General Description
The MAX16010–MAX16014 is a family of ultra-small, low-
power, overvoltage-protection circuits for high-voltage,
high-transient systems such as those found in telecom
and industrial applications. These devices operate over
a wide 5.5V to 72V supply voltage range, making them
also suitable for other applications such as battery stacks,
notebook computers, and servers.
The MAX16010 and MAX16011 offer two independent
comparators for monitoring both undervoltage and over-
voltage conditions. These comparators offer open-drain
outputs capable of handling voltages up to 72V. The
MAX16010 features complementary enable inputs (EN/
EN), while the MAX16011 features an active-high enable
input and a selectable active-high/low OUTB output.
The MAX16012 offers a single comparator and an
independent reference output. The reference output can
be directly connected to either the inverting or noninvert-
ing input to select the comparator output logic.
The MAX16013 and MAX16014 are overvoltage-
protection circuits that are capable of driving two
p-channel MOSFETs to prevent reverse-battery and
overvoltage conditions. One MOSFET (P1) eliminates the
need for external diodes, thus minimizing the input volt-
age drop. The second MOSFET (P2) isolates the load or
regulates the output voltage during an overvoltage condi-
tion. The MAX16014 keeps the MOSFET (P2) latched off
until the input power is cycled.
The MAX16010 and MAX16011 are available in small
8-pin TDFN packages, while the MAX16012–MAX16014
are available in small 6-pin TDFN packages. These
devices are fully specified from -40°C to +125°C.
Applications
●Industrial
●48V Telecom/Server/Networking
●FireWire®
●Notebook Computers
●Multicell Battery-Stack-Powered Equipment
Features
●Wide 5.5V to 72V Supply Voltage Range
●Open-Drain Outputs Up to 72V
(MAX16010/MAX16011/MAX16012)
● Fast 2μs (max) Propagation Delay
●Internal Undervoltage Lockout
●p-Channel MOSFET Latches Off After an
Overvoltage Condition (MAX16014)
●Adjustable Overvoltage Threshold
●-40°C to +125°C Operating Temperature Range
●Small 3mm x 3mm TDFN Package
Pin Configurations appear at end of data sheet
FireWire is a registered trademark of Apple, Inc.
19-3693; Rev 5; 2/15
Note: Replace the “_” with “A” for 0.5% hysteresis, “B” for 5%
hysteresis, and “C” for 7.5% hysteresis.
*Replace -T with +T for lead(Pb)-free/RoHS-compliant
packages.
**EP = Exposed pad.
PART* TEMP RANGE PIN-PACKAGE
MAX16010TA_-T -40°C to +125°C 8 TDFN-EP**
MAX16011TA_-T -40°C to +125°C 8 TDFN-EP**
MAX16012TT-T -40°C to +125°C 6 TDFN-EP**
MAX16013TT-T -40°C to +125°C 6 TDFN-EP**
MAX16014TT-T -40°C to +125°C 6 TDFN-EP**
MAX16013
MAX16014
GATE1
SET
GATE2
VCC
GND
P1
R1
R2
VBATT
P2
2MΩ*
*OPTIONAL
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
Typical Operating Circuit
Ordering Information
(All pins referenced to GND, unless otherwise noted.)
