MCP23008-E/SS - Microchip Technology

MCP23008/MCP23S08

Features

• 8-bit remote bidirectional I/O port

- I/O pins default to input

• High-speed I2C™ interface (MCP23008)

- 100 kHz

- 400 kHz

-1.7MHz

• High-speed SPI interface (MCP23S08)

-10MHz

• Hardware address pins

- Three for the MCP23008 to allow up to eight

devices on the bus

- Two for the MCP23S08 to allow up to four

devices using the same chip-select

• Configurable interrupt output pin

- Configurable as active-high, active-low or

open-drain

• Configurable interrupt source

- Interrupt-on-change from configured defaults

or pin change

• Polarity Inversion register to configure the polarity

of the input port data

• External reset input

• Low standby current: 1 µA (max.)

• Operating voltage:

- 1.8V to 5.5V @ -40°C to +85°C

I2C @ 100 kHz

SPI @ 5 MHz

- 2.7V to 5.5V @ -40°C to +85°C

I2C @ 400 kHz

SPI @ 10 MHz

- 4.5V to 5.5V @ -40°C to +125°C

I2C @ 1.7 kHz

SPI @ 10 MHz

Packages

• 18-pin PDIP (300 mil)

• 18-pin SOIC (300 mil)

• 20-pin SSOP

• 20-pin QFN

Block Diagram

GP0

GP1

GP2

GP3

GP4

GP5

GP6

GP7

Serial

Control

GPIO

SCL

SDA

RESET

INT

Configuration/

A2:A0 3

Control

Registers

Serializer/

Deserializer

Interrupt

Logic

VDD

VSS

POR

Decode

Interface

SCK

MCP23S08

MCP23008

A1:A0

MCP23S08

8-Bit I/O Expander with Serial Interface

MCP23008/MCP23S08

Package Types

SDA

SCL

INT

RESET

GP4

VDD

GP7

GP6

GP5

GP3

GP2

PDIP/SOIC

GP1

GP0

VSS

MCP23008

GP3

VDD

GP7

GP6

GP5

GP2

GP1

GP0

N/C

GP4

SDA

SCL

VSS

N/C

RESET

INT

SSOP

MCP23008

QFN

SCL

SDA

VSS

N/C

RESET

INT

GP3

VDD

GP7

GP6

GP5

GP2

GP1

GP0

N/C

GP4

MCP23008/MCP23S08

Package Types: (Continued)

SCK

INT

RESET

GP4

VDD

GP7

GP6

GP5

GP3

GP2

PDIP/SOIC

GP1

GP0

VSS

MCP23S08

GP3

VDD

GP7

GP6

GP5

GP2

GP1

GP0

N/C

GP4

SCK

VSS

N/C

RESET

INT

SSOP

QFN

MCP23S08

SCK

VSS

N/C

RESET

INT

GP3

VDD

GP7

GP6

GP5

GP2

GP1

GP0

N/C

GP4

MCP23008/MCP23S08

NOTES:

MCP23008/MCP23S08

1.0 DEVICE OVERVIEW

The MCP23X08 device provides 8-bit, general

purpose, parallel I/O expansion for I2C bus or SPI

applications. The two devices differ in the number of

hardware address pins and the serial interface:

• MCP23008 – I2C interface; three address pins

• MCP23S08 – SPI interface; two address pins

The MCP23X08 consists of multiple 8-bit configuration

registers for input, output and polarity selection. The

system master can enable the I/Os as either inputs or

outputs by writing the I/O configuration bits. The data

for each input or output is kept in the corresponding

Input or Output register. The polarity of the Input Port

The interrupt output can be configured to activate

under two conditions (mutually exclusive):

1. When any input state differs from its

corresponding input port register state, this is

used to indicate to the system master that an

input state has changed.

2. When an input state differs from a preconfigured

The Interrupt Capture register captures port values at

the time of the interrupt, thereby saving the condition

that caused the interrupt.

The Power-on Reset (POR) sets the registers to their

default values and initializes the device state machine.

The hardware address pins are used to determine the

device address.

1.1 Pin Descriptions

TABLE 1-1: PINOUT DESCRIPTION

Name

PDIP/

SOIC QFN SSOP Pin

Type Function

SCL/SCK 1 19 1 I Serial clock input.

SDA/SI 2 20 2 I/O Serial data I/O (MCP23008)/Serial data input (MCP23S08).

A2/SO 3 1 3 I/O Hardware address input (MCP23008)/

Serial data output (MCP23S08).

A2 must be biased externally.

A1 4 2 4 I Hardware address input. Must be biased externally.

A0 5 3 5 I Hardware address input. Must be biased externally.

RESET 6 4 6 I External reset input. Must be biased externally.

NC/CS 7 5 7 I No connect (MCP23008)/External chip select input (MCP23S08).

INT 8 7 8 O Interrupt output. Can be configured for active-high, active-low or

open-drain.

VSS 9179PGround.

GP0 10 9 12 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP1 11 10 13 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP2 12 11 14 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP3 13 12 15 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP4 14 13 16 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP5 15 14 17 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP6 16 15 18 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

GP7 17 16 19 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or

internal weak pull-up resistor.

