929000789813 - NXP SEMICONDUCTORS

A

Datasheet

SaBLE-x-R2TM Bluetooth® Smart (BLE) Module

Version 1.5

SaBLE-x-R2

Datasheet

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REVISION HISTORY

Version

Date

Notes

Approver

1.0

20 June 2017

Initial Release

Josh Bablitch

1.1

22 June 2017

Updated Device Markings Section

Josh Bablitch

1.2

6 July 2017

Added Industry Canada Statement

Josh Bablitch

1.3

21 Aug 2017

Added mFlexPIFA antenna information

Bill Steinike

1.4

9 Nov 2017

Updated Certification Section

Robert Gosewehr

1.5

22 Oct 2018

Updated Legal Statement, Label Info, & Added

New Part Numbers

Robert Gosewehr

SaBLE-x-R2         
Datasheet 
 
           
Connectivity Solutions Support Center: 
http://ews-support.lairdtech.com 
www.lairdtech.com/wireless 
330-0237-R1.5 

The information in this document is subject to change without notice. 
© Copyright 2017-2018 Laird. All Rights Reserved 
Americas: +1-800-492-2320 
Europe: +44-1628-858-940 
Hong Kong: +852 2923 0610 
 
CONTENTS 
Description .........................................................................................................................................................4 
Features ..............................................................................................................................................................4 
Applications ........................................................................................................................................................4 
Ordering Information .........................................................................................................................................5 
Module Accessories ............................................................................................................................................6 
Pin Descriptions ..................................................................................................................................................8 
Electrical Specifications ................................................................................................................................... 10 
1 Absolute Maximum Ratings..................................................................................................................... 10 
2 Recommended Operating Conditions ..................................................................................................... 10 
3 General Characteristics............................................................................................................................ 10 
4 DC Characteristics .................................................................................................................................... 11 
5 General Power Consumption .................................................................................................................. 12 
6 RF Characteristics - TX ............................................................................................................................. 12 
7 RF Characteristics – RX 1 Mbps (BLE) ...................................................................................................... 13 
8 RF Characteristics – RX 2 Mbps (BLE5) .................................................................................................... 13 
9 RF Characteristics – RX 125-kbps Coded (BLE5) ...................................................................................... 14 
10 RF Characteristics – RX 500-kbps Coded (BLE5) ...................................................................................... 14 
11 Wakeup Timing ........................................................................................................................................ 15 
Soldering Recommendations........................................................................................................................... 17 
Cleaning ........................................................................................................................................................... 17 
Optical Inspection ........................................................................................................................................ 17 
Rework ......................................................................................................................................................... 18 
Shipping, Handling, and Storage ................................................................................................................. 18 
1 Shipping ................................................................................................................................................... 18 
2 Handling ................................................................................................................................................... 18 
3 Moisture Sensitivity Level (MSL) ............................................................................................................. 18 
4 Storage ..................................................................................................................................................... 18 
5 Repeating Reflow Soldering .................................................................................................................... 18 
Agency Certifications ................................................................................................................................... 19 
Agency Statements ...................................................................................................................................... 19 
1 Federal Communication Commission Interference Statement ............................................................... 19 
2 Industry Canada Statements ................................................................................................................... 20 
3 OEM Responsibilities to Comply with FCC and Industry Canada Regulations ........................................ 21 
4 OEM Labeling Requirements for End-Product ........................................................................................ 22 
5 OEM End Product User Manual Statements ........................................................................................... 22 
Europe ......................................................................................................................................................... 23 
Australia ....................................................................................................................................................... 23 
Bluetooth SIG Qualification ......................................................................................................................... 24 
Antenna Information ................................................................................................................................... 26 
Mechanical Data .......................................................................................................................................... 33 
PCB Footprint ............................................................................................................................................... 34 
Device Markings .......................................................................................................................................... 36 
Contacting LSR ............................................................................................................................................. 38 
 

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

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1 DESCRIPTION

Laird is announcing a low-cost and low-power consumption

module with all Bluetooth 5 Low Energy functionalities.

The SaBLE-x-R2 module fully supports the single mode Bluetooth

Low Energy operation and the output power can support class 2.

The module provides the ability to either put your entire

application into the integrated ARM Cortex M3 microcontroller.

Need to get to market quickly? Not an expert in Bluetooth Low

Energy? Need a custom antenna? Do you need help with your host

board? LSR Design Services will be happy to develop custom

hardware or software, or help integrate the design. Contact us at sales@lsr.com or call us at 262-375-4400.