VCC ........................................................................-0.3V to +80V
EN, EN, LOGIC ........................................ -0.3V to (VCC + 0.3V)
INA+, INB-, IN+, IN-, REF, SET.............................-0.3V to +12V
OUTA, OUTB, OUT ...............................................-0.3V to +80V
GATE1, GATE2 to VCC .........................................-12V to +0.3V
GATE1, GATE2 ........................................-0.3V to (VCC + 0.3V)
Current Sink/Source (all pins) ............................................50mA
Continuous Power Dissipation (TA = +70°C)
6-Pin TDFN (derate 18.2mW/°C above +70°C) ........1455mW
8-Pin TDFN (derate 18.2mW/°C above +70°C) ........1455mW
Operating Temperature Range ......................... -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
(VCC = 14V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range VCC 5.5 72.0 V
Input Supply Current ICC No load VCC = 12V 20 30 µA
VCC = 48V 25 40
VCC Undervoltage Lockout VUVLO
VCC rising, part enabled, VINA+ = 2V, OUTA
deasserted (MAX16010/MAX16011),
VIN = 2V, VOUT deasserted (MAX16012),
VSET = 0V, GATE2 = VCLMP (MAX16013/
MAX16014)
4.75 5 5.25 V
INA+/INB-/SET Threshold Voltage
VTH+ 1.215 1.245 1.265
V
VTH-
0.5% hysteresis, MAX16010/MAX16011 1.21 1.223 1.26
5.0% hysteresis, MAX16010/MAX16011/
MAX16013/MAX16014 1.15 1.18 1.21
7.5% hysteresis MAX16010/MAX16011 1.12 1.15 1.18
Threshold-Voltage Hysteresis
MAX16010TAA/MAX16011TAA 0.5
%
MAX16010TAB/MAX16011TAB/
MAX16013/MAX16014 5.0
MAX16010TAC/MAX16011TAC 7.5
SET/IN_ Input Current SET/IN_ = 2V -100 +100 nA
IN_ Operating Voltage Range 0 4 V
Startup Response Time tSTART VCC rising from 0 to 5.5V 100 µs
IN_-to-OUT/SET-to-GATE2
Propagation Delay tPROP
IN_/SET rising from (VTH - 100mV) to
(VTH + 100mV) or falling from (VTH +
100mV) to (VTH - 100mV) (no load)
2 µs
OUT_ Output-Voltage Low VOL
VCC ≥ 5.5V, ISINK = 3.2mA 0.4 V
VCC ≥ 2.8V, ISINK = 100µA 0.4 V
OUT_ Leakage Current ILEAK OUT_ = 72V 500 nA
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
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Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(VCC = 14V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
Note 1: 100% production tested at TA = +25°C and TA = +125°C. Specifications at TA = -40°C are guaranteed by design.
(VIN = 14V, TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
EN/EN, LOGIC Input Voltage VIL 0.4 V
VIH 1.4
EN/EN, LOGIC Input Current 1 2 µA
EN/EN, LOGIC Pulse Width 10 µs
VCC-to-GATE_ Output Low
Voltage
IGATE_SINK = 75µA, IGATE_SOURCE = 1µA,
VCC = 14V 711 V
VCC-to-GATE_ Clamp Voltage VCC = 24V 12 18 V
MAX16012
Reference Output Voltage VREF No load 1.275 1.3 1.320 V
Reference Short-Circuit Current ISHORT REF = GND 100 µA
Reference Load Regulation Sourcing, 0 ≤ IREF ≤ 1µA 0.1 mV/µA
Sinking, -1µA P IREF ≤ 0 0.1
Input Offset Voltage VCM = 0 to 2V -12.5 +12.5 mV
Input Offset Current 3 nA
Input Hysteresis 8 mV
Common-Mode Voltage Range CMVR 0 2.0 V
Common-Mode Rejection Ratio CMRR MAX16012, DC 70 dB
Comparator Power-Supply
Rejection Ratio PSRR MAX16012, DC 70 dB
SUPPLY CURRENT
vs. TEMPERATURE
MAX16010 toc02
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
1109565 80-10 5 20 35 50-25
26.05
26.10
26.15
26.20
26.25
26.30
26.35
26.40
26.45
26.50
26.00
-40 125
MAX16013/MAX16014
SET = GND, EN = VCC
GATE VOLTAGE
vs. SUPPLY VOLTAGE
MAX16010 toc03
SUPPLY VOLTAGE (V)
GATE VOLTAGE (V)
655545352515
10
20
30
40
50
60
0
5 75
MAX16013/MAX16014
SET = GND, EN = VCC
VGATE
VCC - VGATE
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX16010 toc01
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (µA)
655545352515
15
20
25
30
35
40
10
5 75
MAX16013/MAX16014
SET = GND, EN = VCC
MAX16010/MAX16011
INA+ = INB- = GND
OUTPUTS ENABLED
MAX16012
IN+ = IN- = GND
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
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Electrical Characteristics (continued)
Typical Operating Characteristics
(VIN = 14V, TA = +25°C, unless otherwise noted.)