VDD 18 18 20 P Power.

N/C — 6, 8 10, 11 — —

MCP23008/MCP23S08

1.2 Power-on Reset (POR)

The on-chip POR circuit holds the device in reset until

VDD has reached a high enough voltage to deactivate

the POR circuit (i.e., release the device from Reset).

The maximum VDD rise time is specified in Section 2.0

“Electrical Characteristics”.

When the device exits the POR condition (releases

reset), device operating parameters (i.e., voltage,

temperature, serial bus frequency, etc.) must be met to

ensure proper operation.

1.3 Serial Interface

This block handles the functionality of the I2C

(MCP23008) or SPI (MCP23S08) interface protocol.

The MCP23X08 contains eleven registers that can be

addressed through the serial interface block (Table 1-2):

TABLE 1-2: REGISTER ADDRESSES

1.3.1 SEQUENTIAL OPERATION BIT

The Sequential Operation (SEQOP) bit (IOCON

The address pointer can either be enabled (default) to

allow the address pointer to increment automatically

after each data transfer, or it can be disabled.

When operating in Sequential mode

(IOCON.SEQOP = 0), the address pointer automati-

cally increments to the next address after each byte

is clocked.

When operating in Byte mode (IOCON.SEQOP = 1),

the MCP23X08 does not increment its address

counter after each byte during the data transfer. This

gives the ability to continually read the same address

by providing extra clocks (without additional control

bytes). This is useful for polling the GPIO register for

data changes.

1.3.2 I2C™ INTERFACE

1.3.2.1 I2C Write Operation

The I2C Write operation includes the control byte and

Figure 1-1. This sequence is followed by eight bits of

data from the master and an Acknowledge (ACK) from

the MCP23008. The operation is ended with a STOP

or RESTART condition being generated by the master.

Data is written to the MCP23008 after every byte

transfer. If a STOP or RESTART condition is

generated during a data transfer, the data will not be

written to the MCP23008.

Byte writes and sequential writes are both supported

by the MCP23008. The MCP23008 increments its

address counter after each ACK during the data

transfer.

1.3.2.2 I2C Read Operation

The I2C Read operation includes the control byte

sequence, as shown in the bottom of Figure 1-1. This

sequence is followed by another control byte (includ-

ing the START condition and ACK) with the R/W bit

equal to a logic 1 (R/W = 1). The MCP23008 then

transmits the data contained in the addressed register.

The sequence is ended with the master generating a

STOP or RESTART condition.

1.3.2.3 I2C Sequential Write/Read

For sequential operations (Write or Read), instead of

transmitting a STOP or RESTART condition after the

data transfer, the master clocks the next byte pointed to

by the address pointer (see Section 1.3.1 “Sequential

Operation Bit” for details regarding sequential

operation control).

The sequence ends with the master sending a STOP or

RESTART condition.

The MCP23008 address pointer will roll over to

address zero after reaching the last register address.

Refer to Figure 1-1.

1.3.3 SPI INTERFACE

1.3.3.1 SPI Write Operation

The SPI Write operation is started by lowering CS. The

Write command (slave address with R/W bit cleared) is

then clocked into the device. The opcode is followed by

an address and at least one data byte.

1.3.3.2 SPI Read Operation

The SPI Read operation is started by lowering CS. The

SPI read command (slave address with R/W bit set) is

then clocked into the device. The opcode is followed by

an address, with at least one data byte being clocked

out of the device.

Address Access to:

00h IODIR

01h IPOL

02h GPINTEN

03h DEFVAL

04h INTCON

05h IOCON

06h GPPU

07h INTF

08h INTCAP (Read-only)

09h GPIO

0Ah OLAT

MCP23008/MCP23S08

FIGURE 1-1: MCP23008 I2C™ DEVICE PROTOCOL

1.3.3.3 SPI Sequential Write/Read

For sequential operations, instead of deselecting the

device by raising CS, the master clocks the next byte

pointed to by the address pointer.

The sequence ends by the raising of CS.

The MCP23S08 address pointer will roll over to

address zero after reaching the last register address.

1.4 Hardware Address Decoder

The hardware address pins are used to determine the

device address. To address a device, the correspond-

ing address bits in the control byte must match the pin

state.

• MCP23008 has address pins A2, A1 and A0.

• MCP23S08 has address pins A1 and A0.

The pins must be biased externally.

ADDR

DOUT

DIN

- START

- RESTART

- STOP

- Write

- Read

- Device opcode

- Device address

- Data out from MCP23008

- Data into MCP23008

OP ADDR DIN DIN

....

ADDR

OUT

DOUT

.... P

SR WOP

DIN

.... P

SR R

DOUT DOUT

....

OUT

DOUT

.... P

SR OP DIN

....

S PWOP ADDR DIN DIN

....

Byte and Sequential Write

OP SR R

OUT

DOUT

.... P

Byte and Sequential Read

S WOP ADDR DIN P

OP SR ROP D

OUT

Byte

Sequential

Byte

Sequential

MCP23008/MCP23S08

1.4.1 ADDRESSING I2C DEVICES

(MCP23008)

The MCP23008 is a slave I2C device that supports 7-bit

slave addressing, with the read/write bit filling out the

control byte. The slave address contains four fixed bits

and three user-defined hardware address bits (pins A2,

A1 and A0). Figure 1-2 shows the control byte format.