2 FEATURES

▪ Built-in CC2640R2F Bluetooth 5 Low Energy

System-On-Chip (SOC) 5x5 mm RHB package

with 15 GPIOs

▪ 128 kB Flash/20 kB SRAM

▪ RF Output Power: +5 dBm

▪ RF Receive Sensitivity: -96 dBm

▪ Size: 11.6 mm x 17.9 mm x 2.4 mm

▪ Operating Voltage: 1.8V to 3.8V

▪ Operating Temperature: -40 to +85C

▪ 8.4 mA Transmit Mode (+5 dBm)

▪ 7.4 mA Receive Mode

▪ 1μA Standby (SRAM/CPU retention and RTC

running) with quick 100 μs start up

▪ 200 nA Shutdown

▪ 61μA/MHz Active CPU Current

▪ Drivers, Bluetooth Low Energy Controller, and

bootloader in ROM

▪ Flexible peripheral set

▪ On board 32 KHz and 24 MHz Crystals

▪ Worldwide Acceptance:

– FCC (USA), IC (Canada),

– ETSI (Europe), Giteki (Japan), and

– RCM (AU/NZ)

▪ BT SIG QD ID: 96853

▪ REACH and RoHS compliant

3 APPLICATIONS

▪ Consumer electronics

▪ Mobile phone accessories

▪ Sports and fitness equipment

▪ HID applications

▪ Home and building automation, lighting control, alarm and security

▪ Electronic shelf labeling and proximity tags

SaBLE-x-R2

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4 ORDERING INFORMATION

Table 1: Orderable model numbers

Order Number

Description

450-0177C

SaBLE-x-R2 Module, PCB Trace Antenna (Cut Tape)

450-0177R

SaBLE-x-R2 Module, PCB Trace Antenna (Tape & Reel)

450-0178C

SaBLE-x-R2 Module, External Antenna Port (Cut Tape)

450-0178R

SaBLE-x-R2 Module, External Antenna Port (Tape & Reel)

450-0184

SaBLE-x-R2 Evaluation Kit, PCB Trace Antenna

450-0185

SaBLE-x-R2 Development Kit, PCB Trace Antenna

450-0194C

SaBLE-x-R2 Module, Non-Ferrous Shield, PCB Trace Antenna (Cut Tape)

450-0194R

SaBLE-x-R2 Module, Non-Ferrous Shield, PCB Trace Antenna (Tape & Reel)

450-0195C

SaBLE-x-R2 Module, Non-Ferrous Shield, External Antenna Port (Cut Tape)

450-0195R

SaBLE-x-R2 Module, Non-Ferrous Shield, External Antenna Port (Tape & Reel)

SaBLE-x-R2

Datasheet

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5 MODULE ACCESSORIES

Table 2: Module accessories

Order Number

Description

001-0001

2.4 GHz Dipole Antenna with Reverse

Polarity SMA Connector

080-0001

U.FL to Reverse Polarity SMA Bulkhead

Cable 105 mm

001-0014

2.4 GHz FlexPIFA antenna

001-0015

2.4 GHz FlexNotch Antenna

SaBLE-x-R2

Datasheet

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Order Number

Description

001-0030

2.4 GHz Metal FlexPIFA Antenna w/U.FL

Cable, 100mm

SaBLE-x-R2 Module

CC2640R2F

Bluetooth Low Energy (BLE)

System-on-Chip (SOC)

Band

Pass

Filter

PCB

Trace

Antenna

(optional)

32 kHz

Crystal

Off Module Antenna

(optional) VCC

/Reset

2

15

2 Wire

JTAG

I/O

24 MHz

Crystal

Figure 1: SaBLE-x-R2 module block diagram

SaBLE-x-R2

Datasheet

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1

33

2

32

3

31

4

30

5

29

6

28

7

34

37

27

8

26

9

35

38

25

10

24

11

36

39

23

12

22

13

14

15

16

17

18

19

20

21

Figure 2: SaBLE-x-R2 module footprint (viewed from top)

6 PIN DESCRIPTIONS

Table 3: SaBLE-x-R2 Pin Descriptions

Module Pin

Name

I/O Type

Description

1

RF OUT

RF

Antenna, 50 OHMS

2

GND

Ground

3

GND

Ground

4

NC

-

No Connect (Do Not Connect)

5

NC

-

No Connect (Do Not Connect)

6

/RESET

DI

Active Low Reset. 100 kΩ Pull-up

7

JTAG_TCKC

DI/DIO

JTAG TCKC

8

JTAG_TMSC

DIO

JTAG TMSC

SaBLE-x-R2

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Module Pin

Name

I/O Type

Description

9

NC

-

No Connect (Do Not Connect)

10

NC

-

No Connect (Do Not Connect)

11

VCC

PI

Power Supply to Module

12

VCC

PI

Power Supply to Module

13

DIO_5/JTAG_TDO

DIO

GPIO, JTAG_TDO, LED Driving Capability

14

DIO_6/JTAG_TDI

DIO

GPIO, JTAG_TDI, LED Driving Capability

15

DIO_4

DIO

GPIO, ULP Sensor Interface, LED Driving Capability

16

DIO_3

DIO

GPIO, ULP Sensor Interface, LED Driving Capability

17

DIO_2

DIO

GPIO, ULP Sensor Interface, LED Driving Capability

18

DIO_1/BOOT_RX

DIO

GPIO, ULP Sensor Interface, Bootloader RX

(UART0)

19

DIO_0/BOOT_TX

DIO

GPIO, ULP Sensor Interface, Bootloader TX

(UART0)

20

DIO_7

DIO

GPIO, Analog Input, ULP Sensor Interface

21

DIO_8

DIO

GPIO, Analog Input, ULP Sensor Interface

22

GND

Ground

23

DIO_10

DIO

GPIO, Analog Input, ULP Sensor Interface

24

DIO_9

DIO

GPIO, Analog Input, ULP Sensor Interface

25

NC

-

No Connect (Do Not Connect)