UVLO THRESHOLD
vs. TEMPERATURE
MAX16010 toc04
TEMPERATURE (°C)
UVLO THRESHOLD (V)
1109565 80-10 5 20 35 50-25
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
4.5
-40 125
INA+/INB-/SET = GND
EN = VCC
RISING
FALLING
INA+/INB-/SET THRESHOLD
vs. TEMPERATURE
MAX16010 toc05
TEMPERATURE (°C)
INA+/INB-/SET THRESHOLD (V)
1109565 80-10 5 20 35 50-25
1.21
1.22
1.23
1.24
1.25
1.26
1.27
1.28
1.29
1.30
1.20
-40 125
INA+/INB-/SET RISING
EN = VCC
GATE VOLTAGE
vs. TEMPERATURE
MAX16010 toc06
TEMPERATURE (°C)
(V
CC
- V
GATE
) (V)
1109565 80-10 5 20 35 50-25
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10.0
9.0
-40 125
MAX16013/MAX16014
SET = GND, EN = VCC
STARTUP WAVEFORM
(ROUT = 100Ω, CIN = 10mF, COUT = 10nF)
MAX16010 toc07
VGATE
5V/div
VOUT
10V/div
VCC
10V/div
200µs/div
STARTUP WAVEFORM
(ROUT = 100Ω, CIN = 10mF, COUT = 10nF)
MAX16010 toc08
VGATE
10V/div
VOUT
10V/div
VCC
1V/div
20µs/div
VEN = 0 TO 2V
OVERVOLTAGE SWITCH FAULT
(ROUT = 100Ω, CIN = 80mF, COUT = 10nF)
MAX16010 toc09
VGATE
20V/div
VOUT
20V/div
VCC
20V/div
1ms/div
VIN = 12V TO 40V, TRIP THRESHOLD = 28V
OVERVOLTAGE LIMIT
(ROUT = 100Ω, CIN = 80mF, COUT = 10nF)
MAX16010 toc10
VGATE
20V/div
VOUT
20V/div
VCC
20V/div
1ms/div
VIN = 12V TO 40V
TRIP THRESHOLD = 28V
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
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Typical Operating Characteristics (continued)
PIN
NAME FUNCTION
MAX16010
MAX16011
MAX16012
MAX16013/
MAX16014
1 1 1 1 VCC Positive-Supply Input Voltage. Connect VCC to a 5.5V to 72V supply.
2 2 2 2 GND Ground
3 — — — EN Active-Low Enable Input. Drive EN low to turn on the voltage detectors. Drive EN high to force the
OUTA and OUTB outputs low. EN is internally pulled up to VCC. Connect EN to GND if not used.
4 4 — — OUTB
Open-Drain Monitor B Output. Connect a pullup resistor from OUTB to VCC. OUTB goes low when
INB- exceeds VTH+ and goes high when INB- drops below VTH- (with LOGIC connected to GND
for the MAX16011). Drive LOGIC high to reverse OUTB’s logic state. OUTB is usually used as an
overvoltage output. OUTB goes low (LOGIC = low) or high (LOGIC = high) when VCC drops below
the UVLO threshold voltage.
5 5 — — INB- Adjustable Voltage Monitor Threshold Input
6 6 — 5 EN
Active-High ENABLE Input. For the MAX16010/MAX16011, drive EN high to turn on the voltage
detectors. Drive EN low to force OUTA low and OUTB low (LOGIC = low) or high (LOGIC = high). For
the MAX16013/MAX16014, drive EN high to enhance the p-channel MOSFET (P2), and drive EN low
to turn off the MOSFET. EN is internally pulled down to GND. Connect EN to VCC if not used.
7 7 — — OUTA
Open-Drain Monitor A Output. Connect a pullup resistor from OUTA to VCC. OUTA goes low when
INA+ drops below VTH- and goes high when INA+ exceeds VTH+. OUTA is usually used as an
undervoltage output. OUTA also goes low when VCC drops below the UVLO threshold voltage.