1.4.2 ADDRESSING SPI DEVICES

(MCP23S08)

The MCP23S08 is a slave SPI device. The slave

address contains five fixed bits and two user-defined

hardware address bits (pins A1 and A0), with the read/

write bit filling out the control byte. Figure 1-3 shows

the control byte format.

FIGURE 1-2: I2C™ CONTROL BYTE

FORMAT

FIGURE 1-3: SPI CONTROL BYTE

FORMAT

FIGURE 1-4: I2C™ ADDRESSING REGISTERS

FIGURE 1-5: SPI ADDRESSING REGISTERS

S 0 1 0 0 A2A1A0R/WACK

Start

bit

Slave Address

R/W bit

ACK bit

Control Byte

R/W = 0 = write

R/W = 1 = read

01000A1A0R/W

Slave Address

R/W bit

Control Byte

R/W = 0 = write

R/W = 1 = read

S0100A2A1A00ACKA7A6A5A4A3A2A1A0ACK

Device Opcode Register Address

R/W = 0

The ACKs are provided by the MCP23008.

01000A1A0R/W A7A6A5A4A3A2A1A0

Device Opcode Register Address

MCP23008/MCP23S08

1.5 GPIO Port

The GPIO module contains the data port (GPIO),

internal pull up resistors and the Output Latches

(OLAT).

Reading the GPIO register reads the value on the port.

Reading the OLAT register only reads the OLAT, not

the actual value on the port.

Writing to the GPIO register actually causes a write to

the OLAT. Writing to the OLAT register forces the

associated output drivers to drive to the level in OLAT.

Pins configured as inputs turn off the associated output

driver and put it in high-impedance.

1.6 Configuration and Control

Registers

The Configuration and Control blocks contain the

registers as shown in Table 1-3.

TABLE 1-3: CONFIGURATION AND CONTROL REGISTERS

Name

Address

(hex) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 POR/RST

value

IODIR 00 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 1111 1111

IPOL 01 IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 0000 0000

GPINTEN 02 GPINT7 GPINT6 GPINT5 GPINT4 GPINT3 GPINT2 GPINT1 GPINT0 0000 0000

DEFVAL 03 DEF7 DEF6 DEF5 DEF4 DEF3 DEF2 DEF1 DEF0 0000 0000

INTCON 04 IOC7 IOC6 IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 0000 0000

IOCON 05 —— SREAD DISSLW HAEN*ODR INTPOL —--00 000-

GPPU 06 PU7 PU6 PU5 PU4 PU3 PU2 PU1 PU0 0000 0000

INTF 07 INT7 INT6 INT5 INT4 INT3 INT2 INT1 INTO 0000 0000

INTCAP 08 ICP7 ICP6 ICP5 ICP4 ICP3 ICP2 ICP1 ICP0 0000 0000

GPIO 09 GP7GP6GP5GP4GP3GP2GP1GP00000 0000

OLAT 0A OL7 OL6 OL5 OL4 OL3 OL2 OL1 OL0 0000 0000

*Not used on the MCP23008.

MCP23008/MCP23S08

1.6.1 I/O DIRECTION (IODIR) REGISTER

Controls the direction of the data I/O.

When a bit is set, the corresponding pin becomes an

input. When a bit is clear, the corresponding pin

becomes an output.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 IO7:IO0: These bits control the direction of data I/O <7:0>

1 = Pin is configured as an input.

0 = Pin is configured as an output.

MCP23008/MCP23S08

1.6.2 INPUT POLARITY (IPOL) REGISTER

The IPOL register allows the user to configure the

polarity on the corresponding GPIO port bits.

If a bit is set, the corresponding GPIO register bit will

reflect the inverted value on the pin.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 IP7:IP0: These bits control the polarity inversion of the input pins <7:0>

1 = GPIO register bit will reflect the opposite logic state of the input pin.

0 = GPIO register bit will reflect the same logic state of the input pin.

MCP23008/MCP23S08

1.6.3 INTERRUPT-ON-CHANGE

CONTROL (GPINTEN) REGISTER

The GPINTEN register controls the interrupt-on-

change feature for each pin.

If a bit is set, the corresponding pin is enabled for

interrupt-on-change. The DEFVAL and INTCON

registers must also be configured if any pins are

enabled for interrupt-on-change.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GPINT7 GPINT6 GPINT5 GPINT4 GPINT3 GPINT2 GPINT1 GPINT0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 GPINT7:GPINT0: General purpose I/O interrupt-on-change bits <7:0>

1 = Enable GPIO input pin for interrupt-on-change event.

0 = Disable GPIO input pin for interrupt-on-change event.

Refer to INTCON and GPINTEN.