26

NC

-

No Connect (Do Not Connect)

27

NC

-

No Connect (Do Not Connect)

28

NC

-

No Connect (Do Not Connect)

29

DIO_11

DIO

GPIO, Analog Input, ULP Sensor Interface

30

DIO_12

DIO

GPIO, Analog Input, ULP Sensor Interface

31

DIO_13

DIO

GPIO, Analog Input, ULP Sensor Interface

32

DIO_14

DIO

GPIO, Analog Input, ULP Sensor Interface

33

GND

Ground

34-39

GND

Ground and Thermal Relief Pads

PI = Power Input

GND = Ground

DI = Digital Input

DO = Digital Output

DIO = Digital Input/Output

AI = Analog Input

RF = Bi-directional RF Port

Note: See the Texas Instruments CC2640 datasheet and user guide for further details on the I/O.

SaBLE-x-R2

Datasheet

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7 ELECTRICAL SPECIFICATIONS

7.1 Absolute Maximum Ratings

Table 4: Absolute maximum ratings

Symbol

Description

Min

Max

Unit

VCC

Digital Input Supply Voltage

-0.3

4.1

V

Voltage on any digital pin

-0.3

VCC+0.3, max 4.1

V

Input RF level

+5

dBm

IMPORTANT!

Do not exceed the absolute maximum ratings specified in Table 4 under any circumstances. Stressing the

module beyond these limits may result in permanent damage to the module; this damage is not covered

by the warranty.

7.2 Recommended Operating Conditions

7.2.1 Test Conditions: Ambient Temp = 25°C

Table 5: Recommended operating conditions

Symbol

Min

Typ

Max

Unit

VCC

1.8

3.3

3.8

V

7.3 General Characteristics

Table 6: General Characteristics

Characteristic

Description

Model Name

SaBLE-x-R2

Product Description

Bluetooth Low Energy Wireless Module

Dimension

11.63 mm x 17.86 mm x 2.4 mm (W*L*T)

Operating temperature

-40°C to 85°C

Storage temperature

-40°C to 85°C

Humidity

Operating Humidity: 10% to 95% Non-Condensing

Storage Humidity: 5% to 95% Non-Condensing

Weight

0.75 g ± 0.05 g

SaBLE-x-R2

Datasheet

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7.4 DC Characteristics

Table 7: SaBLE-x-R2 module Bluetooth general DC characteristics

Parameter

Test Conditions

Min

Typ

Max

Unit

Input low-to-high transition with

hysteresis

Transition from 0 to 1, TA= 25°C,

VCC=1.8V

1.07

V

Input high-to-low transition with

hysteresis

Transition from 1 to 0, TA= 25°C,

VCC=1.8V

0.74

V

Input hysteresis

Difference between 0 to 1 and 1 to 0.

0.33

V

Input low-to-high transition with

hysteresis

Transition from 0 to 1, TA= 25°C,

VCC=3.8V

1.94

V

Input high-to-low transition with

hysteresis

Transition from 1 to 0, TA= 25°C,

VCC=3.8V

1.54

V

Input hysteresis

Difference between 0 to 1 and 1 to 0.

0.40

V

Logic-0 output voltage, 4 mA pins

Output load 4 mA, TA= 25°C, VCC=1.8V

0.26

V

Logic-1 output voltage, 4 mA pins

Output load 4 mA, TA= 25°C, VCC=1.8V

1.54

V

Logic-0 output voltage, 8 mA pins

Output load 8 mA, TA= 25°C, VCC=1.8V

0.21

V

Logic-1 output voltage, 8 mA pins

Output load 8 mA, TA= 25°C, VCC=1.8V

1.58

V

Logic-0 output voltage, 4 mA pins

Output load 4 mA, TA= 25°C, VCC=3.0V

0.33

V

Logic-1 output voltage, 4 mA pins

Output load 4 mA, TA= 25°C, VCC=3.0V

2.72

V

Logic-0 output voltage, 8 mA pins

Output load 8 mA, TA= 25°C, VCC=3.0V

0.28

V

Logic-1 output voltage, 8 mA pins

Output load 8 mA, TA= 25°C, VCC=3.0V

2.68

V

Input pullup current

Vpad=0V, TA= 25°C, VCC=1.8V

72

uA

Input pulldown current

Vpad=1.8V, TA= 25°C, VCC=1.8V

22

uA

Input pullup current

Vpad=0V, TA= 25°C, VCC=3.8V

277

uA

Input pulldown current

Vpad=3.8V, TA= 25°C, VCC=3.8V

113

uA

SaBLE-x-R2

Datasheet

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7.5 General Power Consumption

7.5.1 TA = 25°C

Table 8: SaBLE-x-R2 module Bluetooth TX and RX current consumption specifications

Parameter

Test Conditions

Min

Typical Average Current

Max

Unit

1.8V

3.0V

3.3V

3.8V

Shutdown

No clocks running, no data

retention

200

nA

Standby 1

With RTC, CPU, RAM, and partial

register retention. XOSC_LF

1.2

uA

Standby 2

With Cache, RTC, CPU, RAM, and

partial register retention. XOSC_LF

2.7

uA

Idle

Supply Systems and RAM

powered.

