1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
1.2 Features
1.3 Applications
BAS70 series;
1PS7xSB70 series
General-purpose Schottky diodes
Rev. 08 — 4 May 2006 Product data sheet
Table 1. Product overview
Type number Package Configuration
Philips JEITA
1PS76SB70 SOD323 SC-76 single diode
1PS79SB70 SOD523 SC-79 single diode
BAS70 SOT23 - single diode
BAS70H SOD123F - single diode
BAS70L SOD882 - single diode
BAS70W SOT323 SC-70 single diode
BAS70-04 SOT23 - dual series
BAS70-04W SOT323 SC-70 dual series
BAS70-05 SOT23 - dual common cathode
BAS70-05W SOT323 SC-70 dual common cathode
BAS70-06 SOT23 - dual common anode
BAS70-06W SOT323 SC-70 dual common anode
BAS70-07 SOT143B - dual isolated
BAS70-07S SOT363 SC-88 dual isolated
BAS70-07V SOT666 - dual isolated
BAS70VV SOT666 - triple isolated
BAS70XY SOT363 SC-88 quadruple; 2 series
nHigh switching speed nLow leakage current
nHigh breakdown voltage nLow capacitance
nUltra high-speed switching nVoltage clamping
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 2 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
2. Pinning information
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current - - 70 mA
VFforward voltage IF=1mA [1] - - 410 mV
VRreverse voltage - - 70 V
Table 3. Pinning
Pin Description Simplified outline Symbol
BAS70H; 1PS76SB70; 1PS79SB70
1 cathode [1]
2 anode
BAS70L
1 cathode [1]
2 anode
BAS70; BAS70W
1 anode
2 not connected
3 cathode
BAS70-04; BAS70-04W
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
001aab540
12
sym001
12
21
Transparent
top view
sym001
12
006aaa144
12
3
006aaa436
1
3
2
n.c.
006aaa144
12
3
006aaa437
12
3
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 3 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
BAS70-05; BAS70-05W
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 1),
cathode (diode 2)
BAS70-06; BAS70-06W
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 1),
anode (diode 2)
BAS70-07
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 2)
4 anode (diode 1)
BAS70-07S; BAS70-07V
1 anode (diode 1)
2 not connected
3 cathode (diode 2)
4 anode (diode 2)
5 not connected
6 cathode (diode 1)
BAS70VV
1 anode (diode 1)
2 anode (diode 2)
3 anode (diode 3)
4 cathode (diode 3)
5 cathode (diode 2)
6 cathode (diode 1)
Table 3. Pinning
…continued
Pin Description Simplified outline Symbol
006aaa144
12
3
006aaa438
12
3
006aaa144
12
3
006aaa439
12
3
21
34
006aaa434
2
34
1
001aab555
6 45
1 32
006aaa440
654
123
123
456 6
1
5
2
4
3
sym046
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 4 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
[1] The marking bar indicates the cathode.
3. Ordering information
BAS70XY
1 anode (diode 1)
2 cathode (diode 2)
3 anode (diode 3),
cathode (diode 4)
4 anode (diode 4)
5 cathode (diode 3)
6 cathode (diode 1),
anode (diode 2)
Table 3. Pinning
…continued
Pin Description Simplified outline Symbol
132
4
56
006aaa256
654
123
Table 4. Ordering information
Type number Package
Name Description Version
1PS76SB70 SC-76 plastic surface-mounted package; 2 leads SOD323
1PS79SB70 SC-79 plastic surface-mounted package; 2 leads SOD523
BAS70 - plastic surface-mounted package; 3 leads SOT23
BAS70H - plastic surface-mounted package; 2 leads SOD123F
BAS70L - leadless ultra small plastic package; 2 terminals;
body 1.0 ×0.6 ×0.5 mm SOD882
BAS70W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-04 - plastic surface-mounted package; 3 leads SOT23
BAS70-04W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-05 - plastic surface-mounted package; 3 leads SOT23
BAS70-05W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-06 - plastic surface-mounted package; 3 leads SOT23
BAS70-06W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-07 - plastic surface-mounted package; 4 leads SOT143B
BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT363
BAS70-07V - plastic surface-mounted package; 6 leads SOT666
BAS70VV - plastic surface-mounted package; 6 leads SOT666
BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 5 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Tj=25°C prior to surge.