MCP23008/MCP23S08

1.6.4 DEFAULT COMPARE (DEFVAL)

CHANGE

The default comparison value is configured in the

DEFVAL register. If enabled (via GPINTEN and

INTCON) to compare against the DEFVAL register, an

opposite value on the associated pin will cause an

interrupt to occur.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

DEF7 DEF6 DEF5 DEF4 DEF3 DEF2 DEF1 DEF0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 DEF7:DEF0: These bits set the compare value for pins configured for interrupt-on-change from

defaults <7:0>. Refer to INTCON.

If the associated pin level is the opposite from the register bit, an interrupt occurs.

Refer to INTCON and GPINTEN.

MCP23008/MCP23S08

1.6.5 INTERRUPT CONTROL (INTCON)

The INTCON register controls how the associated pin

value is compared for the interrupt-on-change feature.

If a bit is set, the corresponding I/O pin is compared

against the associated bit in the DEFVAL register. If a

bit value is clear, the corresponding I/O pin is compared

against the previous value.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

IOC7 IOC6 IOC5 IOC4 IOC3 IOC2 IOC1 IOC0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 IOC7:IOC0: These bits control how the associated pin value is compared for interrupt-on-change

<7:0>

1 = Controls how the associated pin value is compared for interrupt-on-change.

0 = Pin value is compared against the previous pin value.

Refer to INTCON and GPINTEN.

MCP23008/MCP23S08

1.6.6 CONFIGURATION (IOCON)

The IOCON register contains several bits for

configuring the device:

• The Sequential Operation (SEQOP) controls the

incrementing function of the address pointer. If the

address pointer is disabled, the address pointer

does not automatically increment after each byte

is clocked during a serial transfer. This feature is

useful when it is desired to continuously poll

(read) or modify (write) a register.

• The Slew Rate (DISSLW) bit controls the slew

rate function on the SDA pin. If enabled, the SDA

slew rate will be controlled when driving from a

high to a low.

• The Hardware Address Enable (HAEN) control bit

enables/disables the hardware address pins (A1,

A0) on the MCP23S08. This bit is not used on the

MCP23008. The address pins are always enabled

on the MCP23008.

• The Open-Drain (ODR) control bit enables/

disables the INT pin for open-drain configuration.

• The Interrupt Polarity (INTPOL) control bit sets

the polarity of the INT pin. This bit is functional

only when the ODR bit is cleared, configuring the

INT pin as active push-pull.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0

— — SEQOP DISSLW HAEN ODR INTPOL —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’.

bit 5 SEQOP: Sequential Operation mode bit.

1 = Sequential operation disabled, address pointer does not increment.

0 = Sequential operation enabled, address pointer increments.

bit 4 DISSLW: Slew Rate control bit for SDA output.

1 = Slew rate disabled.

0 = Slew rate enabled.

bit 3 HAEN: Hardware Address Enable bit (MCP23S08 only).

Address pins are always enabled on MCP23008.

1 = Enables the MCP23S08 address pins.

0 = Disables the MCP23S08 address pins.

bit 2 ODR: This bit configures the INT pin as an open-drain output.

1 = Open-drain output (overrides the INTPOL bit).

0 = Active driver output (INTPOL bit sets the polarity).

bit 1 INTPOL: This bit sets the polarity of the INT output pin.

1 = Active-high.

0 = Active-low.

bit 0 Unimplemented: Read as ‘0’.

MCP23008/MCP23S08

1.6.7 PULL-UP RESISTOR

CONFIGURATION (GPPU)

The GPPU register controls the pull-up resistors for the

port pins. If a bit is set and the corresponding pin is

configured as an input, the corresponding port pin is

internally pulled up with a 100 kΩ resistor.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PU7 PU6 PU5 PU4 PU3 PU2 PU1 PU0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 PU7:PU0: These bits control the weak pull-up resistors on each pin (when configured as an input)

<7:0>.

1 = Pull-up enabled.

0 = Pull-up disabled.

MCP23008/MCP23S08

1.6.8 INTERRUPT FLAG (INTF)

The INTF register reflects the interrupt condition on the

port pins of any pin that is enabled for interrupts via the

GPINTEN register. A ‘set’ bit indicates that the

associated pin caused the interrupt.

This register is ‘read-only’. Writes to this register will be

ignored.

Note: INTF will always reflect the pin(s) that

have an interrupt condition. For example,

one pin causes an interrupt to occur and is

captured in INTCAP and INF. If before

clearing the interrupt another pin changes,

which would normally cause an interrupt, it

will be reflected in INTF, but not INTCAP.

R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 INT7:INT0: These bits reflect the interrupt condition on the port. Will reflect the change only if interrupts

are enabled (GPINTEN) <7:0>.

1 = Pin caused interrupt.

0 = Interrupt not pending.

MCP23008/MCP23S08

1.6.9 INTERRUPT CAPTURE (INTCAP)

The INTCAP register captures the GPIO port value at

the time the interrupt occurred. The register is ‘read-

only’ and is updated only when an interrupt occurs. The

cleared via a read of INTCAP or GPIO.

R-x R-x R-x R-x R-x R-x R-x R-x

ICP7 ICP6 ICP5 ICP4 ICP3 ICP2 ICP1 ICP0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 ICP7:ICP0: These bits reflect the logic level on the port pins at the time of interrupt due to pin change

<7:0>

1 = Logic-high.