550

uA

Active

Core running CoreMark

1.45 mA +

31 uA/MHz

Radio RX

DC-DC Turned OFF

12.7

12.8

12.9

13.0

mA

Radio TX

+5 dBm output power

13.6

9.0

8.4

7.9

7.6 RF Characteristics - TX

The following results are typical performance for the following data rates:

1 Mbps (BLE), 2 Mbps (BLE5), 125 kbps, and 500 kbps Coded (BLE5)

Results measured on LSR SaBLE-x-R2 external antenna development board reference design with TA = 25°C, LEDs

disabled, DC-to-DC converter enabled, and measured at RF connector.

Table 9: BLE TX RF characteristics

Parameter

Test Conditions

Min

Typical

Max

Unit

1.8V

3.0V

3.3V

3.8V

Output Power

CH 0 (2402 MHZ)

4.8

dBm

CH 19 (2440 MHZ)

4.6

4.7

CH 39 (2480 MHZ)

4.3

4.4

Spurious Emission

Conducted

Measurement

f < 1 GHz

-43

dBm

f > 1 GHz

-46

dBm

RF Frequency Range

Programmable in one-MHz steps

2402

2480

MHz

SaBLE-x-R2

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7.7 RF Characteristics – RX 1 Mbps (BLE)

Table 10: BLE TX RF characteristics

Parameter

Test Conditions

Min

Typical

Max

Unit

1.8V

3.0V

3.3V

3.8V

Receiver Sensitivity

DC to DC Disabled

CH 0 (2402 MHZ)

-95

dBm

CH 19 (2440 MHZ)

-95

CH 39 (2480 MHZ)

-95

Receiver Sensitivity

DC to DC Enabled

CH 0 (2402 MHZ)

-95

-94

-93

-92

dBm

CH 19 (2440 MHZ)

-95

-94

-93

-92

CH 39 (2480 MHZ)

-95

-94

-93

-92

Saturation

BER < 0.1%

4

dBm

Co-channel

Rejection

Wanted signal –67 dBm

-6

dB

Frequency Error

Tolerance

Difference between the incoming

carrier frequency and the

internally-generated carrier

frequency

-350

350

kHz

Intermodulation

Minimum interferer level

-34

dBm

7.8 RF Characteristics – RX 2 Mbps (BLE5)

Table 11: BLE TX RF characteristics

Parameter

Test Conditions

Min

Typical

Max

Unit

1.8V

3.0V

3.3V

3.8V

Receiver Sensitivity

DC to DC Disabled

CH 0 (2402 MHZ)

-91.5

dBm

CH 19 (2440 MHZ)

-91.5

CH 39 (2480 MHZ)

-91.5

Receiver Sensitivity

DC to DC Enabled

CH 0 (2402 MHZ)

-91.5

-90

-89.5

-89

dBm

CH 19 (2440 MHZ)

-91.5

-90

-89.5

-89

CH 39 (2480 MHZ)

-91.5

-90

-89.5

-89

Saturation

BER < 0.1%

4

dBm

Co-channel Rejection

Wanted signal –67 dBm

-7

dB

Frequency

Error

Tolerance

Difference between the

incoming carrier frequency and

the internally generated carrier

frequency

-300

500

kHz

Intermodulation

Minimum interferer level

-45

dBm

SaBLE-x-R2

Datasheet

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7.9 RF Characteristics – RX 125-kbps Coded (BLE5)

Table 12: BLE TX RF characteristics

Parameter

Test Conditions

Min

Typical

Max

Unit

1.8V

3.0V

3.3V

3.8V

Receiver Sensitivity

DC to DC Disabled

CH 0 (2402 MHZ)

-102

dBm

CH 19 (2440 MHZ)

-102

CH 39 (2480 MHZ)

-102

Receiver Sensitivity

DC to DC Enabled

CH 0 (2402 MHZ)

-102

-100

-98

-97

dBm

CH 19 (2440 MHZ)

-102

-100

-98

-97

CH 39 (2480 MHZ)

-102

-100

-98

-97

Saturation

BER < 0.1%

5

dBm

Co-channel Rejection

Wanted signal –79 dBm

-3

dB

Frequency

Error

Tolerance

Difference between the

incoming carrier frequency and

the internally generated carrier

frequency

-260

310

kHz

Intermodulation

Minimum interferer level

-42

dBm

7.10 RF Characteristics – RX 500-kbps Coded (BLE5)

Table 13: BLE TX RF characteristics

Parameter

Test Conditions

Min

Typical

Max

Unit

1.8V

3.0V

3.3V

3.8V

Receiver Sensitivity

DC to DC Disabled

CH 0 (2402 MHZ)

-99.5

dBm

CH 19 (2440 MHZ)

-99.5

CH 39 (2480 MHZ)

-99.5

Receiver Sensitivity

DC to DC Enabled

CH 0 (2402 MHZ)

-99.5

-98

-96

-95

dBm

CH 19 (2440 MHZ)

-99.5

-98

-96

-95

CH 39 (2480 MHZ)

-99.5

-98

-96

-95

Saturation

BER < 0.1%

5

dBm

Co-channel Rejection

Wanted signal –79 dBm

-5

dB

Frequency

Error

Tolerance

Difference between the

incoming carrier frequency and

the internally generated carrier

frequency

-240

240

kHz

Intermodulation

Minimum interferer level

-37

dBm

SaBLE-x-R2

Datasheet

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7.11 Wakeup Timing

7.11.1 Shutdown

Shutdown is similar to holding the device in reset with two exceptions:

▪ It latches the state of IO prior to shutting down.