8 8 — — INA+ Adjustable Voltage Monitor Threshold Input
— 3 — — LOGIC OUTB Logic-Select Input. Connect LOGIC to GND or VCC to congure the OUTB logic. See the
MAX16011 output logic table.
— — 3 — OUT Open-Drain Comparator Output. Connect a pullup resistor from OUT to VCC. OUT goes low when
IN+ drops below IN-. OUT goes high when IN+ exceeds IN-.
— — 4 — IN- Inverting Comparator Input
— — 5 — REF
Internal 1.30V Reference Output. Connect REF to IN+ for active-low output. Connect REF to IN- for
active-high output. REF can source and sink up to 1µA. Leave REF oating if not used. REF output
is stable with capacitive loads from 0 to 50pF.
— — 6 — IN+ Noninverting Comparator Input
— — — 3 GATE2
Gate-Driver Output. Connect GATE2 to the gate of an external p-channel MOSFET pass switch.
GATE2 is driven low to the higher of VCC - 10V or GND during normal operations and quickly
shorted to VCC during an overvoltage condition (SET above the internal threshold). GATE2 is
shorted to VCC when the supply voltage goes below the UVLO threshold voltage. GATE2 is shorted
to VCC when EN is low.
— — — 4 SET
Device Overvoltage-Threshold-Adjustment Input. Connect SET to an external resistive divider
network to adjust the desired overvoltage disable or overvoltage limit threshold (see the Typical
Application Circuit and Overvoltage Limiter section).
— — — 6 GATE1 Gate-Driver Output. Connect GATE1 to the gate of an external p-channel MOSFET to provide low
drop reverse voltage protection.
— — — — EP Exposed Pad. Connect EP to GND.
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
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Pin Description
Detailed Description
The MAX16010–MAX16014 is a family of ultra-small,
low-power, overvoltage-protection circuits for high-
voltage, high-transient systems such as those found in
automotive, telecom, and industrial applications. These
devices operate over a wide 5.5V to 72V supply voltage
range, making them also suitable for other applications
such as battery stacks, notebook computers, and servers.
The MAX16010 and MAX16011 offer two independent
comparators for monitoring both undervoltage and over-
voltage conditions. These comparators offer open-drain
outputs capable of handling voltages up to 72V. The
MAX16010 features complementary enable inputs (EN/
EN), while the MAX16011 features an active-high enable
input and a selectable active-high/low OUTB output.
The MAX16012 offers a single comparator and an inde-
pendent reference output. The reference output can be
directly connected to either the inverting or noninverting
input to select the comparator output logic.
The MAX16013 and MAX16014 are overvoltage-
protection circuits capable of driving two p-channel
MOSFETs to prevent reverse-battery and overvoltage
conditions. One MOSFET (P1) eliminates the need for
external diodes, thus minimizing the input voltage drop.
While the second MOSFET (P2) isolates the load or
regulates the output voltage during an overvoltage condi-
tion. The MAX16014 keeps the MOSFET (P2) latched off
until the input power is cycled.
Voltage Monitoring
The MAX16010/MAX16011 include undervoltage and over-
voltage comparators for window detection (see Figure
1). OUT_ asserts high when the monitored voltage is
within the selected “window.” OUTA asserts low when the
monitored voltage falls below the lower (VTRIPLOW) limit of
the window, or OUTB asserts low if the monitored voltage
exceeds the upper limit (VTRIPHIGH). The application in
Figure 1 shows OUT_ enabling the DC-DC converter when
the monitored voltage is in the selected window.
The resistor values (R1–R3) can be calculated as follows:
TOTAL
TRIPLOW TH
R
V V R2 R3
−
=
+

TOTAL
TRIPHIGH TH
R
V V R3
+
=

where RTOTAL = R1 + R2 + R3.
Use the following steps to determine the values for
R1–R3.