0 = Logic-low.

MCP23008/MCP23S08

1.6.10 PORT (GPIO) REGISTER

The GPIO register reflects the value on the port.

Reading from this register reads the port. Writing to this

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 GP7:GP0: These bits reflect the logic level on the pins <7:0>

1 = Logic-high.

0 = Logic-low.

MCP23008/MCP23S08

1.6.11 OUTPUT LATCH REGISTER (OLAT)

The OLAT register provides access to the output

latches. A read from this register results in a read of the

OLAT and not the port itself. A write to this register

modifies the output latches that modify the pins

configured as outputs.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

OL7 OL6 OL5 OL4 OL3 OL2 OL1 OL0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 OL7:OL0: These bits reflect the logic level on the output latch <7:0>

1 = Logic-high.

0 = Logic-low.

MCP23008/MCP23S08

1.7 Interrupt Logic

The interrupt output pin will activate if an internal

interrupt occurs. The interrupt block is configured by

the following registers:

• GPINTEN – enables the individual inputs

• DEFVAL – holds the values that are compared

against the associated input port values

• INTCON – controls if the input values are

compared against DEFVAL or the previous values

on the port

• IOCON (ODR and INPOL) – configures the INT

pin as push-pull, open-drain and active-level

Only pins configured as inputs can cause interrupts.

Pins configured as outputs have no affect on INT.

Interrupt activity on the port will cause the port value to

be captured and copied into INTCAP. The interrupt will

remain active until the INTCAP or GPIO register is

read. Writing to these registers will not affect the

interrupt.

The first interrupt event will cause the port contents to

be copied into the INTCAP register. Subsequent

interrupt conditions on the port will not cause an

interrupt to occur as long as the interrupt is not cleared

by a read of INTCAP or GPIO.

1.7.1 INTERRUPT CONDITIONS

There are two possible configurations to cause

interrupts (configured via INTCON):

1. Pins configured for interrupt-on-pin-change

will cause an interrupt to occur if a pin changes

to the opposite state. The default state is reset

after an interrupt occurs. For example, an

interrupt occurs by an input changing from 1 to

0. The new initial state for the pin is a logic 0.

2. Pins configured for interrupt-on-change from

the corresponding input pin differs from the

long as the condition exists, regardless if the

INTAP or GPIO is read.

See Figure 1-6 and Figure 1-7 for more information on

interrupt operations.

FIGURE 1-6: INTERRUPT-ON-PIN-

CHANGE

FIGURE 1-7: INTERRUPT-ON-CHANGE

FROM REGISTER

DEFAULT

GPx

INT ACTIVE ACTIVE

Port value

is captured

into INTCAP

Read GPIU

or INTCAP

Port value

is captured

into INTCAP

INT

Port value

is captured

into INTCAP

Read GPIU

or INTCAP

DEFVAL

X X X X X 0 X X

GP2

76543210GP:

ACTIVE

(INT clears only if interrupt

condition does not exist.)

MCP23008/MCP23S08

NOTES:

MCP23008/MCP23S08

2.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Voltage on all other pins with respect to VSS (except VDD)............................................................. -0.6V to (VDD + 0.6V)

Total power dissipation (Note) .............................................................................................................................700 mW

Maximum current out of VSS pin ...........................................................................................................................150 mA

Maximum current into VDD pin ..............................................................................................................................125 mA

Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................. ±20 mA

Maximum output current sunk by any output pin ....................................................................................................25 mA

Maximum output current sourced by any output pin ...............................................................................................25 mA

Note: Power dissipation is calculated as follows:

PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

MCP23008/MCP23S08

2.1 DC Characteristics

DC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No. Characteristic Sym Min Typ Max Units Conditions

D001 Supply Voltage VDD 1.8 — 5.5 V

D002 VDD Start Voltage to

Ensure Power-on

Reset

VPOR —VSS —V

D003 VDD Rise Rate to

Ensure Power-on

Reset

SVDD 0.05 — — V/ms Design guidance only.

Not tested.

D004 Supply Current IDD — — 1 mA SCL/SCK = 1 MHz

D005 Standby current IDDS ——1µA

— — 2 µA 4.5V - 5.5V @ +125°C

(Note 1)

Input Low-Voltage

D030 A0, A1 (TTL buffer) VIL VSS —0.15VDD V

D031 CS, GPIO, SCL/SCK,

SDA, A2, RESET

(Schmitt Trigger)

VSS —0.2VDD V

Input High-Voltage

D040 A0, A1

(TTL buffer)

VIH 0.25 VDD + 0.8 — VDD V

D041 CS, GPIO, SCL/SCK,

SDA, A2, RESET

(Schmitt Trigger)