▪ It consumes 0.1 uA, versus approximately 37 uA.

Figure 3 shows the response time to wake up from shutdown by using a wake-up pin. The pin is configured to

wake the device up on a negative edge. Once the device wakes, it drives an awake pin low:

Figure 3: SaBLE-x-R2 module waking from shutdown timing diagram

Figure 3 shows the module taking approximately 160 milliseconds to wake.

SaBLE-x-R2

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7.11.2 Standby

Standby is a low power mode policy. When configured correctly in code the software goes into standby.

Figure 4 shows the response time to wake up from standby using a wake up pin. The method is the same as

described in the shutdown section:

Figure 4: SaBLE-x-R2 module waking from standby timing diagram

Figure 4 shows the module taking approximately 139 µs to wake.

SaBLE-x-R2

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8 SOLDERING RECOMMENDATIONS

8.1 Recommended Reflow Profile for Lead Free Solder

Figure 5: Recommended soldering profile

Note: The quality of solder joints on the surface mount pads where they contact the host board should

meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies,

section 8.2.1 Bottom Only Terminations.

9 CLEANING

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily

removed with any cleaning process.

▪ Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host

board and the module. The combination of soldering flux residuals and encapsulated water could lead to

short circuits between neighboring pads. Water could also damage any stickers or labels.

▪ Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield,

which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

▪ Ultrasonic cleaning could damage the module permanently.

10 OPTICAL INSPECTION

After soldering the module to the host board, consider optical inspection to check the following:

▪ Proper alignment and centering of the module over the pads.

▪ Proper solder joints on all pads.

▪ Excessive solder or contacts to neighboring pads, or vias.

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11 REWORK

The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met

as described in this datasheet.

Note: Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will

terminate warranty coverage.

12 SHIPPING, HANDLING, AND STORAGE

12.1 Shipping

Bulk orders of the SaBLE-x-R2 modules are delivered in reels of 1,000.

12.2 Handling

The SaBLE-x-R2 modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection

may damage the module permanently.

12.3 Moisture Sensitivity Level (MSL)

Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior

to use.

Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices

that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required.

If baking is required, refer to J-STD-033 for bake procedure.

12.4 Storage

Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40ºC and <90% room humidity

(RH).

Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3,

SO2, or NOX.

Do not store in direct sunlight.

The product should not be subject to excessive mechanical shock.

12.5 Repeating Reflow Soldering

Note: Only a single reflow soldering process is encouraged for host boards.

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13 AGENCY CERTIFICATIONS

FCC ID

TFB-1005, FCC Part 15.247

IC ID

5969A-1005, RSS 247

CE

Compliant to standards EN 60950-1, ETSI EN 300 328, ETSI EN 301 489-1, and ETSI 301 489-17

Giteki: Compliant to standard ARIB STD-T66 v3.7

201-170613 (PCB trace antenna)

201-170614 (External antenna)

RCM: Compliant to standard AS/NZS 4268:2017

14 AGENCY STATEMENTS

14.1 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a particular installation. If

this equipment does cause harmful interference to radio or television reception, which can be determined by

turning the equipment off and on, the user is encouraged to try to correct the interference by one of the

following measures:

▪ Reorient or relocate the receiving antenna.

▪ Increase the separation between the equipment and receiver.

▪ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

▪ Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

This portable transmitter with its antenna complies with FCC/IC RF exposure limits for general population/

uncontrolled exposure.

FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate this equipment.

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14.2 Industry Canada Statements

Radiation Exposure Statement:

This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following

two conditions: (1) this device may not cause interference, and (2) this device must accept any interference,

including interference that may cause undesired operation of the device.

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the

equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.

This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 0 dBi

(PCB Trace), 2.0 dBi (LSR 2.4 GHz Dipole), 2.0 dBi (LSR 2.4 GHz FlexPIFA), 2.0 dBi (LSR 2.4 GHz FlexNotch), and 2.0

(LSR 2.4 GHz mFlexPIFA). Antennas not included in this list or having a gain greater than 0 dB, 2.0 dBi, 2.0 dBi,

2.0 dBi, and 2.0 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.

List of all Antennas Acceptable for use with the Transmitter

▪ On module PCB trace antenna.

▪ LSR 001-0001 center-fed 2.4 GHz dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector

cable.

▪ LSR 001-0014 2.4 GHz FlexPIFA antenna.

▪ LSR 001-0015 2.4 GHz FlexNotch antenna.

▪ LSR 001-0030 2.4 GHz Metal FlexPIFA (mFlexPIFA) antenna.