1) Choose a value for RTOTAL, the sum of R1, R2, and
R3. Because the MAX16010/MAX16011 have very
high input impedance, RTOTAL can be up to 5MΩ.
2) Calculate R3 based on RTOTAL and the desired upper
trip point:
TH TOTAL
TRIPHIGH
V R
R3 V
+×
=
3) Calculate R2 based on RTOTAL, R3, and the desired
lower trip point:
TH TOTAL
TRIPHIGH
V R
R3 V
+×
=
4) Calculate R1 based on RTOTAL, R3, and R2:
R1 = RTOTAL - R2 - R3
The MAX16012 has both inputs of the comparator avail-
able with an integrated 1.30V reference (REF). When
the voltage at IN+ is greater than the voltage at IN-, OUT
goes high. When the voltage at IN- is greater than the
voltage at IN+, OUT goes low. Connect REF to IN+ or
IN- to set the reference-voltage value. Use an external
resistive divider to set the monitored voltage threshold.
Figure 1. MAX16010 Monitor Circuit
MAX16010
DC-DC
REGULATOR
IN
EN
INA+
INB-
OUTB
OUTA
R3
R2
R1
+48V
EN
GND
VCC
EN
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The MAX16013/MAX16014 can be configured as an
overvoltage switch controller to turn on/off a load (see
the Typical Application Circuit). When the programmed
overvoltage threshold is tripped, the internal fast compara-
tor turns off the external p-channel MOSFET (P2), pulling
GATE2 to VCC to disconnect the power source from the
load. When the monitored voltage goes below the adjusted
overvoltage threshold, the MAX16013 enhances GATE2,
reconnecting the load to the power source (toggle ENABLE
on the MAX16014 to reconnect the load). The MAX16013
can be configured as an overvoltage-limiter switch by
connecting the resistive divider to the load instead of VCC
(Figure 3). See the Overvoltage Limiter section.
Supply Voltage
Connect a 5.5V to 72V supply to VCC for proper opera-
tion. For noisy environments, bypass VCC to GND with
a 0.1μF or greater capacitor. When VCC falls below the
UVLO voltage, the following states are present (Table 1).
Hysteresis
Hysteresis adds noise immunity to the voltage monitors
and prevents oscillation due to repeated triggering when
the monitored voltage is near the threshold trip voltage.
The hysteresis in a comparator creates two trip points:
one for the rising input voltage (VTH+) and one for the
falling input voltage (VTH-). These thresholds are shown
in Figure 4.
Enable Inputs (EN or EN)
The MAX16011 offers an active-high enable input (EN),
while the MAX16010 offers both an active-high enable
input (EN) and an active-low enable input (EN). For the
MAX16010, drive EN low or EN high to force the output
low. When the device is enabled (EN = high and EN =
low) the state of OUTA and OUTB depends on the INA+
and INB- logic states.
Figure 2. Typical Operating Circuit for the MAX16012 Figure 3. Overvoltage Limiter Protection
Figure 4. Input and Output Waveforms
Table 1. UVLO State (VCC < VUVLO)
PART OUTA OUTB OUT GATE2
MAX16010 Low Low — —
MAX16011 Low Low, LOGIC = low
High, LOGIC = high — —
MAX16012 — — Low —
MAX16013
MAX16014 — — — High
MAX16012
IN+
REF
IN-
OUT
RPULLUP
R1
R2
GND
VBATT
VCC
OUT
MAX16013
GATE1
SET
GATE2
VCC
GND
P2P1
R1
R2
VBATT
VIN+
VOUT
VTH+
VTH-
VCC
0V
VHYST
tPROP tPROP tPROP
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For the MAX16011, drive EN low to force OUTA low,
OUTB low when LOGIC = low, and OUTB high when
LOGIC = high. When the device is enabled (EN = high),
the state of OUTA and OUTB depends on the INA+, INB-,
and LOGIC input (see Table 2).
For the MAX16013/MAX16014, drive EN low to pull
GATE2 to VCC, turning off the p-channel MOSFET (P2).
When the device is enabled (EN = high), GATE2 is pulled
to the greater of (VCC - 10V) or GND turning on the
external MOSFET (P2).