0.8 VDD —VDD V For entire VDD range.

Input Leakage Current

D060 I/O port pins IIL ——±1µAVSS ≤ VPIN ≤ VDD

Output Leakage Current

D065 I/O port pins ILO ——±1µAVSS ≤ VPIN ≤ VDD

D070 GPIO weak pull-up

current

IPU 40 75 115 µA VDD = 5V, GP Pins = VSS

–40°C ≤ TA ≤ +85°C

Output Low-Voltage

D080 GPIO VOL ——0.6VIOL = 8.5 mA, VDD = 4.5V

INT — — 0.6 V IOL = 1.6 mA, VDD = 4.5V

SO, SDA — — 0.6 V IOL = 3.0 mA, VDD = 1.8V

SDA — — 0.8 V IOL = 3.0 mA, VDD = 4.5V

Output High-Voltage

D090 GPIO, INT, SO VOH VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V

VDD – 0.7 — — IOH = -400 µA, VDD = 1.8V

Capacitive Loading Specs on Output Pins

D101 GPIO, SO, INT CIO ——50pF

D102 SDA CB— — 400 pF

Note 1: This parameter is characterized, not 100% tested.

MCP23008/MCP23S08

FIGURE 2-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

FIGURE 2-2: RESET AND DEVICE RESET TIMER TIMING

135 pF

1kΩ

VDD

SCL and

SDA pin

MCP23008

50 pF

VDD

RESET

Internal

RESET

Output pin

MCP23008/MCP23S08

TABLE 2-1: DEVICE RESET SPECIFICATIONS

FIGURE 2-3: I2C™ BUS START/STOP BITS TIMING

FIGURE 2-4: I2C™ BUS DATA TIMING

AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No. Characteristic Sym Min Typ(1) Max Units Conditions

30 RESET Pulse Width

(Low)

TRSTL1 — — µs

32 Device Active After

RESET high

THLD —0—µsVDD = 5.0V

34 Output High-Impedance

From RESET Low

TIOZ —— 1 µs

Note 1: This parameter is characterized, not 100% tested.

91 93

SCL

SDA

START

Condition STOP

Condition

90 92

90 91 92

100

101

103

106 107

109 109 110

102

SCL

SDA

Out

MCP23008/MCP23S08

TABLE 2-2: I2C™ BUS DATA REQUIREMENTS

I2C™ AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

RPU (SCL, SDA) = 1 kΩ, CL (SCL, SDA) = 135 pF

Param

No.

Characteristic Sym Min Typ Max Units Conditions

100 Clock High Time: THIGH

100 kHz mode 4.0 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 0.6 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.12 — — µs 4.5V – 5.5V (E-Temp)

101 Clock Low Time: TLOW

100 kHz mode 4.7 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 1.3 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.32 — — µs 4.5V – 5.5V (E-Temp)

102 SDA and SCL Rise Time: TR

(Note 1)

100 kHz mode — — 1000 ns 1.8V – 5.5V (I-Temp)

400 kHz mode 20 + 0.1 CB(2) — 300 ns 2.7V – 5.5V (I-Temp)

1.7 MHz mode 20 — 160 ns 4.5V – 5.5V (E-Temp)

103 SDA and SCL Fall Time: TF

(Note 1)

100 kHz mode — — 300 ns 1.8V – 5.5V (I-Temp)

400 kHz mode 20 + 0.1 CB(2) — 300 ns 2.7V – 5.5V (I-Temp)

1.7 MHz mode 20 — 80 ns 4.5V – 5.5V (E-Temp)

90 START Condition Setup Time: TSU:STA

100 kHz mode 4.7 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 0.6 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.16 — — µs 4.5V – 5.5V (E-Temp)

91 START Condition Hold Time: THD:STA

100 kHz mode 4.0 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 0.6 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.16 — — µs 4.5V – 5.5V (E-Temp)

106 Data Input Hold Time: THD:DAT

100 kHz mode 0 — 3.45 µs 1.8V – 5.5V (I-Temp)

400 kHz mode 0 — 0.9 µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0 — 0.15 µs 4.5V – 5.5V (E-Temp)

107 Data Input Setup Time: TSU:DAT

100 kHz mode 250 — — ns 1.8V – 5.5V (I-Temp)

400 kHz mode 100 — — ns 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.01 — — µs 4.5V – 5.5V (E-Temp)

92 STOP Condition Setup Time: TSU:STO

100 kHz mode 4.0 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 0.6 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode 0.16 — — µs 4.5V – 5.5V (E-Temp)

Note 1: This parameter is characterized, not 100% tested.

2: CB is specified to be from 10 to 400 pF.

MCP23008/MCP23S08

FIGURE 2-5: SPI INPUT TIMING

109 Output Valid From Clock: TAA

100 kHz mode — — 3.45 µs 1.8V – 5.5V (I-Temp)

400 kHz mode — — 0.9 µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode — — 0.18 µs 4.5V – 5.5V (E-Temp)

110 Bus Free Time: TBUF

100 kHz mode 4.7 — — µs 1.8V – 5.5V (I-Temp)

400 kHz mode 1.3 — — µs 2.7V – 5.5V (I-Temp)

1.7 MHz mode N/A — N/A µs 4.5V – 5.5V (E-Temp)

Bus Capacitive Loading: CB

100 kHz and 400 kHz — — 400 pF (Note 1)

1.7 MHz — — 100 pF (Note 1)

Input Filter Spike

Suppression: (SDA and SCL)

TSP

100 kHz and 400 kHz — — 50 ns

1.7 MHz — — 10 ns Spike suppression off

TABLE 2-2: I2C™ BUS DATA REQUIREMENTS (CONTINUED)

I2C™ AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

RPU (SCL, SDA) = 1 kΩ, CL (SCL, SDA) = 135 pF

Param

No.