Déclaration d'exposition aux radiations:

Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.

Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.

Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s). L'opération est soumise

aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit

accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de

l'appareil.

Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de

manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une

communication réussie.

Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 0 dBi (PCB

Trace), 2,0 dBi (LSR 2.4 GHz Dipole), 2,0 dBi (LSR 2.4 GHz FlexPIFA), 2,0 dBi (LSR 2.4 GHz FlexNotch), et 2,0 dBi

(LSR 2.4 GHz mFlexPIFA). Antennes pas inclus dans cette liste ou présentant un gain supérieur à 0 dBi, 2,0 dBi,

2,0 dBi, 2,0 dBi, et 2,0 dBi sont strictement interdites pour une utilisation avec cet appareil. L'impédance

d'antenne requise est de 50 ohms.

Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur

▪ Le module d'antenne PCB trace.

▪ LSR 001-0001 centre-fed 2,4 GHz antenne dipôle et LSR 080-0001 U.FL pour inverser câble connecteur SMA

à polarité.

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▪ LSR 001-0014 antenne FlexPIFA 2,4 GHz.

▪ LSR 001-0015 antenne FlexNotch 2,4 GHz.

▪ LSR 001-0030 antenne Métal FlexPIFA (mFlexPIFA) 2,4 GHz

14.3 OEM Responsibilities to Comply with FCC and Industry Canada Regulations

The SaBLE-x-R2 module has been certified for integration into products only by OEM integrators under the

following conditions:

The antennas for this transmitter must not be co-located with any other transmitters except in accordance with

FCC and Industry Canada multi-transmitter procedures.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-

location with another transmitter), then the FCC and Industry Canada authorizations are

no longer considered valid and the FCC ID and IC Certification Number cannot be used

on the final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate FCC

and Industry Canada authorization.

Le module de SaBLE-x-R2a été certifié pour l'intégration dans des produits uniquement par des

intégrateurs OEM dans les conditions suivantes:

Les antennes pour ce transmetteur ne doit pas être co-localisés avec les autres émetteurs sauf en conformité

avec la FCC et Industrie Canada multi-émetteur procédures..

Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas

tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les

exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil

numérique, les exigences de périphériques PC, etc.)

NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations

ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations

Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de

certification ne peut pas être utilisé sur la produit final. Dans ces circonstances,

l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et

l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.

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OEM Labeling Requirements for End-Product

The SaBLE-x-R2 module is labeled with its own FCC ID and IC certification number. The FCC ID and IC certification

numbers are not visible when the module is installed inside another device. As such, the end device into which

the module is installed must display a label referring to the enclosed module. The end product must be labeled

in a visible area with the following:

Contains Transmitter Module FCC ID: TFB-1005

Contains Transmitter Module IC: 5969A-1005

or

Contains FCC ID: TFB-1005

Contains IC: 5969A-1005

The OEM of the SaBLE-x-R2 module must only use the approved antenna(s) listed above, which have been

certified with this module.

Le module de SaBLE-x-R2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC

et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil,

comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence

au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:

Contient Module émetteur FCC ID: TFB-1005

Contient Module émetteur IC: 5969A-1005

ou

Contient FCC ID: TFB-1005

Contient IC: 5969A-1005

Les OEM du module SaBLE-x-R2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce

module.

14.4 OEM End Product User Manual Statements

The OEM integrator should not provide information to the end user regarding how to install or remove this RF

module or change RF related parameters in the user manual of the end product.

Other user manual statements may apply.

L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de

supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.

Autres déclarations manuel de l'utilisateur peuvent s'appliquer.

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15 EUROPE

15.1 CE Notice

This device has been tested and certified for use in the European Union. See the Declaration of Conformity (DoC)

for specifics (available on the applicable product page of the Laird website).

If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU

standards. A Declaration of Conformity must be issued and kept on file as described in the 2014/53/EU – Radio

Equipment Directive (RED).

The CE mark must be placed on the OEM product per the labeling requirements of the directive.

16 AUSTRALIA

16.1 RCM

Table 14: AS/NZS certification

Radio Equipment and Systems (Short Range Devices) Standard 2014 (Amnt 1:2015)

Radiocommunications (Low Interference Potential Device) Class License 2015

AS/NZS 4268: 2017

EN 300 328 v2.1.1 (2016-11)

Report No.: AR742502, Dated: 25 April 2017, International Certification Corp.

Radiocommunications (Electromagnetic Radiation – Human Exposure) Standard 2014

AS/NZS 2772.2:2011

Report No.: AA742502, Dated: 25 April 2017, International Certification Corp.

Maximum Exposure Levels to Radio Frequency Fields – 3 KHz to 300 GHz (2002) RPS 3, ARPANSA

Category B Exemption – Fixed Station Exemption, ARPANSA Schedule 5, General Public Exposure, <20mW

Mean Power,

Or no antenna near the body (>20 cm from unaware user) and mean output power does not exceed Table 2

threshold for testing.

If this device is used in a product, the OEM has the responsibility to verify the compliance of the final end

product to the Australia/New Zealand (RCM) Standards. All end-products require their own certification (SDoc).

