1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
1.3 Applications
General regulation functions
1.4 Quick reference data
[1] Pulse test: tp300 s; 0.02.
[2] tp=100s; square wave; Tj=25C prior to surge
2. Pinning information
[1] The marking bar indicates the cathode.
BZX84J series
Single Zener diodes
Rev. 2 — 1 August 2011 Product data sheet
SOD323F
Non-repetitive peak reverse power
dissipation: 40 W
Wide working voltage range: nominal
2.4 V to 75 V (E24 range)
Total power dissipation: 550 mW Two tolerance series: 2%and5%
AEC-Q101 qualified Low differential resistance
Small plastic package suitable for
surface-mounted design
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=100mA [1] --1.1V
PZSM non-repetitive peak reverse
power dissipation [2] --40W
Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode
21
006aaa152
2
1
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Product data sheet Rev. 2 — 1 August 2011 2 of 13
NXP Semiconductors BZX84J series
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3. Ordering information
[1] The series consists of 74 types with nominal working voltages from 2.4 V to 75 V.
4. Marking
Tabl e 3. Ordering i nfo rmation
Type number Package
Name Description Version
BZX84J-B2V4 to B
ZX84J-C75[1] SC-90 plastic surface-mounted package; 2 leads SOD323F
Table 4. Marking codes
Type number Marking
code Type number Marking
code Type number Marking
code Type number Marking
code
BZX84J-B2V4 SL BZX84J-B15 SC BZX84J-C2V4 U3 BZX84J-C15 TV
BZX84J-B2V7 SM BZX84J-B16 SD BZX84J-C2V7 U4 BZX84J-C16 TW
BZX84J-B3V0 ST BZX84J-B18 SE BZX84J-C3V0 U9 BZX84J-C18 TX
BZX84J-B3V3 SU BZX84J-B20 SF BZX84J-C3V3 UA BZX84J-C20 TY
BZX84J-B3V6 SV BZX84J-B22 SG BZX84J-C3V6 UB BZX84J-C22 TZ
BZX84J-B3V9 SW BZX84J-B24 SH BZX84J-C3V9 UC BZX84J-C24 U1
BZX84J-B4V3 SZ BZX84J-B27 SK BZX84J-C4V3 UF BZX84J-C27 U2
BZX84J-B4V7 TA BZX84J-B30 SN BZX84J-C4V7 UG BZX84J-C30 U5
BZX84J-B5V1 TD BZX84J-B33 SP BZX84J-C5V1 UL BZX84J-C33 U6
BZX84J-B5V6 TE BZX84J-B36 SR BZX84J-C5V6 UM BZX84J-C36 U7
BZX84J-B6V2 TH BZX84J-B39 SS BZX84J-C6V2 UR BZX84J-C39 U8
BZX84J-B6V8 TK BZX84J-B43 SX BZX84J-C6V8 US BZX84J-C43 UD
BZX84J-B7V5 TM BZX84J-B47 SY BZX84J-C7V5 UU BZX84J-C47 UE
BZX84J-B8V2 TN BZX84J-B51 TB BZX84J-C8V2 UV BZX84J-C51 UH
BZX84J-B9V1 TP BZX84J-B56 TC BZX84J-C9V1 UW BZX84J-C56 UK
BZX84J-B10 S8 BZX84J-B62 TF BZX84J-C10 TR BZX84J-C62 UN
BZX84J-B11 S9 BZX84J-B68 TG BZX84J-C11 TS BZX84J-C68 UP
BZX84J-B12 SA BZX84J-B75 TL BZX84J-C12 TT BZX84J-C75 UT
BZX84J-B13 SB - - BZX84J-C13 TU - -
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Product data sheet Rev. 2 — 1 August 2011 3 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
5. Limiting values
[1] tp=100s; square wave; Tj=25C prior to surge
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: tp300 s; 0.02.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IFforward current - 250 mA
IZSM non-repetitive peak reverse
current [1] -see
Table 8
and 9
PZSM non-repetitive peak reverse
power dissipation [1] -40W
Ptot total power dissipation Tamb 25 C[2] -550mW
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 230 K/W
Rth(j-sp) thermal resistance from
junction to solder point [2] --55K/W
Table 7. Characteristics
Tj=25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF=10mA --0.9V
IF= 100 mA - - 1.1 V
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Product data sheet Rev. 2 — 1 August 2011 4 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
Table 8. Characteristics per type; BZX84J-B2V4 to BZX84J-C24
Tj=25
C unless otherwise specified.