Characteristic Sym Min Typ Max Units Conditions

Note 1: This parameter is characterized, not 100% tested.

2: CB is specified to be from 10 to 400 pF.

SCK

LSb in

MSb in

high-impedance

Mode 1,1

Mode 0,0

MCP23008/MCP23S08

FIGURE 2-6: SPI OUTPUT TIMING

SCK

MSb out LSb out

don’t care

Mode 1,1

Mode 0,0

TABLE 2-3: SPI INTERFACE AC CHARACTERISTICS

SPI Interface AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No. Characteristic Sym Min Typ Max Units Conditions

Clock Frequency FCLK — — 5 MHz 1.8V – 5.5V (I-Temp)

— — 10 MHz 2.7V – 5.5V (I-Temp)

— — 10 MHz 4.5V – 5.5V (E-Temp)

1CS

Setup Time TCSS 50 — — ns

2CS

Hold Time TCSH 100 — — ns 1.8V – 5.5V (I-Temp)

50 — — ns 2.7V – 5.5V (I-Temp)

50 — — ns 4.5V – 5.5V (E-Temp)

3CS

Disable Time TCSD 100 — — ns 1.8V – 5.5V (I-Temp)

50 — — ns 2.7V – 5.5V (I-Temp)

50 — — ns 4.5V – 5.5V (E-Temp)

4 Data Setup Time TSU 20 — — ns 1.8V – 5.5V (I-Temp)

10 — — ns 2.7V – 5.5V (I-Temp)

10 — — ns 4.5V – 5.5V (E-Temp)

5 Data Hold Time THD 20 — — ns 1.8V – 5.5V (I-Temp)

10 — — ns 2.7V – 5.5V (I-Temp)

10 — — ns 4.5V – 5.5V (E-Temp)

6 CLK Rise Time TR—— 2 µsNote 1

7 CLK Fall Time TF—— 2 µsNote 1

8 Clock High Time THI 90 — — ns 1.8V – 5.5V (I-Temp)

45 — — ns 2.7V – 5.5V (I-Temp)

45 — — ns 4.5V – 5.5V (E-Temp)

Note 1: This parameter is characterized, not 100% tested.

2: TV = 90 ns (max) when address pointer rolls over from address 0x0A to 0x00.

MCP23008/MCP23S08

FIGURE 2-7: GPIO AND INT TIMING

9 Clock Low Time TLO 90 — — ns 1.8V – 5.5V (I-Temp)

45 — — ns 2.7V – 5.5V (I-Temp)

45 — — ns 4.5V – 5.5V (E-Temp)

10 Clock Delay Time TCLD 50 — — ns

11 Clock Enable Time TCLE 50 — — ns

12(2) Output Valid from Clock Low TV— — 90 ns 1.8V – 5.5V (I-Temp)

— — 45 ns 2.7V – 5.5V (I-Temp)

— — 45 ns 4.5V – 5.5V (E-Temp)

13 Output Hold Time THO 0——ns

14 Output Disable Time TDIS ——100ns

TABLE 2-3: SPI INTERFACE AC CHARACTERISTICS (CONTINUED)

SPI Interface AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No. Characteristic Sym Min Typ Max Units Conditions

Note 1: This parameter is characterized, not 100% tested.

2: TV = 90 ns (max) when address pointer rolls over from address 0x0A to 0x00.

SCL/SCK

SDA/SI

GPn

LSb of data byte zero

during a write or read

INT

INT pin active

command, depending

on parameter.

Output

GPn

Input

inactive

Loaded

MCP23008/MCP23S08

TABLE 2-4: GP AND INT PINS

AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V ≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No. Characteristic Sym Min Typ Max Units Conditions

50 Serial data to output valid TGPOV ——500ns

51 Interrupt pin disable time TINTD ——600ns

52 GP input change to register

valid

TGPIV ——450ns

53 IOC event to INT active TGPINT ——600ns

Glitch Filter on GP Pins TGLITCH ——150ns

Note 1: This parameter is characterized, not 100% tested

MCP23008/MCP23S08

NOTES:

MCP23008/MCP23S08

3.0 PACKAGING INFORMATION

3.1 Package Marking Information

18-Lead PDIP (300 mil)

18-Lead SOIC (300 mil)

20-Lead SSOP

XXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXXXXXXX

YYWWNNN

Example:

MCP23008

0634256

MCP23008-E/P^^

0634256

XXXXXXXXXXXX

YYWWNNN

MCP23S08

XXXXXXXXXXXX

0634256

E/SO^^

E/SS^^

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

20-Lead QFN Example

XXXXX

XXXXXX

YWWNNN

23S08

E/ML^^

0637

256

MCP23008/MCP23S08

18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensi ons D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 18