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
1PS76SB70 S2 BAS70-05W 75*
1PS79SB70 G BAS70-06 76*
BAS70 73* BAS70-06W 76*
BAS70H AH BAS70-07 77*
BAS70L S8 BAS70-07S 77*
BAS70W 73* BAS70-07V 77
BAS70-04 74* BAS70VV N1
BAS70-04W 74* BAS70XY 70*
BAS70-05 75* - -
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 70 V
IFforward current - 70 mA
IFRM repetitive peak forward
current tp≤1s;δ≤0.5 - 70 mA
IFSM non-repetitive peak forward
current tp≤10 ms [1] - 100 mA
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 6 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (BAS70-07S) - - 416 K/W
SOT666 (BAS70VV) [2] - - 700 K/W
SOT666 (BAS70-07V) [2] - - 416 K/W
SOD123F [2] - - 330 K/W
SOD323 - - 450 K/W
SOD523 [2] - - 450 K/W
SOD882 [2] - - 500 K/W
SOT323 - - 625 K/W
Rth(j-sp) thermal resistance from
junction to solder point
SOT363 (BAS70XY) [3] - - 260 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage [1]
IF= 1 mA - - 410 mV
IF= 10 mA - - 750 mV
IF=15mA - - 1 V
IRreverse current VR= 50 V - - 100 nA
VR=70V - - 10 µA
Cddiode capacitance VR= 0 V; f = 1 MHz - - 2 pF
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 7 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(4) Tamb =−40 °C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
f = 10 kHz Tamb =25°C; f = 1 MHz
Fig 3. Differential forward resistance as a function of
forward current; typical values Fig 4. Diode capacitance as a function of reverse
voltage; typical values
10
0 0.2 0.4 0.6 0.8 1
1
IF
(mA)
VF (V)
mra803
(1) (4)(2) (3)
102
10−1
10−2
mra805
1
10
102
020406080
VR (V)
IR
(µA) (1)
(3)
(2)
10−1
10−2
10−3
10
1110
rdif
(Ω)
IF (mA)
mra802
10−1102
102
103
0
0.5
1
1.5
2
0 20406080
mra804
Cd
(pF)
VR (V)
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 8 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
8. Package outline
Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79)
Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F
Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70)
03-12-17Dimensions in mm
0.25
0.10
0.45
0.15
2.7
2.3 1.8
1.6
0.40
0.25
1.1
0.8
1.35
1.15
1
2
02-12-13Dimensions in mm
1.65
1.55 1.25
1.15
0.17
0.11
0.34
0.26
0.65
0.58
0.85
0.75
1
2
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4 2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
03-04-17Dimensions in mm
0.55
0.47
0.65
0.62
0.55 0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 9 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)
Fig 13. Package outline SOT666
04-11-16Dimensions in mm
3.0
2.8 1.1
0.9
2.5
2.1 1.4
1.2
1.7
1.9
0.48
0.38 0.15
0.09
0.45
0.15
0.88
0.78
21
34
04-11-08Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0 1.35
1.15
2.2
1.8 1.1
0.8
0.45
0.15
132
465
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 10 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70L SOD882 2 mm pitch, 8 mm tape and reel - - - -315
BAS70W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-07S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS70-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS70VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS70XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 11 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
10. Soldering
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
MSA415
1.40
4.40
5.00
1.202.75
solder lands
solder resist
occupied area
preferred transport direction during soldering
MGS343
solder lands
solder resist
occupied area
solder paste
1.80
1.90
0.30
0.40
0.50
1.20 0.60
2.15
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 12 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00 0.85 2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 13 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
MBL872
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)0.70
(2×)0.80
(2×)
solder lands
solder resist
occupied area
solder paste
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 14 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
MSA429
0.852.35
0.55
(3x)
1.3250.75
2.40
2.65
1.30
3
2
1
0.60
(3x) 0.50
(3x) 1.90
solder lands
solder resist
occupied area
solder paste
MSA419
4.00
4.60
2.103.65
1.15
2.70
3
2
10.90
(2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 15 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
msa441
0.60
(4x)
1.30
2.50
3.00
2.70
0.50 (3x)
0.60 (3x)
3.25
43
21
0.90
1.00
solder lands
solder resist
occupied area
solder paste
MSA422
4.00 4.60
1.20 (3x)
4.45
12
34
1.15
3.40 1.00
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 16 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
Fig 26. Wave soldering footprint SOT363 (SC-88)
MSA432
solder lands
solder resist
occupied area
solder paste
1.20
2.40
0.50
(4×)
0.40
(2×)0.90 2.10
0.50
(4×)
0.60
(2×)
2.35
2.65
solder lands
solder resist
occupied area
1.15
3.75
transport direction during soldering
1.000.30 4.00
4.50
5.25
sot363
Dimensions in mm
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 17 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
solder lands
solder resist
placement area
occupied area
0.075 Dimensions in mm
2.75
2.45
2.10
1.60
1.20
2.20
2.50
2.00 1.70 1.00 0.30 (2×)
0.15
(4×)
0.375
(4×)
0.40
(6×)
0.55
(2×)
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 18 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAS70_1PS7XSB70_
SER_8 20060504 Product data sheet - BAS70_1PS7XSB70_
SER_7
Modifications: •Type number BAS70XY added
•Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523
•Figure 26 “Wave soldering footprint SOT363 (SC-88)”: amended
•Figure 27 “Reflow soldering footprint SOT666”: amended
•Section 12 “Legal information”: updated
BAS70_1PS7XSB70_
SER_7 20050718 Product data sheet - 1PS76SB70_2
1PS79SB70_1
BAS70H_1
BAS70L_1
BAS70-07V_1
BAS70VV_1
BAS70W_3
BAS70-07S_4
BAS70_SERIES_6
1PS76SB70_2 20040126 Product specification - 1PS76SB70_1
1PS79SB70_1 19980716 Product specification - -
BAS70H_1 20050425 Product data sheet - -
BAS70L_1 20030520 Product specification - -
BAS70-07V_1 20020117 Product specification - -
BAS70VV_1 20040910 Product data sheet - -
BAS70W_3 19990326 Product specification - BAS70W_2
BAS70-07S_4 20030411 Product specification - BAS70_07S_3
BAS70_SERIES_6 20011011 Product specification - BAS70_5
BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 08 — 4 May 2006 19 of 20
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
Philips Semiconductors BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 4 May 2006
Document identifier: BAS70_1PS7XSB70_SER_8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 4
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information. . . . . . . . . . . . . . . . . . . . . 10
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13 Contact information. . . . . . . . . . . . . . . . . . . . . 19
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
