2
1 VALOX is a registered trademark of the General Electric Company.
Package and Handling Information
The Versatile Link package is made of a ame retardant
VALOX1 UL 94 V-0 material and uses the same pad
layout as a standard, eight pin dual-in-line package. These
Versatile Link packages are stackable and are enclosed to
provide a dust resistant seal. Snap action simplex, simplex
latching, duplex, and duplex latching connectors are
oered with simplex or duplex cables.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connec-
tions. Receivers are black and transmitters are grey.
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use reow solder
processes (i.e., infrared reow or vapor-phase reow).
Non-halogenated water soluble uxes (i.e., 0% chloride),
not rosin based uxes, are recommended for use with
Versatile Link components.
Versatile Link components are moisture sensitive devices
and are shipped in a moisture sealed bag. If the compo-
nents are exposed to air for an extended period of time,
they may require a baking step before the soldering
process. Refer to the special labeling on the shipping tube
for details.
Interlocked (Stacked) Assemblies (refer to Figure 4)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter-locking
mechanism by sliding the L bracket body from above into
the L slot body of the lower package. Use a straight edge,
such as a ruler, to bring all stacked units into uniform
alignment. This technique prevents potential harm that
could occur to ngers and hands of assemblers from the
package pins. Stacked horizontal packages can be disen-
gaged if necessary. Repeated stacking and unstacking
causes no damage to individual units.
Figure 1. Mechanical Dimensions Figure 2. Printed Circuit Board Layout Dimension
4 13 2
5 8
7.62
(0.300)
1.01 (0.040) DIA.
1.85
(0.073) MIN.
PCB EDGE
TOP VIEW
2.54
(0.100)
7.62
(0.300)
DIMENSIONS IN MILLIMETERS (INCHES).
6.86
(0.270)
10.16
(0.400)
4.19
(0.165)
1.27
(0.050)
2.54
(0.100)
0.51
(0.020)
18.8
(0.74)
2.03
(0.080)
7.62
(0.30)
0.64
(0.025)
7.62
(0.300)
2.77
(0.109)
1.85
(0.073)
0.64 (0.025) DIA.
5.08
(0.200)
3.81 (0.150) MAX.
3.56 (0.140) MIN.