cline = 100 pF GND GND * Mobile phones (differential microphone filtering and ESD protection). A C O1 Application This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. GND Features * EMI symmetrical (I/O) low-pass filter * High efficiency in EMI filtering * Very low PCB space consuming: 1.07 mm x 1.47 mm * Very thin package: 0.65 mm * High efficiency in ESD suppression July 2014 This is information on a product in full production. TM: IPAD is a trademark of STMicroelectronics. DocID11739 Rev 3 1/8 www.st.com Electrical characteristics 1 EMIF02-MIC03F2 Electrical characteristics Table 1. Absolute maximum ratings (TAMB = 25 C) Symbol Tj Parameter Value Unit 125 C Maximum junction temperature Top Operating temperature range -40 to +85 C Tstg Storage temperature range -55 to +150 C Table 2. Electrical characteristics (Tamb = 25 C) Symbol Parameters I VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage IPP IR IRM VCL VBR VRM Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output C line Input capacitance per line IRM IR VRM VBR VCL V IPP Table 3. Symbol 2/8 Test condition Min Typ 6 8 Max Unit VBR IR = 1 mA V IRM VRM = 3 V per line RI/O Tolerance 20% 68 Cline VR = 0 V 100 pF 500 DocID11739 Rev 3 nA EMIF02-MIC03F2 Electrical characteristics Figure 2. Attenuation simulation with 1 k input and 10 k ouput 0 Figure 3. Analog crosstalk measurements db 0.00 dB -10.00 50 measurements -10 -20.00 -20 -30.00 -30 50 simulations -40.00 -40 -50.00 -50 Input: 1 k Output: 10 k AC simulations -60 -60.00 -70.00 -70 F (Hz) -80.00 100.0k -80 10 100 1k 10k 100k 1M 10M 100M 1.0M 10.0M 100.0M 1.0G f/Hz 1G Figure 4. ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and one output V(out) Figure 5. ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and one output V(out) Figure 6. Line capacitance versus applied voltage. C(pF) 140 120 F=1MHz V osc=30mVRMS T j=25C 100 80 60 40 20 VR(V) 0 0 1 2 3 DocID11739 Rev 3 4 5 3/8 8 Electrical characteristics EMIF02-MIC03F2 Figure 7. Aplac mode IN1 Rbump Lbump Rmic Lmic Lbump Rbump GND OUT1 Lsub model = D1 model = D2 Rsub Rbump GND model = D3 Lbump model = D1 model = D2 Lgnd Cgnd IN2 Rgnd OUT2 Rbump Lbump Rmic Lmic Lbump Rbump Ground return EMIF02-MIC03F1 model Figure 8. Aplac parameters Model D1 Model D3 Model D2 aplacvar Rmic 68 CJO=Cdiode1 CJO=Cdiode3 CJO=Cdiode2 aplacvar Lmic 10p BV=7 BV=7 BV=7 aplacvar Cdiode1 100pF IBV=1u IBV=1u IBV=1u aplacvar Cdiode2 3.6pF IKF=1000 IKF=1000 IKF=1000 aplacvar Cdiode3 IS=10f IS=10f IS=10f 1.17nF ISR=100p ISR=100p ISR=100p aplacvar Lbump 50pH N=1 N=1 N=1 aplacvar Rbump 20m M=0.3333 M=0.3333 M=0.3333 aplacvar Rsub 0.5m RS=0.7 RS=0.12 RS=0.3 aplacvar Rgnd 10m VJ=0.6 VJ=0.6 VJ=0.6 aplacvar Lgnd 50pH TT=50n TT=50n TT=50n aplacvar Cgnd 0.15pF aplacvar Lsub 10pH 4/8 DocID11739 Rev 3 EMIF02-MIC03F2 2 Ordering information scheme Ordering information scheme Figure 9. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 10. Flip Chip dimensions 500m 10 315m 50 650m 50 15 1.47mm 50m 250m 10 50 0 m 3 1.07mm 50m DocID11739 Rev 3 5/8 8 Ordering information EMIF02-MIC03F2 Figure 11. Footprint Figure 12. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 m recommended, 300 m max E Solder stencil opening: 330 m x x z y ww Solder mask opening recommendation: 340 m min for 315 m copper pad diameter Dot identifying Pin A1 location 2.0 0.05 O 1.55 0.05 4.0 0.1 8.0 0.3 3.5 - 0.05 0.20 0.05 1.75 0.1 Figure 13. Flip Chip tape and reel specification ST E ST E ST E xxz yww xxz yww xxz yww 2.0 0.1 0.55 0.1 User direction of unreeling All dimensions in mm 4 Ordering information Table 4. Ordering information Order code EMIF02-MIC03F2 Note: 6/8 Marking Package Weight Base qty Delivery mode FW Flip Chip 2.1 mg 5000 Tape and reel (7") More packing information is available in the applications note: AN1235: "Flip Chip: package description and recommendations for use" AN 1751: "EMI filters: Recomendations and measurements" DocID11739 Rev 3 EMIF02-MIC03F2 5 Revision history Revision history Table 5. Document revision history Date Revision Changes 14-Oct-2006 1 Initial release 31-Mar-2014 2 Reformatted to current standards. Added ECOPACK statement. Updated Figure 2 and Figure 13. 18/07/2014 3 Updated typo error on Features. DocID11739 Rev 3 7/8 8 EMIF02-MIC03F2 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2014 STMicroelectronics - All rights reserved 8/8 DocID11739 Rev 3