BZX84J-
xxx Sel Working
voltage
VZ(V)
Differential
resistance
rdif ()
Reverse
current
IR(A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=5mA IZ=1mA IZ=5mA IZ=5mA
Min Max Max Max Max VR(V) Min Max Max Max
2V4 B 2.35 2.45 400 100 50 1 3.5 0 450 12
C2.22.6
2V7 B 2.65 2.75 450 100 20 1 3.5 0 440 12
C2.52.9
3V0 B 2.94 3.06 500 95 10 1 3.5 0 425 12
C2.83.2
3V3 B 3.23 3.37 500 95 5 1 3.5 0 410 12
C3.13.5
3V6 B 3.53 3.67 500 90 5 1 3.5 0 390 12
C3.43.8
3V9 B 3.82 3.98 500 90 3 1 3.5 0 370 12
C3.74.1
4V3 B 4.21 4.39 600 90 3 1 3.5 0 350 12
C4 4.6
4V7 B 4.61 4.79 500 80 3 2 3.5 0.2 325 12
C4.45
5V1 B 5 5.2 480 60 2 2 2.7 1.2 300 12
C4.85.4
5V6 B 5.49 5.71 400 40 1 2 22.5275 12
C5.26
6V2 B 6.08 6.32 150 10 3 4 0.4 3.7 250 12
C5.86.6
6V8 B 6.66 6.94 80 15 2 4 1.2 4.5 215 12
C6.47.2
7V5 B 7.35 7.65 80 10 1 5 2.5 5.3 170 4
C7 7.9
8V2 B 8.04 8.36 80 10 0.7 5 3.2 6.2 150 4
C7.78.7
9V1 B 8.92 9.28 100 10 0.5 6 3.8 7 120 3
C8.59.6
10 B 9.8 10.2 150 10 0.2 7 4.5 8 110 3
C 9.4 10.6
11 B 10.8 11.2 150 10 0.1 8 5.4 9 108 2.5
C 10.4 11.6
12 B 11.8 12.2 150 10 0.1 8 6 10 105 2.5
C 11.4 12.7
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Product data sheet Rev. 2 — 1 August 2011 5 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
[1] f = 1 MHz; VR=0V
[2] tp= 100 s; square wave; Tj=25C prior to surge
13 B 12.7 13.3 170 10 0.1 8 7 11 103 2.5
C 12.4 14.1
15 B 14.7 15.3 200 15 0.05 10.5 9.2 13 99 2
C 13.8 15.6
16 B 15.7 16.3 200 20 0.05 11.2 10.4 14 97 1.5
C 15.3 17.1
18 B 17.6 18.4 225 20 0.05 12.6 12.4 16 93 1.5
C 16.8 19.1
20 B 19.6 20.4 225 20 0.05 14 14.4 18 88 1.5
C 18.8 21.2
22 B 21.6 22.4 250 25 0.05 15.4 16.4 20 84 1.25
C 20.8 23.3
24 B 23.5 24.5 250 30 0.05 16.8 18.4 22 80 1.25
C 22.8 25.6
Table 8. Characteristics per type; BZX84J-B2V4 to BZX84J-C24 …continued
Tj=25
C unless otherwise specified.
BZX84J-
xxx Sel Working
voltage
VZ(V)
Differential
resistance
rdif ()
Reverse
current
IR(A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=5mA IZ=1mA IZ=5mA IZ=5mA
Min Max Max Max Max VR(V) Min Max Max Max
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Product data sheet Rev. 2 — 1 August 2011 6 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
[1] f = 1 MHz; VR=0V
[2] tp= 100 s; square wave; Tj=25C prior to surge
Table 9. Characteristics per type; BZX84J-B27 to BZX84J-C75
Tj=25
C unless otherwise specified.
