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Electrical Characteristics
Electrical Connections
Characteristic Sym Notes Min Typ Max Units
Center Frequency fC869.00 MHz
Insertion Loss, 868 to 870 MHz IL 2.7 3.5 dB
Amplitude Ripple, 868 to 870 MHz 0.2 0.7 dBP-P
Attenuation Referenced to 0 dB:
DC to 828 MHz 45 51
dB
828 to 849 MHz 30 40
881 to 890 MHz 22 35
890 to 925 MHz 22 38
925 to 1200 MHz 40 49
1200 to 1740 MHz 36 49
Source Impedance ZS50 Ω
Load Impedance ZL50 Ω
Case Style SM3030-6 3.0 x 3.0 mm Nominal Footprint
Lid Symbolization, Y=year, WW=week, S=shift, Dot=pin 1 indicator 994, YWWS
Standard Reel Quantity Reel Size 7 Inch 500 Pieces/Reel
Reel Size 13 Inch 3000 Pieces/Reel
Connection Terminals
Port 1 2
Port 2 5
Case Ground All others
SM3030-6
• Steep Roll-off Filter for 869.00 MHz Unlicensed Band
• Complies with Directive 2002/95/EC (RoHS)
• No Matching Required for Operation in 50
Ω
Environment
Absolute Maximum Ratings
Rating Value Units
Input Power Level 14 dBm
DC V oltage on any Non-ground Terminal 5 V
Operating Temperature Range -30 to +65 °C
Storage Temperature Range in Tape and Reel -40 to +85 °C
Maximum Soldering Profile, 5 Cycles/10 seconds Maximum 265 °C
869.00 MHz
SAW Filter
SF2137E-1
1. Unless noted oth erwis e, all spec ifications apply ov er the operating temperatur e range with filter soldered to the specified demons trat ion board with imped ance
match ing to 50 Ω and measured with 50 Ω network analyz er.
2. Unless noted otherwise, all frequenc y specifications are referenced to the nominal center frequen cy, fc.
3. Rejection is measur ed a s attenu ation b elow t he minimum I L point in the p assband . Re jecti on in final us er applic ation is de pen dent on PCB la y out and ex ternal
impedance matching des ign. See Application Note No. 42 for details.
4. The desi gn, manufact uring process , and specifications of this filter are subject to change.
5. US and international patents may apply.
6. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
Pb
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
Preliminary
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©2009-2011 by RF Monolithics, Inc. SF2137E-1 2/8/11
K
K
O
MM
N
N
N
L
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
SM3030-6 Case
Top View Bottom View
Case and PCB Footprint Dimensions
Case Materials
Dimension mm Inches
Min Nom Max Min Nom Max
A2.87 3.00 3.13 0.113 0.118 0.123
B2.87 3.00 3.13 0.113 0.118 0.123
C1.12 1.25 1.40 0.044 0.049 0.055
D0.77 0.90 1.03 0.030 0.035 0.040
E2.67 2.80 2.93 0.105 0.110 0.115
F1.47 1.60 1.73 0.058 0.063 0.068
G0.72 0.85 0.98 0.028 0.033 0.038
H1.37 1.50 1.63 0.054 0.059 0.064
I0.47 0.60 0.73 0.019 0.024 0.029
J1.17 1.30 1.43 0.046 0.051 0.056
K3.20 0.126
L1.70 0.067
M1.05 0.041
N0.81 0.032
O0.38 0.015
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
PCB Footprint Top V iew
1
2
3
6
5
4
1
2
3
6
5
4
A
BC
DJ
EF
GH
I
994
YWWS
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©2009-2011 by RF Monolithics, Inc. SF2137E-1 2/8/11
Tape and Reel Specifica t ions
“B” Quantity Per Reel
Inches millimeters
7 178 500
13 330 3000
See Detail "A"
13.0
20.2
2.0
12.0
100 REF.
"B" REF.
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
Ao 3.35 mm
Bo 3.35 mm
Ko 1.40 mm
Pitch 8.0 mm
W12.0 mm
RO.3
(MAX.)
Ko
SECTION A-A
0.3 ± 0.05
SECTION B-B
Bo
2.0 4.0
Ao Pitch
BB
AR0.5
(MAX.)
A
5.5
12.0
1.75
1.5
1.50
PIN #1
USER DIRECTION OF FEED
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©2009-2011 by RF Monolithics, Inc. SF2137E-1 2/8/11
Typical Solder Reflow Profile
0
5 0
1 0 0
1 5 0
2 0 0
2 5 0
3 0 0
0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0
T e m p e r a t u r e ( d e g C )
R a m p u p P r e h e a t R e f l o w C o o l D o w n
T i m e ( s e c o n d s )