Applications Information
Input Transients Clamping
When the external MOSFET is turned off during an over-
voltage occurrence, stray inductance in the power path
may cause voltage ringing to exceed the MAX16013/
MAX16014 absolute maximum input (VCC) supply rating.
The following techniques are recommended to reduce the
effect of transients:
● Minimize stray inductance in the power path using
wide traces, and minimize loop area including the
power traces and the return ground path.
● Add a zener diode or transient voltage suppresser
(TVS) rated below VCC absolute maximum rating
(Figure 3).
Overvoltage Limiter
When operating in overvoltage-limiter mode, the MAX16013
drives the external p-channel MOSFET (P2), resulting in
the external MOSFET operating as a voltage regulator.
During normal operation, GATE2 is pulled to the greater
of (VCC - 10V) or GND. The external MOSFET’s drain
voltage is monitored through a resistor-divider between
the P2 output and SET. When the output voltage rises
above the adjusted overvoltage threshold, an internal
comparator pulls GATE2 to VCC. When the monitored
voltage goes below the overvoltage threshold, the
p-channel MOSFET (P2) is turned on again. This process
continues to keep the voltage at the output regulated to
within approximately a 5% window. The output voltage
is regulated during the overvoltage transients and the
MOSFET (P2) continues to conduct during the overvolt-
age event, operating in switched-linear mode.
Caution must be exercised when operating the MAX16013
in voltage-limiting mode for long durations due to the
MOSFET’s power-dissipation consideration (see the
MOSFET Selection and Operation section).
MOSFET Selection and Operation
(MAX16013 and MAX16014)
Most battery-powered applications must include reverse-
voltage protection. Many times this is implemented with a
diode in series with the battery. The disadvantage in using
a diode is the forward-voltage drop of the diode, which
reduces the operating voltage available to downstream
circuits (VLOAD = VBATTERY - VDIODE). The MAX16013
and MAX16014 include high-voltage GATE1 drive circuitry,
allowing users to replace the high-voltage-drop series diode
with a low-voltage-drop MOSFET device (as shown in the
Typical Operating Circuit and Figure 3). The forward-voltage
drop is reduced to ILOAD x RDS-ON of P1. With a suitably
chosen MOSFET, the voltage drop can be reduced to
millivolts.
In normal operating mode, internal GATE1 output
circuitry enhances P1 to a 10V gate-to-source (VGS) for 11V
< VCC < 72V. The constant 10V enhancement ensures P1
operates in a low RDS-ON mode, but the gate-source
junction is not overstressed during high-battery-voltage
applications or transients (many MOSFET devices specify
a ±20V VGS absolute maximum). As VCC drops below
10V, GATE1 is limited to GND, reducing P1 VGS to VCC
- GND. In normal operation, the P1 power dissipation is
very low:
P1 = ILOAD2 x RDS-ON
During reverse-battery applications, GATE1 is limited to
GND and the P1 gate-source junction is reverse biased.
P1 is turned off and neither the MAX16013/MAX16014
nor the load circuitry is exposed to the reverse-battery
voltage. Care should be taken to place P1 (and its internal
drain-to-source diode) in the correct orientation for proper
reverse-battery operation.
P2 protects the load from input overvoltage conditions.