BZX84J-
xxx Sel Working
voltage
VZ(V)
Differential
resistance
rdif ()
Reverse
current
IR(A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=2mA IZ=0.5mA IZ=2mA IZ=2mA
Min Max Max Max Max VR(V) Min Max Max Max
27 B 26.5 27.5 250 40 0.05 18.9 21.4 25.3 73 1
C 25.1 28.9
30 B 29.4 30.6 250 40 0.05 21 24.4 29.4 66 1
C2832
33 B 32.3 33.7 275 40 0.05 23.1 27.4 33.4 60 0.9
C3135
36 B 35.3 36.7 300 60 0.05 25.2 30.4 37.4 59 0.8
C3438
39 B 38.2 39.8 300 75 0.05 27.3 33.4 41.2 58 0.7
C3741
43 B 42.1 43.9 325 80 0.05 30.1 37.6 46.6 56 0.6
C4046
47 B 46.1 47.9 325 90 0.05 32.9 42 51.8 55 0.5
C4450
51 B 50 52 350 110 0.05 35.7 46.6 57.2 52 0.4
C4854
56 B 54.9 57.1 375 120 0.05 39.2 52.2 63.8 49 0.3
C5260
62 B 60.8 63.2 400 140 0.05 43.4 58.8 71.6 44 0.3
C5866
68 B 66.6 69.4 400 160 0.05 47.6 65.6 79.8 40 0.25
C6472
75 B 73.5 76.5 400 175 0.05 52.5 73.4 88.6 35 0.2
C7079
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Product data sheet Rev. 2 — 1 August 2011 7 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
(1) Tj=25C (prior to surge)
(2) Tj= 150 C (prior to surge) Tj=25C
Fig 1. Non-repetitive peak rev erse power dissipation
as a function of pulse duration; maximum
values
Fig 2. Forward current as a function of forward
voltage; typical values
BZX84J-B/C2V4 to BZX84J-B/C4V7
Tj=25C to 150 CBZX84J-B/C5V1 to BZX84J-B/C15
Tj=25C to 150 C
Fig 3. Temperature coefficient as a function of
working current; typica l values Fig 4. Tempera ture coefficient as a function of
working current; typical va lues
mbg801
10
3
1t
p
(ms)
P
ZSM
(W)
10
10
2
10
1
10
1
(1)
(2)
VF (V)
0.6 10.8
mbg781
100
200
300
IF
(mA)
0
IZ (mA)
101102
101
mld444
1
0.5
1.5
0
0.5
SZ
(mV/K)
2
2V4
4V7
4V3
3V9
3V6
3V3
3V0
2V7
mld445
4
0
8
12
SZ
(mV/K)
4
IZ (mA)
101102
101
15
13
12
11
10
9V1
5V6
5V1
8V2
7V5
6V8
6V2
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Product data sheet Rev. 2 — 1 August 2011 8 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Tj=25C
BZX84J-B/C2V7 to BZX84J-B/C8V2 Tj=25C
BZX84J-B/C10 to BZX84J-B/C36
Fig 5. Working current as a function of working
voltage; typical values Fig 6. Working current as a function of working
voltage; typical values
VZ (V)
0108462
006aaa996
20
30
10
40
50
IZ
(mA)
0
VZ(nom) (V) = 2.7
3.3
3.9
4.75.6 6.8 8.2
VZ (V)
0403010 20
006aaa997
10
20
30
5
15
25
IZ
(mA)
0
VZ(nom) (V) = 10
36
33272218
12
15
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Product data sheet Rev. 2 — 1 August 2011 9 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Fig 7. Package outline SOD323F (SC-90)
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3 1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 10. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Pack ing quantity
3000 10000
BZX84J-B2V4 to
BZX84J-C75 SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint SOD323F (SC-90)
0.951.65
2.2
2.1
3.05
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
0.5
(2×)
0.6
(2×)
0.6 (2×)0.5 (2×)
sod323f_fr
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Product data sheet Rev. 2 — 1 August 2011 10 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
12. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BZX84J_SER v.2 20110801 Product data sheet - BZX84J_SER v.1
Modifications: Figure 5 and Figure 6 updated
Figure 8 updated
Section 1.2 “Features and benefits updated
Section 5 “Limiting values updated
Section 8 “Test information added
Section 13 “Legal information updated
BZX84J_SER v.1 20070301 Product data sheet - -
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Product data sheet Rev. 2 — 1 August 2011 11 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
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profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
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Product data sheet Rev. 2 — 1 August 2011 12 of 13
NXP Semiconductors BZX84J series
Single Zen er di od e s
Quick reference data — The Quick reference dat a is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BZX84J series
Single Zen er di od e s
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 August 2011
Document identifier: BZX84J_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Packing information . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13