Pitch e .100 BSC

Top to Seating Plane A – – .210

Molded Package Thickness A2 .115 .130 .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .300 .310 .325

Molded Package Width E1 .240 .250 .280

Overall Length D .880 . 900 .920

Tip to Seating Plane L .115 .130 .150

Lead Thickness c .008 .010 .014

Upper Lead Width b1 .045 .060 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

NOTE 1

123

Microchip Technology Drawing C04-007B

MCP23008/MCP23S08

18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 18

Pitch e 1.27 BSC

Overall Height A – – 2.65

Molded Package Thickness A2 2.05 – –

Standoff § A1 0.10 – 0.30

Overall Width E 10.30 BSC

Molded Package Width E1 7.50 BS C

Overall Length D 11.55 BS C

Chamfer (optional) h 0.25 – 0.75

Foot Length L 0.40 – 1.27

Footprint L1 1.40 REF

Foot Angle φ0° – 8°

Lead Thickness c 0.20 – 0.33

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

Microchip Technology Drawing C04-051B

MCP23008/MCP23S08

20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 20

Pitch e 0.50 BSC

Overall Height A 0.80 0.90 1. 00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 4.00 BSC

Exposed Pad Width E2 2.60 2.70 2.80

Overall Length D 4.00 BSC

Exposed Pad Length D2 2.60 2.70 2.80

Contact Width b 0.18 0.25 0.30

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

EXPOSED

PAD

TOP VIEW NOTE 1

BOTTOM VIEW

Microchip Technology Drawing C04-126B

MCP23008/MCP23S08

20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 20

Pitch e 0.65 BSC

Overall Height A – – 2.00

Molded Package Thickness A2 1.65 1.75 1.85

Standoff A1 0.05 – –

Overall Width E 7.40 7.80 8. 20

Molded Package Width E1 5.00 5.30 5.60

Overall Length D 6.90 7.20 7.50

Foot Length L 0.55 0.75 0.95

Footprint L1 1.25 REF

Lead Thickness c 0.09 – 0.25

Foot Angle φ0° 4° 8°

Lead Width b 0.22 – 0.38

NOTE 1

Microchip Technology Drawing C04-072B

MCP23008/MCP23S08

NOTES:

MCP23008/MCP23S08

APPENDIX A: REVISION HISTORY

Revision E (August 2007)

1. Section 3.0 “Packaging Information”:

Updated package outline drawings.

Revision D (February 2007)

1. Changed Byte and Sequential Read in

Figure 1-1 from “R” to “W”.

2. Table 2-4, Param No. 51 and 53: Changed from

450 to 600 and 500 to 600, respecively.

3. Added disclaimer to package outline drawings.

4. Updated package outline drawings.

Revision C (October 2006)

1. Added 20-pin QFN package information

throughout document.

2. Added disclaimer to package outline drawings.

Revision B (February 2005)

The following is the list of modifications:

1. Section 1.6 “Configuration and Control Reg-

isters”. Added Hardware Address Enable

(HAEN) bit to Table 1-3.

2. Section 1.6.6 “Configuration (IOCON) Regis-

ter”. Added Hardware Address Enable (HAEN)

bit to Register 1-6.

Revision A (December 2004)

• Original Release of this Document.

MCP23008/MCP23S08

NOTES:

MCP23008/MCP23S08

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device MCP23008: 8-Bit I/O Expander w/ I2C™ Interface

MCP23008T: 8-Bit I/O Expander w/ I2C Interface

(Tape and Reel)

MCP23S08: 8-Bit I/O Expander w/ SPI Interface

MCP23S08T: 8-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

Temperature

Range

E= -40°C to +125°C (Extended) *

* While these devices are only offered in the “E”

temperature range, the device will operate at different

voltages and temperatures as identified in the

Section 2.0 “Electrical Characteristics”.

Package ML = Plastic Quad Flat, No Lead Package

4x4x0.9 mm Body (QFN), 20-Lead

P = Plastic DIP (300 mil Body), 18-Lead

SO = Plastic SOIC (300 mil Body), 18-Lead

SS = SSOP, (209 mil Body, 5.30 mm), 20-Lead

PART NO. X/XX

PackageTemperature

Range

Device

Examples:

a) MCP23008-E/P: Extended Temp.,

18LD PDIP package.

b) MCP23008-E/SO: Extended Temp.,

18LD SOIC package.

c) MCP23008T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d) MCP23008-E/SS: Extended Temp.,

20LD SSOP package.

e) MCP23008T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

f) MCP23008-E/ML: Extended Temp.,

20LD QFN package.

a) MCP23S08-E/P: Extended Temp.,

18LD PDIP package.

b) MCP23S08-E/SO: Extended Temp.,

18LD SOIC package.

c) MCP23S08T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d) MCP23S08-E/SS: Extended Temp.,

20LD SSOP package.

e) MCP23S08T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

f) MCP23S08T-E/MF: Tape and Reel,

Extended Temp.,

20LD QFN package.

–

MCP23008/MCP23S08

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The

Embedded Control Solutions Company are registered

trademarks of Microchip Technology Incorporated in the

U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select

Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,

WiperLock and ZENA are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

06/25/07