During normal operating modes (the monitored voltage
is below the adjusted overvoltage threshold), internal
Table 2. MAX16011 Output Logic
LOGIC INA+ INB- OUTA OUTB
Low > VTH+ > VTH+
High
Impedance Low
Low < VTH- < VTH- Low High
Impedance
High > VTH+ > VTH+
High
Impedance
High
Impedance
High < VTH- < VTH- Low Low
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GATE2 output circuitry enhances P2 to a 10V gate-to-
source (VGS) for 11V < VCC < 72V. The constant 10V
enhancement ensures P2 operates in a low RDS-ON
mode, but the gate-to-source junction is not overstressed
during high-battery-voltage applications (many pFET
devices specify a ±20V VGS absolute maximum). As VCC
drops below 10V, GATE2 is limited to GND, reducing P2
VGS to VCC - GND. In normal operation, the P2 power
dissipation is very low:
P2 = ILOAD2 x RDS-ON
During overvoltage conditions, P2 is either turned com-
pletely off (overvoltage-switch mode) or cycled off-on-off
(voltage-limiter mode). Care should be taken to place
P2 (and its internal drain-to-source diode) in the correct
orientation for proper overvoltage-protection opera-
tion. During voltage-limiter mode, the drain of P2 is
limited to the adjusted overvoltage threshold, while the
battery (VCC) voltage rises. During prolonged overvoltage
events, P2 temperature can increase rapidly due to the
high power dissipation. The power dissipated by P2 is:
P2 = VDS-P2 x ILOAD
= (VCC - VOV-ADJUSTED) x ILOAD
where VCC ~ VBATTERY and VOV-ADJUSTED is the
desired load-limit voltage. For prolonged overvoltage
events with high P2 power dissipation, proper heatsinking
is required.
Adding External Pullup Resistors
It may be necessary to add an external resistor from VCC
to GATE1 to provide enough additional pullup capability
when the GATE1 input goes high. The GATE_ output
can only source up to 1μA current. If the source current
is less than 1μA, no external resistor may be necessary.
However, to improve the pullup capability of the GATE_
output when it goes high, connect an external resistor
between VCC and the GATE_. The application shows a
2MΩ resistor, which is large enough not to impact the
sinking capability of the GATE_ (during normal opera-
tion), while providing enough pullup during an overvoltage
event. With an 11V (worst case) VCC-to-gate clamp volt-
age and a sinking current of 75μA, the smallest resistor
should be 11V/75μA, or about 147kΩ. However, since the
GATE_ is typically low most of the time, a higher value
should be used to reduce overall power consumption.
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
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Figure 5. MAX16010 Functional Diagram
Figure 7. MAX16012 Functional Diagram
Figure 6. MAX16011 Functional Diagram
Figure 8. MAX16013/MAX16014 Functional Diagram
MAX16010
HYST
HYST
REGULATOR
ENABLE CIRCUITRY
1.23V
~4V
INA+
INB-
OUTA
OUTB
GND EN
EN
VCC
MAX16012
REGULATOR
1.30V
~4V
IN- OUT
GND
VCC
IN+
REF
MAX16011
HYST
HYST
REGULATOR
ENABLE
CIRCUITRY
OUTB
LOGIC
1.23V
~4V
INA+
INB-
OUTA
OUTB
GND EN
LOGIC
VCC
MAX16013
MAX16014
HYST
ENABLE
CIRCUITRY
LATCH
CLEAR
1.23V
SET
GND EN
VCC
GATE1
GATE2
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
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Functional Diagrams
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
6 TDFN T633-2 21-0137
8 TDFN T833-2 21-0137
8 7 6 5
1 2 3 4
INA+ OUTA EN INB-
VCC GND EN OUTB
TOP VIEW
MAX16010
TDFN (3mm x 3mm)
8 7 6 5
1 2 3 4
INA+ OUTA EN INB-
VCC GND LOGIC OUTB
MAX16011
TDFN (3mm x 3mm)
6
IN+
5
REF
4
IN-
1
VCC
2
GND
3
OUT
MAX16012
TDFN (3mm x 3mm)
6
GATE1
5
EN
4
SET
1
VCC
2
GND
3
GATE2
MAX16013
MAX16014
TDFN (3mm x 3mm)
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
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Pin Congurations
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 6/05 Initial release —
1 12/05 Removed future product designation for MAX16010/MAX16011 1, 12
2 1/07 Edited Figure 7 1, 10, 12
3 12/07 Fixed text in Voltage Monitoring section and updated Package Outline 6, 12
4 9/08 Revised Figures 6 and 8. 10
5 2/15 No /V OPNs in Ordering Information; deleted automotive reference from
General Description and Applications sections; deleted Load Dump section 1, 8
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/
Detection Circuits
© 2015 Maxim Integrated Products, Inc.
│
12
Revision History
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