You cannot leverage the module certification and ship product into the country.

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17 BLUETOOTH SIG QUALIFICATION

The SaBLE-x-R2 module is listed on the Bluetooth SIG website as a Component Tested design. It is intended use is

integration into a new End Product design by a third-party SIG member.

Design Name

Owner

Declaration

ID

QD ID

Link to listing on the SIG website

SaBLE-x-R2

Laird

Technologies

D035147

96853

https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=35

147

It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing

Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification

process, even when referencing a Bluetooth design that already has its own Declaration ID. The qualification

process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org

The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/

For each Bluetooth design it is necessary to purchase a Declaration ID. This can be done before starting the new

qualification, either through invoicing or credit card payment. The fees for the Declaration ID depend on your

membership status. Please refer to the following webpage:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG

document:

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486

17.1 Qualification Steps When Combining with a Laird Component

If you wish to use a Laird component in your end product, the qualification process follows the Traditional

Project route, creating a completely new design. When creating a new design, it is necessary to complete the full

qualification listing process and maintain a compliance folder for the new design.

The SaBLE-x-R2 design under D035147 incorporates the following Texas Instrument component;

Listing reference

Design Name

Core Spec Version

D035408 (RF-PHY)

CC2640R2F SimpleLink™ Bluetooth® 5.0 low energy Wireless MCU

5.0

If your design is based on un-modified SaBLE-x-R2 hardware, it is possible to use the following process;

Reference the existing RF-PHY test report from the SaBLE-x-R2 listing.

Combine the relevant Texas Instruments component(s) – covering as a minimum LL, L2CAP, GAP, ATT, GATT,

SM). Check relevant QDID with Texas Instruments\Laird.

Example component is Texas Instruments D033411)

Test on PTS any standard SIG profiles that are supported in the design. Customs profiles are exempt.

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Figure 6: End Product design qualification scope

Figure 6 shows the scope of the qualification for an End Product Design.

The first step is to generate a project on the TPG (Test Plan Generator) system. This determines which test cases

apply to demonstrate compliance with the Bluetooth Test Specifications. When combining qualified components

in your design, and they are within their 3-year listing period, you are not required to re-test those layers

covered by those components.

If the design incorporates any standard SIG LE profiles (such as the Heart Rate Profile), it is necessary to test

these profiles using PTS or other tools where permitted; the results are added to the compliance folder.

You must upload your test declaration and test reports (where applicable) and then complete the final listing

steps on the SIG website.

Note: Remember to purchase your Declaration ID before you start the qualification process, as it is not

possible to complete the listing without it.

For further information please refer to the following training material:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates

If you require assistance with the qualification process, please contact our recommended Bluetooth

Qualification Expert (BQE), Steve Flooks, steve.flook@eurexuk.com.

End Product

Laird RF-PHY

3rd Party LL

3rd Party Host

Layers

Optional Profiles

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18 ANTENNA INFORMATION

18.1 LSR Dipole Antenna

See antenna datasheet.

18.2 LSR FlexPIFA

See antenna datasheet.

18.3 LSR FlexNotch

See antenna datasheet.

18.4 LSR mFlexPIFA

See antenna datasheet.

18.5 PCB Trace Antenna

Figure 7: PCB trace antenna pattern measurement planes

AZIMUTH ROTATION

AXIS AND ANGLE

ELEVATION ROTATION

AXIS AND ANGLE

2ND

ELEVATION ROTATION

AXIS AND ANGLE

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Table 15: PCB trace antenna gain summary

Orientation

Frequency

(MHz)

Polarization

Peak Gain

(dBi)

Average

Gain (dBi)

Average

Total Gain

(P) (dBi)

Average

Total Gain

(F, P) (dBi)

Average

Total Gain

(O, F, P)

(dBi)

Azimuth

2402

Vertical

0.0

-3.6

-3.0

-4.6

-5.9

Azimuth

2402

Horizontal

-6.6

-12.4

Azimuth

2440

Vertical

-1.7

-5.1

-4.5

Azimuth

2440

Horizontal

-1.7

-13.4

Azimuth

2480

Vertical

-4.3

-7.9

-7.3

Azimuth

2480

Horizontal

-11.5

-15.9

Elevation

2402

Vertical

-7.3

-11.4

-4.7

-6.0

Elevation

2402

Horizontal

-1.2

-5.7

Elevation

2440

Vertical

-7.9

-12.6

-5.6

Elevation

2440

Horizontal

-7.9

-6.6

Elevation

2480

Vertical

-11.0

-15.9

-8.3

Elevation

2480

Horizontal

-4.2

-9.1

2nd Elevation

2402

Vertical

-9.4

-14.8

-6.6

-7.7

2nd Elevation

2402

Horizontal

-2.8

-7.3

2nd Elevation

2440

Vertical

-10.3

-16.6

-7.3

2nd Elevation

2440

Horizontal

-3.4

-7.9

2nd Elevation

2480

Vertical

-12.8

-18.9

-9.8

2nd Elevation

2480

Horizontal

-6.0

-10.4

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Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) – Azimuth Cut

Figure 8: PCB Trace Antenna Pattern (Azimuth @ 2402 MHz)

Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) – Elevation Cut

Figure 9: PCB Trace Antenna Pattern (Elevation @ 2402 MHz)

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) - Azimuth Cut

Vertical

Horizontal

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) - Elevation Cut

Vertical

Horizontal

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Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) – Second Elevation Cut

Figure 10: PCB Trace Antenna Pattern (2nd Elevation @ 2402 MHz)

Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) – Azimuth Cut

Figure 11: PCB Trace Antenna Pattern (Azimuth @ 2440 MHz)

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2402 MHz (dB) - Second Elevation Cut

Vertical

Horizontal

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) - Azimuth Cut

Vertical

Horizontal

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Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) – Elevation Cut

Figure 12: PCB Trace Antenna Pattern (Elevation @ 2440 MHz)

Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) – Second Elevation Cut

Figure 13: PCB Trace Antenna Pattern (2nd Elevation @ 2440 MHz)

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) - Elevation Cut

Vertical

Horizontal

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2440 MHz (dB) - Second Elevation Cut

Vertical

Horizontal

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Vertical, Horizontal Antenna Patterns at 2480 MHz (dB) – Azimuth Cut

Figure 14: PCB Trace Antenna Pattern (Azimuth @ 2480 MHz)

Vertical, Horizontal Antenna Patterns at 2480 MHz (dB) – Elevation Cut

Figure 15: PCB Trace Antenna Pattern (Elevation @ 2480 MHz)

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2480 MHz (dB) - Azimuth Cut

Vertical

Horizontal

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2480MHz (dB) - Elevation Cut

Vertical

Horizontal

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

32

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Vertical, Horizontal Antenna Patterns at 2480 MHz (dB) – Second Elevation Cut

Figure 16: PCB Trace Antenna Pattern (2nd Elevation @ 2480 MHz)

-40

-30

-20

-10

0

30

210

60

240

90

270

120

300

150

330

180 0

Vertical, Horizontal Antenna Patterns at 2480 MHz (dB) - Second Elevation Cut

Vertical

Horizontal

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

33

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

19 MECHANICAL DATA

The following are the mechanical dimensions of the SaBLE-x-R2 module.

Figure 17: Module Mechanical Dimensions (Maximum Module Height = 2.4mm)

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

34

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

20 PCB FOOTPRINT

Figure 18: SaBLE-x-R2 Recommended PCB Footprint (Viewed from Top)

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

35

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

20.1 Tape and Reel Dimensions

Note: Module must be in this orientation when feeding tape.

Figure 19: Tape and Reel Specification

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

36

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

21 DEVICE MARKINGS

21.1 450-0177 & 450-0178

21.1.1 Rev 1 Devices

The shield on the 450-0177/450-0178 modules contains the following information:

▪ Laird Model: SaBLE-x-R2

▪ Part Number and Revision:

– Part Number: 450-0177 or 450-0178

– Revision: -RX (where X is the latest revision)

▪ FCC ID: TFB-1005

▪ IC: 5969A-1005

▪ SSYYWWD = Date Code (YY=Year, WW=Week)

▪ XXXXX = Incremental Serial Number

▪ 2D Barcode Format is Data Matrix Standard

21.1.2 Rev 2 Devices

Added Giteki and C-Tick Certification

The shield on the 450-0177/450-0178 modules contains the following additional information:

▪ C-Tick Logo (Australia and New Zealand Certification)

▪ Giteki Logo (Japan Certification)

o Symbol of Radio Certification

o 201 CAB ID assigned by Minister of MIC

o 170613 (450-0177) or 170614 (450-0178) Certification number assigned by the CAB.

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

37

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

21.2 450-0194 & 450-0195

21.2.1 Rev 1 Devices

The shield on the 450-0194/450-0195 modules contains the following information:

▪ Laird Model: SaBLE-x-R2

▪ Part Number and Revision:

– Part Number: 450-0194 or 450-0195

– Revision: -RX (where X is the latest revision)

▪ FCC ID: TFB-1005

▪ IC: 5969A-1005

▪ SSYYWWD = Date Code (YY=Year, WW=Week)

▪ XXXXX = Incremental Serial Number

▪ 2D Barcode Format is Data Matrix Standard

▪ C-Tick Logo (Australia and New Zealand Certification)

▪ Giteki Logo (Japan Certification)

o Symbol of Radio Certification

o 201 CAB ID assigned by Minister of MIC

o 170613 (450-0177) or 170614 (450-0178) Certification number assigned by the CAB.

SaBLE-x-R2

Datasheet

Connectivity Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

330-0237-R1.5

38

The information in this document is subject to change without notice.

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

22 CONTACTING LSR

Headquarters

LSR

W66 N220 Commerce Court

Cedarburg, WI 53012-2636

USA

Tel: 1(262) 375-4400 Fax: 1(262) 375-4248

Website

www.lsr.com

Technical Support

forum.lsr.com

Sales Contact

sales@lsr.com

to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and

application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential

uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird

materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall

not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms

and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a

tradename herein, Laird means Laird Limited due to the acquisition by Advent or one or more subsidiaries of Laird Limited.

LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird.

Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party

intellectual property right.